Pressing device for QFN chip

Abstract

The utility model belongs to the technical field of chip processing, in particular to a pressing device for a QFN (Quad Flat No-lead) chip, which comprises a support plate, two transverse plates are fixedly arranged on two sides of the support plate, and rollers are movably arranged at the tops of the two transverse plates. When the position of a containing groove in the top of the packaging plate needs to be adjusted, the two connecting rods are pulled in the approaching direction at the same time, then the connecting rods drive the two ejector rods to move, when the ends, away from the springs, of the ejector rods are attached to the inner wall of the arc-shaped groove, pulling of the connecting rods is stopped, the packaging plate is pushed, and one ends of the ejector rods slide in the arc-shaped groove; when the ejector rod moves to the position of the positioning hole, the positioning hole pops up to position the packaging plate, at the moment, the containing groove in the top of the packaging plate corresponds to the multiple pressing blocks, workers do not need to pay attention to the position of the containing groove all the time, the moving speed of the packaging plate can be increased, and the moving accuracy of the containing groove can also be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to a pressing device for a QFN chip. Background Art

[0002] The integration of electronic parts is getting higher and higher, and more and more electronic parts adopt high-integration IC design. At present, QFN is the most commonly used. The specific method of QFN packaging is: pads (copper foil) are provided on the circuit board and the QFN chip, and the two pads are welded together to realize QFN packaging. The double-row pin QFN is a new type of packaging device developed based on the conventional QFN packaging device. It is smaller in size and has more dots. Its development has made the device smaller in size and more powerful in function, providing the necessary material resources for the high-density development of board-level circuits. At present, chips are pressed on circuit boards through pressing equipment. Since the current pressing equipment has the possibility of damaging the chip, patent CN219286344U5 proposes a "pressing device for QFN chips". By setting components such as a pressing block, a spring, a pressing block and a check, during the bonding process, the insertion rod of the pressing block slides along the through hole, and the buffer spring can buffer the pressing process while maintaining the pressing force of the pressing block on the chip, thereby avoiding damage to the chip caused by hard contact between the pressing block and the chip, thereby improving the safety of the chip.

[0003] However, in this scheme, after pressing a batch, the user needs to move the bottom packaging plate to drive the internal materials to move and align with the pressing block before pressing again. When moving, relevant personnel need to pay attention to the placement slots on the packaging plate, which is not only inefficient but also prone to inaccurate placement of the placement slots, resulting in reduced pressing quality. Therefore, a pressing device for QFN chips is proposed. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a pressing device for QFN chips.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a pressing device for QFN chips, comprising a support plate, two horizontal plates are fixedly provided on both sides of the support plate, rollers are movably provided on the tops of the two groups of the horizontal plates, two push rod motors are fixedly provided on the top of the support plate, the same lower pressure plate is fixedly provided on the tops of the two push rod motors, two groups of connecting frames are fixedly provided on the bottom of the pressure block, the same strip plate is fixedly provided between the two groups of connecting frames, a plurality of plug rods are provided on the strip plate, a pressure block is fixedly provided on the bottom of the plug rods, a packaging plate is provided on the top of the support plate, and limiting structures are provided on both sides of the packaging plate.

[0006] As a further description of the above technical solution:

[0007] The limiting structure includes a side strip fixedly mounted on one side of the packaging plate and a limiting card plate fixedly connected to the top of the support plate, a storage hole is provided on the front side of the side strip, a limiting groove is provided on one side of the side strip, a top rod is provided in the storage hole, and a connecting rod is movably provided in the limiting groove.

[0008] As a further description of the above technical solution:

[0009] An arc-shaped groove is arranged on one side of the position-limiting clamping plate, and a plurality of positioning holes are arranged on the inner wall of the arc-shaped groove, and the positioning holes are matched with the ejector rod.

[0010] As a further description of the above technical solution:

[0011] A spring is fixedly arranged in the receiving hole, one end of the spring is fixedly connected to one end of the push rod, and one end of the connecting rod is fixedly connected to the push rod.

[0012] As a further description of the above technical solution:

[0013] The number of the positioning holes is six, and the spacing between adjacent positioning holes is equal to the spacing between each row of placement grooves on the top of the packaging board.

[0014] As a further description of the above technical solution:

[0015] The outer sleeve of the roller is provided with a rubber sleeve, and the rubber sleeve is fitted with the bottom of the packaging plate.

[0016] The utility model has the following beneficial effects:

[0017] 1. Compared with the prior art, the pressing device for QFN chips is provided with side strips, limit card plates, springs, ejector rods, connecting rods, arc grooves and positioning holes. When the position of the placement groove on the top of the packaging board needs to be adjusted, the two connecting rods are simultaneously pulled in a direction close to each other, and the connecting rods drive the two ejector rods to move. When the end of the ejector rod away from the spring is in contact with the inner wall of the arc groove, the pulling of the connecting rod is stopped and the packaging board is pushed. One end of the ejector rod slides in the arc groove. When the ejector rod moves to the position of the positioning hole, the positioning hole pops out to realize the positioning of the packaging board. At this time, the placement groove on the top of the packaging board corresponds to multiple pressing blocks, and the staff does not need to pay attention to the position of the placement groove all the time. Not only can the adjustment speed of the packaging board be accelerated, but also the movement accuracy of the placement groove can be improved.

[0018] 2. Compared with the prior art, this pressing device for QFN chips, by setting a horizontal plate and a roller, during the movement of the packaging plate, the roller and the packaging plate are in contact with each other to support the packaging plate, which can improve the stability of the packaging plate during movement and reduce the friction between the packaging plate and the support plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the three-dimensional structure of a pressing device for a QFN chip proposed by the utility model from a first perspective;

[0020] Figure 2 A schematic diagram of the third perspective structure of a pressing device for a QFN chip proposed by the utility model;

[0021] Figure 3 This is a first-perspective exploded schematic diagram of a limiting structure in a pressing device for a QFN chip proposed by the utility model;

[0022] Figure 4 This is an exploded schematic diagram from a second viewing angle of a limiting structure in a pressing device for a QFN chip proposed by the utility model.

[0023] Legend:

[0024] 1. Support plate; 2. Horizontal plate; 3. Roller; 4. Push rod motor; 5. Lower pressure plate; 6. Connecting frame; 7. Strip plate; 8. Pressure block; 9. Packaging plate; 10. Limiting structure; 101. Side strip; 102. Limiting card plate; 103. Storage hole; 104. Limiting groove; 105. Spring; 106. Push rod; 107. Connecting rod; 108. Arc groove; 109. Positioning hole. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Reference Figures 1 to 4 The utility model provides a pressing device for QFN chips: comprising a support plate 1, two horizontal plates 2 are fixedly provided on both sides of the support plate 1, rollers 3 are movably provided on the tops of the two groups of horizontal plates 2, rubber sleeves are provided on the outer sleeves of the rollers 3, and the rubber sleeves are fitted with the bottom of the packaging plate 9. The arrangement of the horizontal plate 2 and the rollers 3 can support the packaging plate 9 and improve its stability during movement. Two push rod motors 4 are fixedly provided on the top of the support plate 1, and the same lower pressing plate 5 is fixedly provided on the tops of the two push rod motors 4. Two groups of connecting frames 6 are fixedly provided on the bottom of the pressing block 8, and the same strip plate 7 is fixedly provided between the two groups of connecting frames 6. A plurality of plug rods are provided on the strip plate 7, and a pressing block 8 is fixedly provided on the bottom of the plug rods. A packaging plate 9 is provided on the top of the support plate 1;

[0027] A limiting structure 10 is provided on both sides of the packaging plate 9. The limiting structure 10 includes a side strip 101 fixedly installed on one side of the packaging plate 9 and a limiting card plate 102 fixedly connected to the top of the support plate 1. A storage hole 103 is provided on the front of the side strip 101, and a limiting groove 104 is provided on one side of the side strip 101. A top rod 106 is provided in the storage hole 103. A spring 105 is fixed in the storage hole 103. One end of the spring 105 is fixedly connected to one end of the top rod 106. One end of the connecting rod 107 is fixedly connected to the top rod 106. A connecting rod 107 is movably provided in the limiting groove 104. The connecting rod 107 and the limiting clamp plate 102 are provided with an arc groove 108 on one side, and a plurality of positioning holes 109 are provided on the inner wall of the arc groove 108. The number of the positioning holes 109 is six, and the spacing between adjacent positioning holes 109 is equal to the spacing between each row of placement grooves on the top of the packaging plate 9. The positioning holes 109 and the top rod 106 are matched. The setting of the limiting structure 10 can limit and lock the moving distance of the packaging plate 9, and there is no need for the staff to always pay attention to the position of the placement groove. It can not only speed up the adjustment speed of the packaging plate 9, but also improve the movement accuracy of the placement groove.

[0028] Working principle: When in use, by starting the push rod motor 4, the push rod motor 4 drives the lower pressure plate 5, so that the pressure block 8 on the strip plate 7 closely fits the chip with the corresponding packaging area. When the materials in the placement slots of the first row on the top of the packaging plate 9 are pressed, the two connecting rods 107 are pulled in the direction of approaching each other at the same time, and the connecting rod 107 drives the two ejector rods 106 to move. The ejector rod 106 squeezes the spring 105. When the end of the ejector rod 106 away from the spring 105 fits the inner wall of the arc groove 108, stop pulling the connecting rod 107 and push the packaging plate 9. During the movement of the packaging plate 9, the connecting rod 107 is released, and the spring 108 is pressed. The spring 105 squeezes the push rod 106, and one end of the push rod 106 slides in the arc groove 108. When the push rod 106 moves to the position of the positioning hole 109, the spring 105 pushes the push rod 106 to make it pop out of the positioning hole 109 to position the packaging plate 9. At this time, the placement groove on the top of the packaging plate 9 corresponds to multiple pressing blocks 8. The staff does not need to pay attention to the position of the placement groove all the time. It can not only speed up the adjustment speed of the packaging plate 9, but also improve the movement accuracy of the placement groove. When moving, the roller 3 fits with the packaging plate 9 to support the packaging plate 9, which can improve the stability of the packaging plate 9 when moving.

Claims

1. A pressing device for a QFN chip, comprising a support plate (1), characterized in that: Two transverse plates (2) are fixedly provided on both sides of the support plate (1), and rollers (3) are movably provided on the tops of the two groups of transverse plates (2). Two push rod motors (4) are fixedly provided on the tops of the support plate (1), and the same lower pressure plate (5) is fixedly provided on the tops of the two push rod motors (4). Two groups of connecting frames (6) are fixedly provided on the bottom of the pressure block (8), and the same strip plate (7) is fixedly provided between the two groups of connecting frames (6). A plurality of insertion rods are provided on the strip plate (7), and a pressure block (8) is fixedly provided on the bottom of the insertion rods. A packaging plate (9) is provided on the top of the support plate (1), and limiting structures (10) are provided on both sides of the packaging plate (9).

2. A pressing device for QFN chip according to claim 1, characterized in that: The limiting structure (10) comprises a side strip (101) fixedly mounted on one side of the packaging plate (9) and a limiting clamping plate (102) fixedly connected to the top of the support plate (1); a storage hole (103) is provided on the front side of the side strip (101); a limiting groove (104) is provided on one side of the side strip (101); a top rod (106) is provided in the storage hole (103); and a connecting rod (107) is movably provided in the limiting groove (104).

3. A pressing device for QFN chip according to claim 2, characterized in that: An arc-shaped groove (108) is provided on one side of the position-limiting clamping plate (102), and a plurality of positioning holes (109) are provided on the inner wall of the arc-shaped groove (108), and the positioning holes (109) are matched with the ejector rod (106).

4. The pressing device for QFN chip according to claim 2, characterized in that: A spring (105) is fixedly arranged in the receiving hole (103), one end of the spring (105) is fixedly connected to one end of the push rod (106), and one end of the connecting rod (107) is fixedly connected to the push rod (106).

5. The pressing device for QFN chip according to claim 3, characterized in that: The number of the positioning holes (109) is six, and the spacing between adjacent positioning holes (109) is equal to the spacing between each row of placement grooves on the top of the packaging plate (9).

6. The pressing device for QFN chip according to claim 1, characterized in that: The outer sleeve of the roller (3) is provided with a rubber sleeve, and the rubber sleeve is in contact with the bottom of the packaging plate (9).

Images