Diamond tool bit with chip removal and heat dissipation effects

Abstract

A diamond tool bit with chip removal and heat dissipation effects is provided with two layers of first blades, two layers of second blades and two layers of third blades, and each first blade is provided with a first easy-to-grind area where no diamond particles are distributed and two first grinding working areas where the diamond particles are distributed; the second blade is provided with a second easy-to-grind area in which no diamond particles are distributed and a second grinding working area in which the diamond particles are distributed; the third blade is provided with a third easy-to-grind area where no diamond particles are distributed and a third grinding working area where the diamond particles are distributed. The first easy-to-grind area, the second easy-to-grind area and the third easy-to-grind area form an easy-to-grind area and are provided with overlapped parts, chip removal grooves are formed in the grinding process, the chip removal function can be achieved, diamond particles are completely wrapped in matrix powder when the diamond tool bit is formed, bonding is firmer, the diamond particles are not prone to falling off, abrasion resistance is good, and the service life is long. And the diamond particles exposed on the side walls of the chip grooves form new sharp blade points, so that the sharpness is improved, and the cutting efficiency is improved.

Description

Technical Field

[0001] The utility model relates to a cutter head, in particular to a diamond cutter head with chip removal and heat dissipation effects. Background Art

[0002] The existing diamond cutter head has the characteristics of high hardness and high wear resistance, is widely used in cutting processing, can adapt to the formations with high abrasiveness and hard geology, and has relatively good cutting performance; especially when it comes to wear-resistant materials (such as stone and ceramic materials), the diamond cutter head has a good cutting effect; the existing diamond cutter head is made of a multi-layer diamond blade, wherein the diamond blade contains diamond particles, and the diamond particles are used to cut the stone; however, the existing diamond tool generally forms a chip groove at the interval between two adjacent diamond cutter heads, and the chip removal and heat dissipation performance are poor; or, the chip grooves are pre-formed on the two side surfaces of the existing diamond cutter head, although the chip removal and heat dissipation effects can be achieved; however, the existing diamond cutter head forms the chip groove during hot pressing or cold pressing, and the diamond particles near the chip groove lack the bonding of the matrix powder, and are easy to fall off during the grinding process; not only does it affect the cutting sharpness, but also has poor wear resistance, and seriously affects the service life of the diamond cutter head.

[0003] In view of this, the designer has made in-depth considerations and actively researched, improved and trial-produced the present invention to address the many deficiencies and inconveniences caused by the imperfect structural design of the diamond cutter head mentioned above, and has developed and designed the present invention. Utility Model Content

[0004] The utility model aims to provide a diamond tool head with chip removal and heat dissipation effects. A chip groove is formed during the grinding process, which can not only achieve the chip removal and heat dissipation functions, but also the diamond particles are completely wrapped in the matrix powder when the diamond tool head is formed, so the bonding is more firm, not easy to fall off, good wear resistance, and long service life; and the diamond particles exposed on the side wall of the chip groove form new sharp blade points, which improves the sharpness and thus improves the cutting efficiency.

[0005] In order to achieve the above purpose, the solution of the utility model is:

[0006] A diamond cutter head with chip removal and heat dissipation effects, the diamond cutter head having two layers of first blades, two layers of second blades and two layers of third blades, the blades of the diamond cutter head being arranged in the order of second blade + first blade + third blade + third blade + first blade + second blade; wherein the first blade has a first easy-grinding area where no diamond particles are distributed and two first grinding working areas located on both sides of the first easy-grinding area and where diamond particles are distributed; the second blade has a second easy-grinding area where no diamond particles are distributed and two first grinding working areas located on both sides of the second easy-grinding area The second grinding working area on both sides of the cutting area and distributed with diamond particles; the third blade has a third easy grinding area without diamond particles and a third grinding working area located on both sides of the third easy grinding area and distributed with diamond particles; the first easy grinding area, the second easy grinding area and the third easy grinding area constitute an easy grinding area and have overlapping parts. During the cutting and grinding process, the first easy grinding area, the second easy grinding area and the third easy grinding area are ground to form an interlinked chip groove, and the diamond particles exposed on the two side walls of the chip groove form new cutting edge points.

[0007] The first easy-grinding zone, the second easy-grinding zone and the third easy-grinding zone are V-shaped and are gradually tapered from the blade edge to the welding edge; the area of ​​the first easy-grinding zone is smaller than the area of ​​the second easy-grinding zone, and the area of ​​the first easy-grinding zone is larger than the area of ​​the third easy-grinding zone; during the cutting and grinding process, the first easy-grinding zone, the second easy-grinding zone and the third easy-grinding zone are ground to form a chip groove with large sides and a small middle.

[0008] A plurality of first diamond particle columns are orderly distributed on the two first grinding working areas, and the plurality of first diamond particle columns located on the same side of the first easy-grinding area are distributed along the parallel lines of the side edge of the first easy-grinding area on that side; a plurality of second diamond particle columns are orderly distributed on the two second grinding working areas, and the plurality of second diamond particle columns located on the same side of the second easy-grinding area are distributed along the parallel lines of the side edge of the second easy-grinding area on that side; a plurality of third diamond particle columns are orderly distributed on the two third grinding working areas, and the plurality of third diamond particle columns located on the same side of the third easy-grinding area are distributed along the parallel lines of the side edge of the third easy-grinding area on that side.

[0009] The two sides of the first easy grinding area are respectively parallel to the two sides of the second easy grinding area and the two sides of the third easy grinding area; and the third diamond particle column on the same side of the easy grinding area is parallel to the first diamond particle column and the second diamond particle column and is staggered.

[0010] The first easy-grinding area, the second easy-grinding area and the third easy-grinding area are located in the middle of the diamond bit and are symmetrically arranged about the center line of the diamond bit. The diamond particles exposed on the two side walls of the chip removal groove form two symmetrically arranged arrow-shaped cutting edges.

[0011] The diamond particles of the first diamond particle row, the second diamond particle row and the third diamond particle row located on the same side of the easy grinding area form a plurality of arrow-shaped cutting edges on the edge of the blade, the arrows of the arrow-shaped cutting edges point toward the center line of the diamond bit, and the plurality of arrow-shaped cutting edges located on the same side of the easy grinding area are connected in sequence.

[0012] The diamond cutter head is fan-shaped, and the third diamond particle row, the first diamond particle row, and the second diamond particle row on the same side of the easy-grinding area are arranged parallel to the straight edge of the diamond cutter head on this side.

[0013] The spacing between two adjacent rows of first diamond particles on the same side of the first easy-grinding area is a first spacing; the spacing between two diamond particles of two rows of first diamond particles on both sides of the first easy-grinding area near the welding edge is a second spacing, and the second spacing is smaller than the first spacing.

[0014] The spacing between the two diamond particles of the two rows of second diamond particles on both sides of the second easy-grinding zone near the welding edge is a third spacing, and the third spacing is greater than the second spacing; the third easy-grinding zone is divided into an upper part near the blade edge and in a V-shape and a lower part near the welding edge and in a V-shape, the two rows of third diamond particles on both sides of the upper part extend from the blade edge to the middle position, and the spacing between the two diamond particles of the two rows of third diamond particles on both sides of the upper part near the middle position is a fifth spacing, which is less than the third spacing and greater than or equal to the second spacing; the spacing between the two diamond particles of the two rows of third diamond particles on both sides of the lower part near the welding edge is a sixth spacing, and the sixth spacing is greater than the third spacing; during the cutting and grinding process, the chip removal groove forms chip removal spaces that change from large to small in the upper part and the lower part of the third easy-grinding zone, respectively.

[0015] The spacing between two adjacent columns of first diamond grains on the same side of the second easy-grinding area is a fourth spacing, which is equal to the first spacing; the spacing between two adjacent columns of third diamond grains on the same side of the third easy-grinding area is a seventh spacing, which is equal to the first spacing.

[0016] After adopting the above structure, during the grinding process of the diamond cutter head of the utility model, the first easy-to-grind area, the second easy-to-grind area and the third easy-to-grind area where diamond particles are not distributed are easily ground into depressions to form interconnected chip grooves, which can not only achieve the chip removal and heat dissipation functions, but also the easy-to-grind area is filled with matrix powder, so that the diamond particles are completely wrapped in the matrix powder when the diamond cutter head is formed, and the bonding is more firm, not easy to fall off, good wear resistance, and long service life; and after the easy-to-grind area is ground into a chip groove, the diamond particles exposed on the side wall of the chip groove form a new sharp blade point, which improves the sharpness and thus improves the cutting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the structure of the diamond cutter head of the utility model;

[0018] Figure 2 This is a front view schematic diagram of the diamond cutter head of the utility model;

[0019] Figure 3 for Figure 2 Schematic cross-sectional view along the AA direction;

[0020] Figure 4 This is an exploded schematic diagram of the diamond cutter head of the utility model;

[0021] Figure 5 It is a front view schematic diagram of the first blade of the utility model;

[0022] Figure 6 It is a front view schematic diagram of the second blade of the utility model;

[0023] Figure 7 It is a front view schematic diagram of the third blade of the utility model.

[0024] Explanation of symbols

[0025] Diamond cutter head 10; easy-grinding area 20; grinding working area 30; blade edge 40; welding edge 50; chip groove 60; first blade 1; first easy-grinding area 11; first grinding working area 12; first diamond particle row 121; first spacing L1; second spacing L2; second blade 2; second easy-grinding area 21; second grinding working area 22; second diamond particle row 221; third spacing L3; fourth spacing L4; arrow-shaped cutting edge 70; third blade 3; third easy-grinding area 31; third grinding working area 32; third diamond particle row 321; upper part 311; lower part 312; fifth spacing L5; sixth spacing L6. DETAILED DESCRIPTION

[0026] In order to further explain the technical solution of the present invention, the present invention is described in detail below through specific embodiments.

[0027] See also Figures 1 to 7 The utility model discloses a diamond cutter head with chip removal and heat dissipation effect, wherein the diamond cutter head 10 has two layers of first blades 1, two layers of second blades 2 and two layers of third blades 3, and the blade arrangement order of the diamond cutter head 10 is second blade 2+first blade 1+third blade 3+third blade 3+first blade 1+second blade 2; wherein the first blade 1 has a first easy-grinding area 11 where no diamond particles are distributed and two first grinding working areas 12 where diamond particles are distributed on both sides of the first easy-grinding area 11; the second blade 2 has a second easy-grinding area 21 where no diamond particles are distributed and a second grinding working area 12 where diamond particles are distributed on both sides of the second easy-grinding area 21 working area 22; the third blade 3 has a third easy-grinding area 31 without diamond particles distributed therein and a third grinding working area 32 located on both sides of the third easy-grinding area 31 and distributed with diamond particles; the first easy-grinding area 11, the second easy-grinding area 21 and the third easy-grinding area 31 constitute the easy-grinding area 20 and have an overlapping portion, and the first grinding working area 12, the second grinding working area 22 and the third grinding working area 32 on the same side constitute the grinding working area 30; during the cutting and grinding process, the first easy-grinding area 11, the second easy-grinding area 21 and the third easy-grinding area 31 are ground to form an interlocking chip groove 60, and the diamond particles exposed on the two side walls of the chip groove 60 form new cutting edge points.

[0028] During the grinding process of the diamond cutter head 10 of the utility model, the first easy-grinding area 11, the second easy-grinding area 21 and the third easy-grinding area 31 where no diamond particles are distributed are easily ground and depressed to form the chip groove 60, which can not only achieve the chip removal and heat dissipation functions, but also the easy-grinding area 20 is filled with matrix powder, so that the diamond particles are completely wrapped in the matrix powder when the diamond cutter head 10 is formed, and the bonding is more firm, not easy to fall off, good wear resistance, and long service life; and after the easy-grinding area 20 is ground into the chip groove 60, the diamond particles exposed on the side wall of the chip groove 60 form a new sharp blade point, which improves the sharpness, thereby improving the cutting efficiency.

[0029] The first easy-grinding area 11, the second easy-grinding area 21 and the third easy-grinding area 31 of the utility model are V-shaped and are gradually reduced from the blade edge 40 to the welding edge 50; the area of ​​the first easy-grinding area 11 is smaller than the area of ​​the second easy-grinding area 21, and the area of ​​the first easy-grinding area 11 is larger than the area of ​​the third easy-grinding area 31; during the cutting and grinding process, the first easy-grinding area 11, the second easy-grinding area 21 and the third easy-grinding area 31 are ground to form a concave area from the blade edge 40 to the welding edge 50 A chip groove 60 is formed with large sides and a small middle; during the grinding process, the chip groove 60 of the diamond bit 10 is formed from nothing to something and gradually becomes smaller and finally disappears; the two grinding work areas 30 are always an integrated structure, so that the structural strength of the diamond bit 10 is stronger, the cutting efficiency is better, and the service life is longer; the two grinding work areas 30 are prevented from being separated and causing the diamond bit 10 to separate from the substrate; during the grinding process, the easy-to-grind area 20 is ground to form a V-shaped chip groove 60, which has a better chip removal effect.

[0030] The two first grinding working areas 12 of the utility model are respectively and orderly distributed with multiple rows of first diamond grains 121, and the multiple rows of first diamond grains 121 located on the same side of the first easy-to-grinding area 11 are distributed along the parallel lines of the side of the first easy-to-grinding area 11 on this side; the two second grinding working areas 22 are respectively and orderly distributed with multiple rows of second diamond grains 221, and the multiple rows of second diamond grains 221 located on the same side of the second easy-to-grinding area 21 are distributed along the parallel lines of the side of the second easy-to-grinding area 21 on this side; the two third grinding working areas 32 There are multiple rows of third diamond grains 321 distributed in order on the upper surface, and the multiple rows of third diamond grains 321 located on the same side of the third easy-grinding area 31 are distributed along the parallel lines of the side of the third easy-grinding area 31 on this side; the first diamond grains rows 121 on both sides of the first easy-grinding area 11, the second diamond grains rows 221 on both sides of the second easy-grinding area 21 and the third diamond grains rows on both sides of the third easy-grinding area can limit the size of the chip groove 60 ground into the easy-grinding area 20, thereby improving the cutting and chip removal efficiency of the diamond bit 10.

[0031] The two side edges of the first easy-grinding area 11 of the utility model are respectively arranged in parallel with the two side edges of the second easy-grinding area 21 and the two side edges of the third easy-grinding area 31; and the third diamond particle row 321 located on the same side of the easy-grinding area 20 is parallel to the first diamond particle row 121 and the second diamond particle row 221 and is staggered; the diamond particles on the first blade 1, the second blade 2 and the third blade 3 of the diamond segment 10 are staggered, so that the positions of the blade points can be staggered, the force points of the cutting and grinding of the diamond segment 10 can be increased, and the efficiency and quality of the cutting and grinding can be improved; and in the cutting and grinding process, the consumption of diamond particles is reduced, the utilization rate of diamond particles is improved, and the service life of the diamond segment 10 is effectively extended.

[0032] The first easy-grinding area 11, the second easy-grinding area 21 and the third easy-grinding area 31 of the utility model are located in the middle position of the diamond bit 10 and are symmetrically arranged with respect to the center line axis of the diamond bit 10; the chip removal groove 60 formed in the easy-grinding area 20 is located in the center position, and has a good chip removal effect; the diamond particles exposed on the two side walls of the chip removal groove 60 are surrounded by two symmetrically arranged arrow-shaped cutting edges 70, and the arrow-shaped cutting edges 70 make the diamond bit 10 sharper and improve the cutting and grinding efficiency.

[0033] The diamond particles of the first diamond particle row 121, the second diamond particle row 221 and the third diamond particle row 321 located on the same side of the easy grinding area 20 of the utility model surround a plurality of arrow-shaped cutting edges 70 on the blade edge 40, and the arrows of the arrow-shaped cutting edges 70 face the center line of the diamond bit 10; the arrow-shaped cutting edges 70 on the two grinding working areas 30 are symmetrically arranged, and the arrow-shaped cutting edges 70 on the side with the same rotation direction as the diamond bit 10 are the main cutting edges, which are opposite to the rotation direction of the diamond bit 10. The arrow-shaped cutting edge 70 on the side is an auxiliary cutting edge; therefore, no matter whether the diamond bit 10 rotates forward or reverse, it has a main cutting edge and an auxiliary cutting edge to ensure the cutting sharpness and cutting and grinding efficiency of the diamond bit 10; and the multiple arrow-shaped cutting edges 70 located on the same side of the easy-grinding area 20 are connected in sequence; there is a diamond particle cutting point at each position on the blade edge 40, and each consumed blade edge 40 is arranged with diamond particles to ensure the cutting sharpness and cutting continuity of the diamond bit 10, and the cutting effect is better.

[0034] The diamond cutter head 10 of the utility model is fan-shaped, and the third diamond particle row 321, the first diamond particle row 121, and the second diamond particle row 221 located on the same side of the easy-grinding area 20 are arranged parallel to the straight edge of the diamond cutter head 10 on this side; the diamond particle rows at the two straight edge positions on the diamond cutter head 10 are arranged symmetrically in rows, so that the cutting force on both sides of the diamond cutter head is the same, thereby improving the sharpness and service life of the diamond cutter head.

[0035] In the present invention, the spacing between two adjacent rows of first diamond particle columns 121 on the same side of the first easy-grinding area 11 is a first spacing L1; the spacing between two diamond particles of the two rows of first diamond particle columns 121 located on both sides of the first easy-grinding area 11 near the welding edge is a second spacing L2, and the second spacing L2 is smaller than the first spacing L1; when the diamond bit 10 is ground and consumed to the welding edge 50, the second spacing between the two diamond particles on both sides of the first easy-grinding area 11 is relatively small, and a chip groove cannot be formed, so that the two first grinding working areas are always an integrated structure, so that the structural strength of the diamond bit is stronger and the cutting efficiency is better.

[0036] The utility model provides that the spacing between the two diamond particles of the two rows of second diamond particles 221 located on both sides of the second easy-grinding zone 21 near the welding edge 50 is a third spacing L3, and the third spacing L3 is greater than the second spacing L2; the third easy-grinding zone 31 is divided into an upper portion 311 near the blade edge 40 and in a V-shape and a lower portion 312 near the welding edge 50 and in a V-shape, the two rows of third diamond particles 321 on both sides of the upper portion 311 extend from the blade edge 40 to the middle position, and the spacing between the two diamond particles of the two rows of third diamond particles 321 on both sides of the upper portion 311 near the middle position is a fifth spacing L5, and the fifth spacing L6 is greater than the second spacing L7; the third easy-grinding zone 31 is divided into an upper portion 311 near the blade edge 40 and in a V-shape and a lower portion 312 near the welding edge 50, the two rows of third diamond particles 321 on both sides of the upper portion 311 extend from the blade edge 40 to the middle position, and the spacing between the two diamond particles of the two rows of third diamond particles 321 on both sides of the upper portion 311 near the middle position is a fifth spacing L5, and the fifth spacing L6 is greater than the second spacing L7; L5 is smaller than the third spacing L3 and greater than or equal to the second spacing L2; the spacing between the two diamond particles of the two rows of third diamond particles 321 on both sides of the lower portion 312 near the welding edge 50 is a sixth spacing L6, and the sixth spacing L6 is larger than the third spacing L3; during the cutting and grinding process, the chip groove 60 is ground in the first easy-grinding area 11, the second easy-grinding area 21 and the third easy-grinding area 31 to form a chip groove 60 with large sides and a small middle, and the chip groove 60 forms chip removal spaces that change from large to small in the upper part 311 and the lower part 312 of the third easy-grinding area 31, respectively, to increase the layout of diamond particles and improve the cutting wear resistance and cutting and grinding efficiency of the diamond bit 10.

[0037] The spacing between two adjacent rows of first diamond grain rows 221 on the same side of the second easy-grinding area 21 of the utility model is a fourth spacing L4, and the fourth spacing L4 is equal to the first spacing L1; the spacing between two adjacent rows of third diamond grain rows 321 on the same side of the third easy-grinding area 31 is a seventh spacing L7, and the seventh spacing L7 is equal to the first spacing L1; the first diamond grain row 121, the second diamond grain row 221 and the third diamond grain row 321 on the same side of the easy-grinding area 20 are arranged in parallel with equal spacing, and the diamond grains on the blade edge 40 are surrounded by a plurality of arrow-shaped cutting edges 70, so that the blade edge 40 of the diamond bit 10 is sharper, thereby improving the cutting and grinding efficiency.

[0038] The above embodiments and drawings do not limit the product form and style of the utility model. Any appropriate changes or modifications made thereto by ordinary technicians in the relevant technical field should be deemed to be within the patent scope of the utility model.

Claims

1. A diamond tool head with chip removal and heat dissipation effects, characterized in that: The diamond cutter head comprises two layers of first blades, two layers of second blades and two layers of third blades, and the blades of the diamond cutter head are arranged in the order of second blade+first blade+third blade+third blade+first blade+second blade; wherein, the first blade comprises a first easy-grinding area where no diamond particles are distributed and two first grinding working areas located on both sides of the first easy-grinding area and where diamond particles are distributed; the second blade comprises a second easy-grinding area where no diamond particles are distributed and a second grinding working area located on both sides of the second easy-grinding area and where diamond particles are distributed; the third blade comprises a third easy-grinding area where no diamond particles are distributed and a third grinding working area located on both sides of the third easy-grinding area and where diamond particles are distributed; the first easy-grinding area, the second easy-grinding area and the third easy-grinding area constitute an easy-grinding area and have overlapping parts, and in the process of cutting and grinding, the first easy-grinding area, the second easy-grinding area and the third easy-grinding area are ground to form interlinked chip grooves, and the diamond particles exposed on the two side walls of the chip grooves form new cutting edge points.

2. A diamond tool head with chip removal and heat dissipation effect as claimed in claim 1, characterized in that: The first easy-grinding zone, the second easy-grinding zone and the third easy-grinding zone are V-shaped and are gradually tapered from the blade edge to the welding edge; the area of ​​the first easy-grinding zone is smaller than the area of ​​the second easy-grinding zone, and the area of ​​the first easy-grinding zone is larger than the area of ​​the third easy-grinding zone; during the cutting and grinding process, the first easy-grinding zone, the second easy-grinding zone and the third easy-grinding zone are ground to form a chip groove with large sides and a small middle.

3. A diamond tool head with chip removal and heat dissipation effect as claimed in claim 2, characterized in that: A plurality of first diamond particle columns are orderly distributed on the two first grinding working areas, and the plurality of first diamond particle columns located on the same side of the first easy-grinding area are distributed along the parallel lines of the side edge of the first easy-grinding area on that side; a plurality of second diamond particle columns are orderly distributed on the two second grinding working areas, and the plurality of second diamond particle columns located on the same side of the second easy-grinding area are distributed along the parallel lines of the side edge of the second easy-grinding area on that side; a plurality of third diamond particle columns are orderly distributed on the two third grinding working areas, and the plurality of third diamond particle columns located on the same side of the third easy-grinding area are distributed along the parallel lines of the side edge of the third easy-grinding area on that side.

4. A diamond tool head with chip removal and heat dissipation effect as claimed in claim 3, characterized in that: The two sides of the first easy grinding area are respectively parallel to the two sides of the second easy grinding area and the two sides of the third easy grinding area; and the third diamond particle column on the same side of the easy grinding area is parallel to the first diamond particle column and the second diamond particle column and is staggered.

5. A diamond tool head with chip removal and heat dissipation effect as claimed in claim 4, characterized in that: The first easy-grinding area, the second easy-grinding area and the third easy-grinding area are located in the middle of the diamond bit and are symmetrically arranged about the center line of the diamond bit. The diamond particles exposed on the two side walls of the chip removal groove form two symmetrically arranged arrow-shaped cutting edges.

6. A diamond tool head with chip removal and heat dissipation effect as claimed in claim 5, characterized in that: The diamond particles of the first diamond particle row, the second diamond particle row and the third diamond particle row located on the same side of the easy grinding area form a plurality of arrow-shaped cutting edges on the edge of the blade, the arrows of the arrow-shaped cutting edges point toward the center line of the diamond bit, and the plurality of arrow-shaped cutting edges located on the same side of the easy grinding area are connected in sequence.

7. A diamond tool head with chip removal and heat dissipation effects as claimed in claim 6, characterized in that: The diamond cutter head is fan-shaped, and the third diamond particle row, the first diamond particle row, and the second diamond particle row on the same side of the easy-grinding area are arranged parallel to the straight edge of the diamond cutter head on this side.

8. A diamond tool head with chip removal and heat dissipation effects as claimed in claim 6, characterized in that: The spacing between two adjacent rows of first diamond particles on the same side of the first easy-grinding area is a first spacing; the spacing between two diamond particles of two rows of first diamond particles on both sides of the first easy-grinding area near the welding edge is a second spacing, and the second spacing is smaller than the first spacing.

9. A diamond tool head with chip removal and heat dissipation effects as claimed in claim 8, characterized in that: The spacing between the two diamond particles of the two rows of second diamond particles on both sides of the second easy-grinding zone near the welding edge is a third spacing, and the third spacing is greater than the second spacing; the third easy-grinding zone is divided into an upper part near the blade edge and in a V-shape and a lower part near the welding edge and in a V-shape, the two rows of third diamond particles on both sides of the upper part extend from the blade edge to the middle position, and the spacing between the two diamond particles of the two rows of third diamond particles on both sides of the upper part near the middle position is a fifth spacing, which is less than the third spacing and greater than or equal to the second spacing; the spacing between the two diamond particles of the two rows of third diamond particles on both sides of the lower part near the welding edge is a sixth spacing, and the sixth spacing is greater than the third spacing; during the cutting and grinding process, the chip removal groove forms chip removal spaces that change from large to small in the upper part and the lower part of the third easy-grinding zone, respectively.

10. A diamond tool head with chip removal and heat dissipation effects as claimed in claim 8, characterized in that: The spacing between two adjacent rows of first diamond particles on the same side of the second easy-grinding area is a fourth spacing, and the fourth spacing is equal to the first spacing; The spacing between two adjacent third diamond particle columns located on the same side of the third easy-grinding area is a seventh spacing, and the seventh spacing is equal to the first spacing.

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