Power adapter

Abstract

The utility model relates to the technical field of electronic product equipment, in particular to a power adapter. Comprising a shell assembly, a first circuit board and a heat dissipation plate, the shell assembly comprises an outer shell and a heat dissipation inner shell, and the heat dissipation inner shell is arranged in the outer shell in a sleeved mode; the first circuit board is arranged in the heat dissipation inner shell; the heat dissipation plate is arranged on the first circuit board in a bending manner, so that a first accommodating cavity, a second accommodating cavity and a third accommodating cavity are formed between the heat dissipation plate and the first circuit board; and heating elements connected with the first circuit board are accommodated in the first accommodating cavity, the second accommodating cavity and the third accommodating cavity. The problems that in the prior art, a natural heat dissipation mode of a power adapter is low in heat dissipation efficiency, so that the service life is affected, and potential safety hazards exist are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic product equipment, in particular to a power adapter. Background Art

[0002] As people spend more time using electronic products, the number of times they charge consumer electronic products such as mobile phones and tablets is also increasing. Therefore, during the long charging process, some heating components in the power adapter, such as the rectifier bridge, switch tube, transformer, secondary synchronous rectifier tube, etc., will face more and more severe heat dissipation problems as the charging power and charging time increase.

[0003] In the prior art, the thermal management of power adapters mainly adopts the method of natural heat dissipation. However, with the development of technology, the charging power of many power adapters has reached more than 60W. During the charging process, part of the power consumption is converted into heat. But now the thermal management method of natural heat dissipation has approached the limit of natural heat dissipation, which can easily affect the charging efficiency of electronic products, shorten the service life of the power adapter, and even have safety hazards. Utility Model Content

[0004] The technical problem to be solved by the embodiments of the utility model is to provide a power adapter to solve the problem that the natural heat dissipation method of the power adapter in the prior art has low heat dissipation efficiency, which affects the service life and poses safety hazards.

[0005] The utility model discloses a power adapter, comprising: a shell assembly, a first circuit board and a heat sink, the shell assembly comprising an outer shell and a heat sink inner shell, the heat sink inner shell is sleeved in the outer shell; the first circuit board is arranged in the heat sink inner shell; the heat sink is bent and arranged on the first circuit board, so that a first accommodating cavity, a second accommodating cavity and a third accommodating cavity are formed between the heat sink and the first circuit board; wherein the first accommodating cavity, the second accommodating cavity and the third accommodating cavity contain heating elements connected to the first circuit board.

[0006] Optionally, the heat dissipation plate includes a first connecting surface, a second connecting surface, a third connecting surface, a fourth connecting surface, a fifth connecting surface and a sixth connecting surface connected in sequence, the first connecting surface, the second connecting surface, the third connecting surface and the first circuit board together constitute a first accommodating cavity, the third connecting surface, the fourth connecting surface, the fifth connecting surface and the first circuit board together constitute a second accommodating cavity, and the fifth connecting surface, the sixth connecting surface and the first circuit board together constitute the third accommodating cavity.

[0007] Optionally, the first connection surface, the second connection surface and the third connection surface are perpendicular to each other, the second connection surface, the fourth connection surface and the sixth connection surface are arranged in parallel, the third connection surface and the fifth connection surface are arranged in parallel, and the first connection surface is parallel to the first circuit board.

[0008] Optionally, the power adapter also includes a heat-conducting component, the heat-conducting component includes a first heat-conducting layer and a second heat-conducting layer, the first heat-conducting layer is arranged between the outer shell and the heat-dissipating inner shell, the second heat-conducting layer is arranged in the heat-dissipating inner shell, and the second heat-conducting layer is arranged on the side of the first connecting surface away from the first circuit board, and the second heat-conducting layer covers the first accommodating cavity and the second accommodating cavity.

[0009] Optionally, the power adapter also includes a second circuit board, which is arranged vertically with respect to the first circuit board, and the second circuit board is arranged in the third accommodating cavity. An AC socket and an electromagnetic interference module are connected to the second circuit board, and the AC socket is connected to the shell.

[0010] Optionally, the heating element further includes a filter module and a common-mode inductor, the filter module and the common-mode inductor are arranged on the first circuit board, the filter module is arranged in the first accommodating cavity, and the common-mode inductor is arranged in the second accommodating cavity.

[0011] Optionally, the second connecting surface and the sixth connecting surface are provided with limiting clamping protrusions for clamping with the first circuit board.

[0012] Optionally, a through hole is provided on the third connecting surface to connect the first accommodating cavity with the second accommodating cavity.

[0013] Optionally, the heat dissipation inner shell and the heat dissipation plate are made of copper.

[0014] Optionally, the housing assembly further includes an insulating layer, the insulating layer is sleeved on the inner side of the heat dissipation inner housing, and the first circuit board and the second heat conductive layer are arranged on the inner side of the insulating layer.

[0015] Compared with the prior art, the beneficial effect of the power adapter provided by the embodiment of the utility model is that by arranging a heat dissipation inner shell and a heat dissipation plate in the power adapter, the heat dissipation efficiency of the power adapter can be effectively improved. The heat dissipation inner shell is sleeved in the outer shell, which can provide a good heat dissipation environment and avoid heat accumulation inside the adapter. The heating element on the first circuit board is accommodated in the first accommodation cavity, the second accommodation cavity and the third accommodation cavity formed by the heat dissipation plate and the first circuit board. The heating element is more reasonably accommodated in the power adapter, which can reduce mutual interference between the heating elements and improve the heat dissipation effect. At the same time, the bent heat dissipation plate increases the heat dissipation surface area, which helps to improve the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The technical solution of the utility model will be further described in detail below with reference to the accompanying drawings and embodiments, in which:

[0017] Figure 1 It is a schematic diagram of the exploded structure of the power adapter provided by the embodiment of the utility model;

[0018] Figure 2 This is one of the schematic diagrams of the heating element and the heat sink provided in the embodiment of the utility model;

[0019] Figure 3 This is the second schematic diagram of the heating element and the heat sink provided by the embodiment of the utility model;

[0020] Figure 4 It is a schematic diagram of a heat sink provided by an embodiment of the utility model.

[0021] The reference numerals in the figures are:

[0022] 1000, power adapter; 100, shell assembly; 101, outer shell; 102, heat dissipation inner shell; 103, insulation layer; 200, first circuit board; 300, heat dissipation plate; 301, first connection surface; 302, second connection surface; 303, third connection surface; 304, fourth connection surface; 305, fifth connection surface; 306, sixth connection surface; 307, first accommodating cavity; 308, second accommodating cavity; 309, third accommodating cavity; 310, limit cam; 311, through hole; 400, heating element; 401, AC socket; 403, filter module; 404, common mode inductor; 500, thermal conductive assembly; 501, first thermal conductive layer; 502, second thermal conductive layer; 600, second circuit board. DETAILED DESCRIPTION

[0023] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. Now, in conjunction with the accompanying drawings, a preferred embodiment of the present utility model is described in detail.

[0024] The present utility model embodiment provides a power adapter 1000, such as Figure 1-4As shown, the power adapter 1000 includes: a shell assembly 100, a first circuit board 200 and a heat sink 300, the shell assembly 100 includes an outer shell 101 and a heat sink inner shell 102, the heat sink inner shell 102 is sleeved in the outer shell 101; the first circuit board 200 is arranged in the heat sink inner shell 102; the heat sink 300 is bent and arranged on the first circuit board 200, so that a first accommodating cavity 307, a second accommodating cavity 308 and a third accommodating cavity 309 are formed between the heat sink 300 and the first circuit board 200; wherein the first accommodating cavity 307, the second accommodating cavity 308 and the third accommodating cavity 309 contain a heating element 400 connected to the first circuit board 200.

[0025] By arranging a heat dissipation inner shell 102 and a heat sink 300 in the power adapter 1000, the heat dissipation efficiency of the power adapter 1000 can be effectively improved. The heat dissipation inner shell 102 is sleeved in the outer shell 101, which can provide a good heat dissipation environment and prevent heat from accumulating inside the adapter. The heating element 400 on the first circuit board 200 is accommodated in the first accommodating cavity 307, the second accommodating cavity 308 and the third accommodating cavity 309 formed by the heat sink 300 and the first circuit board 200. The heating element 400 is more reasonably accommodated in the power adapter 1000, which can reduce mutual interference between the heating elements 400 and improve the heat dissipation effect. At the same time, the bent heat sink 300 increases the heat dissipation surface area, which helps to improve the heat dissipation effect.

[0026] Specifically, the internal design of the power adapter 1000 makes full use of the space, and by bending the heat sink 300 and setting it on the first circuit board 200, a compact layout of multiple accommodating cavities, namely, the first accommodating cavity 307, the second accommodating cavity 308, and the third accommodating cavity 309, is separated. While ensuring the heat dissipation effect, the structure of the power adapter 1000 is made more compact, thereby reducing the volume of the adapter and making it convenient to carry and use.

[0027] Furthermore, the heat dissipation inner shell 102 and the heat dissipation plate 300 are made of copper.

[0028] Copper is an excellent thermal conductive material with high thermal conductivity. By using the heat dissipation inner shell 102 and the heat dissipation plate 300 made of copper, heat can be transferred and dissipated more effectively. This helps to improve the heat dissipation efficiency of the power adapter 1000, quickly transfer the generated heat from the inside to the external environment, and reduce the operating temperature of the power adapter 1000.

[0029] On the other hand, copper has high strength and rigidity, so that the heat dissipation inner shell 102 and the heat dissipation plate 300 have good structural stability. This can ensure that the power adapter 1000 maintains its shape and integrity during use, reducing the risk of damage caused by vibration, impact or other external forces.

[0030] On the other hand, copper has good corrosion resistance and can resist the influence of oxidation and corrosion. The heat dissipation inner shell 102 and the heat dissipation plate 300 made of copper can increase the durability and reliability of the power adapter 1000.

[0031] refer to Figure 4 The heat sink 300 includes a first connection surface 301, a second connection surface 302, a third connection surface 303, a fourth connection surface 304, a fifth connection surface 305 and a sixth connection surface 306 which are connected in sequence. The first connection surface 301, the second connection surface 302, the third connection surface 303 and the first circuit board 200 together form a first accommodation cavity 307, the third connection surface 303, the fourth connection surface 304, the fifth connection surface 305 and the first circuit board 200 together form a second accommodation cavity 308, and the fifth connection surface 305, the sixth connection surface 306 and the first circuit board 200 together form a third accommodation cavity 309.

[0032] With the above-mentioned form, the heat sink 300 can better contact and conduct heat with the heating element 400. The close combination of each connection surface of the heat sink 300 and the first circuit board 200 can improve the heat dissipation efficiency, effectively transfer the heat of the heating element 400 to the heat sink 300, and further dissipate the heat to the surrounding environment.

[0033] Specifically, by forming the first accommodation cavity 307, the second accommodation cavity 308 and the third accommodation cavity 309 with the first circuit board 200 respectively, the heating element 400 can be effectively divided and isolated. Such a design can avoid mutual interference between the heating elements 400, improve the heat dissipation effect, and facilitate the maintenance and replacement of the heating elements 400. Moreover, the formation of the first accommodation cavity 307, the second accommodation cavity 308 and the third accommodation cavity 309 only requires bending the heat dissipation plate 300 at a certain angle, which is conducive to simplifying the setting form.

[0034] refer to Figure 2 , Figure 3 and Figure 4 The first connection surface 301, the second connection surface 302 and the third connection surface 303 are perpendicular to each other, the second connection surface 302, the fourth connection surface 304 and the sixth connection surface 306 are arranged in parallel, the third connection surface 303 and the fifth connection surface 305 are arranged in parallel, and the first connection surface 301 is parallel to the first circuit board 200.

[0035] The first connection surface 301, the second connection surface 302 and the third connection surface 303 are perpendicular to each other, so as to form a relatively independent first accommodation cavity 307, and the first connection surface 301 is parallel to the first circuit board 200, which can well transfer the heat emitted by the heating element 400 in the first accommodation cavity 307 to the heat sink 300. The second connection surface 302, the fourth connection surface 304 and the sixth connection surface 306 are arranged in parallel, which can increase the structural stability of the heat sink 300. The connection between the parallel connection surfaces can provide better support and fixation, prevent the heat sink 300 from deformation or loosening, and ensure close contact between the heat sink 300 and the heating element 400.

[0036] Specifically, the first connection surface 301 is arranged in parallel with the first circuit board 200, which relatively isolates the heating element 400 in the first accommodating cavity 307 from other components in the power adapter 1000 to avoid mutual interference and influence. The first connection surface 301 arranged in parallel with the first circuit board 200 can receive the heat volatilized from the heating element 400 toward the top of the first accommodating cavity 307, which can effectively improve the heat dissipation efficiency of the heat sink 300 to the first accommodating cavity 307.

[0037] Further, refer to Figure 4 The second connection surface 302 and the sixth connection surface 306 are provided with limiting protrusions 310 for being engaged with the first circuit board 200 .

[0038] The heat sink 300 is connected to the first circuit board 200 by providing the limiting clamping protrusion 310 on the second connection surface 302 and the sixth connection surface 306, so that the connection between the heat sink 300 and the first circuit board 200 is stable and reliable. The limiting clamping protrusion 310 provides a stable fixing point to prevent the connection from loosening or falling off, thereby ensuring a good mechanical connection between the heat sink 300 and the first circuit board 200.

[0039] On the other hand, the presence of the limit clamp 310 can help the user to correctly install the heat sink 300 on the first circuit board 200, avoid mis-insertion and connection, and effectively save installation time. The heat sink 300 on the first circuit board 200 can also be limited and positioned, and the heat sink 300 can only be fully engaged when it is inserted in the correct direction and position.

[0040] Further, refer to Figure 4 A through hole 311 is formed on the third connecting surface 303 to connect the first accommodating cavity 307 and the second accommodating cavity 308 .

[0041] The first accommodating chamber 307 is connected to the second accommodating chamber 308 through the through hole 311 on the third connecting surface 303. On the one hand, the components in the first accommodating chamber 307 can be electrically connected to the components in the second accommodating chamber 308 through wiring. On the other hand, the air between the first accommodating chamber 307 and the second accommodating chamber 308 can flow freely. This helps to improve the heat dissipation effect of the power adapter 1000 and promote the transfer and dissipation of heat. By increasing the path for air circulation, the through hole 311 can improve the heat dissipation efficiency and reduce the temperature of the power adapter 1000 during operation, thereby improving its performance and reliability.

[0042] refer to Figure 1 The power adapter 1000 also includes a heat-conducting component 500, which includes a first heat-conducting layer 501 and a second heat-conducting layer 502. The first heat-conducting layer 501 is arranged between the outer shell 101 and the heat-dissipating inner shell 102, and the second heat-conducting layer 502 is arranged in the heat-dissipating inner shell 102. The second heat-conducting layer 502 is arranged on the side of the first connecting surface 301 away from the first circuit board 200, and the second heat-conducting layer 502 covers the first accommodating cavity 307 and the second accommodating cavity 308.

[0043] The first heat-conducting layer 501 is located between the outer shell 101 and the heat-dissipating inner shell 102, and can effectively transfer the heat of the heat-dissipating inner shell 102 to the outer shell 101, thereby improving the overall heat dissipation effect. The first heat-conducting layer 501, as a heat-conducting medium, can help transfer heat from the heat-dissipating inner shell 102 to the outer shell 101, and further dissipate heat to the surrounding environment. The second heat-conducting layer 502 is located inside the heat-dissipating inner shell 102, and can play a role in heat insulation and heat dispersion. It can transfer heat directly to the heat-dissipating inner shell 102, reduce the impact of heat on the first circuit board 200, and thus protect the normal operation of the power adapter 1000.

[0044] Specifically, the second heat-conducting layer 502 covers the first accommodating cavity 307 and the second accommodating cavity 308, which can help to evenly distribute the heat to each accommodating cavity and improve the overall heat dissipation effect. Such a design can ensure that the temperature inside the accommodating cavity is evenly distributed, avoid hot spot concentration, and improve the heat dissipation performance of the power adapter 1000.

[0045] refer to Figure 2 and Figure 3 The power adapter 1000 also includes a second circuit board 600, which is vertically arranged with the first circuit board 200, and is arranged in the third accommodating cavity 309. The second circuit board 600 is connected with an AC socket 401 and an electromagnetic interference module, and the AC socket 401 is connected with the housing 101.

[0046] The second circuit board 600 is arranged vertically with the first circuit board 200, and an AC socket 401 and an electromagnetic interference module are arranged on the second circuit board 600. The above components are arranged in the third accommodating cavity 309, which can reduce interference and interference between components. This helps to improve the working stability and reliability of the power adapter 1000.

[0047] Specifically, the second circuit board 600 is located inside the third accommodating cavity 309, which can more effectively utilize the space of the power adapter 1000. The AC socket 401 needs to be connected to the outside world, so it is set on the side of the shell in the third accommodating cavity 309 to provide grounding function and electrical safety. By connecting with the shell 101, the power adapter 1000 can be better connected to an external electrical appliance or power source to protect the safety of the user.

[0048] Specifically, the AC socket 401 refers to a socket that can only pass AC voltage, and is a device for providing an AC power interface. It is usually used to connect electrical devices or chargers to convert AC power into the power required by the device. The AC socket 401 is usually composed of two or three jacks for inserting plugs of electrical devices. These jacks are usually connected to corresponding pins of the power cord to transmit power to the device.

[0049] refer to Figure 2 and Figure 3 The heating element 400 further includes a filter module 403 and a common-mode inductor 404 . The filter module 403 and the common-mode inductor 404 are disposed on the first circuit board 200 . The filter module 403 is disposed in the first accommodating cavity 307 , and the common-mode inductor 404 is disposed in the second accommodating cavity 308 .

[0050] A filter module 403 is disposed in the first accommodating cavity 307, and a common mode inductor 404 is disposed in the second accommodating cavity 308. Since the filter module 403 and the common mode inductor 404 are disposed on the first circuit board 200 and are respectively placed in different accommodating cavities, this layout can avoid their adverse effects on the heat dissipation performance. The design of the heat dissipation inner shell 102, the first heat conductive layer 501 and the second heat conductive layer 502 can effectively conduct and dissipate the generated heat, improve the heat dissipation effect of the entire power adapter 1000, and maintain the normal operating temperature of the power adapter 1000.

[0051] Specifically, the filter module 403 is used to suppress the electromagnetic interference that may be generated by the power adapter 1000. By placing the filter module 403 in the first accommodation cavity 307, the electromagnetic interference between the filter module 403 and other circuit components can be better isolated, thereby improving the electromagnetic compatibility of the entire system.

[0052] Specifically, the common mode inductor 404 is used to suppress common mode noise, that is, the noise between two signals that appear simultaneously in the circuit. By placing the common mode inductor 404 in the second accommodation cavity 308, the interference between the common mode inductor 404 and other circuit components can be better isolated, the common mode suppression effect is improved, and the noise in the system is reduced.

[0053] refer to Figure 1 The housing assembly 100 further includes an insulating layer 103 , which is attached to the inner heat dissipation shell 102 , and the first circuit board 200 and the second heat conducting layer 502 are disposed on the inner side of the insulating layer 103 .

[0054] The presence of the insulating layer 103 can effectively isolate the first circuit board 200 and the first heat-conducting layer 501, and provide electrical insulation protection. The use of the insulating layer 103 can prevent direct contact between the first circuit board 200 and / or the second circuit board 600 and the heat dissipation inner shell 102, reduce the risk of circuit short circuits and other electrical failures, and improve the safety and reliability of the power adapter 1000. The presence of the insulating layer 103 can also provide a certain degree of electromagnetic isolation. In the power adapter 1000, electronic components and the first circuit board 200 and / or the second circuit board 600 may generate electromagnetic radiation or be subject to external electromagnetic interference. By using the insulating layer 103 to isolate the first circuit board 200 and the second heat-conducting layer 600, the propagation of electromagnetic radiation and the impact of external electromagnetic interference on the circuit can be reduced, and the electromagnetic compatibility and anti-interference ability of the power adapter 1000 can be improved.

[0055] In this embodiment, the insulating layer 103 is an insulating Mylar film, which is an insulating material, usually made of a polyester film (such as polyester Mylar film). The insulating Mylar film has good insulation properties and can effectively isolate current and prevent electrical conduction. The insulating Mylar film usually has high temperature resistance and can maintain stable insulation properties within a certain temperature range. The insulating Mylar film is usually thin and flexible, and is easy to cut, bend and install.

[0056] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present utility model rather than to limit it. For those skilled in the art, the technical solutions described in the above embodiments can be modified, or some of the technical features therein can be replaced by equivalents; and all these modifications and replacements should fall within the scope of protection of the claims attached to the present utility model.

Claims

1. A power adapter, characterized in that: include: A housing assembly, the housing assembly comprising an outer housing and a heat dissipation inner housing, wherein the heat dissipation inner housing is sleeved in the outer housing; A first circuit board, wherein the first circuit board is arranged in the heat dissipation inner shell; A heat dissipation plate, wherein the heat dissipation plate is bent and disposed on the first circuit board, so that a first accommodating cavity, a second accommodating cavity and a third accommodating cavity are formed between the heat dissipation plate and the first circuit board; Wherein, the first accommodating cavity, the second accommodating cavity and the third accommodating cavity contain heating elements connected to the first circuit board.

2. The power adapter according to claim 1, characterized in that: The heat dissipation plate includes a first connection surface, a second connection surface, a third connection surface, a fourth connection surface, a fifth connection surface and a sixth connection surface which are connected in sequence. The first connection surface, the second connection surface, the third connection surface and the first circuit board together constitute a first accommodating cavity. The third connection surface, the fourth connection surface, the fifth connection surface and the first circuit board together constitute a second accommodating cavity. The fifth connection surface, the sixth connection surface and the first circuit board together constitute the third accommodating cavity.

3. The power adapter according to claim 2, characterized in that: The first connection surface, the second connection surface and the third connection surface are perpendicular to each other, the second connection surface, the fourth connection surface and the sixth connection surface are arranged in parallel, the third connection surface and the fifth connection surface are arranged in parallel, and the first connection surface is parallel to the first circuit board.

4. The power adapter according to claim 2, characterized in that: The power adapter also includes a heat-conducting component, which includes a first heat-conducting layer and a second heat-conducting layer. The first heat-conducting layer is arranged between the outer shell and the heat-dissipating inner shell, and the second heat-conducting layer is arranged in the heat-dissipating inner shell. The second heat-conducting layer is arranged on the side of the first connecting surface away from the first circuit board, and the second heat-conducting layer covers the first accommodating cavity and the second accommodating cavity.

5. The power adapter according to claim 2, characterized in that: The power adapter also includes a second circuit board, which is vertically arranged with respect to the first circuit board, and is arranged in the third accommodating cavity. An AC socket and an electromagnetic interference module are connected to the second circuit board, and the AC socket is connected with the housing.

6. The power adapter according to claim 2, characterized in that: The heating element further includes a filter module and a common-mode inductor, wherein the filter module and the common-mode inductor are arranged on the first circuit board, the filter module is arranged in the first accommodating cavity, and the common-mode inductor is arranged in the second accommodating cavity.

7. The power adapter according to any one of claims 2 to 6, characterized in that: The second connection surface and the sixth connection surface are provided with limiting clamping protrusions for clamping with the first circuit board.

8. The power adapter according to any one of claims 2 to 6, characterized in that: The third connecting surface is provided with a through hole to connect the first accommodating cavity with the second accommodating cavity.

9. The power adapter according to any one of claims 1 to 6, characterized in that: The heat dissipation inner shell and the heat dissipation plate are made of copper.

10. The power adapter according to claim 4, characterized in that: The housing assembly further comprises an insulating layer, wherein the insulating layer is attached to the inner heat dissipation shell, and the first circuit board and the second heat conducting layer are arranged on the inner side of the insulating layer.

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