Power conversion device

Abstract

The utility model provides a power conversion device. The power conversion equipment comprises a shell, a heat dissipation substrate, a circuit board, a power module and a uniform temperature plate. The shell comprises a containing cavity, the containing cavity is provided with a mounting hole, and the mounting hole is communicated with the containing cavity. The heat dissipation substrate is contained in the mounting hole and seals the containing cavity, and a plurality of heat dissipation fins are arranged on the side, opposite to the containing cavity, of the heat dissipation substrate in the first direction. The circuit board is accommodated in the accommodating cavity. The power module is arranged between the circuit board and the heat dissipation substrate, the power module comprises a mounting part and a matching part, in the first direction, the mounting part is arranged on one side of the matching part, the mounting part is arranged on the circuit board, and the matching part is in contact with the heat dissipation substrate. In the first direction, the uniform temperature plate is in heat conduction connection with the plurality of heat dissipation fins, and the uniform temperature plate is arranged on one side of the plurality of heat dissipation fins and is opposite to the heat dissipation substrate. The temperature equalizing plate can equalize the temperature of the plurality of heat dissipation fins and reduce the temperature difference among the plurality of heat dissipation fins, so that the overall heat dissipation efficiency of the plurality of heat dissipation fins is improved.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a power conversion device. Background Art

[0002] In existing power conversion devices, the heat generated by the power module during operation is transferred to the heat dissipation fins through the heat dissipation substrate, and the heat dissipation fins transfer the heat to the external environment through natural convection of the air to achieve heat dissipation of the power module. However, the efficiency of the heat dissipation fins in transferring heat to the external environment through natural convection of the air is low, resulting in low heat dissipation efficiency for the power module. Utility Model Content

[0003] The present application provides a power conversion device. In the power conversion device provided by the present application, the overall heat dissipation efficiency of a plurality of heat dissipation fins is effectively improved, and the heat dissipation efficiency of the power module is greatly improved.

[0004] An embodiment of the present application provides a power conversion device. The power conversion device includes a housing, a heat dissipation substrate, a circuit board, a power module and a temperature equalizer. The housing includes a receiving cavity, the receiving cavity is provided with a mounting hole, and the mounting hole is connected to the receiving cavity. The heat dissipation substrate is received in the mounting hole and closes the receiving cavity. In a first direction, a plurality of heat dissipation fins are provided on the side of the heat dissipation substrate facing away from the receiving cavity. The circuit board is received in the receiving cavity. The power module is arranged between the circuit board and the heat dissipation substrate. The power module includes a mounting portion and a mating portion. In the first direction, the mounting portion is arranged on one side of the mating portion, the mounting portion is arranged on the circuit board, and the mating portion contacts the heat dissipation substrate. In the first direction, the temperature equalizer is thermally connected to the plurality of heat dissipation fins, the temperature equalizer is arranged on one side of the plurality of heat dissipation fins and facing away from the heat dissipation substrate, and the first direction is the thickness direction of the temperature equalizer.

[0005] In the power conversion device provided in the present application, most of the heat generated by the power module during operation is transferred to the temperature equalizing plate through a part of the heat dissipation fins, part of the heat transferred to the temperature equalizing plate is transferred to the external environment, and the other part is transferred back to another part of the heat dissipation fins and then transferred to the external environment, thereby achieving rapid heat dissipation of the power module.

[0006] Compared with the existing solution that the heat transferred from the power module to the heat sink is transferred to the external environment through air convection, most of the heat generated by the power module of the power conversion device provided by the present application is quickly dispersed through a part of the heat sink through the temperature averaging plate, and then transferred back to the other part of the heat sink through the temperature averaging plate. The temperature averaging plate can be used to average the temperature of multiple heat sinks and reduce the temperature difference between the multiple heat sinks. Without changing the size of the heat sink, the overall heat dissipation efficiency of the multiple heat sinks is effectively improved, and the ability to naturally dissipate heat for the power module is greatly improved; moreover, the heat generated by the power module can also be transferred to the external environment through the multiple heat sinks through the temperature averaging plate, which greatly improves the heat dissipation efficiency of the power module.

[0007] In a possible implementation, a closed channel is provided in the temperature homogenizing plate, and the closed channel is used for fluid flow to homogenize the temperature of the plurality of heat dissipating fins and reduce the temperature difference between the plurality of heat dissipating fins.

[0008] Most of the heat generated by the power module when it is working is transferred to the temperature equalizer through a part of the heat sink fins, and then transferred from the temperature equalizer to the closed channel. The fluid in the closed channel absorbs heat and evaporates on the side close to the heat sink fins, and releases heat and condenses on the side away from the heat sink fins. The fluid undergoes a gas-liquid two-phase change in the closed channel. The heat released by the condensation of the gaseous fluid in the closed channel is transferred from the temperature equalizer to the external environment. In this process, through the capillary force of the flow channel or the change of the pressure difference in the flow channel, the fluid circulates along the extension direction of the closed channel, and a small temperature difference is achieved at various parts of the temperature equalizer to achieve a uniform temperature state. The heat released by the condensation of the gaseous fluid in the closed channel can also be quickly transferred in the temperature equalizer, and transferred from the temperature equalizer back to another part of the heat sink fins and then to the external environment.

[0009] Through the circulation of fluid in the closed channel and the gas-liquid two-phase change of the fluid in the closed channel, most of the heat generated by the power module of the power conversion device provided by the present application during operation is quickly dissipated through the heat of a part of the heat dissipating fins through the temperature equalizing plate, and then transferred back to the other part of the heat dissipating fins through the temperature equalizing plate. Without changing the size of the heat dissipating fins, the overall heat dissipation efficiency of multiple heat dissipating fins is effectively improved, and the ability of natural heat dissipation of the power module is greatly improved; moreover, the heat generated by the power module can also be transferred to the external environment through the temperature equalizing plate through multiple heat dissipating fins, which greatly improves the heat dissipation efficiency of the power module.

[0010] In one possible embodiment, a plurality of heat sinks are located between a heat sink substrate and a temperature equalizing plate to evenly distribute the temperature of the plurality of heat sinks in a second direction, wherein the second direction is perpendicular to the first direction, and a plurality of air flow channels are formed between the heat sink substrate, the plurality of heat sinks and the temperature equalizing plate, and the plurality of air flow channels are arranged at intervals.

[0011] Most of the heat generated by the power module when it is working can be transferred to the temperature averaging plate through a part of the heat dissipation fins, and then transferred to another part of the heat dissipation fins around this part of the heat dissipation fins through the temperature averaging plate along the second direction, thereby achieving uniform temperature of all the heat dissipation fins. The air flow channel is used for cold air to pass through, and the cold air passing through the air flow channel can take away the heat of the heat dissipation fins, thereby achieving heat dissipation of the power module.

[0012] In one possible embodiment, the plurality of heat sinks include a first heat sink and a second heat sink, the second heat sink is spaced apart from the first heat sink, the projection of the first heat sink in the first direction overlaps with the projection of the power module in the first direction, and the projection of the second heat sink in the first direction is spaced apart from the projection of the power module in the first direction.

[0013] Since the projection of the first heat sink fin in the first direction overlaps with the projection of the power module in the first direction, and the projection of the second heat sink fin in the first direction is spaced from the projection of the power module in the first direction, most of the heat generated by the power module during operation is transferred to the temperature equalizer through the first heat sink fin, and a small part is transferred to the external environment through the second heat sink fin. Through the circulation of the fluid in the closed channel and the gas-liquid two-phase change of the fluid in the closed channel, the heat transferred from the first heat sink fin to the temperature equalizer can be transferred back to the second heat sink fin through the temperature equalizer, thereby improving the heat dissipation efficiency of the second heat sink fin, thereby improving the overall heat dissipation efficiency of multiple heat sinks, and greatly improving the ability to naturally dissipate heat for the power module.

[0014] In a possible implementation manner, a projection of the closed channel in the first direction is spaced apart from a projection of the plurality of heat dissipating fins in the first direction.

[0015] Since the strength of the temperature equalizing plate at the portion corresponding to the closed channel is relatively low, the design of spacing the projection of the closed channel in the first direction and the projection of the plurality of heat sinks in the first direction is beneficial to improving the connection strength between the temperature equalizing plate and the heat sinks, and to improving the structural stability of the power conversion equipment; moreover, on the basis of ensuring the connection strength between the temperature equalizing plate and the heat sinks, it is beneficial to reduce the size of the temperature equalizing plate in the first direction (i.e., the thickness of the temperature equalizing plate), and is beneficial to the miniaturization and lightweight design of the temperature equalizing plate.

[0016] In a possible implementation manner, a projection of the closed channel in the first direction surrounds projections of the plurality of heat dissipating fins in the first direction.

[0017] The design that the projection of the closed channel in the first direction surrounds the projection of the plurality of heat sinks in the first direction ensures that the heat transferred from the power module to the temperature equalizer through a portion of the heat sinks can be transferred to the closed channel in all directions, which is conducive to improving the efficiency of the heat generated by the power module during operation being transferred to the closed channel through a portion of the heat sinks, and is conducive to improving the heat dissipation efficiency of the fluid in the closed channel to a portion of the heat sinks, and is conducive to improving the heat dissipation efficiency of the power module. Moreover, it is conducive to improving the efficiency of the heat released by the condensation of the gaseous fluid in the closed channel being transferred from the temperature equalizer back to another portion of the heat sinks, which is conducive to improving the overall heat dissipation efficiency of the plurality of heat sinks, and is conducive to improving the heat dissipation efficiency of the power module.

[0018] In a possible embodiment, the closed channel includes a bending section and a connecting section, the bending section includes a plurality of receiving openings, the plurality of receiving openings are spaced apart along the second direction, in the third direction, the connecting section is located on one side of the bending section and is connected to the bending section, the connecting section closes the plurality of receiving openings, the first direction, the second direction and the third direction are perpendicular to each other; the projections of the plurality of heat dissipating fins in the first direction are located one-to-one within the projections of the plurality of receiving openings in the first direction.

[0019] The design that the projections of the multiple heat sinks in the first direction are located one by one within the projections of the multiple receiving openings in the first direction ensures that the heat transferred from the power module to the temperature equalizing plate through a part of the heat sink fins can be transferred to the closed channel in all directions, which is conducive to improving the efficiency of the heat generated by the power module during operation being transferred to the closed channel through a part of the heat sink fins, and is conducive to improving the heat dissipation efficiency of the fluid in the closed channel to a part of the heat sink fins, and is conducive to improving the heat dissipation efficiency of the power module. Moreover, it is conducive to improving the efficiency of the heat released by the condensation of the gaseous fluid in the closed channel being transferred back from the temperature equalizing plate to another part of the heat sink fins, which is conducive to improving the overall heat dissipation efficiency of the multiple heat sink fins, and is conducive to improving the heat dissipation efficiency of the power module. In addition, the design is simple and the design cost is low, which is conducive to reducing the processing cost.

[0020] In a possible implementation manner, a guide section is provided in the temperature homogenizing plate, the guide section is communicated with the closed channel, and the guide section is used to restrict the unidirectional flow of the fluid.

[0021] The design of the guide section ensures that the fluid in the closed channel circulates unidirectionally along the closed channel, which is beneficial to improving the efficiency of the fluid circulation, and is beneficial to improving the efficiency of heat transferred from the power module to the temperature equalizing plate through a part of the heat dissipation fins and transferred back to another part of the heat dissipation fins through the fluid in the closed channel. It is beneficial to improve the overall heat dissipation efficiency of multiple heat dissipation fins and improve the heat dissipation efficiency of the power module.

[0022] In a possible embodiment, the guide segment includes a first guide sub-segment and a second guide sub-segment, one end of the second guide sub-segment is connected to one end of the first guide sub-segment, the second guide sub-segment is bent relative to the first guide sub-segment, one end of the first guide sub-segment facing away from the second guide sub-segment is connected to the closed channel, the first guide sub-segment is inclined relative to the extension direction of the closed channel, and one end of the second guide sub-segment facing away from the first guide sub-segment is connected to the closed channel.

[0023] Part of the fluid in the closed channel flows along the extension direction of the closed channel, and the other part flows from the closed channel into the guide section and then flows back to the closed channel from the guide section. When the fluid in the closed channel flows back to the closed channel from the closed channel through the second guide sub-segment and the first guide sub-segment in sequence, the fluid flowing back to the closed channel from the first guide sub-segment will not hinder the fluid flowing in the closed channel. When the fluid in the closed channel flows back to the closed channel from the closed channel through the first guide sub-segment and the second guide sub-segment in sequence, the fluid flowing back to the closed channel from the second guide sub-segment will hinder the fluid flowing in the closed channel. Therefore, the design of the first guide sub-segment and the second guide sub-segment can limit the unidirectional flow of the fluid in the closed channel. In this way, not only is the structure simple and easy to design, but the processing cost is also low, which is conducive to reducing the processing cost of the temperature equalizing plate and the processing cost of the power conversion equipment.

[0024] In a possible implementation manner, a protrusion is provided on the surface of the temperature homogenizing plate, a projection of the protrusion in the first direction overlaps with a projection of the closed channel in the first direction, and the protrusion is spaced apart from the heat dissipation fin.

[0025] The protrusion design is conducive to improving the strength of the portion of the temperature averaging plate corresponding to the closed channel, which is conducive to improving the structural stability of the temperature averaging plate, and is conducive to improving the structural stability of the power conversion device. Moreover, the protrusion can play a role in indicating the closed channel, which is convenient for positioning the heat sink and the closed channel, and then convenient for assembling the temperature averaging plate and the heat sink, which is conducive to reducing the difficulty of assembling the temperature averaging plate and the heat sink, and is conducive to reducing the processing cost of the power conversion device.

[0026] In a possible implementation, a plurality of grooves are provided on the surface of the temperature homogenizing plate, the plurality of grooves are arranged at intervals from the closed channels, and the heat dissipating fins are snapped into the plurality of grooves in a one-to-one correspondence.

[0027] The design of the groove is conducive to improving the installation accuracy of the temperature averaging plate and the heat sink fins, and is conducive to improving the installation strength of the temperature averaging plate and the heat sink fins, and is conducive to improving the structural stability of the power conversion equipment. In addition, the groove can play a positioning role, which is convenient for the assembly of the temperature averaging plate and the heat sink fins, which is conducive to reducing the difficulty of assembling the temperature averaging plate and the heat sink fins, and is conducive to reducing the processing cost of the power conversion equipment.

[0028] In a possible implementation manner, the temperature homogenizing plate is provided with a first through hole, the first through hole penetrates the temperature homogenizing plate along a first direction, and the first through hole is spaced apart from the closed channel.

[0029] The design of the first through hole ensures that cold air from the external environment can flow from the side of the temperature equalizer facing away from the heat sink through the first through hole to the heat sink, which is beneficial to improving the heat dissipation efficiency of the heat sink, and further to improving the heat dissipation efficiency of the power module.

[0030] In a possible implementation manner, the temperature homogenizing plate is provided with a first heat conducting fin, the first heat conducting fin is arranged on the hole wall of the first through hole, and the first heat conducting fin is arranged obliquely relative to the cross section of the first through hole.

[0031] The design of the first heat conducting fin is beneficial to increasing the contact area between the temperature averaging plate and the cold air, which is beneficial to increasing the amount of heat transferred from the power module to the external environment through the heat dissipating fins and the temperature averaging plate, which is beneficial to improving the efficiency of heat dissipation of the power module through the heat dissipating fins and the temperature averaging plate, and which is beneficial to improving the heat dissipation efficiency of the power module.

[0032] In one possible embodiment, the power conversion device includes a fan, which is disposed in a shell and located outside the receiving cavity. In a third direction, the fan is located on one side of the multiple heat dissipation fins and is spaced apart from the multiple heat dissipation fins. The projection of the fan in the third direction overlaps with the projection of the multiple heat dissipation fins in the third direction, and the third direction is perpendicular to the first direction.

[0033] The fan can blow out cooling air, and the cooling air can take away the heat of the multiple cooling fins through the multiple cooling fins, thereby cooling the multiple cooling fins. The design of the fan is conducive to improving the cooling efficiency of the multiple cooling fins, thereby improving the cooling efficiency of the power module.

[0034] In one possible embodiment, the temperature equalizing plate includes a main body and a heat conducting part. In a first direction, the heat conducting part is arranged on one side of the main body, the main body is arranged on one side of the multiple heat dissipating fins and faces away from the heat dissipating substrate, and the heat conducting part faces the heat dissipating substrate. In a second direction, the heat conducting part is located on one side of the multiple heat dissipating fins and is spaced apart from the multiple heat dissipating fins. The second direction is perpendicular to the first direction, and a closed channel is arranged in the main body and the heat conducting part.

[0035] The heat conducting part is arranged on one side of the main body, the main body is arranged on one side of the multiple heat dissipating fins and faces away from the heat dissipating substrate, the heat conducting part faces the heat dissipating substrate, and the closed channel is arranged in the main body and the heat conducting part. On the basis of ensuring that the temperature averaging plate has a large contact area with the cold air of the external environment, it is beneficial to improve the space utilization rate of the temperature averaging plate, the miniaturized design of the temperature averaging plate, and the miniaturized design of the power conversion equipment.

[0036] In a possible implementation manner, the heat conducting portion is provided with a second through hole, the second through hole penetrates the heat conducting portion along the second direction, and the second through hole is spaced apart from the closed channel.

[0037] The design of the second through hole ensures that cold air from the external environment can flow from the side of the heat conduction part facing away from the heat dissipation fins through the second through hole to the heat dissipation fins, which is beneficial to improving the heat dissipation efficiency of the heat dissipation fins, and further beneficial to improving the heat dissipation efficiency of the power module.

[0038] In a possible implementation manner, the heat conducting portion is provided with a second heat conducting fin, the second heat conducting fin is arranged on the hole wall of the second through hole, and the second heat conducting fin is arranged obliquely relative to the cross section of the second through hole.

[0039] The design of the second heat-conducting fin is beneficial to increasing the contact area between the heat-conducting part and the cold air, and is beneficial to increasing the amount of heat transferred from the power module to the external environment through the heat-dissipating fins and the temperature-averaging plate, and is beneficial to improving the efficiency of heat dissipation of the power module through the heat-dissipating fins and the temperature-averaging plate, and is beneficial to improving the heat dissipation efficiency of the power module. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0041] Figure 1 It is a structural block diagram of the cooperation between the power conversion device provided in the embodiment of the present application and the photovoltaic module and the power grid;

[0042] Figure 2 yes Figure 1 A schematic diagram of the three-dimensional structure of the power conversion device shown;

[0043] Figure 3 yes Figure 2 The three-dimensional structure exploded schematic diagram of the power conversion device shown;

[0044] Figure 4 yes Figure 2 The schematic diagram of the structure of the power conversion device shown is cut along the AA line;

[0045] Figure 5 yes Figure 2 The schematic diagram of the exploded three-dimensional structure of the heating element of the power conversion device shown;

[0046] Figure 6 yes Figure 4 The schematic diagram of the structure of the power conversion device shown in another angle;

[0047] Figure 7 yes Figure 6 The schematic diagram of the partial structure of the power conversion device shown is cut along the BB line;

[0048] Figure 8 yes Figure 6 The schematic diagram of the structure of the temperature averaging board of the power conversion device shown in another angle;

[0049] Fig. 9 yes Figure 6 An enlarged view of part IX of the power conversion device shown;

[0050] Fig.10 yes Figure 6 The power conversion device shown is a partial structural schematic diagram of another embodiment cut along line BB;

[0051] Fig.11 yes Figure 6 The power conversion device shown is a partial structural schematic diagram of another embodiment cut along line BB;

[0052] Fig.12 yes Figure 6 The power conversion device shown is a partial structural schematic diagram of another embodiment cut along line BB;

[0053] Fig.13 yes Figure 6 The power conversion device shown is a partial structural schematic diagram of another embodiment cut along line BB;

[0054] Fig.14 yes Figure 6 The power conversion device shown is a partial structural schematic diagram of another embodiment cut along line BB;

[0055] Fig.15 yes Figure 6 The structure diagram of the power conversion device shown in another embodiment;

[0056] Fig.16 yes Fig.15 An enlarged view of part XVI of the power conversion device shown;

[0057] Fig.17 yes Figure 2 The three-dimensional structural schematic diagram of the power conversion device shown in another embodiment;

[0058] Fig.18 yes Fig.17 An enlarged view of part XVIII of the power conversion device shown;

[0059] Fig.19 yes Fig.17 The three-dimensional structural schematic diagram of the power conversion device shown in another embodiment;

[0060] Fig. 20 yes Fig.19An enlarged view of part XX of the power conversion device shown;

[0061] Fig.21 yes Figure 2 The power conversion device shown is a schematic structural diagram of another embodiment cut along line AA. DETAILED DESCRIPTION

[0062] The embodiment of the present application provides a power conversion device. In the power conversion device provided by the present application, through the circulation of the fluid in the closed channel of the temperature averaging plate and the gas-liquid two-phase change of the fluid in the closed channel, most of the heat generated by the heating element can be quickly dispersed through a part of the heat dissipation fins through the temperature averaging plate, and then transferred back to another part of the heat dissipation fins through the temperature averaging plate, without changing the size of the heat dissipation fins, effectively improving the overall heat dissipation efficiency of multiple heat dissipation fins, greatly improving the ability of natural heat dissipation of the heating element; moreover, the heat generated by the heating element can also be transferred to the external environment through the temperature averaging plate, greatly improving the heat dissipation efficiency of the heating element.

[0063] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0064] See also Figure 1 , Figure 2 and Figure 3 , Figure 1 It is a structural block diagram of the cooperation between the power conversion device 100 provided in the embodiment of the present application, the photovoltaic component 200 and the power grid 300. Figure 2 yes Figure 1 The three-dimensional structural schematic diagram of the power conversion device 100 is shown. Figure 3 yes Figure 2 The three-dimensional structure of the power conversion device 100 is shown in FIG. Figure 2 and Figure 3 The features indicated by the dashed lines in are indicative of closed channels 25.

[0065] Exemplarily, the power conversion device 100 is a photovoltaic inverter. In some other embodiments, the power conversion device 100 may also be an electronic device for power conversion such as a rectifier, a transformer, a converter or other inverter. The power conversion device 100 is used to convert the direct current output by the photovoltaic component 200 into alternating current and supply it to the power grid 300. In some other embodiments, the power conversion device 100 can also be used to convert the direct current output by the photovoltaic component 200 into alternating current and supply it to the load device. The load device can be an electronic device that uses alternating current, including but not limited to a motor, a fan or an air conditioner. In some other embodiments, the power conversion device 100 can also be applied to an electric drive controller. For example, the power conversion device 100 can convert the direct current output by the battery into alternating current to supply the motor.

[0066] The power conversion device 100 includes a heating element 10 and a temperature averaging plate 20. In the Z-axis direction, the temperature averaging plate 20 is arranged on one side of the heating element 10. The heating element 10 is used to convert the direct current output by the photovoltaic module 200 into alternating current and supply it to the power grid 300. The temperature averaging plate 20 is used to dissipate heat from the heating element 10. In this application, the Z-axis direction shown in the figure is defined as the first direction, the X-axis direction shown in the figure is defined as the second direction, and the Y-axis direction shown in the figure is defined as the third direction. The first direction, the second direction and the third direction are perpendicular to each other.

[0067] Exemplarily, the temperature equalizing plate 20 is a rectangular plate. In some other embodiments, the temperature equalizing plate 20 may also be a circular plate, a triangular plate or other special-shaped plates. In this embodiment, the Z-axis direction (i.e., the first direction) shown in the figure is the thickness direction of the temperature equalizing plate 20, the X-axis direction (i.e., the second direction) shown in the figure is the length direction of the temperature equalizing plate 20, and the Y-axis direction (i.e., the third direction) shown in the figure is the width direction of the temperature equalizing plate 20. In some other embodiments, the X-axis direction (i.e., the second direction) shown in the figure may also be the width direction of the temperature equalizing plate 20, and the Y-axis direction (i.e., the third direction) shown in the figure may also be the length direction of the temperature equalizing plate 20.

[0068] See also Figure 4 and Figure 5 , and combined with Figure 1 , Figure 4 yes Figure 2 The power conversion device 100 shown is a schematic structural diagram cut along line AA. Figure 5 yes Figure 2 The schematic diagram of the three-dimensional structure explosion of the heating element 10 of the power conversion device 100 is shown.

[0069] like Figure 1 , Figure 4 and Figure 5As shown, in some embodiments, the heating element 10 includes a housing 11, a heat sink 12, a circuit board 13 and a power module 14. In other words, the power conversion device 100 includes a housing 11, a heat sink 12, a circuit board 13 and a power module 14. The heat sink 12 is partially disposed in the housing 11 and partially located outside the housing 11. In the Z-axis direction (i.e., the first direction), the circuit board 13 is disposed on one side of the heat sink 12, and the power module 14 is disposed between the circuit board 13 and the heat sink 12. The circuit board 13 and the power module 14 are accommodated in the housing 11. The direct current output by the photovoltaic assembly 200 is transmitted to the power module 14 through the circuit board 13, and the power module 14 is used to convert the direct current output by the photovoltaic assembly 200 into alternating current. The alternating current output by the power module 14 is transmitted to the power grid 300 through the circuit board 13 to supply the power grid 300. The heat emitted by the power module 14 when working is transferred to the outside of the heating element 10 through the circuit board 13 and the heat sink 12. The design of the shell 11 can protect the power module 14 and the circuit board 13, prevent the power module 14 and the circuit board 13 from being damaged by the external environment, which is beneficial to improving the safety of the power module 14 and the circuit board 13 and extending the service life of the power module 14 and the circuit board 13.

[0070] like Figure 4 and Figure 5 As shown, illustratively, the shell 11 is a rectangular box. In some other embodiments, the shell 11 may also be a triangular box, a sphere or other special-shaped body. The shell 11 includes a receiving chamber 111. Specifically, the shell 11 includes a first shell wall 112, a second shell wall 113, a third shell wall 114 and a fourth shell wall 115. In the Z-axis direction, the first shell wall 112 and the second shell wall 113 are arranged oppositely and spaced apart. The number of the third shell walls 114 is two. In the Y-axis direction, the two third shell walls 114 are arranged oppositely and spaced apart. The two third shell walls 114 are both connected to the first shell wall 112 and the second shell wall 113. The number of the fourth shell wall 115 is two. In the X-axis direction, the two fourth shell walls 115 are arranged oppositely and spaced apart. The two fourth shell walls 115 are both connected to the first shell wall 112, the second shell wall 113 and the two third shell walls 114. The first shell wall 112 , the second shell wall 113 , the two third shell walls 114 and the two fourth shell walls 115 together form the receiving chamber 111 .

[0071] The receiving cavity 111 is provided with a mounting hole 116, and the mounting hole 116 is communicated with the receiving cavity 111. Specifically, the mounting hole 116 passes through the first shell wall 112 along the Z-axis direction and is communicated with the receiving cavity 111. Exemplarily, the mounting hole 116 is a rectangular hole. In some other embodiments, the mounting hole 116 may also be a circular hole, a triangular hole or other special-shaped holes. Among them, the mounting hole 116 includes a first wall surface 1161 and a second wall surface 1162. The number of the first wall surfaces 1161 is two. In the X-axis direction, the two first wall surfaces 1161 are arranged oppositely and spaced apart. The number of the second wall surfaces 1162 is two. In the Y-axis direction, the two second wall surfaces 1162 are arranged oppositely and spaced apart. The two second wall surfaces 1162 are connected between the two first wall surfaces 1161.

[0072] In some embodiments, the heat sink 12 is received in the mounting hole 116 and partially exposed outside the housing 11. The heat sink 12 is made of a heat conductive material including but not limited to copper or aluminum. The heat sink 12 includes a heat sink substrate 121 and a plurality of heat sink fins 122. In other words, the power conversion device 100 includes a heat sink substrate 121 and a plurality of heat sink fins 122. In the Z-axis direction, a plurality of heat sink fins 122 are arranged on one side of the heat sink substrate 121. Specifically, a plurality of heat sink fins 122 are fixedly stacked on one side of the heat sink substrate 121, and a plurality of heat sink fins 122 are fixedly stacked on the surface of the heat sink substrate 121. That is to say, in the Z-axis direction (i.e., the first direction), a plurality of heat sink fins 122 are provided on one side of the heat sink substrate 121. In the X-axis direction, a plurality of heat sink fins 122 are arranged at intervals. In some other embodiments, a plurality of heat sink fins 122 may also be arranged at intervals along the Y-axis direction. Among them, the heat sink substrate 121 is received in the mounting hole 116 and closes the receiving cavity 111. The surface of the heat dissipation substrate 121 facing away from the receiving cavity 111 is exposed outside the housing 11. That is, the heat dissipation substrate 121 is received in the mounting hole 116 and partially exposed outside the housing 11. A plurality of heat dissipation fins 122 are located outside the receiving cavity 111. A plurality of heat dissipation fins 122 are located outside the housing 11. That is, in the Z-axis direction (i.e., the first direction), a plurality of heat dissipation fins 122 are provided on the side of the heat dissipation substrate 121 facing away from the receiving cavity 111.

[0073] Exemplarily, the heat dissipation substrate 121 is a rectangular plate. In some other embodiments, the heat dissipation substrate 121 may also be a circular plate, a triangular plate or other special-shaped plates. The heat dissipation substrate 121 includes a first plate surface 1211, a second plate surface 1212, a third plate surface 1213 and a fourth plate surface 1214. In the Z-axis direction, the first plate surface 1211 and the second plate surface 1212 are arranged opposite to each other and spaced apart. The number of the third plate surfaces 1213 is two. In the X-axis direction, the two third plate surfaces 1213 are arranged opposite to each other and spaced apart. The two third plate surfaces 1213 are both connected to the first plate surface 1211 and the second plate surface 1212. The number of the fourth plate surface 1214 is two. In the Y-axis direction, the two fourth plate surfaces 1214 are arranged opposite to each other and spaced apart. The two fourth plate surfaces 1214 are both connected to the first plate surface 1211, the second plate surface 1212 and the two third plate surfaces 1213. The two third plate surfaces 1213 are respectively opposite to the two first wall surfaces 1161 and fixedly stacked, and the two fourth plate surfaces 1214 are respectively opposite to the two second wall surfaces 1162 and fixedly stacked, by means including but not limited to welding or gluing. The first plate surface 1211 faces away from the receiving cavity 111. The first plate surface 1211 is exposed outside the housing 11. The second plate surface 1212 faces the receiving cavity 111.

[0074] Exemplarily, the number of the heat dissipation fins 122 is 5. In some other embodiments, the number of the heat dissipation fins 122 may also be 1, 2 or more. The plurality of heat dissipation fins 122 include a first heat dissipation fin 122a and a second heat dissipation fin 122b. The number of the first heat dissipation fin 122a is 1. The number of the second heat dissipation fins 122b is 4. In the X-axis direction, two second heat dissipation fins 122b, the first heat dissipation fin 122a and the other two second heat dissipation fins 122b are arranged in sequence. That is, the second heat dissipation fin 122b is arranged at intervals from the first heat dissipation fin 122a. In some other embodiments, the number of the first heat dissipation fin 122a and the second heat dissipation fin 122b may also be 1, 2 or more. The first heat dissipation fin 122a and the second heat dissipation fin 122b may be arranged arbitrarily in the X-axis direction.

[0075] Exemplarily, the heat dissipation fin 122 is a rectangular plate. In some other embodiments, the heat dissipation fin 122 may also be a circular plate, a triangular plate or other special-shaped plate. The heat dissipation fin 122 is fixedly stacked on the first plate surface 1211 of the heat dissipation substrate 121 and faces away from the second plate surface 1212. Among them, the heat dissipation fin 122 includes a first fixed surface 1221, a second fixed surface 1222, a third fixed surface 1223 and a fourth fixed surface 1224. In the Z-axis direction, the first fixed surface 1221 and the second fixed surface 1222 are opposite to each other and are arranged at intervals. The number of the third fixed surface 1223 is two. In the X-axis direction, the two third fixed surfaces 1223 are opposite to each other and are arranged at intervals. The two third fixed surfaces 1223 are both connected to the first fixed surface 1221 and the second fixed surface 1222. The number of the fourth fixed surface 1224 is two. In the Y-axis direction, the two fourth fixed surfaces 1224 are opposite to each other and are arranged at intervals. The two fourth fixing surfaces 1224 are connected to the first fixing surface 1221, the second fixing surface 1222 and the two third fixing surfaces 1223. The first fixing surface 1221 faces away from the first plate surface 1211. The second fixing surface 1222 faces the first plate surface 1211 and is fixedly stacked.

[0076] Exemplarily, the circuit board 13 is a rectangular circuit board. In some other embodiments, the circuit board 13 may also be a circular circuit board, a triangular circuit board or other special-shaped circuit boards. The circuit board 13 is accommodated in the accommodating cavity 111. Specifically, the circuit board 13 is fixedly connected to the two fourth shell walls 115 by means including but not limited to welding, gluing or clamping. In the Z-axis direction, the circuit board 13 is located on one side of the heat dissipation substrate 121 and faces away from the plurality of heat dissipation fins 122. The circuit board 13 is located on the second board surface 1212 and faces away from the first board surface 1211. The circuit board 13 is spaced apart from the heat dissipation substrate 121.

[0077] Exemplarily, the power module 14 may be an electronic device including but not limited to an IGBT (Insulated Gate Bipolar Transistor) chip, an FRD (Fast Recovery Diode) chip or a Mosfet (Metal oxide semiconductor field-effect transistor) chip. The power module 14 is disposed between the circuit board 13 and the radiator 12. Specifically, the power module 14 is disposed between the circuit board 13 and the heat dissipation substrate 121. The power module 14 is accommodated in the accommodating cavity 111. Exemplarily, the number of power modules 14 is multiple. Specifically, the number of power modules 14 is 2. In some other embodiments, the number of power modules 14 may also be 1, 3 or more. In the Y-axis direction, a plurality of power modules 14 are arranged in sequence at intervals. Among them, the projections of the plurality of power modules 14 in the Z-axis direction overlap with the projections of the first heat dissipation fins 122a in the Z-axis direction. In other words, the projection of the first heat dissipation fin 122a in the Z-axis direction (i.e., the first direction) overlaps with the projection of the power module 14 in the Z-axis direction (i.e., the first direction). The projections of the multiple power modules 14 in the Z-axis direction are spaced from the projections of the multiple second heat dissipation fins 122b in the Z-axis direction. In other words, the projection of the second heat dissipation fin 122b in the Z-axis direction (i.e., the first direction) is spaced from the projection of the power module 14 in the Z-axis direction (i.e., the first direction).

[0078] Each power module 14 includes a mounting portion 141 and a mating portion 142. That is, the power module 14 includes a mounting portion 141 and a mating portion 142. In the Z-axis direction (i.e., the first direction), the mounting portion 141 is arranged on one side of the mating portion 142. Specifically, the mounting portion 141 is fixedly stacked on one side of the mating portion 142. Among them, the mounting portion 141 is arranged on the circuit board 13 by means including but not limited to welding or gluing. The mounting portion 141 is fixedly stacked with the circuit board 13. The mating portion 142 is in contact with the heat dissipation substrate 121. In some other embodiments, the mating portion 142 may also be fixedly connected to the heat dissipation substrate 121 by means including but not limited to welding or gluing, and the mating portion 142 is fixedly stacked with the heat dissipation substrate 121. Since the power module 14 is in contact with the heat dissipation substrate 121, the heat generated by the power module 14 when working is transferred from the mating portion 142 to the heat dissipation substrate 121, and then transferred to the plurality of heat dissipation fins 122, so as to be transferred to the external environment, thereby realizing heat dissipation of the power module 14. This helps shorten the heat dissipation path of the power module 14 and improves the heat dissipation efficiency of the power module 14 .

[0079] See also Figure 6 , Figure 7 , Figure 8 and Fig. 9 , and combined with Figure 2 , Figure 3 , Figure 4 and Figure 5 , Figure 6 yes Figure 4 The structure diagram of the power conversion device 100 shown is shown at another angle. Figure 7 yes Figure 6 The shown schematic diagram is a partial structural diagram of the power conversion device 100 cut along line BB. Figure 8 yes Figure 6 The structure schematic diagram of the temperature homogenizing plate 20 of the power conversion device 100 is shown at another angle. Fig. 9 yes Figure 6 The enlarged view of the IX part of the power conversion device 100 shown in FIG. Figure 6 , Figure 8 and Fig. 9 The features indicated by the dotted lines in indicate the occluded features.

[0080] like Figure 2 , Figure 3 and Figure 4 As shown, in some embodiments, in the Z-axis direction (i.e., the first direction), the temperature plate 20 is thermally connected to the plurality of heat dissipation fins 122, and the temperature plate 20 is arranged on one side of the plurality of heat dissipation fins 122 and faces away from the heat dissipation substrate 121. Specifically, in the Z-axis direction, the temperature plate 20 is fixedly connected to the surface of each heat dissipation fin 122 and faces away from the heat dissipation substrate 121. In the Z-axis direction, the temperature plate 20 is fixedly connected to the first fixed surface 1221 of each heat dissipation fin 122 and faces away from the heat dissipation substrate 121. A plurality of airflow channels 20a are formed between the heat dissipation substrate 121, the plurality of heat dissipation fins 122 and the temperature plate 20, and the plurality of airflow channels 20a are arranged at intervals. Specifically, the heat dissipation substrate 121, the plurality of heat dissipation fins 122 and the temperature plate 20 are surrounded to form a plurality of airflow channels 20a, and the plurality of airflow channels 20a are arranged at intervals along the X-axis direction (i.e., the second direction). Each airflow channel 20a extends along the Y-axis direction (i.e., the third direction). The heat of the heat dissipation fins 122 can be quickly transferred to the temperature averaging plate 20. The temperature averaging plate 20 is used to dissipate heat from the plurality of heat dissipation fins 122, and can even out the temperatures of the plurality of heat dissipation fins 122. Specifically, the temperature averaging plate 20 is used to even out the temperatures of the plurality of heat dissipation fins 122 in the X-axis direction. In other words, the plurality of heat dissipation fins 122 are located between the heat dissipation substrate 121 and the temperature averaging plate 20, so as to even out the temperatures of the plurality of heat dissipation fins 122 in the X-axis direction (i.e., the second direction).

[0081] The heat generated by the power module 14 when working is transferred to the multiple heat dissipation fins 122 through the heat dissipation substrate 121, and then transferred from the multiple heat dissipation fins 122 to the temperature averaging plate 20. The heat generated by the power module 14 when working is partially transferred to the external environment through the multiple heat dissipation fins 122, and partially transferred to the external environment through the temperature averaging plate 20. The heat dissipation of the power module 14 is achieved through the heat dissipation substrate 121, the multiple heat dissipation fins 122 and the temperature averaging plate 20, which is beneficial to improving the safety of the use of the power module 14 and extending the working life of the power module 14. The airflow channel 20a is used for cold air to pass through. The cold air passing through the airflow channel 20a can take away the heat of the heat dissipation fins 122, thereby achieving heat dissipation of the power module 14.

[0082] like Figure 3 , Figure 4 and Figure 6 In some embodiments, the temperature homogenizing plate 20 includes a first heat conducting surface 21, a second heat conducting surface 22 and a third heat conducting surface 23. In the Z-axis direction, the first heat conducting surface 21 and the second heat conducting surface 22 are disposed opposite to each other and spaced apart. The third heat conducting surface 23 is connected between the first heat conducting surface 21 and the second heat conducting surface 22. Specifically, the third heat conducting surface 23 includes two first heat conducting sub-surfaces 231 and two second heat conducting sub-surfaces 232. In the X-axis direction, the two first heat conducting sub-surfaces 231 are disposed opposite to each other and spaced apart. In the Y-axis direction, the two second heat conducting sub-surfaces 232 are disposed opposite to each other and spaced apart. Both second heat conducting sub-surfaces 232 are connected to the two first heat conducting sub-surfaces 231. Among them, the first heat conducting surface 21 faces the heat dissipation fins 122. The second heat conducting surface 22 faces away from the heat dissipation fins 122.

[0083] like Figure 3 , Figure 6 and Figure 7As shown, the temperature homogenizing plate 20 is provided with a plurality of grooves 24. Specifically, the first heat conducting surface 21 of the temperature homogenizing plate 20 is provided with a plurality of grooves 24, and each groove 24 extends from the first heat conducting surface 21 along the Z-axis direction. In other words, the surface of the temperature homogenizing plate 20 is provided with a plurality of grooves 24. Exemplarily, the number of grooves 24 is 5. In some other embodiments, the number of grooves 24 may also be 1, 2 or more. In the X-axis direction, the plurality of grooves 24 are arranged in sequence at intervals. Among them, the plurality of heat dissipating fins 122 are arranged in a one-to-one correspondence in the plurality of grooves 24. Specifically, the plurality of heat dissipating fins 122 are snap-fitted in a one-to-one correspondence in the plurality of grooves 24. In some other embodiments, the plurality of heat dissipating fins 122 may also be fixedly connected in a one-to-one correspondence in the plurality of grooves 24 by means including but not limited to welding or gluing, and the plurality of heat dissipating fins 122 may also be arranged in a one-to-one correspondence in the plurality of grooves 24. In other embodiments, the plurality of heat sink fins 122 may also be fixedly stacked with the first heat conducting surface 21 of the temperature vapor chamber 20 by means including but not limited to welding or gluing to achieve thermal connection between the plurality of heat sink fins 122 and the temperature vapor chamber 20 .

[0084] The design of the groove 24 is conducive to improving the installation accuracy of the temperature averaging plate 20 and the heat dissipation fins 122, is conducive to improving the installation strength of the temperature averaging plate 20 and the heat dissipation fins 122, and is conducive to improving the structural stability of the power conversion device 100. In addition, the groove 24 plays a positioning role, which facilitates the assembly of the temperature averaging plate 20 and the heat dissipation fins 122, is conducive to reducing the difficulty of assembling the temperature averaging plate 20 and the heat dissipation fins 122, and is conducive to reducing the processing cost of the power conversion device 100.

[0085] like Figure 8 As shown, illustratively, the groove 24 is a rectangular groove. In some other embodiments, the groove 24 may also be a circular groove or a triangular groove or other special-shaped grooves. The groove 24 includes a first groove wall 241, a second groove wall 242 and a third groove wall 243. The first groove wall 241 faces away from the second heat conducting surface 22. The number of the second groove walls 242 is two. In the X-axis direction, the two second groove walls 242 are connected to both sides of the first groove wall 241, and the two second groove walls 242 are arranged oppositely and spaced apart. The number of the third groove walls 243 is two. In the Y-axis direction, the two third groove walls 243 are arranged oppositely and spaced apart. The two third groove walls 243 are both connected to the first groove wall 241 and the two second groove walls 242.

[0086] like Figure 3 , Figure 7 and Fig. 9As shown, the first groove wall 241 is opposite to and abuts against the first fixing surface 1221 of the heat dissipation fin 122. The two second groove walls 242 are respectively opposite to and abut against the two third fixing surfaces 1223 of the heat dissipation fin 122. The two third groove walls 243 are respectively opposite to and abut against the two fourth fixing surfaces 1224 of the heat dissipation fin 122. The heat dissipation fin 122 is clamped in the groove 24 by the restrictions of the two second groove walls 242 and the two third groove walls 243, and the heat dissipation fin 122 is set in the groove 24.

[0087] like Figure 5 , Figure 6 and Figure 7 As shown, a closed channel 25 is provided in the temperature equalizing plate 20. Specifically, in the Z-axis direction, the closed channel 25 is located between the first heat conducting surface 21 and the second heat conducting surface 22, and is spaced apart from the first heat conducting surface 21 and the second heat conducting surface 22. The closed channel 25 is used for fluid flow to equalize the temperature of the plurality of heat dissipating fins 122 and reduce the temperature difference between the plurality of heat dissipating fins 122. The fluid may be a refrigerant including but not limited to water, fluorinated liquid or acetone. The cross-sectional shape of the closed channel 25 is circular. It should be noted that the channel cross-sectional shape of the closed channel 25 refers to the shape of the closed channel 25 after being cut in a direction perpendicular to the extension direction L1 of the closed channel 25.

[0088] Among them, the projection of the closed channel 25 in the Z-axis direction is spaced apart from the projections of the multiple grooves 24 in the Z-axis direction. It can be understood that the multiple grooves 24 are spaced apart from the closed channel 25. The projection of the closed channel 25 in the Z-axis direction (i.e., the first direction) is spaced apart from the projections of the multiple heat dissipating fins 122 in the Z-axis direction (i.e., the first direction). The projection of the closed channel 25 in the Z-axis direction (i.e., the first direction) surrounds the projections of the multiple heat dissipating fins 122 in the Z-axis direction (i.e., the first direction). In some other embodiments, the projection of the closed channel 25 in the Z-axis direction may also at least partially overlap with the projections of the multiple heat dissipating fins 122 in the Z-axis direction. The projection of the closed channel 25 in the Z-axis direction may also be located on one side of the projections of the multiple heat dissipating fins 122 in the Z-axis direction.

[0089] Since the projection of the first heat dissipation fin 122a in the Z-axis direction (i.e., the first direction) overlaps with the projection of the power module 14 in the Z-axis direction (i.e., the first direction), the projection of the second heat dissipation fin 122b in the Z-axis direction (i.e., the first direction) is spaced from the projection of the power module 14 in the Z-axis direction (i.e., the first direction); most of the heat generated by the power module 14 when working is transferred to the temperature averaging plate 20 through the first heat dissipation fin 122a, and a small part is transferred to the external environment through the second heat dissipation fin 122b. Most of the heat generated by the heating element 10 when working is transferred to the temperature averaging plate 20 through the first heat dissipation fin 122a, and a small part is transferred to the external environment through the second heat dissipation fin 122b.

[0090] Most of the heat generated by the power module 14 when it is working is transferred to the temperature averaging plate 20 through the first heat dissipation fin 122a, and then transferred to the closed channel 25 from the first heat conduction surface 21 of the temperature averaging plate 20. That is, most of the heat generated by the power module 14 when it is working is transferred to the temperature averaging plate 20 through a part of the heat dissipation fins 122 (i.e., the first heat dissipation fin 122a), and then transferred to the closed channel 25 from the temperature averaging plate 20. The fluid in the closed channel 25 absorbs heat and evaporates on the side close to the first heat conduction surface 21, and releases heat and condenses on the side away from the first heat conduction surface 21 due to contact with the cold air of the external environment, and the fluid changes into gas-liquid two-phase in the closed channel 25. The heat released by the condensation of the gaseous fluid in the closed channel 25 is transferred to the external environment from the second heat conduction surface 22 and the third heat conduction surface 23 of the temperature averaging plate 20. That is, the fluid in the closed channel 25 absorbs heat and evaporates on the side close to the heat dissipation fins 122, and releases heat and condenses on the side away from the heat dissipation fins 122, and the fluid undergoes a gas-liquid two-phase change in the closed channel 25. The heat released by the condensation of the gaseous fluid in the closed channel 25 is transferred from the temperature plate 20 to the external environment.

[0091] In this process, through the capillary force of the flow channel or the change of the pressure difference in the flow channel, the fluid circulates along the extension direction of the closed channel 25, and a small temperature difference is achieved at each part of the temperature averaging plate 20 to achieve a uniform temperature state. The heat released by the condensation of the gaseous fluid in the closed channel 25 can also be quickly dispersed in the temperature averaging plate 20, and transferred from the temperature averaging plate 20 back to the multiple second heat sink fins 122b (i.e., another part of the heat sink fins 122) and then transferred to the external environment. In other words, most of the heat generated by the power module 14 during operation is transferred to the temperature averaging plate 20 through a part of the heat sink fins 122 (i.e., the first heat sink fins 122a), and then transferred to the other part of the heat sink fins 122 (i.e., the second heat sink fins 122b) around this part of the heat sink fins 122 (i.e., the first heat sink fins 122a) through the temperature averaging plate 20 along the X-axis direction (i.e., the second direction), so as to achieve uniform temperature of multiple heat sink fins 122 in the X-axis direction (i.e., the second direction), and then achieve uniform temperature of all heat sink fins 122.

[0092] That is to say, through the circulation of the fluid in the closed channel 25 and the gas-liquid phase change of the fluid in the closed channel 25, the heat transferred from the first heat sink 122a to the temperature equalizing plate 20 can be transferred back to the second heat sink 122b through the temperature equalizing plate 20, thereby improving the heat dissipation efficiency of the second heat sink 122b, and then improving the overall heat dissipation efficiency of the multiple heat sinks 122, greatly improving the ability to naturally dissipate heat for the power module 14.

[0093] Through the circulation of the fluid in the closed channel 25 and the gas-liquid two-phase change of the fluid in the closed channel 25, most of the heat generated by the power module 14 of the power conversion device 100 provided in the present application during operation is quickly dissipated through the heat of a part of the heat dissipation fins 122 (i.e., the first heat dissipation fins 122a) through the temperature equalizing plate 20, and then transferred back to the other part of the heat dissipation fins 122 (i.e., the second heat dissipation fins 122b) through the temperature equalizing plate 20. Without changing the size of the heat dissipation fins 122, the overall heat dissipation efficiency of the multiple heat dissipation fins 122 is effectively improved, and the ability to naturally dissipate heat for the power module 14 is greatly improved; moreover, the heat generated by the power module 14 can also be transferred to the external environment through the multiple heat dissipation fins 122 through the temperature equalizing plate 20, which greatly improves the heat dissipation efficiency of the power module 14.

[0094] It can be understood that in the power conversion device 100 provided in the present application, most of the heat generated by the power module 14 during operation is transferred to the temperature equalizing plate 20 through a part of the heat dissipation fins 122 (i.e., the first heat dissipation fins 122a), and part of the heat transferred to the temperature equalizing plate 20 is transferred to the external environment, and the other part is transferred back to another part of the heat dissipation fins 122 (i.e., the second heat dissipation fins 122b) and then transferred to the external environment, thereby realizing rapid heat dissipation of the power module 14.

[0095] Compared with the existing solution that the heat transferred from the power module 14 to the heat dissipation fins 122 is transferred to the external environment through air convection, most of the heat generated by the power module 14 of the power conversion device 100 provided in the present application when working is quickly dispersed through the heat of a part of the heat dissipation fins 122 (i.e., the first heat dissipation fins 122a) through the temperature averaging plate 20, and then transferred back to the other part of the heat dissipation fins 122 (i.e., the second heat dissipation fins 122b) through the temperature averaging plate 20. The temperature averaging plate 20 can be used to average the temperature of multiple heat dissipation fins 122 and reduce the temperature difference between multiple heat dissipation fins 122. Without changing the size of the heat dissipation fins 122, the overall heat dissipation efficiency of multiple heat dissipation fins 122 is effectively improved, and the ability to naturally dissipate heat for the power module 14 is greatly improved; moreover, the heat generated by the power module 14 can also be transferred to the external environment through the multiple heat dissipation fins 122 through the temperature averaging plate 20, which greatly improves the heat dissipation efficiency of the power module 14.

[0096] It can be understood that since the strength of the portion of the temperature equalizing plate 20 corresponding to the closed channel 25 is relatively low, the design of spacing the projection of the closed channel 25 in the Z-axis direction (i.e., the first direction) and the projection of the plurality of heat sinks 122 in the Z-axis direction (i.e., the first direction) is beneficial to improving the connection strength between the temperature equalizing plate 20 and the plurality of heat sinks 122, and is beneficial to improving the structural stability of the power conversion device 100; moreover, on the basis of ensuring the connection strength between the temperature equalizing plate 20 and the plurality of heat sinks 122, it is beneficial to reduce the size of the temperature equalizing plate 20 in the Z-axis direction (i.e., the first direction) (i.e., the thickness of the temperature equalizing plate 20), and is beneficial to the miniaturization and lightweight design of the temperature equalizing plate 20.

[0097] The design that the projection of the closed channel 25 in the Z-axis direction (i.e., the first direction) surrounds the projection of the plurality of heat sinks 122 in the Z-axis direction (i.e., the first direction) ensures that the heat transferred from the power module 14 to the temperature equalizer 20 through a portion of the heat sink 122 (i.e., the first heat sink 122a) can be transferred to the closed channel 25 in all directions, which is conducive to improving the efficiency of the heat generated by the power module 14 when working and transferred to the closed channel 25 through a portion of the heat sink 122 (i.e., the first heat sink 122a), and is conducive to improving the heat dissipation efficiency of the fluid in the closed channel 25 to a portion of the heat sink 122 (i.e., the first heat sink 122a), and is conducive to improving the heat dissipation efficiency of the power module 14. Moreover, it is conducive to improving the efficiency of the heat released by the condensation of the gaseous fluid in the closed channel 25 and being transferred from the temperature equalizer 20 back to another portion of the heat sink 122 (i.e., the second heat sink 122b), which is conducive to improving the overall heat dissipation efficiency of the plurality of heat sinks 122, and is conducive to improving the heat dissipation efficiency of the power module 14.

[0098] like Figure 7 , Figure 8 and Fig. 9 As shown, in some embodiments, the closed channel 25 includes a bending section 26 and a connecting section 27. In the Y-axis direction (i.e., the third direction), the connecting section 27 is located at one side of the bending section 26 and communicates with the bending section 26. The bending section 26 includes a plurality of bending sub-segments 261 and a plurality of matching sub-segments 262. In the Y-axis direction, the plurality of matching sub-segments 262 are located at one side of the plurality of bending sub-segments 261. In the X-axis direction, the plurality of bending sub-segments 261 and the plurality of matching sub-segments 262 are alternately communicated in sequence.

[0099] The plurality of bending sub-segments 261 include a first bending sub-segment 261a, a second bending sub-segment 261b, and a plurality of third bending sub-segments 261c. In the X-axis direction, the first bending sub-segment 261a, the plurality of third bending sub-segments 261c, and the second bending sub-segment 261b are arranged in sequence and spaced apart. Exemplarily, the number of the third bending sub-segments 261c is 3. In some other embodiments, the number of the third bending sub-segments 261c may also be 1, 2, or more.

[0100] Each bending sub-segment 261 includes a first segment 2611, a second segment 2612 and a third segment 2613. Exemplarily, the first segment 2611 and the second segment 2612 are both straight segments. In some other embodiments, the first segment 2611 and the second segment 2612 may also be wavy segments, sawtooth segments or other special-shaped segments. The first segment 2611 and the second segment 2612 extend along the Y-axis direction. In the X-axis direction, the first segment 2611 and the second segment 2612 are opposite and spaced apart. In the Y-axis direction, the third segment 2613 is located on one side of the first segment 2611 and on one side of the second segment 2612. The third segment 2613 is located between the first segment 2611 and the second segment 2612 and is connected to the first segment 2611 and the second segment 2612. Exemplarily, the third segment 2613 is an arc segment. In some other embodiments, the third segment 2613 may also be a straight segment, a wavy segment or other special-shaped segments.

[0101] In each bending sub-segment 261, the first segment 2611, the second segment 2612 and the third segment 2613 together form a receiving opening 263. That is, each bending sub-segment 261 includes a receiving opening 263. The bending segment 26 includes a plurality of receiving openings 263. The number of receiving openings 263 is equal to the number of bending sub-segments 261. The number of receiving openings 263 is 5. In some other embodiments, the number of receiving openings 263 may also be 2, 3 or more. The plurality of receiving openings 263 are spaced apart along the X-axis direction (i.e., the second direction).

[0102] The plurality of mating sub-segments 262 include a first mating sub-segment 262a, a second mating sub-segment 262b and a plurality of third mating sub-segments 262c. Exemplarily, the number of the third mating sub-segments 262c is 2. In some other embodiments, the number of the third mating sub-segments 262c may also be 1, 3 or more. In the X-axis direction, the first mating sub-segment 262a, the plurality of third mating sub-segments 262c and the second mating sub-segment 262b are arranged in sequence and spaced apart. The first mating sub-segment 262a is located between the first bending sub-segment 261a and the third bending sub-segment 261c adjacent to the first bending sub-segment 261a, and is connected to the first bending sub-segment 261a and the third bending sub-segment 261c. Specifically, in the first bending sub-segment 261a and the third bending sub-segment 261c adjacent to the first bending sub-segment 261a, the first matching sub-segment 262a is connected with the second segment 2612 of the first bending sub-segment 261a and the first segment 2611 of the third bending sub-segment 261c.

[0103] The second matching sub-segment 262b is located between the second bending sub-segment 261b and the third bending sub-segment 261c adjacent to the second bending sub-segment 261b, and is connected to the second bending sub-segment 261b and the third bending sub-segment 261c. Specifically, in the second bending sub-segment 261b and the third bending sub-segment 261c adjacent to the second bending sub-segment 261b, the second matching sub-segment 262b is connected to the first segment 2611 of the second bending sub-segment 261b and the first segment 2611 of the third bending sub-segment 261c. A plurality of third matching sub-segments 262c are located between the plurality of third bending sub-segments 261c in a one-to-one correspondence. A third matching sub-segment 262c is connected to two third bending sub-segments 261c adjacent to it.

[0104] In some other embodiments, the third bending sub-segment 261c may be omitted, the number of the matching sub-segment 262 may be one, and the matching sub-segment 262 is located between the first matching sub-segment 262a and the second matching sub-segment 262b and is connected to the first matching sub-segment 262a and the second matching sub-segment 262b. Exemplarily, the matching sub-segment 262 is an arc segment. In some other embodiments, the matching sub-segment 262 may also be a straight line segment, a wavy line segment, or other special-shaped segments.

[0105] In some embodiments, in the Y-axis direction (i.e., the third direction), the connecting section 27 is located at one side of the bending section 26 and communicates with the bending section 26. Specifically, in the Y-axis direction, the connecting section 27 is located at one side of the first section 2611 of the first bending sub-segment 261a and faces away from the third section 2613, and the connecting section 27 communicates with the first section 2611 of the first bending sub-segment 261a. In the Y-axis direction, the connecting section 27 is located at one side of the second section 2612 of the second bending sub-segment 261b and faces away from the third section 2613, and the connecting section 27 communicates with the second section 2612 of the second bending sub-segment 261b. The connecting section 27 closes a plurality of receiving openings 263.

[0106] The connecting section 27 includes a first connecting sub-section 271, a second connecting sub-section 272 and a third connecting sub-section 273. Exemplarily, the first connecting sub-section 271, the second connecting sub-section 272 and the third connecting sub-section 273 are all straight line segments. In some other embodiments, the first connecting sub-section 271, the second connecting sub-section 272 and the third connecting sub-section 273 may also be wavy line segments, sawtooth segments or other special-shaped segments. The first connecting sub-section 271 extends along the X-axis direction. The second connecting sub-section 272 and the third connecting sub-section 273 extend along the Y-axis direction. In the X-axis direction, the second connecting sub-section 272 and the third connecting sub-section 273 are located on opposite sides of the first connecting sub-section 271 and are both connected to the first connecting sub-section 271.

[0107] In the Y-axis direction, the first connecting sub-segment 271 is located at one side of the bending segment 26, so that the multiple receiving openings 263 face the first connecting sub-segment 271. The first connecting sub-segment 271 is spaced apart from the bending segment 26. In the Y-axis direction, the second connecting sub-segment 272 is located at one side of the first segment 2611 of the first bending sub-segment 261a and faces away from the third segment 2613, and the second connecting sub-segment 272 is connected to the first segment 2611 of the first bending sub-segment 261a. In the Y-axis direction, the third connecting sub-segment 273 is located at one side of the second segment 2612 of the second bending sub-segment 261b and faces away from the third segment 2613, and the third connecting sub-segment 273 is connected to the second segment 2612 of the second bending sub-segment 261b. The multiple receiving openings 263 of the bending segment 26 can be closed by the first connecting sub-segment 271, the second connecting sub-segment 272 and the third connecting sub-segment 273. In some other embodiments, the closed channel 25 can also be annular, triangular, or other shapes.

[0108] like Figure 2 , Figure 6 and Fig. 9 As shown, the projections of the plurality of grooves 24 in the Z-axis direction are located one by one within the projections of the plurality of receiving openings 263 in the Z-axis direction, and the projections of the plurality of heat dissipating fins 122 in the Z-axis direction (i.e., the first direction) are located one by one within the projections of the plurality of receiving openings 263 in the Z-axis direction (i.e., the first direction). That is, the projections of the heat dissipating fins 122 in the Z-axis direction are located one by one within the projections of the receiving openings 263 in the Z-axis direction. And the projections of the heat dissipating fins 122 in the Z-axis direction are arranged at intervals with the projections of the bending sections 26 in the Z-axis direction, and the projections of the connecting sections 27 in the Z-axis direction. The projection of each heat dissipating fin 122 in the Z-axis direction is surrounded by the projection of the closed channel 25 in the Z-axis direction. That is, the projection of the closed channel 25 in the Z-axis direction surrounds the projections of the plurality of heat dissipating fins 122 in the Z-axis direction. In some other embodiments, the projection of the heat dissipating fins 122 in the Z-axis direction may also be located between the projections of two adjacent bending sub-segments 261 in the Z-axis direction. For example, in the adjacent first bending sub-segment 261a and the third bending sub-segment 261c, the projection of the heat dissipating fin 122 in the Z-axis direction may also be located between the projection of the first bending sub-segment 261a in the Z-axis direction and the projection of the third bending sub-segment 261c in the Z-axis direction.

[0109] The design in which the projections of the plurality of heat sinks 122 in the Z-axis direction (i.e., the first direction) are one-to-one located within the projections of the plurality of receiving openings 263 in the Z-axis direction (i.e., the first direction) ensures that the projections of the plurality of heat sinks 122 in the Z-axis direction are surrounded by the projections of the closed channel 25 in the Z-axis direction, and ensures that the heat transferred from the power module 14 to the temperature equalizing plate 20 through a portion of the heat sink 122 (i.e., the first heat sink 122a) can be transferred to the closed channel 25 in all directions, which is beneficial to improving the efficiency of the heat generated by the power module 14 during operation being transferred to the closed channel 25 through a portion of the heat sink 122 (i.e., the first heat sink 122a), and is beneficial to improving the heat dissipation efficiency of the fluid in the closed channel 25 to a portion of the heat sink 122 (i.e., the first heat sink 122a), and is beneficial to improving the heat dissipation efficiency of the power module 14. Moreover, it is helpful to improve the efficiency of transferring the heat released by the condensation of the gaseous fluid in the closed channel 25 from the temperature equalizing plate 20 back to another part of the heat dissipation fins 122 (i.e., the second heat dissipation fins 122b), which is helpful to improve the overall heat dissipation efficiency of the plurality of heat dissipation fins 122, and is helpful to improve the heat dissipation efficiency of the power module 14. In addition, the design is simple and the design cost is low, which is helpful to reduce the processing cost.

[0110] See also Fig.10 , Fig.11 , Fig.12 , Fig.13 and Fig.14 , and combined with Figure 2 and Figure 7 , Fig.10 yes Figure 6 The power conversion device 100 shown is a partial structural schematic diagram of another embodiment cut along line BB. Fig.11 yes Figure 6 The power conversion device 100 shown is a partial structural schematic diagram of another embodiment cut along line BB. Fig.12 yes Figure 6 The power conversion device 100 shown is a partial structural schematic diagram of another embodiment cut along line BB. Fig.13 yes Figure 6 The power conversion device 100 shown is a partial structural schematic diagram of another embodiment cut along line BB. Fig.14 yes Figure 6 The power conversion device 100 shown is a partial structural schematic diagram of another embodiment cut along line BB.

[0111] like Figure 2 , Figure 7 and Fig.10As shown, in some other embodiments, a protrusion 28 is provided on the surface of the temperature-averaging plate 20. The projection of the protrusion 28 in the Z-axis direction (i.e., the first direction) overlaps with the projection of the closed channel 25 in the Z-axis direction (i.e., the first direction), and the protrusion 28 is arranged at intervals with a plurality of heat sinks 122. The design of the protrusion 28 is conducive to improving the strength of the portion of the temperature-averaging plate 20 corresponding to the closed channel 25, and is conducive to improving the structural stability of the temperature-averaging plate 20, and is conducive to improving the structural stability of the power conversion device 100. Moreover, the protrusion 28 can play a role of indicating the closed channel 25, which is convenient for positioning the heat sink 122 and the closed channel 25, and then facilitates the assembly of the temperature-averaging plate 20 and the heat sink 122, which is conducive to reducing the difficulty of assembling the temperature-averaging plate 20 and the heat sink 122, and is conducive to reducing the processing cost of the power conversion device 100.

[0112] Specifically, the protrusion 28 includes a first protrusion 281 and a second protrusion 282. The first protrusion 281 is arranged on the first heat conducting surface 21 of the temperature equalizing plate 20 and faces away from the second heat conducting surface 22, and the first protrusion 281 extends along the extension direction of the closed channel 25. The second protrusion 282 is arranged on the second heat conducting surface 22 of the temperature equalizing plate 20 and faces away from the first heat conducting surface 21. The second protrusion 282 extends along the extension direction of the closed channel 25. The projection of the first protrusion 281 in the Z-axis direction overlaps with the projection of the second protrusion 282 in the Z-axis direction, and both cover the projection of the closed channel 25 in the Z-axis direction. It can be understood that in the Z-axis direction, the protrusions 28 are provided on the two opposite surfaces of the temperature equalizing plate 20. Among them, in the X-axis direction, the first protrusion 281 is spaced apart from the heat dissipation fins 122, and the protrusion 28 is spaced apart from the heat dissipation fins 122. The design of protrusions 28 on two opposite surfaces of the temperature averaging plate 20 further improves the strength of the portion of the temperature averaging plate 20 corresponding to the closed channel 25, which is beneficial to improving the structural stability of the temperature averaging plate 20 and the structural stability of the power conversion device 100.

[0113] like Figure 2 , Fig. 9 and Fig.10 As shown, in some other embodiments, the channel cross-section shape of the closed channel 25 may also be semicircular, and the semicircle faces away from the first heat-conducting surface 21. The second protrusion 282 may be provided only on the second heat-conducting surface 22 of the temperature-averaging plate 20, that is, the first protrusion 281 may be omitted. In this way, the protrusion 28 can also improve the strength of the portion of the temperature-averaging plate 20 corresponding to the closed channel 25, improve the structural stability of the temperature-averaging plate 20, and improve the structural stability of the power conversion device 100. Moreover, the protrusion 28 can also play a role in indicating the closed channel 25, which is convenient for positioning the heat dissipating fins 122 and the closed channel 25, and then facilitates the assembly of the temperature-averaging plate 20 and the heat dissipating fins 122, which is conducive to reducing the difficulty of assembling the temperature-averaging plate 20 and the heat dissipating fins 122, and is conducive to reducing the processing cost of the power conversion device 100.

[0114] like Fig.12 , Fig.13 and Fig.14 As shown, in other embodiments, the cross-sectional shape of the closed channel 25 may also be, but is not limited to, a rectangle (such as Fig.12 As shown), triangle (as Fig.13 as shown) or oval (as Fig.14 The design of the closed channel 25 is varied and can be designed according to the needs. The design requirements and design costs of the closed channel 25 are low, which is conducive to reducing the processing cost of the temperature plate 20 and the power conversion device 100 (such as Figure 2 The processing cost is shown in Figure 2.

[0115] See also Fig.15 and Fig.16 , and combined with Figure 2 , Figure 5 and Figure 6 , Fig.15 yes Figure 6 The structure diagram of the power conversion device 100 shown in another embodiment. Fig.16 yes Fig.15 FIG. 1 is an enlarged view of the XVI portion of the power conversion device 100. It should be noted that: Fig.15 and Fig.16 The features indicated by the dotted lines in indicate the occluded features.

[0116] like Figure 2 , Figure 6 and Fig.16 As shown, in some other embodiments, a guide section 29 is provided in the temperature homogenizing plate 20, and the guide section 29 is connected to the closed channel 25, and the guide section 29 is used to limit the unidirectional flow of the fluid. The design of the guide section 29 ensures that the fluid in the closed channel 25 circulates along the closed channel 25 in one direction, which is conducive to improving the efficiency of the fluid circulation flow and improving the power module 14 (such as Figure 5 The efficiency of heat transferred to the temperature equalizing plate 20 through a portion of the heat dissipating fins 122 (i.e., the first heat dissipating fins 122a) and transferred back to the other portion of the heat dissipating fins 122 (i.e., the second heat dissipating fins 122b) through the fluid in the closed channel 25 is beneficial to improving the overall heat dissipation efficiency of the multiple heat dissipating fins 122, and is beneficial to improving the heat dissipation efficiency of the power module 14.

[0117] like Figure 6 , Fig.15 and Fig.16As shown, the guide segment 29 is connected to the bending segment 26. Exemplarily, the number of the guide segments 29 is multiple, and specifically, the number of the guide segments 29 is 12. In some other embodiments, the number of the guide segments 29 may also be 1, 2, or more. The 12 guide segments 29 are divided into 4 first guide segments 29a, 4 second guide segments 29b, and 4 third guide segments 29c.

[0118] The plurality of first guide segments 29a are connected to the first bending sub-segment 261a of the bending segment 26. Specifically, in the X-axis direction, the plurality of first guide segments 29a are located on one side of the first segment 2611 of the first bending sub-segment 261a and facing away from the second segment 2612, and the first guide segment 29a is connected to the first segment 2611. In the Y-axis direction, the plurality of first guide segments 29a are arranged in sequence and spaced apart. The projection of the first guide segment 29a in the Z-axis direction is spaced apart from the projection of the heat dissipation fin 122 in the Z-axis direction. In other embodiments, the first guide segment 29a may also be located on one side of the first segment 2611 of the first bending sub-segment 261a and facing the second segment 2612, and the first guide segment 29a is connected to the first segment 2611. The first guide segment 29a may also be located on one side of the second segment 2612 of the first bending sub-segment 261a and facing the first segment 2611, and the first guide segment 29a is connected to the second segment 2612. The first guide segment 29 a may also be located at one side of the second segment 2612 of the first bending sub-segment 261 a and facing away from the first segment 2611 , and the first guide segment 29 a is connected to the second segment 2612 .

[0119] In this embodiment, the first guide segment 29a (i.e., the guide segment 29) includes a first guide segment 291 and a second guide segment 292. The second guide segment 292 is connected to the first guide segment 291. The second guide segment 292 is bent relative to the first guide segment 291. Specifically, the first guide segment 291 includes a first end 2911 and a second end 2912. The first end 2911 and the second end 2912 are arranged opposite to each other. The second guide segment 292 includes a third end 2921 and a fourth end 2922. The third end 2921 and the fourth end 2922 are arranged opposite to each other. The third end 2921 is connected to the fourth end 2922. That is, one end of the second guide segment 292 is connected to one end of the first guide segment 291. The first end 2911 is facing away from the second guide segment 292, and the fourth end 2922 is facing away from the first guide segment 291.

[0120] The first end 2911 of the first guide segment 291 is connected to the first segment 2611 of the first bending segment 261a. That is, the first end 2911 of the first guide segment 291 (that is, the end of the first guide segment 291 facing away from the second guide segment 292) is connected to the closed passage 25. The first guide segment 291 is arranged obliquely relative to the first segment 2611 of the first bending segment 261a. The first guide segment 291 is away from the third segment 2613 relative to the first segment 2611 of the first bending segment 261a. In some other embodiments, the first guide segment 291 may also be close to the third segment 2613 relative to the first segment 2611 of the first bending segment 261a. It can be understood that the first guide segment 291 is arranged obliquely relative to the extension direction L1 of the closed passage 25. In the Y-axis direction, the second guide segment 292 is located at one side of the first guide segment 291 and faces away from the third segment 2613 of the first bending segment 261a. The fourth end 2922 of the second guide segment 292 is connected to the first segment 2611 of the first bending segment 261a. That is, the fourth end 2922 of the second guide segment 292 (that is, the end of the second guide segment 292 facing away from the first guide segment 291) is connected to the closed channel 25.

[0121] A portion of the fluid in the closed channel 25 can flow along the extending direction of the first segment 2611 of the first bending sub-segment 261a, and another portion flows from the first segment 2611 into the guide segment 29 and then flows back from the guide segment 29 to the first segment 2611. When the fluid in the closed channel 25 flows back from the first segment 2611 of the first bending sub-segment 261a to the first segment 2611 sequentially through the second guide segment 292 of the first guide segment 29a and the first guide segment 291, the fluid flowing back from the first guide segment 291 to the first segment 2611 will not hinder the fluid flowing in the first segment 2611. When the fluid in the closed channel 25 flows back to the first section 2611 from the first section 2611 of the first bending sub-segment 261a through the first guide sub-segment 291 and the second guide sub-segment 292 of the first guide section 29a, the fluid flowing back to the first section 2611 from the second guide sub-segment 292 will hinder the fluid flowing in the first section 2611.

[0122] That is to say, a part of the fluid in the closed channel 25 flows along the extension direction L1 of the closed channel 25, and the other part flows from the closed channel 25 into the guide section 29 and then flows back to the closed channel 25 from the guide section 29. When the fluid in the closed channel 25 flows back to the closed channel 25 from the closed channel 25 through the second guide sub-segment 292 and the first guide sub-segment 291 in sequence, the fluid flowing back to the closed channel 25 from the first guide sub-segment 291 will not hinder the fluid flowing in the closed channel 25. When the fluid in the closed channel 25 flows back to the closed channel 25 from the closed channel 25 through the first guide sub-segment 291 and the second guide sub-segment 292 in sequence, the fluid flowing back to the closed channel 25 from the second guide sub-segment 292 will hinder the fluid flowing in the closed channel 25. Therefore, the design of the first guide sub-segment 291 and the second guide sub-segment 292 can limit the one-way flow of the fluid in the closed channel 25. In this way, not only is the structure simple and easy to design, but also the processing cost is low, which is beneficial to reducing the processing cost of the temperature homogenizing plate 20 and the processing cost of the power conversion device 100 .

[0123] The plurality of second guide segments 29b are connected to the third bending sub-segment 261c adjacent to the first bending sub-segment 261a. For details, please refer to the relevant description of the first guide segment 29a and the first bending sub-segment 261a. In the X-axis direction, the plurality of second guide segments 29b are located on one side of the first segment 2611 of the third bending sub-segment 261c and facing away from the second segment 2612, and the second guide segment 29b is connected to the first segment 2611. In the Y-axis direction, the plurality of second guide segments 29b are arranged in sequence and spaced apart.

[0124] The plurality of third guide segments 29c are connected to the third bending sub-segment 261c adjacent to the first bending sub-segment 261a. For details, please refer to the relevant description of the first guide segment 29a and the first bending sub-segment 261a. In the X-axis direction, the plurality of third guide segments 29c are located on one side of the first segment 2611 of the third bending sub-segment 261c and face the second segment 2612, and the third guide segment 29c is connected to the first segment 2611. In the Y-axis direction, the plurality of third guide segments 29c are arranged in sequence and arranged at intervals. In the X-axis direction, the plurality of third guide segments 29c and the plurality of second guide segments 29b are arranged in a staggered manner, that is, the third guide segment 29c and the second guide segment 29b are arranged in a staggered manner. In the X-axis direction, the "staggered arrangement" of feature A and feature B means that the partial projection of feature A in the X-axis direction overlaps the partial projection of feature B in the X-axis direction. In other embodiments, in the X-axis direction, the third guide segment 29c and the second guide segment 29b may also be arranged in a non-staggered manner.

[0125] It can be understood that in this embodiment, the guide section 29 is connected to the first bending sub-segment 261a and the third bending sub-segment 261c adjacent to the first bending sub-segment 261a. In other embodiments, the guide section 29 may also be connected to the second bending sub-segment 261b or other third bending sub-segments 261c. In some other embodiments, the guide section 29 may also be connected to the connecting section 27. There are various ways for the guide section 29 to communicate with the closed channel 25, and the design cost is low, which is conducive to reducing the processing cost of the temperature plate 20 and the processing cost of the power conversion device 100.

[0126] See also Fig.17 and Fig.18 , and combined with Figure 2 and Figure 5 , Fig.17 yes Figure 2 The shown diagram is a three-dimensional structural diagram of a power conversion device 100 in another embodiment. Fig.18 yes Fig.17 An enlarged view of portion XVIII of the power conversion device 100 is shown.

[0127] like Figure 2 , Fig.17 and Fig.18 As shown, in some other embodiments, the temperature homogenizer 20 is provided with a first through hole 30. The first through hole 30 penetrates the temperature homogenizer 20 along the Z-axis direction (i.e., the first direction). The first through hole 30 is communicated with the air flow channel 20a. The first through hole 30 is spaced apart from the closed channel 25. And the first through hole 30 is spaced apart from the plurality of heat sinks 122. Cold air from the external environment can flow into the air flow channel 20a from the first through hole 30 and contact the heat sink fins 122. After the cold air absorbs the heat from the heat sink fins 122, its temperature rises to form hot air, and the hot air flows out from the air flow channel 20a along the positive direction of the Z-axis to heat the power module 14 (such as Figure 5 The heat dissipated from the heat sink 122 to the heat sink 122 is transferred to the external environment to achieve heat dissipation of the power module 14. The design of the first through hole 30 ensures that the cold air from the external environment can flow from the side of the temperature averaging plate 20 facing away from the heat sink 122 (i.e., the side of the second heat conducting surface 22 facing away from the first heat conducting surface 21) to the heat sink 122 through the first through hole 30, which is beneficial to improving the heat dissipation efficiency of the heat sink 122, and further beneficial to improving the heat dissipation efficiency of the power module 14.

[0128] Exemplarily, the number of the first through holes 30 is multiple, specifically, the number of the first through holes 30 is 66. The six first through holes 30 and the multiple bending sub-segments 261 of the closed channel 25 are alternately arranged in sequence along the X-axis direction, and the six first through holes 30 are arranged in sequence along the X-axis direction and form a row of first through holes 30. 11 rows of first through holes 30 are arranged in sequence along the Y-axis direction. In other embodiments, the number of the first through holes 30 may also be 1, 2 or more. The first through hole 30 is a rectangular hole. In other embodiments, the first through hole 30 may also be a circular hole, a triangular hole or other special-shaped holes. Among them, the first through hole 30 includes a first hole wall 31, a second hole wall 32, a third hole wall 33 and a fourth hole wall 34. In the X-axis direction, the first hole wall 31 and the second hole wall 32 are opposite and spaced. In the Y-axis direction, the third hole wall 33 and the fourth hole wall 34 are opposite and spaced. The third hole wall 33 and the fourth hole wall 34 are both connected to the first hole wall 31 and the second hole wall 32 .

[0129] The temperature equalizing plate 20 is provided with a first heat conducting fin 30a. The first heat conducting fin 30a is arranged on the hole wall of the first through hole 30, and the first heat conducting fin 30a is arranged obliquely relative to the cross section of the first through hole 30. Specifically, in the Z-axis direction, the first heat conducting fin 30a is located on the side of the second heat conducting surface 22 facing away from the first heat conducting surface 21, and is fixedly connected to the second heat conducting surface 22. And in the X-axis direction, the first heat conducting fin 30a is located on one side of the first hole wall 31 of the first through hole 30 and facing away from the second hole wall 32, and the first heat conducting fin 30a is fixedly connected to the first hole wall 31. The first heat conducting fin 30a is arranged on the first hole wall 31 of the first through hole 30. The first heat conducting fin 30a is arranged obliquely along the X-axis direction relative to the cross section of the first through hole 30. Specifically, the first heat conducting fin 30a is close to the second hole wall 32 along the X-axis direction relative to the cross section of the first through hole 30. The angle between the first heat conducting fin 30a and the cross section of the first through hole 30 is an acute angle. In other embodiments, the angle between the first heat conducting fin 30a and the cross section of the first through hole 30 may also be an obtuse angle or a right angle. It should be noted that the cross section of the first through hole 30 refers to the cross section of the first through hole 30 cut along a direction perpendicular to the axial direction of the first through hole 30, and the cross section of the first through hole 30 is parallel to the XY plane.

[0130] The design of the first heat conducting fin 30a is beneficial to increasing the contact area between the temperature averaging plate 20 and the cold air, and is beneficial to increasing the power module 14 (such as Figure 5 The amount of heat transferred to the external environment through the heat sink 122 and the temperature plate 20 is beneficial to improving the efficiency of heat dissipation of the power module 14 through the heat sink 122 and the temperature plate 20, which is beneficial to improving the heat dissipation efficiency of the power module 14.

[0131] In some other embodiments, in the X-axis direction, the first heat-conducting fin 30a may also be located on one side of the second hole wall 32 of the first through hole 30 and facing away from the first hole wall 31, the first heat-conducting fin 30a is fixedly connected to the second hole wall 32, and the first heat-conducting fin 30a is tilted relative to the cross-section of the first through hole 30 along the X-axis direction. In the Y-axis direction, the first heat-conducting fin 30a may also be located on one side of the third hole wall 33 and facing away from the fourth hole wall 34, the first heat-conducting fin 30a is fixedly connected to the third hole wall 33, and the first heat-conducting fin 30a is tilted relative to the cross-section of the first through hole 30 along the Y-axis direction. In the Y-axis direction, the first heat-conducting fin 30a may also be located on one side of the fourth hole wall 34 and facing away from the third hole wall 33, the first heat-conducting fin 30a is fixedly connected to the fourth hole wall 34, and the first heat-conducting fin 30a is tilted relative to the cross-section of the first through hole 30 along the Y-axis direction.

[0132] In other embodiments, the first thermal conductive fin 30a may also be fixedly connected to the side of the first hole wall 31 facing the second hole wall 32, and bent along the Z-axis direction relative to the first hole wall 31. The first thermal conductive fin 30a may also be arranged on the first hole wall 31 and inclined along the X-axis direction relative to the cross-section of the first through hole 30.

[0133] In some other embodiments, in the Z-axis direction, the first thermal conductive fin 30a may also be located on the side of the first thermal conductive surface 21 facing away from the second thermal conductive surface 22 and fixedly connected to the first thermal conductive surface 21, the first thermal conductive fin 30a is fixedly connected to the hole wall of the first through hole 30, and the first thermal conductive fin 30a is inclined relative to the cross-section of the first through hole 30.

[0134] See also Fig.19 and Fig. 20 , and combined with Figure 5 and Fig.17 , Fig.19 yes Fig.17 The shown diagram is a three-dimensional structural diagram of a power conversion device 100 in another embodiment. Fig. 20 yes Fig.19 An enlarged view of a portion XX of the power conversion device 100 is shown.

[0135] like Fig.17 , Fig.19 and Fig. 20As shown, in some other embodiments, the temperature plate 20 includes a main body 40 and a heat conducting part 50. In the Z-axis direction (i.e., the first direction), the heat conducting part 50 is arranged on one side of the main body 40, and the main body 40 is arranged on one side of the plurality of heat dissipation fins 122 and faces away from the heat dissipation substrate 121. The heat conducting part 50 faces the heat dissipation substrate 121. In the X-axis direction (i.e., the second direction), the heat conducting part 50 is located on one side of the plurality of heat dissipation fins 122 and is spaced apart from the plurality of heat dissipation fins 122. The closed channel 25 is arranged in the main body 40 and in the heat conducting part 50. The heat dissipation substrate 121, the plurality of heat dissipation fins 122, the temperature plate 20, the main body 40 and the heat conducting part 50 are surrounded to form a plurality of air flow channels 20a. In other words, a plurality of air flow channels 20a are formed between the heat dissipation substrate 121, the plurality of heat dissipation fins 122 and the temperature plate 20.

[0136] The heat conducting part 50 is arranged on one side of the main body 40, the main body 40 is arranged on one side of the plurality of heat dissipating fins 122 and faces away from the heat dissipating substrate 121, the heat conducting part 50 faces the heat dissipating substrate 121, and the closed channel 25 is arranged in the main body 40 and the heat conducting part 50. This design is beneficial to improving the space utilization of the temperature averaging plate 20, the miniaturized design of the temperature averaging plate 20, and the miniaturized design of the power conversion device 100 while ensuring that the temperature averaging plate 20 has a large contact area with the cold air of the external environment.

[0137] Specifically, the structure of the main body 40 and the connection method between the main body 40 and the plurality of heat dissipation fins 122 can be referred to Fig.17 The relevant description of the temperature equalizing plate 20 and the multiple heat dissipating fins 122 of the illustrated embodiment is not repeated here. Among them, the main body 40 includes a first heat-conducting surface 21 and a second heat-conducting surface 22. In the Z-axis direction, the first heat-conducting surface 21 and the second heat-conducting surface 22 are arranged opposite to each other and spaced apart. The first heat-conducting surface 21 faces the multiple heat-dissipating fins 122, and the second heat-conducting surface 22 faces away from the multiple heat-dissipating fins 122. The heat-conducting part 50 is arranged on one side of the first heat-conducting surface 21 of the main body 40 and faces away from the second heat-conducting surface 22. The heat-conducting part 50 is fixedly stacked on the first heat-conducting surface 21 of the main body 40 and faces away from the second heat-conducting surface 22. The heat-conducting part 50 extends along the Z-axis direction. The heat-conducting part 50 is fixedly connected to the shell 11 of the heating element 10. The heat-conducting part 50 is fixedly connected to the heating element 10. In other embodiments, the heat-conducting part 50 may also be in contact with, abut against, or spaced apart from the heating element 10.

[0138] Exemplarily, the number of the heat conducting parts 50 is multiple. Specifically, the number of the heat conducting parts 50 is two, and the two heat conducting parts 50 are respectively the first heat conducting part 50a and the second heat conducting part 50b. In other words, the heat conducting part 50 includes the first heat conducting part 50a and the second heat conducting part 50b. In the X-axis direction, the first heat conducting part 50a and the second heat conducting part 50b are located on opposite sides of the plurality of heat dissipating fins 122, and are both spaced apart from the plurality of heat dissipating fins 122. In other embodiments, the heat conducting part 50 may also include only the first heat conducting part 50a or the second heat conducting part 50b. Among them, each heat conducting part 50 includes a first mating surface 51 and a second mating surface 52. In the X-axis direction, the first mating surface 51 and the second mating surface 52 are disposed opposite to each other. The first mating surface 51 faces the plurality of heat dissipating fins 122, and the second mating surface 52 faces away from the plurality of heat dissipating fins 122. The projection of each heat conducting part 50 in the X-axis direction overlaps with the projection of the plurality of heat dissipating fins 122 in the X-axis direction. Specifically, the projection of each heat conducting portion 50 in the X-axis direction covers the projection of the plurality of heat dissipating fins 122 in the X-axis direction. That is, the projection of the heat conducting portion 50 in the X-axis direction overlaps with all the projections of the plurality of heat dissipating fins 122 in the X-axis direction. In other embodiments, the projection of the heat conducting portion 50 in the X-axis direction may also overlap with part of the projections of the plurality of heat dissipating fins 122 in the X-axis direction.

[0139] The closed channel 25 includes a first closed sub-channel 25a, a second closed sub-channel 25b and a third closed sub-channel 25c. The first closed sub-channel 25a is disposed in the main body 40. The second closed sub-channel 25b is disposed in the first heat-conducting portion 50a. The third closed sub-channel 25c is disposed in the second heat-conducting portion 50b. In the X-axis direction, the second closed sub-channel 25b and the third closed sub-channel 25c are located on opposite sides of the first closed sub-channel 25a and are both connected to the first closed sub-channel 25a. Specifically, the first closed sub-channel 25a includes four first connection ends. The second closed sub-channel 25b includes two second connection ends. The third closed sub-channel 25c includes two third connection ends. Two of the first connection ends of the first closed sub-channel 25a are connected to the two second connection ends of the second closed sub-channel 25b; and the other two first connection ends are connected to the two third connection ends of the third closed sub-channel 25c. The matching relationship between the first closed sub-channel 25a and the plurality of heat dissipation fins 122 can be referred to. Fig.17 The description related to the closed channel 25 and the plurality of heat dissipation fins 122 of the illustrated embodiment will not be repeated herein.

[0140] The heat conducting part 50 is provided with a second through hole 53. Specifically, the second through hole 53 extends from the first mating surface 51 to the second mating surface 52 along the X-axis direction. The second through hole 53 penetrates the heat conducting part 50 along the X-axis direction (i.e., the second direction). The second through hole 53 is connected to the air flow channel 20a. Specifically, the second through hole 53 is connected to the air flow channel 20a formed by the heat dissipation substrate 121, the heat dissipation fins 122, the temperature equalizing plate 20 and the heat conducting part 50. Exemplarily, the number of the second through holes 53 is multiple. Specifically, the number of the second through holes 53 is 30. Three second through holes 53 are arranged in sequence along the Z-axis direction and constitute a row of second through holes 53. Ten rows of second through holes 53 are arranged in intervals along the Y-axis direction. In other embodiments, the number of the second through holes 53 may also be 1, 2 or more. The second through hole 53 is a rectangular hole. In other embodiments, the second through hole 53 may also be a circular hole, a triangular hole or other special-shaped hole. The second through hole 53 includes a fifth hole wall 531, a sixth hole wall 532, a seventh hole wall 533 and an eighth hole wall 534. In the Z-axis direction, the fifth hole wall 531 and the sixth hole wall 532 are opposite and spaced apart. In the Y-axis direction, the seventh hole wall 533 and the eighth hole wall 534 are opposite and spaced apart. The seventh hole wall 533 and the eighth hole wall 534 are both connected to the fifth hole wall 531 and the sixth hole wall 532.

[0141] The projection of the second through hole 53 of the first heat conducting portion 50a in the Z-axis direction is spaced from the projection of the second closed sub-channel 25b in the Z-axis direction. That is, the second through hole 53 of the first heat conducting portion 50a is spaced from the second closed sub-channel 25b. The projection of the second through hole 53 of the second heat conducting portion 50b in the Z-axis direction is spaced from the projection of the third closed sub-channel 25c in the Z-axis direction. That is, the second through hole 53 of the second heat conducting portion 50b is spaced from the third closed sub-channel 25c. The second through hole 53 is spaced from the closed channel 25.

[0142] The cold air from the external environment can flow from the second through hole 53 into the air flow channel 20a formed by the heat dissipation substrate 121, the heat dissipation fins 122, the temperature equalizing plate 20 and the heat conduction portion 50, and contact the heat dissipation fins 122. The cold air absorbs the heat from the heat dissipation fins 122 and the temperature rises to form hot air. The hot air flows out from the air flow channel 20a along the positive direction of the Z axis to dissipate the power module 14 (such as Figure 5 The heat dissipated to the heat dissipating fins 122 (as shown in the figure) is transferred to the external environment to achieve heat dissipation of the power module 14. The design of the second through hole 53 ensures that the cold air in the external environment can flow from the side of the heat conducting portion 50 facing away from the heat dissipating fins 122 (i.e., the side of the second mating surface 52 facing away from the first mating surface 51) to the heat dissipating fins 122 through the second through hole 53, which is beneficial to improving the heat dissipation efficiency of the heat dissipating fins 122, and further beneficial to improving the heat dissipation efficiency of the power module 14.

[0143] The heat conducting portion 50 is provided with a second heat conducting fin 54. The second heat conducting fin 54 is arranged on the hole wall of the second through hole 53, and the second heat conducting fin 54 is arranged obliquely relative to the cross section of the second through hole 53. Specifically, in the first heat conducting portion 50a, in the X-axis direction, the second heat conducting fin 54 is located on the side of the second mating surface 52 facing away from the first mating surface 51, and is fixedly connected to the second mating surface 52. And in the Z-axis direction, the second heat conducting fin 54 is located on the side of the fifth hole wall 531 of the second through hole 53 and facing away from the sixth hole wall 532, and the second heat conducting fin 54 is fixedly connected to the sixth hole wall 532. The second heat conducting fin 54 is arranged on the fifth hole wall 531 of the second through hole 53. The second heat conducting fin 54 is arranged obliquely relative to the cross section of the second through hole 53 along the Z-axis direction. Specifically, the second heat conducting fin 54 is close to the sixth hole wall 532 relative to the cross section of the second through hole 53 along the X-axis direction. The angle between the cross section of the second heat conducting fin 54 and the second through hole 53 is an acute angle. In other embodiments, the angle between the cross section of the second heat conducting fin 54 and the second through hole 53 may also be an obtuse angle or a right angle. It should be noted that the cross section of the second through hole 53 refers to the cross section of the second through hole 53 cut along a direction perpendicular to the axial direction of the second through hole 53, and the cross section of the second through hole 53 is parallel to the YZ plane.

[0144] In some other embodiments, in the Z-axis direction, the second heat-conducting fin 54 may also be located on one side of the sixth hole wall 532 of the second through hole 53 and facing away from the fifth hole wall 531, the second heat-conducting fin 54 is fixedly connected to the sixth hole wall 532, and the second heat-conducting fin 54 is tilted relative to the cross section of the second through hole 53 along the Z-axis direction. In the Y-axis direction, the second heat-conducting fin 54 may also be located on one side of the seventh hole wall 533 and facing away from the eighth hole wall 534, the second heat-conducting fin 54 is fixedly connected to the seventh hole wall 533, and the second heat-conducting fin 54 is tilted relative to the cross section of the second through hole 53 along the Y-axis direction. In the Y-axis direction, the second heat-conducting fin 54 may also be located on one side of the eighth hole wall 534 and facing away from the seventh hole wall 533, the second heat-conducting fin 54 is fixedly connected to the eighth hole wall 534, and the second heat-conducting fin 54 is tilted relative to the cross section of the second through hole 53 along the Y-axis direction.

[0145] In other embodiments, the second thermal conductive fin 54 may also be fixedly connected to the side of the fifth hole wall 531 facing the sixth hole wall 532, and bent along the X-axis direction relative to the fifth hole wall 531. The second thermal conductive fin 54 may also be arranged on the fifth hole wall 531 and inclined along the Z-axis direction relative to the cross-section of the second through hole 53.

[0146] In some other embodiments, in the X-axis direction, the second thermal conductive fin 54 may also be located on the side of the first mating surface 51 facing away from the second mating surface 52 and fixedly connected to the first mating surface 51, and the second thermal conductive fin 54 is fixedly connected to the hole wall of the second through hole 53, and the second thermal conductive fin 54 is inclined relative to the cross-section of the second through hole 53.

[0147] The arrangement of the second heat conducting fins 54 of the second heat conducting part 50b can refer to the arrangement of the second heat conducting fins 54 of the first heat conducting part 50a, and will not be repeated. The design of the second heat conducting fins 54 is conducive to increasing the contact area between the heat conducting part 50 and the cold air, which is conducive to increasing the power module 14 (such as Figure 5 The amount of heat transferred to the external environment through the heat sink 122 and the temperature plate 20 is beneficial to improving the efficiency of heat dissipation of the power module 14 through the heat sink 122 and the temperature plate 20, which is beneficial to improving the heat dissipation efficiency of the power module 14.

[0148] See also Fig.21 , and combined with Figure 2 and Figure 4 , Fig.21 yes Figure 2 The power conversion device 100 shown is a schematic structural diagram of another embodiment cut along line AA.

[0149] In some other embodiments, the power conversion device 100 includes a fan 60. The fan 60 is disposed in the housing 11 and is located outside the receiving cavity 111. Specifically, a fixing portion 117 is provided on the side of the first shell wall 112 of the housing 11 facing away from the receiving cavity 111. The fixing portion 117 is arranged perpendicular to the first shell wall 112. In the Y-axis direction, the fixing portion 117 is located on one side of the plurality of heat dissipating fins 122 and is spaced apart from the plurality of heat dissipating fins 122. The projection of the fixing portion 117 in the Y-axis direction overlaps with the projection of the plurality of heat dissipating fins 122 in the Y-axis direction. Among them, the fixing portion 117 is provided with a ventilation hole 1171. The ventilation hole 1171 penetrates the fixing portion 117 along the thickness direction of the fixing portion 117 (i.e., the Y-axis direction).

[0150] The fan 60 is fixedly stacked on one side of the fixing portion 117 and faces the plurality of heat dissipation fins 122 by means including but not limited to threaded connection, welding or adhesive connection. The fan 60 is disposed perpendicularly to the first shell wall 112. The fan 60 is disposed perpendicularly to the shell 11. In the Y-axis direction (i.e., the third direction), the fan 60 is located on one side of the plurality of heat dissipation fins 122 and is spaced apart from the plurality of heat dissipation fins 122. The projection of the fan 60 in the Y-axis direction (i.e., the third direction) overlaps with the projection of the plurality of heat dissipation fins 122 in the Y-axis direction (i.e., the third direction). In other embodiments, the fan 60 may also be fixedly stacked on one side of the first shell wall 112 and faces away from the accommodating cavity 111 by means including but not limited to threaded connection, welding or adhesive connection.

[0151] The fan 60 can blow out heat dissipation air, which blows from the ventilation holes 1171 toward the multiple heat dissipation fins 122, flows into the multiple airflow channels 20a and contacts the multiple heat dissipation fins 122, absorbs the heat of the multiple heat dissipation fins 122, and the temperature rises to form hot air, which flows out of the multiple airflow channels 20a along the positive direction of the Z axis to transfer the heat of the multiple heat dissipation fins 122 to the external environment, that is, the heat dissipation air can take away the heat of the multiple heat dissipation fins 122 through the multiple heat dissipation fins 122, and then dissipate the heat of the multiple heat dissipation fins 122. The design of the fan 60 is conducive to improving the heat dissipation efficiency of the multiple heat dissipation fins 122, and then is conducive to improving the heat dissipation efficiency of the power module 14.

[0152] In other embodiments, the fixing portion 117 may also be arranged obliquely relative to the first shell wall 112, and the fan 60 may be arranged obliquely relative to the shell 11. The fixing portion 117 may be close to the plurality of heat dissipation fins 122 relative to the first shell wall 112, and the fan 60 may be close to the plurality of heat dissipation fins 122 relative to the shell 11. The fixing portion 117 may also be away from the plurality of heat dissipation fins 122 relative to the first shell wall 112, and the fan 60 may be away from the plurality of heat dissipation fins 122 relative to the shell 11. By changing the inclination angle of the fan 60 and the shell 11, the wind direction of the heat dissipation wind may be adjusted so as to dissipate heat for the plurality of heat dissipation fins 122, which is beneficial to improving the heat dissipation efficiency of the plurality of heat dissipation fins 122, and is beneficial to improving the heat dissipation efficiency of the power module 14.

[0153] Please refer again Figure 2 , Figure 4 , Fig.15 , Fig.17 , Fig.19 as well as Fig.21 , an embodiment of the present application provides a power conversion device 100. The power conversion device 100 includes a heat dissipation substrate 121, a power module 14 and a temperature equalizer 20. In the Z-axis direction (i.e., the first direction), a plurality of heat dissipation fins 122 are provided on one side of the heat dissipation substrate 121. In the Z-axis direction (i.e., the first direction), the power module 14 is arranged on one side of the heat dissipation substrate 121 and faces away from the plurality of heat dissipation fins 122. In the Z-axis direction (i.e., the first direction), the temperature equalizer 20 is thermally connected to the plurality of heat dissipation fins 122, the temperature equalizer 20 is arranged on one side of the plurality of heat dissipation fins 122 and faces away from the heat dissipation substrate 121, and a closed channel 25 is provided in the temperature equalizer 20, and the closed channel 25 is used for fluid flow.

[0154] The embodiment of the present application provides a power conversion device 100. The power conversion device includes a housing 11, a heat dissipation substrate 121, a circuit board 13, a power module 14 and a temperature plate 20. The housing 11 includes a receiving cavity 111, and the receiving cavity 111 is provided with a mounting hole 116, and the mounting hole 116 is connected to the receiving cavity 111. The heat dissipation substrate 121 is received in the mounting hole 116 and closes the receiving cavity 111. In the Z-axis direction (i.e., the first direction), a plurality of heat dissipation fins 122 are provided on the side of the heat dissipation substrate 121 facing away from the receiving cavity 111. The circuit board 13 is received in the receiving cavity 111. The power module 14 is arranged between the circuit board 13 and the heat dissipation substrate 121. The power module 14 includes a mounting portion 141 and a mating portion 142. In the Z-axis direction (i.e., the first direction), the mounting portion 141 is arranged on one side of the mating portion 142, the mounting portion 141 is arranged on the circuit board 13, and the mating portion 142 contacts the heat dissipation substrate 121. In the Z-axis direction (ie, the first direction), the temperature homogenizer 20 is disposed on one side of the plurality of heat dissipation fins 122 and faces away from the heat dissipation substrate 121 . The Z-axis direction (ie, the first direction) is the thickness direction of the temperature homogenizer 20 .

[0155] In the power conversion device 100 provided in the present application, most of the heat generated by the power module 14 during operation is transferred to the temperature equalizing plate 20 through a part of the heat dissipation fins 122 (i.e., the first heat dissipation fins 122a). Part of the heat transferred to the temperature equalizing plate 20 is transferred to the external environment, and the other part is transferred back to another part of the heat dissipation fins 122 (i.e., the second heat dissipation fins 122b) and then transferred to the external environment, thereby achieving rapid heat dissipation of the power module 14.

[0156] Compared with the existing solution that the heat transferred from the power module 14 to the heat dissipation fins 122 is transferred to the external environment through air convection, most of the heat generated by the power module 14 of the power conversion device 100 provided in the present application when working is quickly dispersed through a part of the heat dissipation fins 122 (i.e., the first heat dissipation fins 122a) through the temperature averaging plate 20, and then transferred back to the other part of the heat dissipation fins 122 (i.e., the second heat dissipation fins 122b) through the temperature averaging plate 20. The temperature averaging plate 20 can be used to average the temperature of multiple heat dissipation fins 122 and reduce the temperature difference between multiple heat dissipation fins 122. Without changing the size of the heat dissipation fins 122, the overall heat dissipation efficiency of the multiple heat dissipation fins 122 is effectively improved, and the ability to naturally dissipate heat for the power module 14 is greatly improved; moreover, the heat generated by the power module 14 can also be transferred to the external environment through the multiple heat dissipation fins 122 through the temperature averaging plate 20, which greatly improves the heat dissipation efficiency of the power module 14.

Claims

1. A power conversion device, characterized in that: The power conversion device comprises: A housing, the housing comprising a receiving cavity, the receiving cavity being provided with a mounting hole, the mounting hole being in communication with the receiving cavity; A heat dissipation substrate, the heat dissipation substrate is received in the mounting hole and closes the receiving cavity, and a plurality of heat dissipation fins are provided on a side of the heat dissipation substrate facing away from the receiving cavity in a first direction; A circuit board, the circuit board is accommodated in the accommodation cavity; a power module, the power module being disposed between the circuit board and the heat dissipation substrate, the power module comprising a mounting portion and a mating portion, wherein in the first direction, the mounting portion is disposed on one side of the mating portion, the mounting portion is disposed on the circuit board, and the mating portion is in contact with the heat dissipation substrate; and A temperature averaging plate is thermally connected to the plurality of heat sinks in the first direction. The temperature averaging plate is disposed on one side of the plurality of heat sinks and faces away from the heat sink substrate. The first direction is the thickness direction of the temperature averaging plate.

2. The power conversion device according to claim 1, characterized in that: A closed channel is provided in the temperature homogenizing plate, and the closed channel is used for fluid flow to homogenize the temperature of the plurality of heat dissipating fins and reduce the temperature difference between the plurality of heat dissipating fins.

3. The power conversion device according to claim 1 or 2, characterized in that: The plurality of heat sinks are located between the heat sink substrate and the temperature equalizing plate to equalize the temperature of the plurality of heat sinks in a second direction, wherein the second direction is perpendicular to the first direction, and a plurality of air flow channels are formed between the heat sink substrate, the plurality of heat sinks and the temperature equalizing plate, and the plurality of air flow channels are arranged at intervals.

4. The power conversion device according to claim 1 or 2, characterized in that: The multiple heat dissipation fins include a first heat dissipation fin and a second heat dissipation fin, the second heat dissipation fin is spaced apart from the first heat dissipation fin, the projection of the first heat dissipation fin in the first direction overlaps with the projection of the power module in the first direction, and the projection of the second heat dissipation fin in the first direction is spaced apart from the projection of the power module in the first direction.

5. The power conversion device according to claim 2, characterized in that: A projection of the closed channel in the first direction is spaced apart from a projection of the plurality of heat dissipating fins in the first direction.

6. The power conversion device according to claim 5, characterized in that: The projection of the closed channel in the first direction surrounds the projections of the plurality of heat dissipation fins in the first direction.

7. The power conversion device according to claim 6, characterized in that: The closed channel includes a bending section and a connecting section, the bending section includes a plurality of receiving openings, the plurality of receiving openings are arranged at intervals along the second direction, in the third direction, the connecting section is located on one side of the bending section and is connected to the bending section, the connecting section closes the plurality of receiving openings, the first direction, the second direction and the third direction are perpendicular to each other, and the projections of the plurality of heat dissipating fins in the first direction are located one by one within the projections of the plurality of receiving openings in the first direction.

8. The power conversion device according to claim 2, characterized in that: A guide section is provided in the temperature homogenizing plate, the guide section is communicated with the closed channel, and the guide section is used to limit the unidirectional flow of the fluid.

9. The power conversion device according to claim 8, characterized in that: The guide segment includes a first guide sub-segment and a second guide sub-segment, one end of the second guide sub-segment is connected to one end of the first guide sub-segment, the second guide sub-segment is bent relative to the first guide sub-segment, one end of the first guide sub-segment facing away from the second guide sub-segment is connected to the closed channel, the first guide sub-segment is inclined relative to the extension direction of the closed channel, and one end of the second guide sub-segment facing away from the first guide sub-segment is connected to the closed channel.

10. The power conversion device according to claim 2, characterized in that: A protrusion is provided on the surface of the temperature homogenizing plate, a projection of the protrusion in the first direction overlaps with a projection of the closed channel in the first direction, and the protrusion is spaced apart from the plurality of heat dissipation fins; Alternatively, a plurality of grooves are provided on the surface of the temperature homogenizing plate, the plurality of grooves are arranged at intervals from the closed channel, and the plurality of heat dissipation fins are clamped in the plurality of grooves in a one-to-one correspondence; Alternatively, the temperature homogenizing plate is provided with a first through hole, the first through hole penetrates the temperature homogenizing plate along the first direction, and the first through hole is spaced apart from the closed channel.

11. The power conversion device according to claim 10, characterized in that: The temperature homogenizing plate is provided with a first heat-conducting fin, which is arranged on the hole wall of the first through hole, and the first heat-conducting fin is arranged obliquely relative to the cross section of the first through hole.

12. The power conversion device according to claim 2, characterized in that: The power conversion device includes a fan, which is arranged in the shell and located outside the accommodating cavity. In a third direction, the fan is located on one side of the multiple heat dissipation fins and is spaced apart from the multiple heat dissipation fins. The projection of the fan in the third direction overlaps with the projection of the multiple heat dissipation fins in the third direction, and the third direction is perpendicular to the first direction.

13. The power conversion device according to any one of claims 5 to 12, characterized in that: The temperature homogenizing plate includes a main body and a heat conducting part. In the first direction, the heat conducting part is arranged on one side of the main body, the main body is arranged on one side of the plurality of heat dissipating fins and faces away from the heat dissipating substrate, and the heat conducting part faces the heat dissipating substrate. In the second direction, the heat conducting part is located on one side of the plurality of heat dissipating fins and is spaced apart from the plurality of heat dissipating fins. The second direction is perpendicular to the first direction. The closed channel is arranged in the main body and the heat conducting part.

14. The power conversion device according to claim 13, characterized in that: The heat conducting portion is provided with a second through hole, the second through hole penetrates the heat conducting portion along the second direction, and the second through hole is spaced apart from the closed channel.

15. The power conversion device according to claim 14, characterized in that: The heat conducting portion is provided with a second heat conducting fin, the second heat conducting fin is arranged on the hole wall of the second through hole, and the second heat conducting fin is arranged obliquely relative to the cross section of the second through hole.

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