Circuit board structure capable of improving welding yield
By setting up multiple matrix-distributed steel mesh and heat dissipation holes on the circuit board, combined with the welding resist window design, the problem of the same size as the steel mesh and the heat dissipation pad and the through holes being directly punched on the steel mesh is solved, and the welding yield rate is improved and heat dissipation effect.
Patent Information
- Application Number
- CN202420564392.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-21
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2034-03-21
AI Technical Summary
The steel mesh in the existing circuit board is the same size as the heat dissipation pad, and the through hole is directly hit on the steel mesh, causing solder paste to flow into the hole, causing poor welding and affecting the heat dissipation effect.
Set up multiple matrix-distributed steel mesh on the circuit board, heat dissipation holes are evenly distributed around each steel mesh, and solder resist windows are installed on the outside of the steel mesh to prevent solder paste from flowing into the holes and ensure uniform distribution of solder.
It improves the welding yield rate, prevents the risk of short circuit, enhances the heat dissipation effect of the device, and ensures the heat dissipation performance of the chip.
Smart Images
Figure CN222366421U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board design, in particular to a circuit board structure capable of improving welding yield. Background Art
[0002] Printed Circuit Board (PCB), also known as printed circuit board, is an important part of the physical support and signal transmission of electronic products. With the continuous development of electronic technology, the density of devices is getting higher and higher, and the heat dissipation requirements of chips are getting higher and higher. The heat dissipation of devices is related to whether the chips can be used normally.
[0003] In the current electronic manufacturing field, large chips are often equipped with special device heat dissipation pads to ensure that the chips can effectively dissipate the heat generated when working under high load. On these heat dissipation pads, a steel mesh is usually set, which mainly prevents the flow of solder paste during soldering and ensures that the solder on the pad is evenly distributed.
[0004] In traditional practice, the size of the steel mesh is often consistent with the heat dissipation pad. Due to the large size of the steel mesh, a lot of solder paste will be brushed on it during welding. Too much solder paste will lift up the heat dissipation pad of the device, resulting in poor welding such as cold soldering and leaking soldering on other pads of the device. In addition, in order to further improve the heat dissipation efficiency, it is common practice to drill through holes on the heat dissipation pad. These holes are connected to the GND network plane to form an effective heat dissipation channel. However, since the through holes are directly punched on the steel mesh, it is easy for the solder paste to flow into these holes during the soldering process. Once the solder paste flows into the hole, the amount of solder that should be distributed on the pad will be reduced, resulting in poor welding of the heat dissipation pad, which in turn affects the heat dissipation effect of the entire chip.
[0005] The above defects need to be solved urgently. Utility Model Content
[0006] In order to solve the problem that the size of the existing steel mesh is consistent with the heat dissipation pad, and the through holes are directly punched in the steel mesh, which easily causes solder paste to flow into the through holes, thereby causing poor welding of the heat dissipation pad, the utility model provides a circuit board structure with improved welding yield.
[0007] The technical solution of the utility model is as follows:
[0008] A circuit board structure for improving welding yield rate comprises a device heat sink arranged on the circuit board, wherein a plurality of steel meshes distributed in a matrix are arranged on the device heat sink, and a plurality of evenly distributed heat dissipation holes are arranged around each of the steel meshes.
[0009] According to the above-mentioned solution of the utility model, a plurality of the heat dissipation holes are respectively arranged at the four corners of the corresponding steel mesh.
[0010] According to the above-mentioned solution of the utility model, each of the heat dissipation holes is arranged in the middle position of the corresponding two steel meshes.
[0011] According to the above-mentioned solution of the utility model, the plurality of heat dissipation holes are distributed in a matrix.
[0012] According to the utility model of the above scheme, a solder resist window is provided on the outer side of the steel mesh.
[0013] According to the above-mentioned solution of the utility model, the distance between the edge of the solder resist window and the edge of the steel mesh is 0.04mm~0.06mm.
[0014] According to the above-mentioned solution of the utility model, the distance between the edge of the heat dissipation hole and the edge of the steel mesh is 0.05mm~0.1mm.
[0015] According to the utility model of the above solution, the shape of the steel mesh is square.
[0016] According to the utility model of the above solution, the surface of the inner layer and the surface of the bottom layer of the circuit board are both paved with heat dissipation copper sheets corresponding to the positions of the heat dissipation holes.
[0017] According to the utility model of the above solution, the size of the heat dissipation copper sheet is equal to the size of the device heat dissipation plate.
[0018] The utility model according to the above scheme has the following beneficial effects:
[0019] In the above-mentioned circuit board structure for improving the welding yield rate, the steel mesh on the heat sink is changed from a whole piece to multiple steel meshes, and a number of evenly distributed heat dissipation holes are arranged around each steel mesh, which effectively avoids the situation where the heat dissipation holes are directly punched on the steel mesh and avoids the heat dissipation holes directly contacting the steel mesh. Therefore, when soldering, the solder can be prevented from flowing into the heat dissipation holes, thereby preventing the solder from flowing through the heat dissipation holes to the other side of the circuit board, avoiding the risk of short circuit on the other side of the circuit board, ensuring the accuracy of the welding process, making the soldering of the device heat sink more uniform, thereby improving the welding yield rate, and being able to improve the heat dissipation effect of the device heat sink to prevent affecting the heat dissipation effect of the entire chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0021] Figure 1 It is a structural schematic diagram of embodiment 1;
[0022] Figure 2 for Figure 1 A magnified view of part A;
[0023] Figure 3 It is a structural diagram of embodiment 2.
[0024] In the figure, 1, circuit board; 11, device heat sink; 12, steel mesh; 13, heat dissipation hole; 14, solder mask window. DETAILED DESCRIPTION
[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. Embodiment 1
[0026] like Figure 1 As shown, this embodiment provides a circuit board structure for improving welding yield, including a device heat sink 11 arranged on a circuit board 1, on which a plurality of steel meshes 12 distributed in a matrix are arranged, and each steel mesh 12 is provided with a plurality of evenly distributed heat dissipation holes 13 around it.
[0027] In this embodiment, a plurality of heat dissipation holes 13 are distributed in a matrix, and a plurality of heat dissipation holes 13 are respectively arranged at the four corners of the corresponding steel mesh 12. The steel mesh 12 can be designed to be three rows and three columns, and a heat dissipation hole 13 is designed at each of the four corners of the steel mesh 12. By changing the steel mesh 12 on the heat dissipation plate from a whole piece to multiple steel meshes 12, it can effectively avoid the situation where the heat dissipation hole 13 is directly punched on the steel mesh 12, and avoids the heat dissipation hole 13 directly contacting the steel mesh 12. When soldering, it can prevent the solder from flowing into the heat dissipation hole 13, thereby preventing the solder from flowing through the heat dissipation hole 13 to the other side of the circuit board 1, avoiding the risk of short circuit on the other side of the circuit board 1, ensuring the accuracy of the welding process, making the soldering of the device heat dissipation plate 11 more uniform, thereby improving the welding yield rate, and can improve the heat dissipation effect of the device heat dissipation plate 11, and prevent affecting the heat dissipation effect of the entire chip. Of course, in other embodiments, each heat dissipation hole 13 may be designed to be disposed in the middle position of the corresponding two steel meshes 12. In actual design, the distribution positions of the heat dissipation holes 13 and the steel meshes 12 may be designed according to actual needs.
[0028] In this embodiment, the diameter of the heat dissipation hole 13 is 0.2 mm to 0.4 mm, and the diameter of the heat dissipation hole 13 can be designed to be any value in the range of 0.2 mm, 0.22 mm, 0.24 mm, 0.25 mm, 0.27 mm, 0.3 mm, 0.32 mm, 0.35 mm, 0.37 mm, 0.4 mm, etc. In actual design, the diameter of the heat dissipation hole 13 can be designed according to design requirements. Preferably, the diameter of the heat dissipation hole 13 is 0.3 mm.
[0029] In this embodiment, the center distance between two adjacent heat dissipation holes 13 is 1 mm to 2 mm, and the center distance between two adjacent heat dissipation holes 13 can be designed to be any value in the range of 1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm, 2 mm, etc. In actual design, the center distance between two adjacent heat dissipation holes 13 can be designed according to actual needs. Preferably, the center distance between two adjacent heat dissipation holes 13 in the same row is 1.4 mm.
[0030] In this embodiment, the shape of the steel mesh 12 is a square. Of course, in actual design, the shape of the steel mesh 12 can be designed according to actual needs. In addition, the width and length of the steel mesh 12 are both 0.5 mm to 1.5 mm. The width and length of the steel mesh 12 can be designed to be any value in the range of 0.5 mm, 0.7 mm, 0.8 mm, 1 mm, 1.2 mm, 1.3 mm, 1.5 mm, etc. In actual design, the width and length of the steel mesh 12 can be designed according to actual needs. Preferably, the width and length of the steel mesh 12 are both 1 mm.
[0031] like Figure 2As shown, in the present embodiment, the distance a between the edge of the heat dissipation hole 13 and the edge of the steel mesh 12 is 0.05mm~0.1mm, and the distance a between the edge of the heat dissipation hole 13 and the edge of the steel mesh 12 can be designed to be any value in the range of 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 1mm, etc. In actual design, the size of the distance a between the edge of the heat dissipation hole 13 and the edge of the steel mesh 12 can be designed according to actual needs.
[0032] In this embodiment, the surface of the inner layer and the surface of the bottom layer of the circuit board 1 are both paved with heat dissipation copper sheets corresponding to the positions of the heat dissipation holes 13, and the size of the heat dissipation copper sheets is equal to the size of the device heat dissipation plate 11. The copper sheet treatment can directly increase the heat conduction area in contact with the heat dissipation holes 13, thereby increasing the heat dissipation area of the inner layer of the circuit board 1 and the bottom layer of the circuit board 1, which is equivalent to forming a larger heat conduction surface around the heat dissipation holes 13, so that more heat can be quickly dispersed through the copper sheet, thereby improving the heat dissipation effect.
[0033] In this embodiment, a solder resist window 14 is provided on the outer side of the device heat sink 11. The solder resist window 14 refers to an opening in the solder resist layer to facilitate welding at the opening position. The design of the solder resist window 14 helps to ensure that the copper foil at the welding position is exposed to facilitate the welding operation. Embodiment 2
[0034] like Figure 3 As shown, different from the first embodiment, the outer side of the steel mesh 12 of this embodiment is provided with a solder resist window 14, and the solder resist window 14 is changed from a whole solder resist window 14 opened on the outer side of the device heat sink 11 to a solder resist window 14 of a size similar to the steel mesh 12, thereby reducing the area of the solder resist window 14, increasing the green oil coverage, allowing the green oil to cover more area of the substrate, reducing the area of the substrate exposed on the circuit board 1, and thus increasing the aesthetics of the circuit board 1. In addition, the distance between the edge of the solder resist window 14 and the edge of the steel mesh 12 is 0.04mm~0.06mm, and the distance between the edge of the solder resist window 14 and the edge of the steel mesh 12 can be designed to be 0.05mm, that is, the length of the solder resist window 14 is 0.05mm larger than the length of the steel mesh 12, and the width of the solder resist window 14 is 0.05mm larger than the width of the steel mesh 12. Of course, in actual design, the distance between the edge of the solder resist window 14 and the edge of the steel mesh 12 can be designed according to actual needs.
[0035] In this embodiment, the shape of the steel mesh 12 is a square. Of course, the shape of the steel mesh 12 can also be designed as a rectangle or a circle. In actual design, the shape of the steel mesh 12 can be designed according to actual needs. In addition, the width and length of the steel mesh 12 are both 0.25mm~0.5mm. The width and length of the steel mesh 12 can be designed to be any value in the range of 0.25mm, 0.28mm, 0.3mm, 0.32mm, 0.35mm, 0.4mm, 0.43mm, 0.44mm, 0.45mm, 0.47mm, 0.48mm, 0.5mm, etc. In actual design, the width and length of the steel mesh 12 can be designed according to actual needs. Preferably, the width and length of the steel mesh 12 are both 0.43mm.
[0036] In this embodiment, the diameter of the heat dissipation hole 13 is 0.1 mm to 0.25 mm, and the diameter of the heat dissipation hole 13 can be designed to be any value in the range of 0.1 mm, 0.12 mm, 0.14 mm, 0.15 mm, 0.17 mm, 0.2 mm, 0.22 mm, 0.23 mm, 0.25 mm, etc. In actual design, the diameter of the heat dissipation hole 13 can be designed according to design requirements. Preferably, the diameter of the heat dissipation hole 13 is 0.15 mm.
[0037] In this embodiment, the minimum distance between the edges of two adjacent steel meshes 12 is 0.2 mm, so that it is convenient to set the heat dissipation holes 13. Of course, in actual design, the edge distance between two adjacent steel meshes 12 can be designed according to actual needs. In addition, the steel meshes 12 can be designed as seven rows and seven columns, and each steel mesh 12 is provided with a heat dissipation hole 13 at the four corners. Of course, in actual design, due to the different use of the chip in the circuit board 1, the requirements for heat dissipation will also be different (the greater the current, the more heat generated). The number of heat dissipation holes 13 can be designed according to actual conditions to meet the heat dissipation requirements.
[0038] It should be noted that the indicated orientation or position relationship is based on the orientation or position relationship shown in the drawings, or is the orientation or position relationship in which the application product is usually placed when used, or is the orientation or position relationship commonly understood by technical personnel in this field, or is the orientation or position relationship in which the application product is usually placed when used. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.
[0039] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.
[0040] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.
Claims
1. A circuit board structure for improving welding yield, characterized in that: The invention comprises a device heat dissipation plate arranged on a circuit board, wherein a plurality of steel meshes distributed in a matrix are arranged on the device heat dissipation plate, and a plurality of evenly distributed heat dissipation holes are arranged around each of the steel meshes.
2. The circuit board structure for improving soldering yield according to claim 1, characterized in that: A plurality of heat dissipation holes are respectively arranged at the four corners of the corresponding steel mesh.
3. The circuit board structure for improving soldering yield according to claim 1, characterized in that: Each of the heat dissipation holes is arranged in the middle position of the corresponding two steel meshes.
4. The circuit board structure for improving soldering yield according to claim 1, characterized in that: The heat dissipation holes are distributed in a matrix.
5. The circuit board structure for improving soldering yield according to claim 1, characterized in that: The outer side of the steel mesh is provided with a solder resist window.
6. The circuit board structure for improving soldering yield according to claim 5, characterized in that: The distance between the edge of the solder resist window and the edge of the steel mesh is 0.04mm~0.06mm.
7. The circuit board structure for improving soldering yield according to claim 1, characterized in that: The distance between the edge of the heat dissipation hole and the edge of the steel mesh is 0.05mm~0.1mm.
8. The circuit board structure for improving soldering yield according to claim 1, characterized in that: The shape of the steel mesh is square.
9. The circuit board structure for improving soldering yield according to claim 1, characterized in that: The surface of the inner layer and the surface of the bottom layer of the circuit board are both paved with heat dissipation copper sheets corresponding to the positions of the heat dissipation holes.
10. The circuit board structure for improving soldering yield according to claim 9, characterized in that: The size of the heat dissipation copper sheet is equal to the size of the device heat dissipation plate.