Micro-electronic micro-connection deep-cavity solder ball bonding chopper with high bonding efficiency

Abstract

The utility model discloses a microelectronic micro-connection deep-cavity solder ball bonding chopper with high bonding efficiency, which relates to the technical field of bonding choppers and comprises a chopper body provided with a wire penetrating hole penetrating through the chopper body. The wire penetrating hole is composed of a circular-truncated-cone-shaped wire inlet hole located in the tail portion of the cutter body, a wire outlet hole located in the head portion of the cutter body and a middle hole located between the wire inlet hole and the wire outlet hole, and the large-diameter end of the wire inlet hole is far away from the middle hole. According to the utility model, through the arrangement of the circular truncated cone-shaped wire inlet hole, the aperture of the wire inlet end of the wire penetrating hole is enlarged, so that the end part of a gold wire or an aluminum wire can penetrate into the wire penetrating hole more conveniently during wire penetrating, and the working efficiency of workers is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of welding wedges, in particular to a microelectronic micro-connection deep cavity welding ball welding wedge with high bonding efficiency. Background Art

[0002] As a welding needle of the bonding machine, the welding knife is suitable for the welding and packaging of diodes, triodes, thyristors, LEDs, surface acoustic waves, IC chips and other circuits. It is mainly used in the production process of gold wire, silver wire, alloy wire and copper wire of LED and semiconductor automatic ultrasonic ball welding machines.

[0003] In deep cavity welding and ball welding, the welding splitter has a long blade (for example, 16mm or 19mm in length), and the wire is generally fed into the welding splitter by blowing compressed air until the wire passes through the welding splitter. The existing welding splitter has a small wire inlet, which makes it inconvenient to thread the wire and affects the processing efficiency.

[0004] In view of this, there is an urgent need for a microelectronic micro-connection deep cavity ball bonding wedge with high bonding performance to solve the above problems. Utility Model Content

[0005] In view of the problems existing in the prior art, the utility model solves the problems with the following technical structure.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A microelectronic micro-connection deep cavity ball welding wedge with high bonding efficiency comprises: a knife body, a wire threading hole penetrating the knife body is provided on the knife body, the wire threading hole is composed of a truncated cone-shaped wire inlet hole located at the tail of the knife body, a wire outlet hole located at the head of the knife body, and a middle hole located between the wire inlet hole and the wire outlet hole, and a large-diameter end of the wire inlet hole is far away from the middle hole.

[0008] It is further characterized in that

[0009] The diameter of the end of the wire feeding hole away from the middle hole is 1.2 mm to 1.3 mm, and the diameter of the end of the wire feeding hole close to the middle hole is 0.7 mm to 0.8 mm.

[0010] The axial length of the wire feeding hole is 0.4 mm to 0.5 mm.

[0011] The caliber of the middle hole is the same as the caliber of the wire feeding hole close to one end of the middle hole.

[0012] The threading hole also includes a truncated cone-shaped transition hole between the middle hole and the wire outlet hole. The caliber of the transition hole close to the middle hole is the same as that of the middle hole, and the caliber of the transition hole away from the middle hole is the same as that of the wire outlet hole.

[0013] The outer diameter of the knife body is 1.5 mm to 1.6 mm.

[0014] The head of the knife body is in the shape of a truncated cone, and the taper of the head of the knife body 1 is 30 degrees.

[0015] One end of the cutter body away from the wire feeding hole is roughened.

[0016] The edges of the cutter body at both ends of the wire feeding hole are both provided with chamfers.

[0017] The radius of the chamfer is 0.1 mm.

[0018] The above structure of the utility model can achieve the following beneficial effects:

[0019] By providing a truncated cone-shaped wire-entry hole and enlarging the diameter of the wire-entry port of the wire-entry hole, it is easier to insert the end of the gold wire or the aluminum wire into the wire-entry hole during wire-entry, thereby improving the work efficiency of the staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of this embodiment;

[0021] Figure 2 is a structural cross-sectional view of this embodiment;

[0022] Figure 3 for Figure 2 A schematic diagram of the structure enlargement at the center A;

[0023] Figure 4 This is a structural schematic diagram of another viewing angle of this embodiment;

[0024] Figure 5 for Figure 3 A magnified schematic diagram of the structure at point B in the middle.

[0025] In the figure: 1. knife body; 2. wire inlet hole; 3. wire outlet hole; 4. middle hole; 5. transition hole. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0027] It should be noted that the terms "including" and "having" and any variations thereof in the specification and claims of the present invention and the above-mentioned drawings are intended to cover non-exclusive inclusions. For example, a process, method, apparatus, product or equipment comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0028] The following is combined with Figure 1-5 This application is described in further detail.

[0029] like Figure 1-2 As shown, a microelectronic micro-connection deep cavity solder ball welding wedge with high bonding efficiency comprises: a blade body 1, a wire threading hole penetrating the blade body is provided on the blade body 1, the wire threading hole is composed of a truncated cone-shaped wire inlet hole 2 located at the tail of the blade body 1, a wire outlet hole 3 located at the head of the blade body 1, and a middle hole 4 located between the wire inlet hole 2 and the wire outlet hole 3, the end of the wire inlet hole 2 with a large diameter is far away from the middle hole 4, the wire threading hole also comprises a truncated cone-shaped transition hole 5 located between the middle hole 4 and the wire outlet hole 3, the diameter of the transition hole 5 close to the middle hole 4 is the same as the diameter of the middle hole 4, the diameter of the transition hole 5 away from the middle hole 4 is the same as the diameter of the wire outlet hole 3, and the diameter of the middle hole 4 is the same as the diameter of the wire inlet hole 2 close to the middle hole 4.

[0030] Based on the above structure, by setting a truncated cone-shaped wire feeding hole 2, the diameter of the wire feeding port of the wire feeding hole is enlarged, making it easier to insert the end of the gold wire or aluminum wire into the wire feeding hole during wire threading, thereby improving the work efficiency of the staff.

[0031] Among them, the diameter of the end of the wire feeding hole 2 away from the middle hole 4 is 1.2 mm to 1.3 mm (for example, 1.28 mm), the diameter of the end of the wire feeding hole 2 close to the middle hole 4 is 0.7 mm to 0.8 mm (for example, 0.76 mm), and the axial length of the wire feeding hole 2 is 0.4 mm to 0.5 mm (for example, 0.46 mm).

[0032] The outer diameter of the blade body 1 is 1.5 mm to 1.6 mm (eg 1.58 mm).

[0033] The head of the cutter body 1 is in the shape of a truncated cone, and the taper of the head of the cutter body 1 is 30 degrees.

[0034] In actual use, by setting the head of the blade body 1 to a truncated cone with a taper of 30 degrees, better welding can be performed.

[0035] Among them, Figure 2 and 3 As shown, the edges of the openings at both ends of the wire feeding hole 2 of the cutter body 1 are both provided with chamfers, and the radius of the chamfers is 0.1 mm.

[0036] In actual use, by setting the chamfer, the convenience of the end of the gold wire or aluminum wire passing into the wire threading hole is further improved.

[0037] Among them, Figure 4 and 5 As shown, one end of the cutter body 1 away from the wire feeding hole 2 is roughened.

[0038] In actual use, the end of the blade body 1 is set to a rough surface so that the ball can effectively grasp the aluminum pad and transmit ultrasonic energy, thereby improving the bonding performance and life of the aluminum pad.

[0039] The above are only preferred embodiments of the present application, and the present invention is not limited to the above embodiments. It is understood that other improvements and changes directly derived or associated by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included in the protection scope of the present invention.

Claims

1. A microelectronic micro-connection deep cavity ball welding wedge with high bonding efficiency, characterized in that: include: A knife body (1) is provided with a wire threading hole penetrating the knife body, the wire threading hole comprising a truncated cone-shaped wire inlet hole (2) located at the rear of the knife body (1), a wire outlet hole (3) located at the head of the knife body (1), and a middle hole (4) located between the wire inlet hole (2) and the wire outlet hole (3), wherein the end with a large diameter of the wire inlet hole (2) is far away from the middle hole (4).

2. A microelectronic micro-connection deep cavity ball welding wedge with high bonding efficiency according to claim 1, characterized in that: The diameter of the end of the wire feeding hole (2) away from the middle hole (4) is 1.2 mm to 1.3 mm, and the diameter of the end of the wire feeding hole (2) close to the middle hole (4) is 0.7 mm to 0.8 mm.

3. A microelectronic micro-connection deep cavity ball welding wedge with high bonding efficiency according to claim 2, characterized in that: The axial length of the wire feeding hole (2) is 0.4 mm to 0.5 mm.

4. A microelectronic micro-connection deep cavity ball welding wedge with high bonding efficiency according to claim 2, characterized in that: The caliber of the middle hole (4) is the same as the caliber of the wire feeding hole (2) at one end close to the middle hole (4).

5. A microelectronic micro-connection deep cavity ball welding wedge with high bonding efficiency according to claim 1, characterized in that: The threading hole also includes a truncated cone-shaped transition hole (5) located between the middle hole (4) and the thread outlet hole (3); the caliber of the transition hole (5) at one end close to the middle hole (4) is the same as the caliber of the middle hole (4); and the caliber of the transition hole (5) at one end away from the middle hole (4) is the same as the caliber of the thread outlet hole (3).

6. A microelectronic micro-connection deep cavity ball welding wedge with high bonding efficiency according to claim 1, characterized in that: The outer diameter of the blade body (1) is 1.5 mm to 1.6 mm.

7. A microelectronic micro-connection deep cavity ball welding wedge with high bonding efficiency according to claim 6, characterized in that: The head of the knife body (1) is in the shape of a truncated cone, and the taper of the head of the knife body (1) is 30 degrees.

8. The microelectronic micro-connection deep cavity ball welding wedge with high bonding efficiency according to claim 1, characterized in that: One end of the knife body (1) away from the wire feeding hole (2) is roughened.

9. A microelectronic micro-connection deep cavity ball welding wedge with high bonding efficiency according to claim 1, characterized in that: The edges of the knife body (1) at both ends of the wire feeding hole (2) are chamfered.

10. A microelectronic micro-connection deep cavity ball bonding wedge with high bonding efficiency according to claim 9, characterized in that: The radius of the chamfer is 0.1 mm.

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