Upper and lower bridge monitoring equipment of IGBT module

Abstract

The utility model discloses an upper and lower bridge monitoring device of an IGBT module, which comprises an IGBT body, a direct current power supply device shell is arranged outside the IGBT body, an inverter shell is arranged outside the direct current power supply device shell, a heat dissipation mechanism is arranged inside the inverter shell, the heat dissipation mechanism comprises a heat dissipation assembly and a control assembly, and the control assembly is connected with the heat dissipation assembly. The control assembly comprises a control device, and a control system is arranged in the control device. The design of the IGBT body, the temperature sensor and the heat dissipation mechanism is utilized, temperature data are transmitted to the interior of the temperature sensor through the temperature sensor, when the temperature exceeds a set threshold value, the regulation and control unit increases the voltage input to the miniature electric fan, so that the rotating speed of the miniature electric fan is increased, and when the judgment unit continuously transmits signals to the regulation and control unit, the regulation and control unit stops working. And the regulation and control unit continuously increases the voltage, so that the rotating speed of the micro electric fan is continuously increased, and the wind speed of the micro electric fan is regulated.

Description

Technical Field

[0001] The utility model relates to the field of power electronics, in particular to an upper and lower bridge monitoring device of an IGBT module. Background Art

[0002] IGBT is a semiconductor device. IGBT is provided inside the DC power supply device of the power inverter for controlling voltage and current.

[0003] During the use of IGBT, the upper and lower bridges of the IGBT will generate heat when working. The traditional way is to open holes in the casing of the DC power supply device, and use a micro fan installed inside the inverter to blow air in from the heat dissipation holes to dissipate the heat of the IGBT. However, in this way, the speed of the micro fan cannot be controlled. When the temperature of the upper and lower bridges of the IGBT is too high and the fan speed remains unchanged, the air volume is not enough to cool the upper and lower bridges, which will cause the upper and lower bridges of the IGBT to fail due to excessive temperature. Utility Model Content

[0004] The purpose of the utility model is to provide an upper and lower bridge monitoring device for an IGBT module to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an upper and lower bridge monitoring device of an IGBT module, comprising an IGBT body, a DC power supply device housing for covering the IGBT body is arranged outside the IGBT body, an inverter housing for installing the DC power supply device housing is arranged outside the DC power supply device housing, a heat dissipation mechanism for dissipating heat from the IGBT body is arranged inside the inverter housing, the heat dissipation mechanism comprises a heat dissipation component and a control component, the control component comprises a control device, a control system for controlling the heat dissipation component is arranged inside the control device, the control system comprises an input unit, a judgment unit, a regulation unit and an output unit, the input unit The input end of the element is electrically connected to a temperature sensor for monitoring the upper and lower bridge temperatures of the IGBT body, the output end of the input unit is electrically connected to the input end of the judgment unit, the output end of the judgment unit is electrically connected to the input end of the control unit, the output end of the control unit is electrically connected to the input end of the output unit, the output end of the output unit is electrically connected to the input end of the micro fan, the top of the housing of the DC power supply device is provided with an insertion hole for inserting the temperature sensor, the input unit is used to receive and transmit monitoring data of the temperature sensor, the judgment unit is used to determine whether the monitored temperature exceeds a threshold value, the control unit is used to adjust the voltage, and the output unit is used to output voltage to the micro fan.

[0006] Preferably, a substrate for installing the IGBT body is fixedly connected to the bottom of the IGBT body, the bottom end of the substrate is fixedly connected to the bottom end of the inner wall of the DC power supply device casing, the bottom end of the DC power supply device casing is fixedly connected to the bottom end of the inner wall of the inverter casing, and a heat dissipation hole is provided at the top of the DC power supply device casing.

[0007] Preferably, a mounting bracket for mounting the control device is fixedly connected to the top of the control device, the back of the mounting bracket is fixedly connected to the back of the inner wall of the inverter housing, the heat dissipation assembly includes a micro fan, and the bottom end of the mounting bracket is fixedly connected to the top of the micro fan.

[0008] Preferably, pressing components for fixing the temperature sensor are respectively arranged on both sides of the IGBT body, the pressing components include an extrusion block, and one end of the temperature sensor is arranged on a side opposite to the extrusion block and the upper and lower bridges of the IGBT body.

[0009] Preferably, a top end of the extrusion block is fixedly connected with an extrusion bolt, a fixing frame for installing the extrusion bolt is provided on one side of the IGBT body, a threaded hole is opened at one end of the fixing frame, and the extrusion bolt is threadedly inserted and connected with the threaded hole.

[0010] Technical effects and advantages of the utility model:

[0011] The utility model utilizes the design of an IGBT body, a temperature sensor and a heat dissipation mechanism, and presses one end of the temperature sensor through an extrusion block, so that the one end of the temperature sensor can monitor the temperature of the upper and lower bridges of the IGBT body in real time, and the temperature data is transmitted to the inside of the temperature sensor through the temperature sensor, and a judgment unit compares the temperature data transmitted by the temperature sensor with a set threshold value. When the temperature exceeds the set threshold value, the judgment unit transmits it to the control unit, and the control unit increases the voltage input to the micro fan to increase the speed of the micro fan. When the judgment unit continuously transmits a signal to the control unit, the control unit continuously increases the voltage, thereby continuously increasing the speed of the micro fan, realizing the adjustment of the wind speed of the micro fan, and thus improving the heat dissipation of the upper and lower bridges of the IGBT body. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the cross-sectional structure of the utility model.

[0013] Figure 2 For this utility model Figure 1 A is a schematic diagram of the enlarged structure.

[0014] Figure 3 This is a schematic diagram of the connection structure of the control system of the utility model.

[0015] In the figure: 1. IGBT body; 2. DC power supply device housing; 3. Inverter housing; 4. Control device; 5. Temperature sensor; 6. Micro fan; 7. Mounting frame; 8. Base plate; 9. Fixing frame; 10. Extrusion bolt; 11. Extrusion block. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0017] The utility model provides Figure 1-3 The upper and lower bridge monitoring device of an IGBT module shown in the figure includes an IGBT body 1, a DC power supply device housing 2 for covering the IGBT body 1 is arranged outside the IGBT body 1, an inverter housing 3 for installing the DC power supply device housing 2 is arranged outside the DC power supply device housing 2, a heat dissipation mechanism for dissipating heat of the IGBT body 1 is arranged inside the inverter housing 3, the heat dissipation mechanism includes a heat dissipation component and a control component, the control component includes a control device 4, a control system for controlling the heat dissipation component is arranged inside the control device 4, and the control system includes an input unit, a judgment unit, a regulation unit and an output unit.

[0018] Specifically, a substrate 8 for installing the IGBT body 1 is fixedly connected to the bottom of the IGBT body 1, the bottom end of the substrate 8 is fixedly connected to the bottom end of the inner wall of the DC power supply device housing 2, the bottom end of the DC power supply device housing 2 is fixedly connected to the bottom end of the inner wall of the inverter housing 3, and a heat dissipation hole is provided at the top of the DC power supply device housing 2. Pressing components for fixing the temperature sensor 5 are respectively provided on both sides of the IGBT body 1. The pressing components include an extrusion block 11. One end of the temperature sensor 5 is provided on the side opposite to the upper and lower bridges of the extrusion block 11 and the IGBT body 1. The top of the extrusion block 11 is fixedly connected with an extrusion bolt 10. A fixing frame 9 for installing the extrusion bolt 10 is provided on one side of the IGBT body 1. A threaded hole is provided at one end of the fixing frame 9, and the extrusion bolt 10 is threadedly inserted and connected with the threaded hole.

[0019] Furthermore, two groups of pressing components are provided, which are respectively arranged on one side of the upper bridge and the lower bridge of the IGBT body 1. The bottom end of the fixing frame 9 is fixedly connected to the top of the substrate 8 by welding. The fixing frame 9 is an inverted L-shape. The threads on the inner wall of the threaded hole are engaged with the threads on the outer wall of the extrusion bolt 10. By rotating the extrusion bolt 10 clockwise, the extrusion block 11 is driven to move closer to the substrate 8 under the action of the threads of the threaded hole, and the monitoring end of the temperature sensor 5 is squeezed and fixed on the top of the upper and lower bridges of the IGBT body 1, thereby realizing continuous monitoring of the temperatures of the upper and lower bridges.

[0020] Specifically, the top of the control device 4 is fixedly connected to a mounting bracket 7 for installing the control device 4, the back of the mounting bracket 7 is fixedly connected to the back of the inner wall of the inverter housing 3, the heat dissipation component includes a micro fan 6, the bottom of the mounting bracket 7 is fixedly connected to the top of the micro fan 6, the input end of the input unit is electrically connected to a temperature sensor 5 for monitoring the upper and lower bridge temperatures of the IGBT body 1, the output end of the input unit is electrically connected to the input end of the judgment unit, the output end of the judgment unit is electrically connected to the input end of the control unit, the output end of the control unit is electrically connected to the input end of the output unit, the output end of the output unit is electrically connected to the input end of the micro fan 6, and the top of the DC power supply device housing 2 is provided with an insertion hole for inserting the temperature sensor 5, the input unit is used to receive and transmit monitoring data of the temperature sensor 5, the judgment unit is used to determine whether the monitored temperature exceeds a threshold value, the control unit is used to adjust the voltage, and the output unit is used to output voltage to the micro fan 6.

[0021] Furthermore, the temperature sensor 5 is an existing signal PL7203 wire-type thermocouple. Two temperature sensors 5 are provided, which are respectively used to monitor the temperature of the upper bridge and the lower bridge of the IGBT body 1. The other end of the temperature sensor 5 is electrically connected to the input unit inside the control device 4, so that the temperature of the upper and lower bridges is continuously transmitted to the input unit. The control device 4 is electrically connected to the external control power supply. The control power supply supplies power to the control device 4, and the control device 4 then supplies power to the micro fan 6. The control device 4 and the micro fan 6 are fixedly connected to the mounting frame 7 by bolts. A temperature threshold is set inside the judgment unit. When the transmitted temperature does not exceed the threshold, the signal is not transmitted to the control unit. At this time, the control unit outputs a stable voltage to the output unit to be transmitted to the micro fan 6 to maintain the current speed of the micro fan 6. When the temperature exceeds the threshold, the judgment unit The interruption unit transmits a signal to the control unit, and the control unit adjusts the output voltage to increase the rotation speed of the micro fan 6, thereby increasing the air volume, increasing the air volume entering the DC power supply device housing 2 through the heat dissipation holes, and accelerating the heat dissipation of the upper and lower bridges of the IGBT body 1. When the judgment unit continues to transmit signals, the control unit continuously increases the voltage until the maximum voltage of the micro fan 6 is reached. The increase interval timing of the control unit is measured in units of 2s. When there is still a signal from the judgment unit after 2s, the voltage is increased. The voltage increase method can be a linear equal value increase, which increases gradually. When the judgment unit does not transmit a signal, the control unit directly withdraws the previously increased voltage value control, so that the output voltage value returns to the initial value, thereby realizing continuous monitoring of the upper and lower bridge temperatures of the IGBT body 1, and adjusting the wind speed of the micro fan 6 according to the different temperatures.

[0022] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An upper and lower bridge monitoring device for an IGBT module, comprising an IGBT body (1), a DC power supply device housing (2) for covering the IGBT body (1) is arranged outside the IGBT body (1), an inverter housing (3) for mounting the DC power supply device housing (2) is arranged outside the DC power supply device housing (2), characterized in that: A heat dissipation mechanism for dissipating heat from the IGBT body (1) is arranged inside the inverter housing (3), the heat dissipation mechanism comprises a heat dissipation component and a control component, the control component comprises a control device (4), a control system for controlling the heat dissipation component is arranged inside the control device (4), the control system comprises an input unit, a judgment unit, a control unit and an output unit, the input end of the input unit is electrically connected to a temperature sensor (5) for monitoring the upper and lower bridge temperatures of the IGBT body (1), the output end of the input unit is electrically connected to the input end of the judgment unit, the output end of the judgment unit is electrically connected to the input end of the control unit, the output end of the control unit is electrically connected to the input end of the output unit, the output end of the output unit is electrically connected to the input end of the micro fan (6), the top end of the DC power supply device housing (2) is provided with an insertion hole for inserting the temperature sensor (5), the input unit is used to receive and transmit monitoring data of the temperature sensor (5), the judgment unit is used to judge whether the monitored temperature exceeds a threshold value, the control unit is used to adjust the voltage, and the output unit is used to output voltage to the micro fan (6).

2. The upper and lower bridge monitoring device of an IGBT module according to claim 1, characterized in that: A substrate (8) for mounting the IGBT body (1) is fixedly connected to the bottom of the IGBT body (1); the bottom end of the substrate (8) is fixedly connected to the bottom end of the inner wall of the DC power supply device housing (2); the bottom end of the DC power supply device housing (2) is fixedly connected to the bottom end of the inner wall of the inverter housing (3); and a heat dissipation hole is provided at the top of the DC power supply device housing (2).

3. The upper and lower bridge monitoring device of an IGBT module according to claim 1, characterized in that: The top end of the control device (4) is fixedly connected to a mounting frame (7) for mounting the control device (4); the back end of the mounting frame (7) is fixedly connected to the back end of the inner wall of the inverter housing (3); the heat dissipation component comprises a micro fan (6); the bottom end of the mounting frame (7) is fixedly connected to the top end of the micro fan (6).

4. The upper and lower bridge monitoring device of an IGBT module according to claim 1, characterized in that: Pressing components for fixing the temperature sensor (5) are respectively arranged on both sides of the IGBT body (1), the pressing components comprising a pressing block (11), and one end of the temperature sensor (5) is arranged on a side opposite to the pressing block (11) and the upper and lower bridges of the IGBT body (1).

5. The upper and lower bridge monitoring device of an IGBT module according to claim 4, characterized in that: The top end of the extrusion block (11) is fixedly connected with an extrusion bolt (10), and one side of the IGBT body (1) is provided with a fixing frame (9) for mounting the extrusion bolt (10), one end of the fixing frame (9) is provided with a threaded hole, and the extrusion bolt (10) is threadedly inserted into the threaded hole.

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