Semiconductor fluid packaging device
By designing storage and storage bins and conveying mechanisms in semiconductor fluid packaging devices, the problem of low automation of loading systems in the prior art is solved, efficient automatic transportation and loading of material boxes are achieved, and overall production efficiency is improved.
Patent Information
- Application Number
- CN202420848723.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-23
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2034-04-23
AI Technical Summary
The loading system of existing semiconductor fluid packaging devices relies on manual operation or semi-automated processes, and the degree of automation of material supply is low, making it difficult to match the demand of high-speed packaging assembly lines, resulting in low production efficiency.
A semiconductor fluid packaging device is designed, including a storage bin and a conveying mechanism, through the first conveying mechanism, multiple material boxes are transported to the output position in sequence, reducing the possibility of the material boxes being placed closely, and improving the degree of automation of the pickup parts. And automatic loading of the parts to be processed is realized through material picking and feeding, and the second conveying mechanism receives and processes the loading.
It improves the degree of material supply automation of semiconductor fluid packaging devices, improves loading efficiency and production efficiency, and ensures the material supply rate of high-speed packaging assembly lines.
Smart Images
Figure CN222365555U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a semiconductor fluid packaging device. Background Art
[0002] With the rapid development of microelectronics technology, the miniaturization and integration of semiconductor devices are increasing, and the requirements for semiconductor packaging technology are becoming more and more stringent. In the traditional semiconductor packaging process, there are many technical challenges in the loading link of semiconductor fluid packaging devices. Currently, the loading systems of semiconductor fluid packaging devices on the market often rely on manual operation or semi-automatic processes, with a low degree of automation in material supply, and the material supply rate is difficult to match the needs of high-speed packaging lines, resulting in low overall production efficiency. Utility Model Content
[0003] The main purpose of the utility model is to provide a semiconductor fluid packaging device, aiming to improve the automation level of material supply of the semiconductor fluid packaging device, so as to improve the production efficiency of the semiconductor fluid packaging device.
[0004] To achieve the above-mentioned purpose, the semiconductor fluid packaging device proposed by the utility model comprises:
[0005] A material box having a receiving cavity for storing the workpiece to be processed, and two openings communicating with the receiving cavity are provided on opposite sides of the material box in the length direction of the material box;
[0006] A first conveying mechanism, having a storage bin for storing a plurality of the material boxes, the first conveying mechanism comprising a first conveying member disposed above the storage bin, the first conveying member having an output position for transporting the material boxes in a first direction, the first conveying member being used to transport the plurality of material boxes from the storage bin to the output position in sequence;
[0007] A material picking mechanism, comprising a picking member for picking up the material box, and a first driving member drivingly connected to the picking member, wherein the first driving member drives the picking member to move to the output position so that the picking member can pick up the material box;
[0008] A feeding member having a feeding position, wherein the first driving member drives the picking member to move to the feeding position so that the opening is located at the feeding position, and the feeding member is used to push the workpiece to be processed out of the accommodating cavity; and
[0009] The second conveying mechanism is used to receive the workpiece to be processed ejected by the feeding piece.
[0010] Optionally, the first conveying mechanism further includes a limiting member, and in the second direction, the limiting members are provided on opposite sides of the first conveying member, the length direction of the material box is placed on the first conveying member along the second direction, and opposite sides of the material box are against the limiting members.
[0011] Optionally, the semiconductor fluid encapsulation device further comprises a machine platform, the second conveying mechanism is arranged on the machine platform, and in the second direction, one side of the machine platform has a mounting portion, and the first conveying mechanism and the material taking mechanism are both arranged on the mounting portion.
[0012] Optionally, the first driving member includes a first stepper motor drivingly connected to the picking member, and a second stepper motor drivingly connected to the first stepper motor, the second stepper motor drives the first stepper motor to move in a first direction, and the first stepper motor drives the picking member to move in an up and down direction.
[0013] Optionally, the second conveying mechanism includes a second conveying member arranged on the machine table, and a third linear motor driving the second conveying member, the second conveying mechanism has a receiving position, the second conveying member has a carrying position for placing the workpiece to be processed, the feeding member is used to eject the workpiece to be processed to the receiving position, and the third linear motor drives the second conveying member to move to the receiving position so that the second conveying member can receive the workpiece to be processed.
[0014] Optionally, the semiconductor fluid packaging device also includes a dispensing mechanism arranged on the machine, the dispensing mechanism includes a second driving member arranged on the machine, and a dispensing valve driven and connected by the second driving member, the second conveying member also has a dispensing position, and the second driving member drives the dispensing valve to move to the dispensing position to dispense glue to the workpiece to be processed located at the dispensing position.
[0015] Optionally, the second driving component includes a first motor provided on the machine, and a second motor driving the dispensing valve, the first motor drives the second motor to move in the second direction, the second motor drives the dispensing valve to move in the first direction, and the second driving component also includes a servo motor driving the dispensing valve, the servo motor drives the dispensing valve to move in the up and down directions.
[0016] Optionally, the dispensing valves are provided in plurality, the plurality of dispensing positions are arranged in the second direction, the second motors are provided in plurality, one second motor drives and connects to the dispensing valve, the first motor has a plurality of mounting seats, one second motor is correspondingly arranged on one mounting seat, and in the thickness direction of the second motor, one side of the second motor is arranged on one mounting seat.
[0017] Optionally, the second conveying mechanism also includes a cover plate arranged above the second conveying member, a lifting member arranged below the second conveying member, and a lifting cylinder driving and connecting the lifting member, the cover plate is provided with a through hole, the through hole is used to expose the conveying member, and the lifting cylinder drives the lifting member to move upward so that the workpiece to be processed is clamped between the lifting member and the cover plate.
[0018] Optionally, the semiconductor fluid encapsulation device further comprises a test glue piece, which is arranged on one side in the width direction of the second conveying member, and is used to detect the dispensing amount and dispensing pressure of the dispensing valve.
[0019] In the technical solution of the present invention, a storage bin is provided to place multiple material boxes, and a first conveyor is provided to transport the material boxes. The storage bin can continuously provide material boxes to the first conveyor, thereby improving the efficiency of the first conveyor in transporting the material boxes. If the picking member directly picks up the material box placed in the storage bin, since the multiple material boxes placed in the storage bin are easy to stick together, it is difficult for the picking member to pick up the material box, and the multiple material boxes need to be manually separated for the picking member to pick up, thereby reducing the loading efficiency of the semiconductor fluid machine. Therefore, the storage bin is arranged below the first conveyor, and the first conveyor transports the material boxes from the storage bin to the output position in turn, so that the multiple material boxes placed in the storage bin are separated in turn in the up and down directions, reducing the possibility of multiple material boxes being placed closely in the storage bin and not being easily picked up, and improving the degree of automation of the first conveyor in transporting the material boxes, thereby improving the loading efficiency of the semiconductor fluid packaging device. When conveying the workpiece to be processed to the semiconductor fluid packaging device, the first conveying member transports the material box from the storage bin to the output position, the first driving member drives the picking member to move to the output position to pick up the material box, and the first driving member continues to drive the picking member to move to the feeding position so that the feeding member can push the workpiece to be processed placed in the accommodating cavity out of the accommodating cavity, and the second conveying mechanism receives the workpiece to be processed determined by the feeding member for subsequent processing operations on the workpiece to be processed. At this point, the loading operation of the workpiece to be processed is completed. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0021] Figure 1 This is a schematic structural diagram of an embodiment of a semiconductor fluid packaging device of the utility model;
[0022] Figure 2 It is a structural schematic diagram of the first conveying mechanism of the utility model;
[0023] Figure 3 It is a structural schematic diagram of a front view of the second conveying mechanism of the utility model.
[0024] Description of Figure Numbers:
[0025] 100, first conveying mechanism; 110, storage bin; 120, first conveying member; 121, output position; 130, limit member; 200, material taking mechanism; 210, picking member; 221, first stepping motor; 222, second stepping motor; 300, feeding member; 310, feeding position; 400, material box; 410, accommodating chamber; 420, opening; 500, machine; 510, mounting portion; 600, second conveying mechanism ; 610, second conveying member; 611, receiving position; 612, bearing position; 613, dispensing position; 620, third linear motor; 630, cover plate; 631, through hole; 640, lifting member; 650, lifting cylinder; 700, dispensing mechanism; 710, dispensing valve; 721, first motor; 722, second motor; 723, servo motor; 724, mounting seat; 800, test glue part; 900, part to be processed.
[0026] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0028] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.
[0029] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or abutment, and it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0030] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0031] With the rapid development of microelectronics technology, the miniaturization and integration of semiconductor devices are increasing, and the requirements for semiconductor packaging processes are becoming more and more stringent. In the traditional semiconductor packaging process, there are many technical challenges in the loading link of the semiconductor fluid packaging device. The loading systems of semiconductor fluid packaging devices currently on the market often rely on manual operation or semi-automatic processes. The degree of automation of material supply is low, and the material supply rate is difficult to match the requirements of high-speed packaging lines, resulting in low overall production efficiency. To this end, the utility model proposes a semiconductor fluid packaging device, which aims to improve the degree of automation of material supply of the semiconductor fluid packaging device to improve the production efficiency of the semiconductor fluid packaging device.
[0032] Reference Figures 1 to 3In the technical solution of the utility model, the semiconductor fluid packaging device includes a material box 400, a first conveying mechanism 100, a material picking mechanism 200, a feeding member 300, and a second conveying mechanism 600. The material box 400 has a receiving cavity 410 for storing a workpiece 900 to be processed. In the length direction of the material box 400, two openings 420 connected to the receiving cavity 410 are opened on opposite sides of the material box 400. The first conveying mechanism 100 has a storage bin 110 for storing a plurality of material boxes 400. The first conveying mechanism 100 includes a first conveying member 120 arranged above the storage bin 110. The first conveying member 120 has an output position 121 for transporting the material box 400 in a first direction. A conveying member 120 is used to transport multiple material boxes 400 from the storage bin 110 to the output position 121 in sequence. The material picking mechanism 200 includes a picking member 210 for picking up the material box 400, and a first driving member driving the picking member 210. The first driving member drives the picking member 210 to move to the output position 121 so that the picking member 210 can pick up the material box 400. The feeding member 300 has a feeding position 310. The first driving member drives the picking member 210 to move to the feeding position 310 so that the opening 420 is at the feeding position 310. The feeding member 300 is used to push the workpiece 900 to be processed out of the accommodating cavity 410. The second conveying mechanism 600 is used to receive the workpiece 900 to be processed ejected by the feeding member 300.
[0033] In this way, the storage bin 110 is provided to place a plurality of material boxes 400, and the first conveyor 120 is provided to transport the material boxes 400. The storage bin 110 can continuously provide the first conveyor 120 with material boxes 400, thereby improving the efficiency of the first conveyor 120 in transporting the material boxes 400. If the picking member 210 directly picks up the material boxes 400 placed in the storage bin 110, since the plurality of material boxes 400 placed in the storage bin 110 are easily attached to each other, it is difficult for the picking member 210 to pick up the material boxes 400, and the plurality of material boxes 400 need to be manually separated for the picking member 210 to pick up the material boxes 400. Picking, thereby reducing the loading efficiency of the semiconductor fluid machine, therefore, the storage bin 110 is arranged below the first conveyor 120, and the first conveyor 120 transports the material box 400 from the storage bin 110 to the output position 121 in sequence, so that the multiple material boxes 400 placed in the storage bin 110 are separated in sequence in the up and down directions, reducing the possibility of multiple material boxes 400 being placed closely in the storage bin 110 and not being easily picked up, and improving the automation degree of the first conveyor 120 in transporting the material box 400, thereby improving the loading efficiency of the semiconductor fluid packaging device.
[0034] When conveying the workpiece 900 to the semiconductor fluid packaging device, the first conveying member 120 transports the material box 400 from the storage bin 110 to the output position 121, the first driving member drives the picking member 210 to move to the output position 121 to pick up the material box 400, and the first driving member continues to drive the picking member 210 to move to the feeding position 310, so that the feeding member 300 can push the workpiece 900 placed in the accommodating cavity 410 out of the accommodating cavity 410, and the second conveying mechanism 600 receives the workpiece 900 positioned by the feeding member 300 for subsequent processing operations on the workpiece 900. At this point, the loading operation of the workpiece 900 is completed.
[0035] Optionally, in one embodiment, the first conveying mechanism 100 further includes a stopper 130. In the second direction, the stoppers 130 are provided on both opposite sides of the first conveying member 120. The length direction of the material box 400 is placed on the first conveying member 120 along the second direction, and the opposite sides of the material box 400 abut against the stoppers 130. In this way, the stoppers 130 are provided on both opposite sides of the first conveying member 120 to limit the displacement of the material box 400 placed on the first conveying member 120 in the second direction, so that the length direction of the material box 400 is consistent with the second direction, so that the picking member 210 can accurately pick up the material box 400, and reduce the possibility that the material box 400 is offset during the transportation on the first conveying member 120, which causes the picking member 210 to fail to accurately pick up the material box 400.
[0036] Optionally, in another embodiment, the limiting member 130 may be arranged in various forms. In the second direction, the limiting member 130 may be configured as two baffles arranged on opposite sides of the first conveying member 120, and the two baffles extend along the first direction to limit the material box 400, as long as the displacement of the material box 400 in the second direction can be limited.
[0037] Optionally, in one embodiment, the semiconductor fluid encapsulation device further includes a platform 500, the second conveying mechanism 600 is disposed on the platform 500, and in the second direction, one side of the platform 500 has a mounting portion 510, and the first conveying mechanism 100 and the material taking mechanism 200 are both disposed on the mounting portion 510. In this way, the first conveying mechanism 100 and the material taking mechanism 200 are mounted on the mounting portion 510 of the platform 500 to reduce the space occupied by the first conveying mechanism 100 and the material taking mechanism 200 on the platform 500, thereby reducing the volume of the platform 500, making the structure of the semiconductor fluid encapsulation device more compact, and reducing the volume of the semiconductor fluid encapsulation device as a whole.
[0038] Optionally, in another embodiment, both the first conveying mechanism 100 and the material taking mechanism 200 may be installed on the machine platform 500 , as long as the installation of the first conveying mechanism 100 and the material taking mechanism 200 can be realized.
[0039] Optionally, in one embodiment, the first driving member includes a first stepper motor 221 that is arranged to drive and connect the picking member 210, and a second stepper motor 222 that is drive and connect the first stepper motor 221, the second stepper motor 222 drives the first stepper motor 221 to move in the first direction, and the first stepper motor 221 drives the picking member 210 to move in the up-down direction. In this way, the first stepper motor 221 drives the picking member 210 to move closer to or away from the output position 121 in the first direction, and the second stepper motor 222 drives the picking member 210 to move closer to or away from the output position 121 in the up-down direction. Under the drive of the first stepper motor 221 and the second stepper motor 222, the picking member 210 can adjust its position in the first direction and the up-down direction, so as to accurately move the picking material box 400 to the output position 121, and accurately transport the material box 400 to the feeding position 310, so that the feeding member 300 can push the workpiece 900 to be processed out of the accommodating cavity 410 of the material box 400.
[0040] Optionally, in one embodiment, the second conveying mechanism 600 includes a second conveying member 610 arranged on the machine table 500, and a third linear motor 620 driving the second conveying member 610, the second conveying mechanism 600 has a receiving position 611, the second conveying member 610 has a carrying position 612 for placing the workpiece 900 to be processed, the feeding member 300 is used to eject the workpiece 900 to be processed to the receiving position 611, and the third linear motor 620 drives the second conveying member 610 to move to the receiving position 611 so that the second conveying member 610 can receive the workpiece 900 to be processed. In this way, the feeding member 300 ejects the workpiece 900 to the receiving position 611, and the third linear motor 620 drives the second conveying member 610 to move to the receiving position 611 to receive the workpiece 900 ejected by the feeding member 300, thereby reducing the gap between the workpiece 900 ejected by the feeding member 300 and the second conveying member 610 in the height direction and the second direction, so that the workpiece 900 is not likely to fall outside the second conveying member 610 due to the large distance between the second conveying members 610 in the height direction and the second direction, thereby ensuring that the second conveying member 610 can accurately receive the workpiece 900, so that the semiconductor fluid packaging device can operate stably.
[0041] Optionally, in another embodiment, there may be a variety of settings for realizing the function of the second conveyor 610 to receive the workpiece 900 to be processed, and the structure of the third linear motor 620 may be omitted. The second conveyor 610 is set at the receiving position 611, and the bearing position 612 of the second conveyor 610 is set at the receiving position 611, so that the workpiece 900 to be processed ejected by the feeding member 300 can directly enter the second conveyor 610 to be transmitted, as long as the second conveyor 610 realizes the function of transporting the workpiece 900 to be processed.
[0042] Optionally, in one embodiment, the semiconductor fluid encapsulation device further includes a dispensing mechanism 700 disposed on the machine 500, the dispensing mechanism 700 includes a second driving member disposed on the machine 500, and a dispensing valve 710 driven and connected by the second driving member, the second conveying member 610 further has a dispensing position 613, and the second driving member drives the dispensing valve 710 to move to the dispensing position 613 to dispense glue to the workpiece 900 to be processed located at the dispensing position 613. In this way, the second driving member drives the dispensing valve 710 to move to the dispensing position 613 to dispense glue to the workpiece 900 to be processed transported to the dispensing position 613 by the second conveying member 610, thereby completing the dispensing process on the workpiece 900 to be processed.
[0043] Optionally, in one embodiment, the second driving member includes a first motor 721 provided on the machine 500, and a second motor 722 driving the dispensing valve 710, the first motor 721 drives the second motor 722 to move in the second direction, the second motor 722 drives the dispensing valve 710 to move in the first direction, and the second driving member also includes a servo motor 723 driving the dispensing valve 710, and the servo motor 723 drives the dispensing valve 710 to move in the up-down direction. In this way, the servo motor 723 is provided to drive and connect multiple dispensing valves 710, so that the multiple dispensing valves 710 move in the up-down direction, the first motor 721 is provided to drive the second motor 722 to move in the second direction, and the second motor 722 is provided to drive the dispensing valve 710 to move in the first direction, so that the dispensing valve 710 can adjust its position in the first direction, the second direction, and the up-down direction to move toward the dispensing position 613, so that the dispensing valve 710 can accurately dispense glue to the workpiece 900.
[0044] Optionally, in one embodiment, a plurality of dispensing valves 710 are provided, and a plurality of dispensing positions 613 are arranged in the second direction. A plurality of second motors 722 are provided, and a second motor 722 drives and connects to the dispensing valve 710. The first motor 721 has a plurality of mounting seats 724, and a second motor 722 is correspondingly arranged on a mounting seat 724. In the thickness direction of the second motor 722, one side of the second motor 722 is arranged on a mounting seat 724. In this way, multiple dispensing valves 710 are set, so that the semiconductor fluid packaging device can dispense glue to multiple workpieces 900 to be processed at the same time, thereby improving the dispensing efficiency of the semiconductor fluid packaging device. Multiple second motors 722 are installed on the mounting seat 724 one by one. In the width direction of the second motor 722, one side of the second motor 722 is installed on the mounting seat 724. Since the size of the second motor 722 in the width direction is smaller, the space occupied by the second motor 722 on the mounting seat 724 is reduced, which greatly saves the layout space of the second motor 722 in the second direction, thereby reducing the space occupied by multiple second motors 722 in the second direction, making the overall structure of the semiconductor fluid packaging device more compact, thereby reducing the overall volume of the semiconductor fluid packaging device.
[0045] Optionally, in another embodiment, the second motor 722 may be installed on the mounting seat 724 in a variety of ways. One side of the second motor 722 may be installed on the mounting seat 724 in the thickness direction of the second motor 722, as long as the installation of the second motor 722 can be achieved.
[0046] Optionally, in one embodiment, the second conveying mechanism 600 also includes a cover plate 630 disposed above the second conveying member 610, a lifting member 640 disposed below the second conveying member 610, and a lifting cylinder 650 driving the lifting member 640, wherein the lifting cylinder 650 drives the lifting member 640 to move upward so that the workpiece 900 to be processed is clamped between the lifting member 640 and the cover plate 630. In this way, the lifting cylinder 650 drives the lifting member 640 to move upward to lift the workpiece 900 to be processed and to oppose it to the cover plate 630, so that the workpiece 900 to be processed is clamped between the lifting member 640 and the cover plate 630, thereby limiting the displacement of the workpiece 900 to be processed on the conveying member, and improving the dispensing effect of the dispensing valve 710 on the workpiece 900 to be processed. The lifting member 640 lifts the workpiece 900 to be processed and separates it from the conveying member to expose the workpiece 900 above the conveying member, which is convenient for the dispensing valve 710 to accurately dispense glue on the workpiece 900 to be processed, thereby improving the dispensing effect of the workpiece 900 to be processed.
[0047] Optionally, in another embodiment, the structures of the lifting member 640 and the lifting cylinder 650 may be omitted to reduce the volume of the second conveying mechanism 600, reduce the space occupied by the second conveying mechanism 600, and reduce the development cost of the semiconductor fluid packaging device.
[0048] Optionally, in one embodiment, the semiconductor fluid packaging device further includes a test glue piece 800, which is disposed on one side of the second conveying member 610 in the width direction, and the test glue piece 800 is used to detect the glue dispensing amount and glue dispensing pressure of the glue dispensing valve 710. Before the glue dispensing valve 710 dispenses glue to the workpiece 900, it is necessary to detect the glue dispensing amount and glue dispensing pressure of the glue dispensing valve 710. Thus, the test glue piece 800 is provided to detect the glue dispensing amount and glue dispensing pressure of the glue dispensing valve 710. The semiconductor fluid packaging device further includes a controller connected to the test glue piece 800. When the glue dispensing amount and glue dispensing pressure of the glue dispensing valve 710 are outside the preset value range, the test glue piece 800 feeds back the detected signal to the controller, and the controller reminds the staff to adjust the glue dispensing amount or glue dispensing pressure of the glue dispensing valve 710 according to the feedback signal, so as to improve the reliability and stability of the glue dispensing valve 710 during dispensing.
[0049] Optionally, in another embodiment, the structure of the test piece 800 may be omitted to save the development cost of the semiconductor fluid packaging device.
[0050] The above description is only an optional embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A semiconductor fluid encapsulation device, characterized in that: include: A material box having a receiving cavity for storing the workpiece to be processed, and two openings communicating with the receiving cavity are provided on opposite sides of the material box in the length direction of the material box; A first conveying mechanism, having a storage bin for storing a plurality of the material boxes, the first conveying mechanism comprising a first conveying member disposed above the storage bin, the first conveying member having an output position for transporting the material boxes in a first direction, the first conveying member being used to transport the plurality of material boxes from the storage bin to the output position in sequence; A material picking mechanism, comprising a picking member for picking up the material box, and a first driving member drivingly connected to the picking member, wherein the first driving member drives the picking member to move to the output position so that the picking member can pick up the material box; A feeding member having a feeding position, wherein the first driving member drives the picking member to move to the feeding position so that the opening is located at the feeding position, and the feeding member is used to push the workpiece to be processed out of the accommodating cavity; and The second conveying mechanism is used to receive the workpiece to be processed ejected by the feeding piece.
2. The semiconductor fluid encapsulation device according to claim 1, characterized in that: The first conveying mechanism further includes a limiting member, and in the second direction, the limiting members are provided on opposite sides of the first conveying member, and the length direction of the material box is placed on the first conveying member along the second direction, and opposite sides of the material box are against the limiting members.
3. The semiconductor fluid encapsulation device according to claim 2, characterized in that: The semiconductor fluid packaging device further comprises a machine platform, the second conveying mechanism is arranged on the machine platform, and in the second direction, one side of the machine platform has a mounting portion, and the first conveying mechanism and the material taking mechanism are both arranged on the mounting portion.
4. The semiconductor fluid encapsulation device according to claim 2, characterized in that: The first driving member includes a first stepper motor drivingly connected to the picking member, and a second stepper motor drivingly connected to the first stepper motor, the second stepper motor drives the first stepper motor to move in a first direction, and the first stepper motor drives the picking member to move in an up and down direction.
5. The semiconductor fluid encapsulation device according to claim 3, characterized in that: The second conveying mechanism includes a second conveying member arranged on the machine platform, and a third linear motor driving and connecting the second conveying member, the second conveying mechanism has a receiving position, the second conveying member has a carrying position for placing the workpiece to be processed, the feeding member is used to eject the workpiece to be processed to the receiving position, and the third linear motor drives the second conveying member to move to the receiving position so that the second conveying member can receive the workpiece to be processed.
6. The semiconductor fluid encapsulation device according to claim 5, characterized in that: The semiconductor fluid packaging device also includes a dispensing mechanism arranged on the machine, and the dispensing mechanism includes a second driving member arranged on the machine, and a dispensing valve driven and connected by the second driving member. The second conveying member also has a dispensing position, and the second driving member drives the dispensing valve to move to the dispensing position to dispense glue to the workpiece to be processed located at the dispensing position.
7. The semiconductor fluid encapsulation device according to claim 6, characterized in that: The second driving component includes a first motor provided on the machine, and a second motor driving and connected to the dispensing valve, the first motor drives the second motor to move in the second direction, the second motor drives the dispensing valve to move in the first direction, the second driving component also includes a servo motor driving and connected to the dispensing valve, the servo motor drives the dispensing valve to move in the up and down directions.
8. The semiconductor fluid encapsulation device according to claim 7, characterized in that: The dispensing valves are provided in plurality, and the plurality of dispensing positions are arranged in the second direction. The second motors are provided in plurality, and one of the second motors drives and connects to the dispensing valves. The first motor has a plurality of mounting seats, and one of the second motors is correspondingly arranged on one of the mounting seats. In the thickness direction of the second motor, one side of the second motor is arranged on one of the mounting seats.
9. The semiconductor fluid encapsulation device according to claim 5, characterized in that: The second conveying mechanism also includes a cover plate arranged above the second conveying member, a lifting member arranged below the second conveying member, and a lifting cylinder driving and connecting the lifting member. The cover plate is provided with a through hole, and the through hole is used to expose the conveying member. The lifting cylinder drives the lifting member to move upward so that the workpiece to be processed is clamped between the lifting member and the cover plate.
10. The semiconductor fluid encapsulation device according to claim 7, characterized in that: The semiconductor fluid packaging device further comprises a test glue testing member, which is arranged at one side in the width direction of the second conveying member, and is used to detect the glue dispensing amount and glue dispensing pressure of the glue dispensing valve.