Semiconductor process equipment

Abstract

The utility model provides semiconductor process equipment, which comprises a base, a process pipe, a gas inlet pipe, a first switching component and a second switching component, the process pipe is vertically arranged on the base, the gas inlet pipe is vertically arranged in the process pipe and is used for conveying process gas into the process pipe, and the first switching component and the second switching component are of split structures which are detachably connected. At least part of the first adapter component is vertically arranged in the base and communicates with the air inlet pipe, the second adapter component transversely penetrates through the base, the part, located in the base, of the second adapter component detachably communicates with the first adapter component, and the part, located outside the base, of the second adapter component is used for communicating with an external pipe. According to the semiconductor process equipment provided by the utility model, the possibility of collision and scratch among the air inlet pipe, the base and the process pipe can be reduced when the air inlet pipe is disassembled and assembled, additional designs such as an avoiding structure and the like do not need to be carried out on the process pipe, and in addition, parts needing to be disassembled and assembled can be reduced, so that the disassembly and assembly convenience can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to semiconductor process equipment. Background Art

[0002] Semiconductor vertical equipment (for example, a semiconductor vertical furnace) usually includes a base, a process pipe, an air inlet pipe and a pipeline transfer structure. The process pipe is vertically arranged on the base, the air inlet pipe is vertically arranged in the process pipe and close to the inner wall of the process pipe. The pipeline transfer structure is arranged in cooperation with the base to connect the air inlet pipe with an external pipe outside the process pipe. The external pipe can be connected to a process gas source so that the process gas provided by the process gas source can be transported to the process pipe through the external pipe, the pipeline transfer structure and the air inlet pipe in sequence.

[0003] In the prior art, the pipeline transition structure includes a transverse transition section and a vertical transition section that are interconnected, and the transverse transition section and the vertical transition section are an integrated structure. The vertical transition section is vertically arranged in the base and is connected to the air intake pipe. The transverse transition section is arranged transversely through the base, and the part of the transverse transition section located outside the base is connected to the external pipe. When the air intake pipe needs to be disassembled and assembled for maintenance and replacement, the first disassembly and assembly method is to first cancel the connection between the air intake pipe and the vertical transition section in the base, and then pull the air intake pipe upward to separate the air intake pipe from the vertical transition section. When installing, the air intake pipe can be placed into the process pipe first, and the air intake pipe can be inserted into the vertical transition section in the base, and then the air intake pipe and the vertical transition section can be connected in the base. When disassembly and assembly are carried out in the second disassembly and assembly method, the bottom plate of the base can be removed first, and the horizontal transition section and the external pipe can be separated outside the base, and then the air intake pipe and the pipeline transition structure can be taken out as a whole. When installing, the air intake pipe and the vertical transition section can be connected outside the base first, and then the air intake pipe and the pipeline transition structure can be placed as a whole into the base and the process pipe, and then the horizontal transition section and the external pipe can be connected outside the process pipe, and the bottom plate of the base can be installed.

[0004] However, when the first disassembly and assembly method is used, since the internal space of the vertical base and the process pipe is relatively narrow, disassembly and assembly of the air intake pipe in the base is likely to cause bumps and scratches between the air intake pipe, the base and the inner wall of the process pipe, and since the air intake pipe needs to be plugged in and out vertically, an avoidance structure needs to be designed at the top of the process pipe. When the second disassembly and assembly method is used, since it is necessary to disassemble and assemble the transverse transition section and the external pipe, and also the bottom plate, a large number of parts need to be disassembled and assembled, and the convenience of disassembly and assembly is poor. Utility Model Content

[0005] The utility model aims to solve at least one of the technical problems existing in the prior art, and proposes a semiconductor process equipment, which can reduce the possibility of collision and scratches between the intake pipe, the base and the process pipe when disassembling the intake pipe, and does not require additional design of the process pipe such as an avoidance structure. In addition, it can also reduce the parts that need to be disassembled, thereby improving the convenience of disassembly and assembly.

[0006] In order to achieve the purpose of the utility model, a semiconductor process equipment is provided, including a base, a process tube, an air inlet pipe, a first adapter component and a second adapter component. The process tube is vertically arranged on the base, the air inlet pipe is vertically arranged in the process tube, and is used to transport process gas into the process tube. The first adapter component and the second adapter component are detachably connected split structures. At least part of the first adapter component is vertically arranged in the base and connected to the air inlet pipe. The second adapter component is arranged horizontally through the base. The part of the second adapter component located in the base is detachably connected to the first adapter component, and the part of the second adapter component located outside the base is used to be connected to an external pipe.

[0007] Optionally, the first adapter component includes a first connecting piece and a first connecting piece, and the second adapter component includes a second connecting piece and a second connecting piece. The first connecting piece is connected to the first connecting piece and is connected to the intake pipe, and the second connecting piece is connected to the second connecting piece and is used to be connected to the external pipe. The first connecting piece and the second connecting piece are detachably connected via the first connecting piece and the second connecting piece.

[0008] Optionally, a first channel and a second channel that are interconnected are provided inside the first connecting member, the first channel is for the first connecting member to be inserted into, and the second channel is for the second connecting member to be inserted into.

[0009] Optionally, the semiconductor process equipment further includes a first threaded connector, the first connector is provided with a first connecting through hole, the second connector is provided with a first threaded connecting hole, and the first threaded connector is used to pass through the first connecting through hole and be threadedly connected to the first threaded connecting hole.

[0010] Optionally, there are multiple first threaded connectors, and the first connecting through holes are provided on opposite sides of the first connecting member, and the axial direction of the first connecting through hole is parallel to the axial direction of the second connecting member, the side of the first connecting through hole facing away from the first connecting member is an opening, and the first threaded connecting holes are provided on opposite sides of the second connecting member, and multiple first threaded connectors pass through the multiple first connecting through holes in a one-to-one manner and are threadedly connected to the multiple first threaded connecting holes in a one-to-one manner.

[0011] Optionally, the first connecting member includes a sleeve and a first adapter tube, the sleeve is sleeved around the first adapter tube, and the gap between the inner wall of the sleeve and the outer wall of the first adapter tube is for the intake pipe to be inserted, one end of the first adapter tube can be inserted into the intake pipe to connect with the intake pipe, and the other end is connected to the first connecting member.

[0012] Optionally, the semiconductor process equipment also includes a support and limiting component, which is arranged in the base and can support the first adapter component, the second adapter component and the air inlet pipe by cooperating with the first adapter component and / or the second adapter component, and limit the first adapter component, the second adapter component and the air inlet pipe from moving toward the base and the process pipe.

[0013] Optionally, the support and limiting component abuts against the bottom of the first adapter component to support the first adapter component, the second adapter component and the air inlet pipe, and a matching structure is provided at the abutment point between the first adapter component and the support and limiting component, and a limiting member is provided at the abutment point between the support and limiting component and the first adapter component, and the limiting member cooperates with the matching structure to limit the movement of the first adapter component, the second adapter component and the air inlet pipe toward the base and the process pipe.

[0014] Optionally, the support and limiting component also includes a support frame and a fastening nut, the limiting component includes a limiting bolt, the matching structure includes a limiting groove adapted to the head of the limiting bolt, the support frame is arranged in the base and is provided with a through hole for the rod of the limiting bolt to pass through, and the fastening nut is threadedly connected to the rod of the limiting bolt.

[0015] Optionally, the support and limiting component also includes a third connecting member and a fourth connecting member, the support frame is provided with a second connecting through hole, the third connecting member is connected to the base, and the third connecting member is provided with a first connecting structure, part of the fourth connecting member can pass through the second connecting through hole, and part of it can be offset against the second connecting through hole, and the part of the fourth connecting member that can pass through the second connecting through hole is provided with a second connecting structure that can cooperate with the first connecting structure.

[0016] The utility model has the following beneficial effects:

[0017] The semiconductor process equipment provided by the utility model makes the first adapter component and the second adapter component a split structure that can be detachably connected. When the air intake pipe needs to be disassembled, the first adapter component and the second adapter component can be firstly separated in the base, and then the first adapter component and the air intake pipe are taken out of the base and the process pipe as a whole to the outside of the base and the process pipe, and then the air intake pipe and the first adapter component are separated outside the base. When the air intake pipe needs to be installed, the air intake pipe can be firstly connected to the first adapter component outside the base, and then the first adapter component and the air intake pipe can be put into the base and the process pipe as a whole from the outside of the base, and then the first adapter component and the second adapter component can be connected in the base. Since there is no need to disassemble and assemble the air intake pipe and the first adapter component in the base, there is no need to plug and unplug the air intake pipe in the base, and the connection between the first adapter component and the second adapter component is closer to the opening at the bottom of the base relative to the connection between the air intake pipe and the first adapter component, since there is no need to disassemble and assemble the transversely arranged second adapter component, there is no need to separate the second adapter component from the external tube, and there is no need to disassemble and assemble the bottom plate of the base, thereby reducing the possibility of collision and scratches between the air intake pipe, the base and the process pipe when disassembling and assembling the air intake pipe, and there is no need to make additional designs for the process pipe such as avoidance structures, and it can also reduce the parts that need to be disassembled, thereby improving the convenience of disassembly and assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the structure of a semiconductor process equipment provided by an embodiment of the utility model;

[0019] Figure 2 A schematic diagram of a partial structure of a semiconductor process equipment provided by an embodiment of the utility model;

[0020] Figure 3 A schematic diagram of the structure of a first adapter component and a second adapter component provided in an embodiment of the utility model;

[0021] Figure 4 Another partial structural schematic diagram of a semiconductor process equipment provided by an embodiment of the utility model;

[0022] Description of reference numerals:

[0023] 1-first adapter component; 11-first connecting piece; 111-sleeve; 112-first adapter tube;

[0024] 12-first connecting member; 121-first connecting through hole; 122-matching structure; 2-second adapter component;

[0025] 21-second connecting piece; 22-second connecting piece; 221-first threaded connecting hole; 31-first threaded connecting piece; 4-support and limiting component; 41-limiting piece; 42-support frame; 43-fastening nut; 44-third connecting piece; 441-second connecting threaded hole; 45-fourth connecting piece; 5-connecting component; 100-semiconductor process equipment; 101-base; 102-process tube; 1021-process inner tube; 1022-process outer tube; 104-support ring; 1041-third connecting threaded hole; 105-inlet pipe; 200-external tube; 300-crystal boat. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the technical solution of the present invention, the semiconductor process equipment provided by the present invention is described in detail below in conjunction with the accompanying drawings.

[0027] like Figure 1-Figure 4 As shown, an embodiment of the utility model provides a semiconductor process equipment 100, including a base 101, a process tube 102, an air inlet pipe 105, a first adapter component 1 and a second adapter component 2, the process tube 102 is vertically arranged on the base 101, the air inlet pipe 105 is vertically arranged in the process tube 102, and is used to transport process gas into the process tube 102, the first adapter component 1 and the second adapter component 2 are detachably connected split structures, at least part of the first adapter component 1 is vertically arranged in the base 101 and is connected to the air inlet pipe 105, the second adapter component 2 is transversely arranged through the base 101, the part of the second adapter component 2 located in the base 101 is detachably connected to the first adapter component 1, and the part of the second adapter component 2 located outside the base 101 is used to be connected to the external pipe 200.

[0028] The semiconductor process equipment provided by the embodiment of the utility model makes the first adapter component 1 and the second adapter component 2 a split structure that can be detachably connected. When the air inlet pipe 105 needs to be disassembled, the first adapter component 1 and the second adapter component 2 can be firstly separated in the base 101, and then the first adapter component 1 and the air inlet pipe 105 are taken out of the base 101 and the process pipe 102 as a whole to the outside of the base 101 and the process pipe 102, and then the air inlet pipe 105 and the first adapter component 1 are separated outside the base 101. When the air inlet pipe 105 needs to be installed, the air inlet pipe 105 can be firstly connected to the first adapter component 1 outside the base 101, and then the first adapter component 1 and the air inlet pipe 105 can be put into the base 101 and the process pipe 102 as a whole from the outside of the base 101, and then the first adapter component 1 and the second adapter component can be connected in the base 101. 2 connection, in this way, since there is no need to disassemble the air intake pipe 105 and the first adapter component 1 in the base 101, there is no need to vertically plug and unplug the air intake pipe 105 in the base 101, and the connection between the first adapter component 1 and the second adapter component 2 is closer to the opening at the bottom of the base 101 relative to the connection between the air intake pipe 105 and the first adapter component 1, and since there is no need to disassemble the transversely arranged second adapter component 2, there is no need to disassemble the second adapter component 2 and the external tube 200, and there is no need to disassemble the bottom plate of the base 101, so that when disassembling the air intake pipe 105, the possibility of collision and scratches between the air intake pipe 105, the base 101 and the process pipe 102 is reduced, and there is no need to perform additional design on the process pipe 102, such as an avoidance structure, and the parts that need to be disassembled can be reduced, thereby improving the convenience of disassembly and assembly.

[0029] In actual application, when installing the air intake pipe 105 for the first time, the air intake pipe 105 can be first connected to the first adapter component 1 outside the base 101, and the second adapter component 2 can be horizontally passed through the base 101, and then the part of the second adapter component 2 outside the base 101 can be connected to the external pipe 200 outside the base 101, and the air intake pipe 105 and the first adapter component 1 are put into the base 101 from outside the base 101 as a whole, and then the first adapter component 1 is connected to the second adapter component 2 in the base 101, and the bottom plate of the base 101 is installed, thereby completing the installation of the air intake pipe 105. When disassembling the air intake pipe 105 during use, there is no need to disassemble the external pipe 200 and the second adapter component 2, and there is no need to disassemble the bottom plate.

[0030] In actual applications, the external tube 200 can be connected to the base 101 and the process gas source outside the process tube 102. The process gas provided by the process gas source can first enter the external tube 200, enter the second adapter component 2 through the external tube 200, and then enter the first adapter component 1 through the second adapter component 2, and then enter the air inlet pipe 105 through the first adapter component 1, and then be transported to the process tube 102 through the air inlet pipe 105 to react with the wafer in the process tube 102 to realize the semiconductor process.

[0031] like Figure 2-Figure 4 As shown, in one embodiment of the utility model, the first adapter component 1 may include a first connecting piece 11 and a first connecting piece 12, and the second adapter component 2 may include a second connecting piece 21 and a second connecting piece 22. The first connecting piece 11 is connected to the first connecting piece 12 and is connected to the intake pipe 105, and the second connecting piece 21 is connected to the second connecting piece 22 and is used to be connected to the external pipe 200. The first connecting piece 11 and the second connecting piece 21 are detachably connected through a detachable connection between the first connecting piece 12 and the second connecting piece 22.

[0032] In practical applications, by connecting the first connecting member 12 with the second connecting member 22, the first connecting member 11 can be connected with the second connecting member 21, thereby realizing the connection between the first adapter component 1 and the second adapter component 2. By disassembling the first connecting member 12 and the second connecting member 22, the first connecting member 11 can be disconnected from the second connecting member 21, thereby realizing the disassembly of the first adapter component 1 and the second adapter component 2. In practical applications, the process gas of the external pipe 200 can first enter the second connecting member 21, then enter the first connecting member 11 through the second connecting member 21, and then enter the air inlet pipe 105 through the first connecting member 11.

[0033] In an embodiment of the present invention, a first channel and a second channel that are interconnected may be provided inside the first connecting member 12 , wherein the first connecting member 11 is inserted into the first channel, and the second connecting member 21 is inserted into the second channel.

[0034] In actual applications, by inserting the first connecting piece 11 into the first channel, the first connecting piece 11 can be connected to the first channel, and by inserting the second connecting piece 21 into the second channel, the second connecting piece 21 can be connected to the second channel. The first channel and the second channel are connected to each other, so the first connecting piece 11 and the second connecting piece 21 can be connected, and the process gas of the second connecting piece 21 can enter the first connecting piece 11.

[0035] like Figure 2-Figure 4 As shown, in one embodiment of the utility model, the semiconductor process equipment 100 may also include a first threaded connection member 31, the first connection member 12 is provided with a first connection through hole 121, and the second connection member 22 is provided with a first threaded connection hole 221, and the first threaded connection member 31 is used to pass through the first connection through hole 121 and be threadedly connected with the first threaded connection hole 221.

[0036] In actual applications, the first connecting member 12 can be connected to the second connecting member 22 by passing the first threaded connecting member 31 through the first connecting through hole 121, threadedly connected to the first threaded connecting hole 221, and screwed into the first threaded connecting hole 221. The first connecting member 12 and the second connecting member 22 can be separated by unscrewing the first threaded connecting member 31 from the first threaded connecting hole 221, thereby realizing a detachable connection between the first connecting member 12 and the second connecting member 22.

[0037] like Figure 2 and Figure 3 As shown, optionally, the first connecting member 12 may be in a block shape.

[0038] like Figure 2 and Figure 3 As shown, optionally, the second connecting member 22 may be plate-shaped, the second connecting member 21 may be tube-shaped, and the second connecting member 21 may be disposed through the second connecting member 22 .

[0039] Optionally, the second connecting member 21 and the second connecting member 22 may be welded, so that the connection between the second connecting member 21 and the second connecting member 22 can be more firmly established.

[0040] like Figure 2 and Figure 3 As shown, in one embodiment of the utility model, there are multiple first threaded connectors 31, first connecting through holes 121 are provided on opposite sides of the first connector 12, and the axial direction of the first connecting through hole 121 is parallel to the axial direction of the second connecting member 21, and the side of the first connecting through hole 121 facing away from the first connector 12 is an opening, and first threaded connecting holes 221 are provided on opposite sides of the second connector 22, and multiple first threaded connectors 31 pass through the multiple first connecting through holes 121 one by one, and are threadedly connected to the multiple first threaded connecting holes 221 one by one.

[0041] By passing through the plurality of first connection through holes 121 one by one, and threadingly connecting with the plurality of first threaded connection holes 221 one by one, and screwing into the corresponding first threaded connection holes 221, the first connection member 12 is connected with the second connection member 22 by means of the plurality of first threaded connection members 31, so that the connection stability between the first connection member 12 and the second connection member 22 can be improved. By making the side of the first connection through hole 121 away from the first connection member 12 as an opening, the relative position of the first connection member 12 and the second connection member 22 can be adjusted, and after the relative position of the first connection member 12 and the second connection member 22 is adjusted, the first connection member 12 and the second connection member 22 can be connected by the first threaded connection member 31.

[0042] Optionally, the first connecting through hole 121 may be a U-shaped hole.

[0043] Optionally, the first connecting through holes 121 on opposite sides of the first connecting member 12 may be staggered in the vertical direction, and the first threaded connecting holes 221 on opposite sides of the second connecting member 22 may be staggered in the vertical direction.

[0044] like Figure 2-Figure 4 As shown, in one embodiment of the utility model, the first connecting piece 11 may include a sleeve 111 and a first transfer tube 112. The sleeve 111 is sleeved around the first transfer tube 112. The gap between the inner wall of the sleeve 111 and the outer wall of the first transfer tube 112 is provided for the air intake pipe 105 to be inserted. One end of the first transfer tube 112 can be inserted into the air intake pipe 105 to communicate with the air intake pipe 105, and the other end is connected to the first connecting piece 12.

[0045] That is, there is a gap between the inner wall of the sleeve 111 sleeved around the first transfer tube 112 and the outer wall of the first transfer tube 112, and the air intake pipe 105 can be inserted into the gap, and when the air intake pipe 105 is inserted into the gap, one end of the first transfer tube 112 is also inserted into the air intake pipe 105 at the same time, so that the first transfer tube 112 can be connected to the air intake pipe 105. The other end of the first transfer tube 112 can be connected to the first connector 12, for example, the other end of the first transfer tube 112 can be inserted into the first channel inside the first connector 12.

[0046] like Figure 2 As shown, optionally, the air intake pipe 105 can be detachably connected to the sleeve 111 through the connecting component 5 to achieve a detachable connection between the air intake pipe 105 and the first connecting member 11, and further achieve a detachable connection between the air intake pipe 105 and the first adapter component 1.

[0047] Optionally, the sleeve 111 and the first transfer tube 112 can be welded, and the first transfer tube 112 and the first connector 12 can be welded. This can make the connection between the sleeve and the first transfer tube 112 more secure, and make the connection between the first transfer tube 112 and the first connector 12 more secure.

[0048] like Figure 2 and Figure 4 As shown, in one embodiment of the utility model, the semiconductor process equipment 100 may further include a support and limit component 4, which is disposed in the base 101 and is capable of supporting the first adapter component 1, the second adapter component 2 and the air inlet pipe 105 by cooperating with the first adapter component 1 and / or the second adapter component 2, and limiting the movement of the first adapter component 1, the second adapter component 2 and the air inlet pipe 105 toward the base 101 and the process tube 102.

[0049] Such a design is due to the fact that in the semiconductor process, the wafer boat 300 for carrying the wafers is placed vertically in the process tube 102 and is close to the axis of the process tube 102 relative to the first adapter component 1 and the air inlet pipe 105. In addition, since the portion of the second adapter component 2 that passes through the base 101 may have a gap with the base 101, the supporting stability of the first adapter component 1, the second adapter component 2 and the air inlet pipe 105 is poor and may shake and tilt, causing the first adapter component 1 and the air inlet pipe 105 to collide with the wafer boat 300, resulting in damage to the first adapter component 1, the air inlet pipe 105, the wafer boat 300 and / or the wafers. In addition, due to In the semiconductor process, the base 101 and the process tube 102 need to be vacuumed so that the air pressure in the base 101 and the process tube 102 is lower than the air pressure of the external environment. Therefore, the first adapter component 1, the second adapter component 2 and the air inlet pipe 105 may be drawn toward the base 101 and the process tube 102 due to the low air pressure and vacuum in the base 101 and the process tube 102, causing the first adapter component 1, the second adapter component 2 and the air inlet pipe 105 to collide with the wafer boat 300, causing damage to the first adapter component 1, the second adapter component 2, the air inlet pipe 105, the wafer boat 300 and / or the wafer, thereby resulting in poor safety of the semiconductor process.

[0050] The semiconductor process equipment 100 provided by the utility model supports the first adapter component 1, the second adapter component 2 and the air inlet pipe 105 by means of the support and limiting component 4, which can improve the supporting stability of the first adapter component 1 and the air inlet pipe 105 in the base 101 and the process tube 102, and reduce the possibility of the first adapter component 1 and the air inlet pipe 105 colliding with the wafer boat 300 due to shaking or tilting, thereby reducing the possibility of damage to the first adapter component 1, the air inlet pipe 105, the wafer boat 300 and / or the wafer, thereby improving the safety of the semiconductor process. Furthermore, by limiting the movement of the first adapter component 1, the second adapter component 2 and the air inlet pipe 105 toward the base 101 and the process tube 102 with the help of the support and limiting component 4, the first adapter component 1, the second adapter component 2 and the air inlet pipe 105 can be reduced from being drawn toward the base 101 and the process tube 102 due to the low air pressure and vacuum in the base 101 and the process tube 102, thereby reducing the possibility of damage to the first adapter component 1, the second adapter component 2, the air inlet pipe 105, the crystal boat 300 and / or the wafer, thereby improving the safety of the semiconductor process.

[0051] like Figure 2 and Figure 4As shown, in one embodiment of the utility model, the support and limiting component 4 can be abutted against the bottom of the first adapter component 1 to support the first adapter component 1, the second adapter component 2 and the air inlet pipe 105, and the abutment between the first adapter component 1 and the support and limiting component 4 can be provided with a matching structure 122, and the abutment between the support and limiting component 4 and the first adapter component 1 is provided with a limiting member 41, and the limiting member 41 is limitedly matched with the matching structure 122 to limit the movement of the first adapter component 1, the second adapter component 2 and the air inlet pipe 105 toward the base 101 and the process pipe 102.

[0052] In actual applications, after the first adapter component 1 and the air intake pipe 105 are placed as a whole from outside the base 101 into the base 101 and the process pipe 102, the first adapter component 1 and the second adapter component 2 can be connected in the base 101 first, and then the matching structure 122 and the limiting member 41 can be matched in the base 101 to limit the movement of the first adapter component 1, the second adapter component 2 and the air intake pipe 105 into the base 101 and the process pipe 102 with the help of the matching structure 122 and the limiting member 41. By arranging a matching structure 122 at the abutment between the first adapter component 1 and the supporting and limiting component 4, and arranging a limiting member 41 at the abutment between the supporting and limiting component 4 and the first adapter component 1, that is, arranging a matching structure 122 at the position of the first adapter component 1 supported by the supporting and limiting component 4, and arranging a limiting member 41 at the position of the supporting and limiting component 4 supporting the first adapter component 1, the first adapter component 1, the second adapter component 2 and the intake pipe 105 can be supported and the first adapter component 1 and the intake pipe 105 can be limited by means of the same position of the supporting and limiting component 4, thereby reducing the design complexity of the supporting and limiting component 4, reducing the number of components of the supporting and limiting component 4, and reducing the maintenance cost of the first adapter component 1, the intake pipe 105 and the supporting and limiting component 4.

[0053] Optionally, there may be multiple stoppers 41, and the multiple stoppers 41 may be arranged at intervals. Such a design is because the process tube 102 may be provided with multiple air inlet pipes 105 and multiple first adapter components 1 corresponding to the multiple air inlet pipes 105, and the multiple stoppers 41 may be matched with the matching structures 122 of the multiple first adapter components 1 in a one-to-one manner, so that the multiple first adapter components 1 and the multiple air inlet pipes 105 can be limited in position by the multiple stoppers 41 in a one-to-one manner.

[0054] like Figure 2 and Figure 4As shown, in one embodiment of the utility model, the support and limiting component 4 may also include a support frame 42 and a fastening nut 43, the limiting component 41 may include a limiting bolt, the matching structure 122 may include a limiting groove adapted to the head of the limiting bolt, the support frame 42 is arranged in the base 101, and is provided with a through hole for the rod of the limiting bolt to pass through, and the fastening nut 43 is threadedly connected to the rod of the limiting bolt.

[0055] The limiting bolt has a head and a rod, the radial dimension of the head is larger than the radial dimension of the through hole, that is, the head cannot pass through the through hole, the rod has an external thread, and the fastening nut 43 has an internal thread. In practical applications, the limiting bolt can be fastened to the support frame 42 by passing the rod of the limiting bolt through the through hole and positioning the head on the side of the support frame 42 facing the first adapter component 1, and then threading the fastening nut 43 with the rod of the limiting bolt, and screwing the fastening nut 43 to the side of the support frame 42 facing away from the first adapter component 1. After the first adapter component 1 and the air inlet pipe 105 are placed as a whole from outside the base 101 into the base 101 and the process pipe 102, the head of the limiting bolt can be located in the limiting groove in the base 101, that is, the head of the limiting bolt is matched with the limiting groove, so that the limiting groove limits the position of the limiting bolt head, and the first adapter component 1, the second adapter component 2 and the air inlet pipe 105 are limited, thereby restricting the first adapter component 1, the second adapter component 2 and the air inlet pipe 105 from moving toward the base 101 and the process pipe 102.

[0056] Optionally, the support limiting component 4 may abut against the bottom of the first connecting member 12 , and the limiting groove may be provided at the bottom of the first connecting member 12 .

[0057] Optionally, the limiting groove may be a U-shaped groove, and a side opening of the limiting groove may be located on a side of the first adapter component 1 away from the second adapter component 2 .

[0058] In this way, the head of the limiting bolt can be limited by virtue of the side inner wall of the limiting groove located on the side of the first adapter component 1 close to the second adapter component 2 abutting against the edge of the head of the limiting bolt.

[0059] like Figure 2 and Figure 4 As shown, in one embodiment of the utility model, the support and limiting component 4 may also include a third connecting member 44 and a fourth connecting member 45, the support frame 42 may be provided with a second connecting through hole, the third connecting member 44 is connected to the base 101, and the third connecting member 44 is provided with a first connecting structure, part of the fourth connecting member 45 can pass through the second connecting through hole, part of it can be offset against the second connecting through hole, and the part of the fourth connecting member 45 that can pass through the second connecting through hole is provided with a second connecting structure that can cooperate with the first connecting structure.

[0060] Specifically, in actual applications, the base 101 can be ring-shaped, a bottom plate can be provided at the bottom of the base 101, and the bottom plate can be detachably connected to the base 101, the process tube 102 can include a process inner tube 1021 and a process outer tube 1022, the semiconductor process equipment 100 can also include a support ring 104, the process inner tube 1021 is arranged on the base 101, the process outer tube 1022 is arranged on the base 101, and is sleeved on the outside of the process inner tube 1021, the support ring 104 can be arranged in the ring of the base 101, and abut against the bottom of the process inner tube 1021, for supporting the process inner tube 1021, the second adapter component 2 can be arranged horizontally through the base 101, the first adapter component 1 can be at least partially vertically arranged in the ring of the base 101, the air inlet pipe 105 can be vertically arranged inside the process inner tube 1021, and the wafer boat 300 can be vertically placed inside the process inner tube 1021.

[0061] A third connecting threaded hole 1041 may be provided at the bottom of the support ring 104, and an external thread that can be threadedly connected to the third connecting threaded hole 1041 may be provided at the top of the third connecting member 44. By threading the external thread at the top of the third connecting member 44 to the third connecting threaded hole 1041, the third connecting member 44 can be connected to the base 101. The radial dimension of the bottom of the third connecting member 44 can be greater than the radial dimension of the second connecting through hole, so that the bottom of the third connecting member 44 can be against the top surface of the support frame 42, the top of the fourth connecting member 45 can pass through the second connecting through hole, and the top of the fourth connecting member 45 can be provided with an external thread (as a second connecting structure) that can be threadedly connected to the second connecting threaded hole 441 (as a first connecting structure), the radial dimension of the bottom of the fourth connecting member 45 can be greater than the radial dimension of the second connecting through hole, so that the bottom of the fourth connecting member 45 can be against the bottom of the support frame 42, by passing the top of the fourth connecting member 45 through the second connecting through hole and threading the top of the fourth connecting member 45 with the second connecting threaded hole 441, the support frame 42 can be hung on the bottom of the support ring 104 and connected to the support ring 104, so that the support frame 42 is set in the base 101.

[0062] Optionally, the number of third connecting members 44, the number of fourth connecting members 45 and the number of second connecting through holes can all be two, and the two third connecting members 44 are connected to the base 101 at intervals, and in the direction of the interval between the two third connecting members 44, the two second connecting through holes are arranged one-to-one on opposite sides of the support frame 42, and the side of the two second connecting through holes facing away from the support frame 42 is open, and the two fourth connecting members 45 pass through the two second connecting through holes one-to-one and are threadedly connected to the two third connecting members 44 one-to-one.

[0063] By connecting the two third connecting members 44 to the support ring 104 at intervals, and passing the tops of the two fourth connecting members 45 through the two second connecting through holes one by one, and making the tops of the two fourth connecting members 45 threadedly connected to the two second connecting threaded holes 441 one by one, the support frame 42 can be connected to the support ring 104 with the help of the two fourth connecting members 45, thereby improving the connection stability of the support frame 42.

[0064] In summary, the semiconductor process equipment 100 provided by the embodiment of the utility model can reduce the possibility of collision and scratches between the air inlet pipe 105, the base 101 and the process tube 102 when disassembling and assembling the air inlet pipe 105, and there is no need to perform additional design on the process tube 102, such as an avoidance structure, and can also reduce the parts that need to be disassembled, thereby improving the convenience of disassembly and assembly.

[0065] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A semiconductor process equipment, characterized in that: It includes a base, a process pipe, an air inlet pipe, a first adapter component and a second adapter component. The process pipe is vertically arranged on the base, the air inlet pipe is vertically arranged in the process pipe, and is used to transport process gas into the process pipe. The first adapter component and the second adapter component are detachably connected split structures. At least part of the first adapter component is vertically arranged in the base and connected to the air inlet pipe. The second adapter component is arranged horizontally through the base. The part of the second adapter component located in the base is detachably connected to the first adapter component, and the part of the second adapter component located outside the base is used to connect with an external pipe.

2. The semiconductor process equipment according to claim 1, characterized in that: The first adapter component includes a first connecting piece and a first connecting piece, and the second adapter component includes a second connecting piece and a second connecting piece. The first connecting piece is connected to the first connecting piece and is connected to the intake pipe. The second connecting piece is connected to the second connecting piece and is used to be connected to the external pipe. The first connecting piece and the second connecting piece are detachably connected via the first connecting piece and the second connecting piece.

3. The semiconductor process equipment according to claim 2, characterized in that: A first channel and a second channel that are interconnected are disposed inside the first connecting member. The first channel is for the first connecting member to be inserted into, and the second channel is for the second connecting member to be inserted into.

4. The semiconductor process equipment according to claim 2, characterized in that: The semiconductor process equipment further includes a first threaded connector, the first connector is provided with a first connecting through hole, the second connector is provided with a first threaded connecting hole, and the first threaded connector is used to pass through the first connecting through hole and be threadedly connected with the first threaded connecting hole.

5. The semiconductor process equipment according to claim 4, characterized in that: There are multiple first threaded connectors, and the first connecting through holes are provided on opposite sides of the first connecting member, and the axial direction of the first connecting through hole is parallel to the axial direction of the second connecting member. The side of the first connecting through hole facing away from the first connecting member is an opening, and the first threaded connecting holes are provided on opposite sides of the second connecting member. Multiple first threaded connectors pass through the multiple first connecting through holes in a one-to-one manner and are threadedly connected to the multiple first threaded connecting holes in a one-to-one manner.

6. The semiconductor process equipment according to claim 2, characterized in that: The first connecting piece includes a sleeve and a first adapter tube, the sleeve is sleeved around the first adapter tube, the gap between the inner wall of the sleeve and the outer wall of the first adapter tube is for the intake pipe to be inserted, one end of the first adapter tube can be inserted into the intake pipe to communicate with the intake pipe, and the other end is connected to the first connecting piece.

7. The semiconductor process equipment according to claim 1, characterized in that: The semiconductor process equipment also includes a support and limiting component, which is arranged in the base and can support the first adapter component, the second adapter component and the air inlet pipe by cooperating with the first adapter component and / or the second adapter component, and limit the first adapter component, the second adapter component and the air inlet pipe from moving toward the base and the process pipe.

8. The semiconductor process equipment according to claim 7, characterized in that: The support and limiting component abuts against the bottom of the first adapter component to support the first adapter component, the second adapter component and the air inlet pipe, and a matching structure is provided at the abutment between the first adapter component and the support and limiting component, and a limiting member is provided at the abutment between the support and limiting component and the first adapter component, and the limiting member cooperates with the matching structure to limit the first adapter component, the second adapter component and the air inlet pipe from moving toward the base and the process pipe.

9. The semiconductor process equipment according to claim 8, characterized in that: The support and limiting component also includes a support frame and a fastening nut, the limiting component includes a limiting bolt, the matching structure includes a limiting groove adapted to the head of the limiting bolt, the support frame is arranged in the base, and is provided with a through hole for the rod of the limiting bolt to pass through, and the fastening nut is threadedly connected to the rod of the limiting bolt.

10. The semiconductor process equipment according to claim 9, characterized in that: The support and limiting component also includes a third connecting member and a fourth connecting member, the support frame is provided with a second connecting through hole, the third connecting member is connected to the base, and the third connecting member is provided with a first connecting structure, part of the fourth connecting member can pass through the second connecting through hole, and part of it can be offset against the second connecting through hole, and the part of the fourth connecting member that can pass through the second connecting through hole is provided with a second connecting structure that can cooperate with the first connecting structure.

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