Film coating device for semiconductor accessory production

Abstract

The utility model discloses a film coating device for producing semiconductor accessories, which is applied to the field of semiconductors and comprises a base, four supporting columns are fixedly connected to the top surface of the base, a top plate is fixedly connected to the top surfaces of the four supporting columns, a placing seat is fixedly connected to the top surface of the base, and the placing seat is fixedly connected to the top surface of the base. A fixing mechanism facilitating taking and placing of a semiconductor is arranged in the placing base, coating mechanisms are arranged on the two sides of the top plate, and when the semiconductor coating device is used, the semiconductor can be taken and placed in the placing base through the fixing mechanism, and the semiconductor placed in the placing base can be automatically clamped and fixed; and meanwhile, clamping and fixing are automatically relieved when the semiconductor is taken out, so that the semiconductor can be conveniently taken and placed before and after film coating, meanwhile, the semiconductor can be conveniently clamped and fixed after being placed, the semiconductor is prevented from deviating during film coating, film coating liquid can be uniformly sprayed and coated on the surface of the semiconductor through the film coating mechanism, and the film coating efficiency is improved. And high-efficiency film coating operation on semiconductors is realized.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and particularly relates to a film coating device for producing semiconductor accessories. Background Art

[0002] Objects such as germanium, silicon, selenium, arsenide, and many metal oxides and metal sulfides have electrical conductivity between conductors and insulators and are called semiconductors. They need to be coated in the production process of semiconductors. The main functions of coating are: 1. Keep the surface of the object in a brand new state for a long time; 2. Prevent the surface of the object from being easily contaminated or affected by external substances; 3. Easily remove some dirt on the surface of the object when cleaning the surface.

[0003] The Chinese utility model patent currently announced as: CN212596713U discloses a coating device for semiconductor production, involving the field of semiconductor technology, including a base plate and a semiconductor. The top surface of the base plate is provided with a circular groove, and the semiconductor is placed in the circular groove. A circular tube is arranged on the base plate, and a limiting mechanism is arranged on the outer side of the circular tube. A fixed tube is arranged above the circular tube, and an annular groove 1 is arranged on the inner side of the fixed tube. The annular groove 1 is arranged at the lower end of the fixed tube. A cylinder is arranged in the fixed tube, and the cylinder is rotatably arranged in the fixed tube. A coating liquid is arranged in the cylinder, and a piston is arranged in the cylinder. A hard rod is fixedly arranged on the top of the piston, and the top of the hard rod passes through the cylinder and extends upward. A plurality of holes are arranged at the bottom of the cylinder, and a soft coating pad is arranged on the bottom surface of the cylinder. The utility model solves the problem that the existing coating device is prone to deviation when coating semiconductors, thereby affecting the coating effect.

[0004] Although this patent can prevent the semiconductor from shifting during coating to a certain extent, it is inconvenient to take and place the semiconductor before and after coating. At the same time, it cannot clamp and fix the semiconductor, so the semiconductor is still prone to shifting during coating. Utility Model Content

[0005] The purpose of the utility model is to provide a coating device for producing semiconductor parts to solve the problems mentioned in the above background problems.

[0006] The above technical objectives of the utility model are achieved through the following technical solutions: a coating device for semiconductor parts production, comprising a base, four supporting columns are fixedly connected to the top surface of the base, a top plate is fixedly connected to the top surface of the four supporting columns, a placement seat is fixedly connected to the top surface of the base, a fixing mechanism for conveniently taking and placing semiconductors is arranged inside the placement seat, and coating mechanisms are arranged on both sides of the top plate;

[0007] The fixing mechanism includes a cavity, an electric telescopic rod, a placement plate, a semiconductor body, a motion groove, a connecting block, a clamping plate and a pushing block. The cavity is opened in the placement seat, the electric telescopic rod is bolted to the inner bottom surface of the placement seat, the placement plate is movably arranged inside the placement seat and fixedly connected to the output end of the electric telescopic rod, the semiconductor body is arranged on the top surface of the placement plate, six motion grooves are opened on the inner wall of the placement seat and pass through the cavity, six connecting blocks are fixedly connected to the side wall of the cavity, the clamping plate is hinged to the middle part of the connecting block, the top of the clamping plate is inclined and contacts the semiconductor body, the six pushing blocks are fixedly connected to the side wall of the placement plate and movably connected to the motion groove, and the top of the pushing block is arc-shaped and contacts the side wall of the clamping plate.

[0008] By adopting the above technical scheme, by setting a base, a support column, a top plate, a placement seat, a fixing mechanism and a coating mechanism, when in use, the semiconductor can be taken and placed in the placement seat through the fixing mechanism, and the semiconductor placed in the placement seat can be automatically clamped and fixed, and the semiconductor can be automatically released from the clamping and fixing when it is taken out. In this way, the semiconductor can be taken and placed before and after coating, and can be clamped and fixed after placement to prevent the semiconductor from shifting during coating. The coating mechanism can achieve uniform spraying of the coating liquid on the surface of the semiconductor, thereby achieving efficient coating operation of the semiconductor; by setting a cavity, an electric telescopic rod, a placement plate, a semiconductor body, and a moving groove , connecting block, clamping plate and pushing block. First, the electric telescopic rod pushes the placement plate to move upward inside the placement seat. During the movement of the placement plate, the pushing block pushes the top of the clamping plate. At this time, the bottom of the clamping plate is inclined toward the middle of the placement seat. When the semiconductor body is placed on the placement plate, the electric telescopic rod pulls the placement plate to move downward. During the movement of the placement plate, the pushing block pushes the bottom of the clamping plate. At this time, the top of the clamping plate is inclined toward the middle of the placement seat, and the top of the clamping plate contacts the semiconductor body. At this time, the semiconductor body is clamped and fixed inside the placement seat. In this way, it is easy to take and place the semiconductor body inside the placement seat, and the semiconductor body placed inside the placement seat can be clamped and fixed.

[0009] The utility model is further configured as follows: the coating mechanism includes a high-pressure pump, a liquid storage tank, two electric telescopic rods, a connecting plate, a bellows, a connecting pipe, a disc atomizing nozzle, a cover and a spring; the high-pressure pump is bolted to the top surface of the top plate; the liquid storage tank is fixedly connected to the top surface of the top plate and is fixedly connected to the input end of the high-pressure pump; the two electric telescopic rods are bolted to the top surface of the top plate; the connecting plate is fixedly connected to the output ends of the two electric telescopic rods; the bellows is fixedly connected to the output end of the high-pressure pump; the connecting pipe is fixedly connected to the bottom of the bellows; the disc atomizing nozzle is fixedly connected to the bottom of the connecting pipe; the cover is sleeved on the side wall of the connecting pipe; the spring is sleeved on the side wall of the connecting pipe and its two ends are respectively fixedly connected to the connecting plate and the cover.

[0010] The above technical scheme is adopted, by arranging a high-pressure pump, a liquid storage tank, an electric telescopic rod 2, a connecting plate, a bellows, a connecting pipe, a disc atomizing nozzle, a cover and a spring. When in use, the electric telescopic rod 2 first pushes the connecting plate to move downward, and at this time the connecting plate pulls the bellows to telescopically move, and first the cover contacts the top of the placement seat, and when the connecting plate continues to move, the spring contracts to buffer the contact between the cover and the placement seat, and then the high-pressure pump is started to transport the coating liquid in the liquid storage tank to the bellows, and the coating liquid then enters the disc atomizing nozzle through the connecting pipe and is sprayed out, so that the coating liquid can be evenly sprayed on the surface of the semiconductor body, and can be protected when the semiconductor body is coated.

[0011] The utility model is further configured as follows: an electric heating plate is bolted on the bottom surface of the liquid storage tank.

[0012] By adopting the above technical solution, an electric heating plate is provided and started at low temperature, so that the plating liquid inside the liquid storage tank can be heated to prevent the plating liquid from condensing or precipitating.

[0013] The utility model is further configured as follows: a wear-reducing wheel is arranged at one end of the pushing block in contact with the clamping plate, and the wear-reducing wheel is in contact with the clamping plate.

[0014] By adopting the above technical solution and providing the wear-reducing wheel, the friction between the pushing block and the clamping plate can be reduced.

[0015] The utility model is further configured as follows: a plurality of anti-collision rubber blocks are fixedly connected to the inner wall of the cavity, and the side wall of the bottom of the clamping plate is in contact with the anti-collision rubber blocks.

[0016] By adopting the above technical solution and arranging the anti-collision rubber block, the movement range of the clamping plate can be limited to prevent the top of the clamping plate from causing collision damage to the semiconductor body.

[0017] The utility model is further configured as follows: a plurality of guide cylinders are fixedly connected to the bottom surface of the placement seat, a plurality of guide rods are fixedly connected to the bottom surface of the placement plate, and the guide rods are movably connected to the guide cylinders.

[0018] By adopting the above technical solution, by providing a guide cylinder and a guide rod, when the placement plate moves, the guide rod slides inside the guide cylinder, thereby guiding the movement of the placement plate.

[0019] The utility model is further configured as follows: an annular sealing groove is provided on the top of the placement seat, and the sealing cover is plugged and matched with the top of the placement seat.

[0020] By adopting the above technical solution and providing the annular sealing groove, the placement seat and the sealing cover can be sealed and connected.

[0021] In summary, the utility model has the following beneficial effects:

[0022] By setting up a fixing mechanism, the semiconductor can be taken and placed inside the placement seat, the semiconductor placed inside the placement seat can be automatically clamped and fixed, and the semiconductor can be automatically released when taken out. In this way, the semiconductor can be taken and placed before and after coating, and the semiconductor can be clamped and fixed after placement to prevent the semiconductor from shifting during coating.

[0023] By setting up a coating mechanism, the coating liquid can be evenly sprayed on the surface of the semiconductor, thereby achieving efficient coating operation on the semiconductor.

[0024] Based on the above-mentioned improvements, the overall technical effect achieved by the present device is that it can facilitate the placement and taking of the semiconductor body inside the placement seat before and after coating, can clamp and fix the semiconductor body inside the placement seat to prevent it from shifting during coating, and can evenly spray the coating liquid on the surface of the semiconductor body. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0026] Figure 2 It is a left view of the utility model;

[0027] Figure 3 This utility model Figure 2 The three-dimensional cross-section view at AA in the middle;

[0028] Figure 4 It is a structural schematic diagram of the coating mechanism of the utility model;

[0029] Figure 5 It is a structural schematic diagram of the fixing mechanism of the utility model.

[0030] In the figure, 1, base; 21, support column; 22, top plate; 23, placement seat; 3, fixing mechanism; 4, coating mechanism; 31, cavity; 32, electric telescopic rod 1; 33, placement plate; 34, semiconductor body; 35, moving groove; 36, connecting block; 37, clamping plate; 38, pushing block; 41, high-pressure pump; 42, liquid storage tank; 43, electric telescopic rod 2; 44, connecting plate; 45, bellows; 46, connecting pipe; 47, disc atomizing nozzle; 48, sealing cover; 49, spring; 51, electric heating plate; 61, anti-friction wheel; 71, anti-collision rubber block; 81, guide cylinder; 82, guide rod; 91, annular sealing groove. DETAILED DESCRIPTION

[0031] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0032] Example:

[0033] See also Figure 1-Figure 5The utility model provides a technical solution: a coating device for semiconductor parts production, including a base 1, four support columns 21 are fixedly connected to the top surface of the base 1, a top plate 22 is fixedly connected to the top surface of the four support columns 21, a placement seat 23 is fixedly connected to the top surface of the base 1, a fixing mechanism 3 for conveniently taking and placing semiconductors is arranged inside the placement seat 23, and a coating mechanism 4 is arranged on both sides of the top plate 22; the fixing mechanism 3 includes a cavity 31, an electric telescopic rod 32, a placement plate 33, a semiconductor body 34, a moving groove 35, a connecting block 36, a clamping plate 37 and a pushing block 38, the cavity 31 is opened in the placement seat 23, the electric telescopic rod 32 is bolted to the inner bottom surface of the placement seat 23, and the placement plate 33 is movably arranged on the placement seat 2 3 and fixedly connected to the output end of the electric telescopic rod 32, the semiconductor body 34 is arranged on the top surface of the placement plate 33, six movement grooves 35 are opened on the inner wall of the placement seat 23 and penetrate the cavity 31, six connecting blocks 36 are fixedly connected to the side wall of the cavity 31, the clamping plate 37 is hinged to the middle of the connecting block 36, the top of the clamping plate 37 is inclined and contacts with the semiconductor body 34, six pushing blocks 38 are fixedly connected to the side wall of the placement plate 33 and are movably connected to the movement groove 35, the top of the pushing block 38 is arc-shaped and contacts with the side wall of the clamping plate 37, by setting the base 1, the support column 21, the top plate 22, the placement seat 23, the fixing mechanism 3 and the coating mechanism 4, when in use, the fixing mechanism 3 can The semiconductor can be taken and placed inside the placement seat 23, and the semiconductor placed inside the placement seat 23 can be automatically clamped and fixed, and the semiconductor can be automatically unclamped and fixed when it is taken out. In this way, the semiconductor can be taken and placed before and after coating, and the semiconductor can be clamped and fixed after placement to prevent the semiconductor from shifting during coating. The coating liquid can be evenly sprayed on the surface of the semiconductor through the coating mechanism 4, so as to achieve efficient coating operation of the semiconductor; by setting the cavity 31, the electric telescopic rod 32, the placement plate 33, the semiconductor body 34, the moving groove 35, the connecting block 36, the clamping plate 37 and the pushing block 38, first the electric telescopic rod 32 pushes the placement plate 33 inside the placement seat 23 The placing plate 33 moves upward, and the pushing block 38 pushes the top of the clamping plate 37 during the movement. At this time, the bottom of the clamping plate 37 is inclined toward the middle of the placing seat 23. When the semiconductor body 34 is placed on the placing plate 33, the electric telescopic rod 32 pulls the placing plate 33 to move downward. During the movement of the placing plate 33, the pushing block 38 pushes the bottom of the clamping plate 37. At this time, the top of the clamping plate 37 is inclined toward the middle of the placing seat 23, and the top of the clamping plate 37 contacts the semiconductor body 34. At this time, the semiconductor body 34 is clamped and fixed inside the placing seat 23. In this way, it is convenient to take and place the semiconductor body 34 inside the placing seat 23, and the semiconductor body 34 placed inside the placing seat 23 can be clamped and fixed.

[0034] refer to Figure 4 The coating mechanism 4 includes a high-pressure pump 41, a liquid storage tank 42, an electric telescopic rod 43, a connecting plate 44, a bellows 45, a connecting pipe 46, a disc atomizing nozzle 47, a cover 48 and a spring 49. The high-pressure pump 41 is bolted to the top surface of the top plate 22, the liquid storage tank 42 is fixedly connected to the top surface of the top plate 22 and is fixedly connected to the input end of the high-pressure pump 41, two electric telescopic rods 43 are bolted to the top surface of the top plate 22, the connecting plate 44 is fixedly connected to the output ends of the two electric telescopic rods 43, the bellows 45 is fixedly connected to the output end of the high-pressure pump 41, the connecting pipe 46 is fixedly connected to the bottom of the bellows 45, the disc atomizing nozzle 47 is fixedly connected to the bottom of the connecting pipe 46, the cover 48 is sleeved on the side wall of the connecting pipe 46, the spring 49 is sleeved on the side wall of the connecting pipe 46 and the two ends are respectively connected to the connecting plate 44 and the cover The cover 48 is fixedly connected; by arranging a high-pressure pump 41, a liquid storage tank 42, an electric telescopic rod 43, a connecting plate 44, a bellows 45, a connecting pipe 46, a disc atomizing nozzle 47, a cover 48 and a spring 49, when in use, first the electric telescopic rod 43 pushes the connecting plate 44 to move downward, at which time the connecting plate 44 pulls the bellows 45 to telescopically move, first the cover 48 contacts the top of the placement seat 23, when the connecting plate 44 continues to move, the spring 49 contracts to buffer the contact between the cover 48 and the placement seat 23, then the high-pressure pump 41 is started to transport the coating liquid in the liquid storage tank 42 to the bellows 45, and the coating liquid then enters the disc atomizing nozzle 47 through the connecting pipe 46 and is sprayed out, so that the coating liquid can be evenly sprayed on the surface of the semiconductor body 34, and can be protected when the semiconductor body 34 is coated.

[0035] refer to Figure 4 An electric heating plate 51 is bolted to the bottom surface of the liquid storage tank 42. By setting the electric heating plate 51 and starting the electric heating plate 51 at low temperatures, the plating liquid inside the liquid storage tank 42 can be heated to prevent the plating liquid from condensing or precipitating.

[0036] refer to Figure 5 A wear-reducing wheel 61 is provided at one end of the pushing block 38 that contacts the clamping plate 37 , and the wear-reducing wheel 61 contacts the clamping plate 37 ; by providing the wear-reducing wheel 61 , the friction between the pushing block 38 and the clamping plate 37 can be reduced.

[0037] refer to Figure 5 A plurality of anti-collision rubber blocks 71 are fixedly connected to the inner wall of the cavity 31, and the side wall at the bottom of the clamping plate 37 is in contact with the anti-collision rubber block 71; by setting the anti-collision rubber block 71, the movement range of the clamping plate 37 can be limited to prevent the top of the clamping plate 37 from causing collision damage to the semiconductor body 34.

[0038] refer to Figure 5A plurality of guide cylinders 81 are fixedly connected to the bottom surface of the placement seat 23, and a plurality of guide rods 82 are fixedly connected to the bottom surface of the placement plate 33, and the guide rods 82 are movably connected to the guide cylinders 81; by setting the guide cylinders 81 and the guide rods 82, when the placement plate 33 moves, the guide rods 82 slide inside the guide cylinders 81, thereby guiding the movement of the placement plate 33.

[0039] refer to Figure 5 An annular sealing groove 91 is provided at the top of the placement seat 23, and the sealing cover 48 is plugged into and matched with the top of the placement seat 23; by providing the annular sealing groove 91, the placement seat 23 and the sealing cover 48 can be sealed and connected.

[0040] Brief description of the use process: When in use, first, the electric telescopic rod 32 pushes the placement plate 33 to move upward inside the placement seat 23. During the movement of the placement plate 33, the push block 38 pushes the top of the clamping plate 37. At this time, the bottom of the clamping plate 37 is tilted toward the middle of the placement seat 23. When the semiconductor body 34 is placed on the placement plate 33, the electric telescopic rod 32 pulls the placement plate 33 to move downward. During the movement of the placement plate 33, the push block 38 pushes the bottom of the clamping plate 37. At this time, the top of the clamping plate 37 is tilted toward the middle of the placement seat 23, and the top of the clamping plate 37 contacts the semiconductor body 34. At this time, the semiconductor body 34 is clamped and fixed inside the placement seat 23, and the electric telescopic rod 243 pushes the connecting plate 4 4 moves downward, at which time the connecting plate 44 pulls the bellows 45 to telescopically move, first the cover 48 contacts the top of the placement seat 23, and when the connecting plate 44 continues to move, the spring 49 contracts to buffer the contact between the cover 48 and the placement seat 23, and then the high-pressure pump 41 is started to transport the coating liquid in the liquid storage tank 42 to the bellows 45, and the coating liquid then enters the disc atomizing nozzle 47 through the connecting pipe 46 and is sprayed out, so that it is convenient to take and place the semiconductor body 34 in the placement seat 23, the semiconductor body 34 placed in the placement seat 23 can be clamped and fixed, the coating liquid can be evenly sprayed on the surface of the semiconductor body 34, and the semiconductor body 34 can be protected when being plated.

[0041] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A coating device for producing semiconductor parts, comprising a base (1), characterized in that: Four support columns (21) are fixedly connected to the top surface of the base (1), a top plate (22) is fixedly connected to the top surface of the four support columns (21), a placement seat (23) is fixedly connected to the top surface of the base (1), a fixing mechanism (3) for facilitating the placement of semiconductors is provided inside the placement seat (23), and coating mechanisms (4) are provided on both sides of the top plate (22); The fixing mechanism (3) comprises a cavity (31), an electric telescopic rod (32), a placement plate (33), a semiconductor body (34), a moving groove (35), a connecting block (36), a clamping plate (37) and a pushing block (38); the cavity (31) is opened in the placement seat (23); the electric telescopic rod (32) is bolted to the inner bottom surface of the placement seat (23); the placement plate (33) is movably arranged inside the placement seat (23) and fixedly connected to the output end of the electric telescopic rod (32); the semiconductor body (34) is arranged on the placement plate (33); On the top surface, six of the movement grooves (35) are opened on the inner wall of the placement seat (23) and are connected to the cavity (31); six of the connection blocks (36) are fixedly connected to the side wall of the cavity (31); the clamping plate (37) is hinged to the middle of the connection block (36); the top of the clamping plate (37) is inclined and contacts the semiconductor body (34); six of the pushing blocks (38) are fixedly connected to the side wall of the placement plate (33) and are movably connected to the movement grooves (35); the top of the pushing block (38) is arc-shaped and contacts the side wall of the clamping plate (37).

2. The coating device for semiconductor component production according to claim 1, characterized in that: The coating mechanism (4) comprises a high-pressure pump (41), a liquid storage tank (42), two electric telescopic rods (43), a connecting plate (44), a bellows (45), a connecting pipe (46), a disc atomizing nozzle (47), a sealing cover (48) and a spring (49); the high-pressure pump (41) is bolted to the top surface of the top plate (22); the liquid storage tank (42) is fixedly connected to the top surface of the top plate (22) and is fixedly connected to the input end of the high-pressure pump (41); the two electric telescopic rods (43) are bolted to the top surface of the top plate (22); The connecting plate (44) is fixedly connected to the output ends of the two electric telescopic rods (43); the bellows (45) is fixedly connected to the output end of the high-pressure pump (41); the connecting pipe (46) is fixedly connected to the bottom of the bellows (45); the disc atomizing nozzle (47) is fixedly connected to the bottom of the connecting pipe (46); the sealing cover (48) is sleeved on the side wall of the connecting pipe (46); the spring (49) is sleeved on the side wall of the connecting pipe (46) and its two ends are respectively fixedly connected to the connecting plate (44) and the sealing cover (48).

3. The film coating device for semiconductor component production according to claim 2, characterized in that: An electric heating plate (51) is bolted to the bottom surface of the liquid storage tank (42).

4. The coating device for semiconductor component production according to claim 1, characterized in that: One end of the pushing block (38) in contact with the clamping plate (37) is provided with a wear-reducing wheel (61), and the wear-reducing wheel (61) is in contact with the clamping plate (37).

5. The film coating device for semiconductor component production according to claim 1, characterized in that: A plurality of anti-collision rubber blocks (71) are fixedly connected to the inner wall of the cavity (31), and the side wall of the bottom of the clamping plate (37) is in contact with the anti-collision rubber blocks (71).

6. The film coating device for semiconductor component production according to claim 1, characterized in that: A plurality of guide cylinders (81) are fixedly connected to the bottom surface of the placement seat (23), a plurality of guide rods (82) are fixedly connected to the bottom surface of the placement plate (33), and the guide rods (82) are movably connected to the guide cylinders (81).

7. The film coating device for semiconductor component production according to claim 1, characterized in that: The top of the placement seat (23) is provided with an annular sealing groove (91), and the sealing cover (48) is plugged into and matched with the top of the placement seat (23).

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