High-density calculation exchange fusion board card and electronic equipment

Abstract

According to the high-density calculation exchange fusion board card and the electronic equipment provided by the utility model, the processor, the network communication chip, the Ethernet controller chip, the embedded bridge chip, the input / output chip and the core exchange chip are integrated together, so that the board card can realize a calculation function and an exchange function at the same time, the product size is reduced, and the cost is reduced. The distance between the second power supply module and the Ethernet control chip on the PCB is set to be smaller than the preset distance, and the copper-clad layer is arranged, so that the data exchange rate and the heat dissipation effect of the board card are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic circuits, in particular to a high-density computing exchange fusion board and electronic equipment. Background Art

[0002] Currently, there are 6U-VPX computing boards, 6U-VPX switching boards, and 6U-VPX computing storage boards on the market. 6U-VPX computing boards, 6U-VPX switching boards, and 6U-VPX computing storage boards are all board types designed based on the VPX specification. 6U-VPX computing boards mainly include high-performance processors such as FPGA and DSP, as well as memory and interfaces such as DDR3 / 4, Flash, and RapidIO, which can provide powerful computing and data processing capabilities. 6U-VPX switching boards mainly provide high-speed data transmission and switching capabilities, usually using high-performance Ethernet, Fiber Channel and other interfaces, which can meet the needs of large-scale data transmission and switching. 6U-VPX computing storage boards combine computing and storage functions, and can provide high-performance computing and data storage capabilities at the same time. This type of board usually contains high-performance FPGA, DSP, memory and other components, which can meet the application requirements of data processing and storage at the same time.

[0003] These 6U-VPX boards are designed and packaged independently. There is no 6U-VPX board with integrated computing and switching. Due to the board size and EMC (I), the packaging and quantity of components of standard 6U-VPX boards are limited. The power input and output on the board, especially the power input of the chip, requires a large number of capacitors of different specifications to filter and store energy to obtain the cleanest power, which will occupy more usable area and cause the product size to be too large. Utility Model Content

[0004] In view of this, an embodiment of the utility model provides a high-density computing switch fusion board and an electronic device to provide a high-density computing switch fusion board with a smaller size.

[0005] To achieve the above purpose, the present invention provides the following technical solutions:

[0006] A high-density computing switching fusion board, comprising:

[0007] processor;

[0008] A network communication chip, an Ethernet controller chip, an embedded bridge chip, an input / output chip and a core switching chip connected to the processor;

[0009] A core switching chip connected to the network communication chip and the Ethernet controller chip;

[0010] A first power supply module, the first power supply module is used to supply power to the processor and the embedded bridge chip;

[0011] A second power supply module, the second power supply module is used to supply power to the core switching chip;

[0012] A power control chip connected to the first power module and the second power module;

[0013] Among them, the distance between the second power supply module and the Ethernet controller chip power supply on the PCB circuit board is less than a preset distance, and a copper cladding layer is provided on the PCB circuit board, and the copper cladding layer is obtained by copper cladding the first power supply and the second power supply.

[0014] Optionally, in the above-mentioned high-density computing switching fusion board, the copper clad layer is arranged on the first layer of the PCB circuit board.

[0015] Optionally, in the above-mentioned high-density computing switching fusion board, the copper clad layer and the high-speed signal line are isolated by a ground layer.

[0016] Optionally, in the above-mentioned high-density computing switch fusion board, the power devices on the high-density computing switch fusion board are provided with a heat dissipation structure.

[0017] Optionally, in the above-mentioned high-density computing switch fusion board, the heat dissipation structure is a heat dissipation slot or a heat dissipation hole.

[0018] Optionally, the high-density computing switching fusion board further includes:

[0019] A graphics card interface, a Type-C interface and a sound card interface connected to the embedded bridge chip.

[0020] Optionally, the high-density computing switch fusion board further includes:

[0021] An optical module connected to the core switching chip.

[0022] Optionally, in the above-mentioned high-density computing switching fusion board, the model of the processor is D2000, the model of the network communication chip is PHY, the model of the Ethernet controller chip is WX1820, the model of the embedded bridge chip is X100, the model of the input and output chip is SIT3490EX2, the model of the core switching chip is CTC7132, the model of the first power module is MAC1625, the model of the second power module is AST4630CB, and the model of the power control chip is CPLD.

[0023] An electronic device is integrated with any one of the high-density computing switch fusion boards described above.

[0024] Based on the above technical scheme, the above scheme provided by the embodiment of the utility model integrates the processor, network communication chip, Ethernet controller chip, embedded bridge chip, input and output chip and core switching chip together by setting a high-density computing and switching fusion board, so that the board can realize computing function and switching function at the same time, reducing the product size, and by setting the distance between the second power supply module and the Ethernet controller chip power supply on the PCB circuit board to be less than a preset distance, and setting a copper cladding layer, the data exchange rate and heat dissipation effect of the board are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0026] Figure 1 A schematic diagram of the structure of a high-density computing switch fusion board disclosed in an embodiment of the present application;

[0027] Figure 2 A schematic diagram of the structure of a high-density computing switch fusion board disclosed in another embodiment of the present application;

[0028] Figure 3 A schematic diagram of the structure of a high-density computing switch fusion board disclosed in another embodiment of the present application;

[0029] Figure 4 This is a schematic diagram of the structure of a high-density computing switch fusion board disclosed in another embodiment of the present application. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] The present application provides a high-density computing switch fusion board to reduce product size.

[0032] For details, see Figure 1 and Figure 2The high-density computing switching fusion board disclosed in the embodiment of the present application can be a 6U-VPX board. The board can include: a processor 1, a network communication chip 2, an Ethernet controller chip 3, an embedded bridge chip 4, an input and output chip 5, a core switching chip 6, a first power module 7, a second power module 8 and a power control chip 9. These components can be integrated on the same PCB board.

[0033] Regarding processor 1, the processor 1 can specifically adopt a D2000 processor model, which has the following characteristics: integrated 8 high-performance processor cores FTC663, using a random four-issue superscalar pipeline, compatible with the 64-bit ARMV8 instruction set and supporting ARM64 and ARM32 execution modes. Supports single-precision, double-precision floating-point operation instructions and ASIMD processing instructions, and supports hardware virtualization. The maximum main frequency is 2.3GHz, with a built-in cryptographic acceleration engine and an integrated system-level security mechanism, which can meet the performance requirements and security and trust requirements in complex application scenarios. Supports commercial and industrial quality levels. Suitable for building desktop terminals, portable terminals, lightweight servers and embedded low-power products with higher performance, energy efficiency and security needs.

[0034] The network communication chip 2, Ethernet controller chip 3, embedded bridge chip 4 and input / output chip 5 are connected to the processor 1;

[0035] Regarding the network communication chip 2, the network communication chip 2 can adopt a PHY chip, which refers to a physical layer chip. The PHY chip is an interface for connecting data between devices. It is responsible for transmitting data from the device to the network, and is also responsible for transmitting data from the network to the device. The main function of the PHY chip is to realize data transmission and conversion, such as converting digital signals into analog signals, or converting analog signals into digital signals, so that devices can communicate with each other.

[0036] Regarding the Ethernet controller chip 3, the Ethernet controller chip 3 can adopt the WX1820 chip. The WX1820 chip is a 10 Gigabit Ethernet adapter chip. The WX1820 chip has 2 10G network interfaces, a PCIe Gen3 x8 host interface, and supports SFI / KR / KX4 / XAUI / SGMII1.

[0037] Regarding the embedded bridge chip 4, the embedded bridge chip 4 can adopt the X100 bridge chip. The X100 chip is a cloud AI chip that adopts a 7nm process, has 256 AI computing cores, supports multiple computing precisions such as FP32, FP16, INT8, and can support up to 2.5Gbps AI acceleration network. It supports AI application software to be directly compiled and deployed on the X100 chip to achieve full-process AI application development. The X100 bridge chip integrates graphics processing acceleration GPU, video decoding VPU, display control interface DisplayPort, and video memory controller. These functions enable the bridge chip to provide efficient graphics processing and video decoding capabilities to meet the needs of various application scenarios.

[0038] Regarding the input-output chip 5, the input-output chip 5 may adopt the SIT3490E X2 chip, which is a full-duplex, low-power full RS-485 transceiver that complies with RS-485 / RS-422 standard requirements 1. The chip has excellent ESD release capability, HBM reaches +15kV, the operating voltage range is 3.0V to 5.5V, and has functions such as current limiting P rotation, overvoltage protection, and control port hot-swap input.

[0039] The core switching chip 6 is connected to the network communication chip 2 and the Ethernet controller chip 3. The core switching chip 6 can adopt a CTC7132 chip, which can realize the core function of data exchange. The CTC7132 chip adopts an ARM Cortex-A9 core with a main frequency of 1.2GHz, supports multiple multimedia formats, and has a powerful processing capability. Figure 4 , the core switching chip can also be connected to an optical module, and the optical module can include an optical module (NTR-A631IGC) or an optical module (10G), wherein the two have different rates and types. The rate of the optical module NTR-A631IGC is 400G. The rate of the optical module 10G is 10G. The type of the optical module NTR-A631IGC is SFP+. The type of the optical module 10G is XENPAK. The optical module is composed of optoelectronic devices, functional circuits, and optical interfaces, and the optoelectronic devices include two parts, the transmitting and receiving parts. Simply put, the function of the optical module is to convert the electrical signal into an optical signal at the transmitting end, and after being transmitted through the optical fiber, the receiving end converts the optical signal into an electrical signal.

[0040] Regarding the first power module 7, the first power module 7 is used to supply power to the processor 1 and the embedded bridge chip 4. The first power module 7 can adopt a MAC1625 power module. The MAC1625 power module is a common power module, which is usually used to provide a stable DC voltage for various electronic devices. This power module has many advantages, such as high efficiency, high reliability, easy installation and use, etc. The rated power of the MAC1625 power module is usually between 10W and 150W, depending on its design and application. It usually adopts push-pull, single-ended, half-bridge or full-bridge transistor connection mode to meet the needs of different applications. The MAC1625 power module usually has high efficiency and stability, and can provide a stable output voltage under different working conditions. It also has overheat protection and overcurrent protection functions to ensure that the device will not be damaged under abnormal circumstances. In addition, the MAC1625 power module also has the benefits of easy installation and use. It usually adopts standard interfaces and connection methods, which can be easily connected with other electronic devices. At the same time, it also has a small size and weight, which is convenient for use in compact electronic devices.

[0041] Regarding the second power supply module 8, the second power supply module 8 is used to supply power to the core switching chip 6; the second power supply module 8 can be an AST4630CB power supply module, which is a switching regulator with multiple advantages and characteristics. It is a power supply module that is generally used to provide a stable DC voltage for various electronic devices. This power supply module has the advantages of high efficiency, high reliability, easy installation and use. The rated power of the AST4630CB power supply module is generally between 10W and 150W, depending on its design and application. It usually adopts push-pull, single-ended, half-bridge or full-bridge transistor connection methods to meet the needs of different applications. In addition, the AST4630CB power supply module also has overheat protection and overcurrent protection functions to ensure that the equipment will not be damaged under abnormal circumstances. At the same time, it also has the benefits of easy installation and use.

[0042] Regarding the power control chip 9, the power control chip 9 is used to control the power-on and power-off states of the first power module and the second power module, as well as the output power of the first power module and the second power module. In the technical solution disclosed in this embodiment, the power control chip 9 can adopt a CPLD chip. The CPLD (complex programmable logic device) chip is an integrated circuit used to realize various complex logic functions. Compared with other types of chips such as microprocessors or FPGAs, CPLD chips have higher integration and lower power consumption, so they are widely used in many fields. CPLD chips are usually composed of multiple logic gates and triggers, and their internal logic circuits can be configured by programming to realize various digital circuit functions. Due to its high programmability and flexibility, CPLD chips can be used to realize various digital signal processing, communication, control, storage and other applications. When selecting and using CPLD chips, factors such as performance, power consumption, reliability, and cost need to be considered. At the same time, it is also necessary to select and configure according to specific application requirements to ensure that it can meet the requirements of the system.

[0043] During the design, the distance between the second power supply module and the Ethernet controller chip power supply on the PCB circuit board is less than a preset distance, and a copper clad layer is provided on the PCB circuit board, and the copper clad layer is obtained by copper cladding the first power supply and the second power supply.

[0044] In the technical solution disclosed in the above embodiment of the present application, the processor 1 can be interconnected with the core switching chip 6 and the network communication chip 2 through the R(S)GMII signal, which is used as the gigabit network of the CPU. The processor 1 is connected to the WX1820 through the PCIE bus, and then interconnected with the core switching chip 6 through the 10G-KR signal. The routing method of the PCIE bus can adopt the backplane routing method, so there is no network port. The remaining ports of the core switching chip 6 are interconnected with the external network port signal through VPX as a conversion of the network signal.

[0045] The processor 1 and the embedded bridge chip 4 are used as computing modules in the high-density computing exchange fusion board. The processor 1 leads to a 232 serial port through the UART bus for external debugging. The embedded bridge chip 4 and the processor 1 are interconnected through PCIE. Figure 3 The embedded bridge chip 4 is also connected to a graphics card interface, a USB interface and a sound card interface. The graphics card interface may be a DVI X2 interface, the USB may be a USB X4 interface, and the sound card interface may be a USB sound card interface, which is connected to the LR X2 interface and the MIC X2 interface. DVI X2 is two DVI interfaces, DVI (Digital Visual Interface), i.e., digital video interface.

[0046] The technical solution disclosed in the above embodiment of the present application, the switching module (core switching chip 6) and the computing module (processor 1 and embedded bridge chip 4) respectively use the first power module 7 and the second power module 8 as independent power supplies. As long as the two are not powered off at the same time, the restart or power off of any module (switching module and computing module) will not affect the other module. When laying out the PCB, the second power module 8 can be set near the core switching chip 6 so that the distance between the two is less than the preset value, and the load capacity of the board can be improved by setting a copper cladding layer. This setting method can enable the chip to dissipate heat through the ground layer of the PCB board, thereby improving the heat dissipation effect. Furthermore, in order to improve the transmission quality of signals in the board, the copper cladding layer can be set on the first layer of the PCB board. When some high-speed signal lines in the board need to pass through the first power module and the second power module due to design requirements, the copper cladding layers corresponding to the first power module and the second power module can be isolated from the high-speed signal lines by the ground layer. For example, in this solution, the copper cladding layer can be set on the 6th layer of the PCB. At this time, the ground layer can be used to isolate the copper cladding layer and the high-speed signal line to avoid the signal in the high-speed signal line from being interfered by the magnetic field of the power module.

[0047] In the technical solution disclosed in the present application, the first power module and the second power module are controlled by a power control chip, and the power control chip has an EN (enable) pin corresponding to the first power module and the second power module. The power control chip can achieve the purpose of controlling the power on and off of the first power module and the second power module by controlling the state of this pin, thereby independently controlling the switching module and the computing module. For example, when controlling the switching module to work, if you want to shut down the computing module, you can directly control the EN (enable) pin corresponding to the first power module through the power control chip to power off. For example, you can input the command sudo poweroff to the power control chip, and when the power control chip obtains the command, it will control the EN (enable) pin corresponding to the first power module to power off. When the computing module is required to work, you can control the EN (enable) pin corresponding to the first power module in the power control chip to power on.

[0048] Furthermore, in order to improve the heat dissipation effect of the board, in this embodiment, in order to ensure the reliability of the board, a heat dissipation structure can be set for the power device on the cold plate of the board to improve the heat dissipation efficiency of the board to ensure that the board has a good heat dissipation effect. The heat dissipation structure includes but is not limited to setting a heat dissipation groove or heat dissipation hole on the power device.

[0049] Corresponding to the above solution, the present application also discloses an electronic device, which is integrated with any of the high-density computing switch fusion boards described above.

[0050] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0051] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A high-density computing switching fusion board, characterized in that: include: processor; A network communication chip, an Ethernet controller chip, an embedded bridge chip, an input / output chip and a core switching chip connected to the processor; A core switching chip connected to the network communication chip and the Ethernet controller chip; A first power supply module, the first power supply module is used to supply power to the processor and the embedded bridge chip; A second power supply module, the second power supply module is used to supply power to the core switching chip; A power control chip connected to the first power module and the second power module; Among them, the distance between the second power supply module and the Ethernet controller chip power supply on the PCB circuit board is less than a preset distance, and a copper cladding layer is provided on the PCB circuit board, and the copper cladding layer is obtained by copper cladding the first power supply and the second power supply.

2. The high-density computing switching fusion board according to claim 1, characterized in that: The copper clad layer is arranged on the first layer of the PCB circuit board.

3. The high-density computing switching fusion board according to claim 1, characterized in that: The copper clad layer is isolated from the high-speed signal line by a ground layer.

4. The high-density computing switching fusion board according to claim 1, characterized in that: The power devices on the high-density computing switching fusion board are provided with a heat dissipation structure.

5. The high-density computing switching fusion board according to claim 4, characterized in that: The heat dissipation structure is a heat dissipation slot or a heat dissipation hole.

6. The high-density computing switching fusion board according to claim 1, characterized in that: Also includes: A graphics card interface, a Type-C interface and a sound card interface connected to the embedded bridge chip.

7. The high-density computing switching fusion board according to claim 1, characterized in that: Also includes: An optical module connected to the core switching chip.

8. The high-density computing switching fusion board according to claim 1, characterized in that: The model of the processor is D2000, the model of the network communication chip is PHY, the model of the Ethernet controller chip is WX1820, the model of the embedded bridge chip is X100, the model of the input and output chip is SIT3490EX2, the model of the core switching chip is CTC7132, the model of the first power module is MAC1625, the model of the second power module is AST4630CB, and the model of the power control chip is CPLD.

9. An electronic device, characterized in that: A high-density computing switch fusion board card according to any one of claims 1 to 8 is integrated.

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