Electronic component testing device capable of providing high-uniformity temperature environment

Abstract

The utility model discloses an electronic component testing device capable of providing a highly uniform temperature environment, which comprises a temperature box, a fixing frame surrounding the outside of a testing frame is arranged in the temperature box, the air inlet side wall and the air return side wall of the fixing frame are provided with directional air guide ports, and the air guide ports are arranged close to the side edge of an electronic component burn-in board or a testing clamp. The burn-in board or the test fixture is arranged in the test frame; the positions of the air guide ports correspond to the space between the adjacent burn-in plates, the space between the adjacent test clamps, the space between the burn-in plates and the parallel inner walls of the temperature box, or the space between the test clamps and the parallel inner walls of the temperature box. According to the utility model, under the condition that the temperature box is provided with the burn-in board or the test clamp, the directionality of airflow near the burn-in board or the test clamp in the temperature box is further improved, and a certain continuous guiding air channel is formed at the air outlet, the interval area of the burn-in board or the test clamp and the return air inlet, so that the uniformity of temperature is further improved.

Description

Technical Field

[0001] The utility model relates to an electronic component testing device which can provide a high uniform temperature environment. Background Art

[0002] For electronic components with high precision, in order to evaluate their temperature stability, it is usually necessary to test or test the electronic components under different temperature environments such as normal temperature, low temperature and high temperature. In addition, in order to assess the reliability of electronic components, it is necessary to heat and power them in a high temperature environment for aging, and it is necessary to monitor key parameters during the aging process. In order to improve the efficiency of aging tests, it is usually hoped that a large number of electronic components can be aged at one time. Common temperature environments are realized by temperature boxes. For some electronic components, after loading the aging board or test fixture, in order to prevent the electronic components from being displaced, it is hoped that the aging board or test fixture is inserted into the temperature box in a horizontal manner, and multiple aging boards or test fixtures are arranged up and down at a certain interval. The usual temperature box forms a circular airflow circulation in the temperature box with a single air outlet and a single return air outlet to achieve better temperature uniformity, but when more aging boards or test boards are arranged in the temperature box, the airflow circulation will be greatly disturbed, causing the temperature uniformity to be greatly damaged. However, due to the certain spacing between the aging board or test fixture and the side wall of the temperature box, the direction of the airflow will be adversely affected, and the higher temperature uniformity required for high-precision testing cannot be met. There is a need to improve the matching structure between the linear airflow temperature box and the aging board or the test fixture to achieve better temperature uniformity. Utility Model Content

[0003] The purpose of the utility model is to overcome the defects existing in the prior art and provide an electronic component testing device that can provide a high uniform temperature environment. When the temperature box is equipped with an aging board or a test fixture, the directionality of the airflow near the aging board or the test fixture in the temperature box is further improved, and an air duct with a certain continuous guiding effect is formed at the air outlet, the spacing area of ​​the aging board or the test fixture, and the return air outlet, thereby further improving the temperature uniformity.

[0004] To achieve the above-mentioned purpose, the technical solution of the utility model is to design an electronic component testing device that can provide a high uniform temperature environment, including a temperature box, a fixed frame is arranged in the temperature box around the outside of the test frame, and directional air guides are arranged on the air inlet side wall and the air return side wall of the fixed frame. The air guides are arranged close to the side of the electronic component aging board or the test fixture, and the aging board or the test fixture is arranged in the test frame; the air guide position corresponds to the space between adjacent aging boards, or the space between adjacent test fixtures, or the space between the aging board and the parallel inner wall of the temperature box, or the space between the test fixture and the parallel inner wall of the temperature box. A heater and a heat exchanger are arranged in the temperature box. The parallel inner wall of the temperature box refers to the inner wall of the temperature box parallel to the aging board (or test fixture); if the aging board (or test fixture) is arranged horizontally, the parallel inner wall of the temperature box at this time refers to the inner top wall or inner bottom wall of the temperature box; if the aging board (or test fixture) is arranged vertically, the parallel inner wall of the temperature box at this time refers to the inner side wall of the temperature box. If the aging board (or test fixture) is arranged horizontally, the side of the aging board or test fixture at this time refers to the upper surface of the aging board (or test fixture). If the aging board (or test fixture) is arranged vertically, the side of the aging board or test fixture at this time refers to the side of the aging board (or test fixture). A heater and a heat exchanger are arranged in the temperature box. An insulation layer is arranged between the inner wall and the outer wall of the temperature box. Several spaced partitions are fixedly arranged in the test frame for placing multiple aging boards (or test fixtures). The partitions are arranged in parallel or vertically. 1. The air guide port corresponds to the interval space between the aging boards or test fixtures, and between the aging board or test board and the parallel side of the temperature box. The interval is used to achieve a certain continuous air duct, so that the temperature gas flow between each aging board or test fixture is more uniform, thereby improving the temperature uniformity.

[0005] A further technical solution is that the air guide on the air inlet side wall is the air inlet, and the air guide on the return air side wall is the return air outlet. The air guide section is arranged at the interval between the aging boards or the test fixtures, and at the interval between the aging board or the test board and the parallel side of the temperature box. The airflow blown out from the air outlet passes through the air guide section close to the air outlet side and enters the interval space between the test boards or the test boards, and the interval space between the aging board or the test board and the parallel side of the temperature box, and finally flows back to the return air outlet through the air guide section on the side of the return air outlet, and the formed air duct has a certain continuity.

[0006] A further technical solution is that a plurality of air guide sections close to the air outlet and the return air outlet are arranged on the opposite side surfaces of the fixing frame, and each air guide section corresponds to an air outlet or a return air outlet; the air guide sections are located in the space between adjacent aging boards, or the space between adjacent test fixtures, or the space between the aging board and the parallel inner wall of the temperature box, or the space between the test fixture and the parallel inner wall of the temperature box.

[0007] A further technical solution is that the fixing frame is fixedly connected to the test frame so that the air outlet and the return air outlet form a continuous air duct with each interval area formed by each aging board or test fixture.

[0008] A further technical solution is that the aging board or test fixture is arranged horizontally or vertically; the side walls of the temperature box at the air outlet and the return air outlet are perpendicular to the aging board or the test fixture; the side walls of the fixing frame are parallel to the side walls of the temperature box. The side of the aging board or test fixture fixing frame perpendicular to the aging board or the test board can be completely close to the air outlet or the return air outlet, so that the air outlet and the return air outlet and each interval area formed by each aging board or test fixture form a certain continuous air duct; the aging board or test fixture can be arranged horizontally or vertically, and the corresponding side walls of the temperature box where the air outlet and the return air outlet are located are perpendicular to the aging board or the test fixture.

[0009] A further technical solution is that a plurality of aging boards or test fixtures are provided and arranged side by side; the fixing frame is also provided with an air guide section in the direction of the side-by-side arrangement of the aging boards or test fixtures. The aging board or test fixture also uses a plurality of aging boards or test fixtures to be arranged side by side, and the aging board or test fixture is also provided with a guide section in the side-by-side direction, so that the formed air duct has a certain continuity.

[0010] Another technical solution is that there is one return air vent and it is located on the return air side wall. If there is only one return air vent, one solution is that the return air vent is located on the return air side wall, the return air side wall is set close to the side wall of the test frame, and the return air vent is equivalent to the return air side wall that penetrates the side wall of the test frame and the fixed frame; another solution is: there is a gap between the return air side wall of the fixed frame and the side wall of the test frame, the return air vent is set at the lower end of the return air side wall of the fixed frame and penetrates the return air side wall of the fixed frame, and a number of air outlets that penetrate the side wall of the test frame are set from top to bottom on the side wall of the test frame to blow the hot air blown in from the air inlet through the test fixture (or aging board) and then blow it out from the test frame, and finally reach the heat exchanger through the return air vent set at the lower end of the return air side wall of the fixed frame.

[0011] A further technical solution is that the size of the fixing frame is larger than the size of the test frame; the air guide section is fixedly connected to the test frame to extend the air inlet channel at the air inlet of the fixing frame to form a closed air duct. In this way, when the size of the test frame is different, the fixing frame can be adapted (that is, as long as the test frame is smaller than the fixing frame, it can be adapted), which improves the adaptability of the utility model.

[0012] The advantages and beneficial effects of the utility model are that the air guide port corresponds to the interval space between the aging boards or test fixtures, and between the aging boards or test boards and the parallel sides of the temperature box, and a certain continuous air duct is realized by utilizing the interval, so that the temperature gas flow between the aging boards or test fixtures is more uniform, thereby improving the temperature uniformity.

[0013] The air guide section is arranged at the interval between the aging boards or the test fixtures, and at the interval between the aging boards or the test boards and the parallel sides of the temperature box. The airflow blown out from the air outlet enters the interval between the test boards or the test boards, and the interval between the aging boards or the test boards and the parallel sides of the temperature box through the air guide section close to the air outlet side, and finally flows back to the return air outlet through the air guide section on the side of the return air outlet. The formed air duct has a certain degree of continuity.

[0014] The aging board or test fixture also uses multiple aging boards or test fixtures to be arranged side by side, and the aging boards or test fixtures will also be provided with guide sections in the side by side direction, so that the formed air duct has a certain continuity.

[0015] When the test frames have different sizes, the fixing frame can be adapted (that is, as long as the test frame is smaller than the fixing frame, it can be adapted), which improves the adaptability of the utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The utility model is a schematic diagram of an electronic component testing device capable of providing a high uniform temperature environment.

[0017] In the figure: 1. Temperature box; 2. Fixing frame; 3. Air inlet side wall; 4. Return air side wall; 5. Air guide port; 6. Aging board or test fixture; 7. Side; 8. Air guide section; 9. Heater; 10. Heat exchanger; 11. Insulation layer; 12. Test frame; 13. Partition; 14. Air outlet; 15. Return air outlet. DETAILED DESCRIPTION

[0018] The following is a further description of the specific implementation of the present invention in conjunction with the accompanying drawings and embodiments. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and cannot be used to limit the protection scope of the present invention.

[0019] like Figure 1 As shown, the utility model is an electronic component testing device that can provide a high-uniform temperature environment, including a temperature box 1. A fixing frame 2 is arranged in the temperature box 1. Directional air guides 5 are formed on the air inlet side wall 3 and the air return side wall 4 of the fixing frame 2, and are as close to the side 7 of the electronic component aging board or the test fixture 6 as possible. The air guides 5 correspond to the interval space between the aging boards or the test fixtures 6, and between the aging boards or the test fixtures 6 and the parallel sides of the temperature box. The intervals are used to realize a certain continuous air duct, so that the temperature gas flow between the aging boards or the test fixtures is more uniform, thereby improving the temperature uniformity.

[0020] The fixing frame 2 where the electronic component aging board or test board is located in the temperature box 1 can be provided with an air guide section 8 with multiple air outlets and return air outlets opened near the air inlet side wall 3 and the return air side wall 4 on the side of the fixing frame. The air guide section 8 is provided at the interval between the aging boards or test fixtures, and at the interval between the aging board or test board and the parallel side of the temperature box. The airflow blown out from the air outlet passes through the air guide section 8 close to the air outlet side and enters the interval space between the test boards or test boards, and the interval space between the aging board or test board and the parallel side of the temperature box, and finally flows back to the return air outlet through the air guide section on the return air outlet side, and the formed air duct has a certain continuity.

[0021] The aging board or test fixture fixing frame 2, whose side perpendicular to the aging board or test board can be completely close to the air outlet (the air guide port 5 is located at the air inlet side wall 3, which is the air outlet) or the return air outlet (the air guide port 5 is located at the return air side wall, which is the air outlet), so that the air outlet and the return air outlet form a certain continuous air duct with each interval area formed by each aging board or test fixture.

[0022] The aging board or the test fixture 6 can be arranged horizontally or vertically, and the side walls of the temperature box where the corresponding air outlets and return air outlets are located are perpendicular to the aging board or the test fixture.

[0023] The aging board or test fixture also uses multiple aging boards or test fixtures to be arranged side by side, and the aging boards or test fixtures will also be provided with guide sections in the side by side direction, so that the formed air duct has a certain continuity.

[0024] The air guide openings 5 ​​on the return air side wall can be concentrated into one opening on the return air side wall.

[0025] A heater 9 and a heat exchanger 10 connected to the heater 9 are arranged in the temperature box. A heat-insulating layer 11 is arranged between the inner wall and the outer wall of the temperature box 1. A fixing frame 2 is arranged in the temperature box 1 and surrounds the test frame 12. A plurality of partitions 13 arranged at intervals are fixedly arranged in the test frame 12 for placing a plurality of aging boards (or test fixtures). The partitions 13 are arranged in parallel.

[0026] There is a gap between the return air side wall 4 of the fixing frame 2 and the side wall of the test frame 12, the return air port is set at the lower end of the return air side wall of the fixing frame and penetrates the return air side wall of the fixing frame, and a plurality of air outlets 14 are set from top to bottom on the side wall of the test frame to blow the hot air blown in from the air inlet through the test fixture (or aging board) and then blow it out from the test frame, and finally reach the heat exchanger 10 through the return air port 15 set at the lower end of the return air side wall of the fixing frame. When used for aging (i.e., the aging board is in the test frame 12), the heat exchanger is used for heating; when high and low temperature tests are performed (i.e., the test fixture is in the test frame 12), the heat exchanger is used for heating or cooling (because the test fixture is set in the test frame for high and low temperature tests). The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. An electronic component testing device capable of providing a high uniform temperature environment, characterized in that: It includes a temperature box, in which a fixing frame is arranged around the outside of a test frame, and directional air guides are arranged on the air inlet side wall and the air return side wall of the fixing frame. The air guides are arranged close to the sides of an electronic component aging board or a test fixture, and the aging board or the test fixture is arranged in the test frame; the air guides are positioned to correspond to the space between adjacent aging boards, or to the space between adjacent test fixtures, or to the space between the aging board and the parallel inner walls of the temperature box, or to the space between the test fixture and the parallel inner walls of the temperature box.

2. The electronic component testing device capable of providing a high uniform temperature environment according to claim 1, characterized in that: The air guide port on the air inlet side wall is the air inlet, and the air guide port on the return air side wall is the return air port.

3. The electronic component testing device capable of providing a high uniform temperature environment according to claim 2, characterized in that: A number of air guide sections close to the air outlet and the return air outlet are arranged on the opposite side surfaces of the fixing frame, and each air guide section corresponds to an air outlet or a return air outlet; the air guide sections are located in the space between adjacent aging boards, or the space between adjacent test fixtures, or the space between the aging board and the parallel inner wall of the temperature box, or the space between the test fixture and the parallel inner wall of the temperature box.

4. The electronic component testing device capable of providing a high uniform temperature environment according to claim 3, characterized in that: The fixing frame is fixedly connected to the test frame so that the air outlet and the air return outlet and each interval area formed by each aging board or the test fixture form a continuous air duct.

5. The electronic component testing device capable of providing a high uniform temperature environment according to claim 4, characterized in that: The aging board or the test fixture is arranged horizontally or vertically; the side walls of the temperature box at the air outlet and the return air outlet are perpendicular to the aging board or the test fixture; the side walls of the fixing frame are parallel to the side walls of the temperature box.

6. The electronic component testing device capable of providing a high uniform temperature environment according to claim 5, characterized in that: The aging boards or test fixtures are provided in plurality and arranged side by side; the fixing frame is also provided with an air guide section in the direction in which the aging boards or test fixtures are arranged side by side.

7. The electronic component testing device capable of providing a high uniform temperature environment according to claim 2, characterized in that: The return air port is provided with one and is located on the return air side wall.

8. The electronic component testing device capable of providing a high uniform temperature environment according to claim 4, characterized in that: The size of the fixing frame is larger than that of the test frame; the air guide section is fixedly connected to the test frame to extend the air inlet channel at the air inlet of the fixing frame to form a closed air duct.

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