Liquid crystal display module with enhanced antistatic capability
By designing double-layer wiring in the bent area of the LCD display module and adding a large grid copper laying area, the problem of poor shielding effect in the bent area is solved, the anti-static ability and product consistency are improved, and the electrostatic interference is avoided. Conductive cloth leaking problem.
Patent Information
- Application Number
- CN202420930196.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-30
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-04-30
AI Technical Summary
The bending area of existing LCD display modules has poor shielding effect and is easily affected by electrostatic interference, resulting in abnormal display. The material and manual pasting of conductive cloth are high, and there is a hidden danger of missing pasting, affecting product consistency.
The bent area is designed as a double-layer wiring, with a large grid copper laying area on the top floor, which is connected to the copper laying area in the non-bending area to form a shielding layer to improve anti-static ability, avoid static interference, and maintain the appearance of the FPC Unchanged, reduce costs and improve product consistency.
It effectively improves the anti-static ability of the LCD display module, prevents static interference, ensures the stability and consistency of the product, and avoids the problem of conductive cloth leakage.
Smart Images
Figure CN222354191U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of liquid crystal display, in particular to a liquid crystal display module with enhanced antistatic capability. Background Art
[0002] For LCD modules with FPC, the FPC comes out from the binding end of the LCD screen and bends to the back of the backlight. The bending area is designed as a single-layer wiring, with only the bottom layer having wiring, so that the FPC can be as soft as possible and convenient for bending during assembly. However, the shielding effect of this bending area is poor, and the bottom layer wiring is easily affected by external static electricity, resulting in display abnormalities. Usually, in order to achieve a better shielding effect in the FPC bending area, the corresponding area can be covered with conductive cloth, but this operation will be accompanied by the material cost of the conductive cloth, the cost of manual pasting, and there is also a certain risk of missing pasting, which affects the consistency of the product. Utility Model Content
[0003] The purpose of the utility model is to overcome the shortcomings of the prior art and provide a liquid crystal display module which has enhanced antistatic capability by changing the bending area into a double-layer design and providing a shielding structure on the top layer.
[0004] The purpose of this utility model is achieved through the following technical solutions:
[0005] A liquid crystal display module with enhanced antistatic capability comprises a liquid crystal display screen, a backlight, a surface iron frame and an FPC, wherein the FPC is bound from a binding end of the liquid crystal display screen, and is bent to the back side of the backlight via a first bending area and a second bending area of the FPC bending area, and double-layer wiring is provided in a non-bending area and a bending area of the FPC, and a first copper-plated area is provided on the top layer of the bending area, which is connected to a second copper-plated area provided on the top layer of the non-bending area and then grounded.
[0006] Furthermore, the first copper plating area is laid in a large grid and is arranged in the bending area of the first bending zone 0.5 mm away from one end of the FPC binding position to avoid affecting the bending of the FPC.
[0007] Preferably, the copper wire laid in the first copper plating area has a wire thickness of 0.2 mm and a line spacing of 1.0 mm.
[0008] Furthermore, a ground hole forbidden area is set on the first copper-clad area, and the ground hole forbidden area is an area within 0.5 mm at both ends of the second bending area. The first copper-clad area is evenly arranged with ground holes except the ground hole forbidden area, and the ground holes are connected to the GND network of the bottom layer of the FPC.
[0009] Furthermore, the bottom layer routing at the connection between the first copper-poured area and the second copper-poured area adopts a straight line routing.
[0010] Furthermore, the copper-plated grid shape of the second copper-plated area is rectangular, triangular, polygonal, or a combination of the above shapes, and the second copper-plated area is evenly arranged with ground holes near the edge of the first copper-plated area, and the arrangement position of the ground holes corresponds to the position of the ground holes on one side of the first copper-plated area connecting the second copper-plated area.
[0011] Preferably, the first copper-plated area and the second copper-plated area are the same copper foil layer.
[0012] The utility model changes the bending area into a double-layer design, adds a large grid copper on the top layer, connects with the top copper in the non-bending area, and connects to the GND network to form a shielding layer. A better shielding effect can be obtained, thereby improving the anti-static ability and effectively protecting the bottom wiring from interference. Since this structure is adopted, the appearance of the FPC does not change, so there is no impact on the cost, and the product consistency is higher, and problems such as conductive cloth missing will not occur. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0014] Figure 1 Schematic diagram of the structure of a liquid crystal display module for enhancing antistatic ability
[0015] Figure 2 Schematic diagram of the routing layer in the FPC bending area of the LCD module to enhance the anti-static ability;
[0016] Figure 3 This is a schematic diagram of the connection between the first and second copper areas (the bottom layer routing is omitted);
[0017] Figure 4 Schematic diagram of the ground hole prohibited area in the FPC bending area. DETAILED DESCRIPTION
[0018] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the relevant drawings. The drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood.
[0019] It should be noted that the terms “first”, “second” and similar expressions used in this document are only for illustrative purposes and do not represent the only implementation methods.
[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0021] See also Figure 1 , Figure 2 The utility model discloses a liquid crystal display module with enhanced antistatic ability, comprising a liquid crystal display screen 1, a backlight 2, a surface iron frame 3 and an FPC 4. The FPC 4 is bound to the binding position of the liquid crystal display screen, and is bent to the back of the backlight 2 through the first bending area 41 and the second bending area 42 of the FPC bending area. The non-bending area and the bending area of the FPC 4 have double-layer routing. The top layer of the bending area is provided with a first copper-plated area 43, which is connected to the second copper-plated area 44 provided on the top layer of the non-bending area and then grounded.
[0022] This implementation changes the traditional single-layer routing design of the FPC4 bending area to a double-layer routing design, adds copper plating on the top layer of the bending area, connects with the top copper plating of the non-bending area, and is grounded to form a shielding layer, which can achieve a better shielding effect, thereby shielding the interference received by the bottom wiring 47 and improving the overall anti-static ability of the component. The application of this structure will not change the appearance of FPC4 fundamentally, and has basically no impact on the cost, and can make the product more consistent, and will not cause problems such as conductive cloth missing.
[0023] See also Figure 3 , Figure 4 In the embodiment, the first copper plating area 43 is laid with a large grid and is located in the bending area of the first bending area 41 0.5 mm away from one end of the FPC 4 binding position. In this way, the design of large-grid copper plating increases the flexibility of the circuit and reduces stress concentration, so that the circuit can better disperse stress when bending, avoiding circuit breakage or performance degradation. The first copper plating area 43 is at a certain distance from the first bending area 41 to avoid affecting the binding and bending of the FPC.
[0024] In this embodiment, the copper wires laid in a large grid in the first copper plating area 43 have a wire thickness of 0.2 mm and a line spacing of 1.0 mm.
[0025] In this embodiment, the first copper-plated area 43 is set as a ground hole forbidden area 48 within 0.5 mm at both ends of the second bending area 42. Since there is a risk of ground holes breaking when entering the bending area, the position of the ground holes needs to avoid entering the second bending area 42. Except for the ground hole forbidden area 48, the first copper-plated area is evenly arranged with ground holes 45. The ground holes 45 are connected to the GND network of the bottom layer of FPC4 to avoid the formation of isolated copper skin, thereby better realizing electrostatic shielding.
[0026] In this embodiment, the bottom layer wiring 47 at the connection between the first copper-plated area 43 and the second copper-plated area 44 is a straight line, and sharp angles or overly concentrated lines are avoided here, which can reduce the influence of stress on the connection.
[0027] Since the non-bending area does not need to consider the influence of bending stress, the shape of the second copper plating area 44 can be flexible and diverse. In this embodiment, a rectangle, a triangle, a polygon, or a combination of the above shapes can be used.
[0028] In this embodiment, ground holes 46 are evenly arranged on the edge of the second copper-plated area 44 near the first copper-plated area 43, and the positions of the ground holes 46 correspond to the positions of the ground holes 45 on the side where the first copper-plated area 43 is connected to the second copper-plated area 44. Therefore, after the first copper-plated area 43 and the second copper-plated area 44 are connected, static electricity can be grounded, thereby improving the shielding capability of the entire copper-plated area after the connection.
[0029] In this embodiment, the first copper plating area 43 and the second copper plating area 44 are the same copper foil layer, but are made into two copper plating area shapes in different regions, which can improve efficiency and reduce costs, and avoid poor connection between the two regions.
[0030] It should be noted that, in other embodiments, the first copper-plated area 43 and the second copper-plated area 44 may be copper foils of equal width and thickness, which become one after being connected, so as to ensure smooth transmission of current between the copper-plated areas while maintaining the overall structure and stability of the circuit board.
[0031] In summary, the utility model changes the bending area into a double-layer design, adds a large grid copper on the top layer, connects with the top copper of the non-bending area, connects to the GND network, and forms a shielding layer, which can obtain a better shielding effect, thereby improving the anti-static ability.
[0032] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A liquid crystal display module with enhanced antistatic capability, comprising a liquid crystal display screen, a backlight, a surface iron frame and an FPC, characterized in that: The FPC is bound to the binding end of the liquid crystal display screen, and is bent to the back of the backlight through the first bending area and the second bending area of the FPC bending area. The non-bending area and the bending area of the FPC are double-layered. A first copper-plated area is provided on the top layer of the bending area, which is connected to the second copper-plated area on the top layer of the non-bending area and then grounded.
2. The liquid crystal display module with enhanced antistatic capability according to claim 1, characterized in that: The first copper plating area is laid using a large grid.
3. The liquid crystal display module with enhanced antistatic capability according to claim 2, characterized in that: The first copper plating area is arranged in the bending area of the first bending area 0.5 mm away from one end of the FPC binding position.
4. The liquid crystal display module with enhanced antistatic capability according to claim 3, characterized in that: The copper wire laid in the first copper-plating area has a wire thickness of 0.2 mm and a line spacing of 1.0 mm.
5. The liquid crystal display module with enhanced antistatic capability according to claim 4, characterized in that: A ground hole prohibited area is provided on the first copper-plated area, and the ground hole prohibited area is an area within 0.5 mm at both ends of the second bending area.
6. The liquid crystal display module with enhanced antistatic capability according to claim 5, characterized in that: The first copper-plated area is evenly provided with ground holes except the ground hole prohibited area, and the ground holes are connected to the GND network of the bottom layer of the FPC.
7. The liquid crystal display module with enhanced antistatic capability according to claim 6, characterized in that: The bottom layer routing at the connection between the first copper-poured area and the second copper-poured area adopts a straight line routing.
8. The liquid crystal display module with enhanced antistatic capability according to claim 7, characterized in that: Ground holes are evenly arranged in the second copper-poured area near the edge of the first copper-poured area, and the positions of the ground holes correspond to the positions of the ground holes on one side of the first copper-poured area connected to the second copper-poured area.
9. The liquid crystal display module with enhanced antistatic capability according to claim 8, characterized in that: The first copper-plated area and the second copper-plated area are made of the same copper foil.