Burn-in board detection equipment and burn-in test system

Abstract

The utility model relates to burn-in board detection equipment and an aging test system. The burn-in board detection device comprises a burn-in board and a driving board. The burn-in board comprises a printed circuit board and a plurality of test seats respectively arranged on the printed circuit board. The test seat is used for inserting a to-be-tested device to form a detection loop. The driving board is connected with the printed circuit board and comprises a voltage driving module and a current sampling module. Wherein the voltage driving module is used for providing reverse driving voltage for the detection loop through the printed circuit board. And the current sampling module is used for acquiring detection current output by the to-be-tested device under the reverse driving voltage so as to determine the on-off state of the test seat according to the detection current. The method is used for improving the detection efficiency.

Description

Technical Field

[0001] The utility model relates to the field of aging detection, in particular to an aging board detection device and an aging test system. Background Art

[0002] For the power-on assessment item of the reliability aging test, it is necessary to first place the device to be tested into the test socket of the aging board, and then place the aging board into the detection equipment for power-on aging. In addition, before the power-on assessment of the aging test, it is necessary to measure the continuity of a single test socket in the aging board. For example, the multimeter can be set to the ohm range, one end of the test lead can be placed on the V+ terminal, and the other end of the test lead can be placed on the pin of the corresponding test socket to form a detection loop. Then, the quality of the corresponding detection loop is determined based on the resistance value of the multimeter. However, conventional aging boards have a large number of test sockets, and measuring each test socket is cumbersome and consumes a lot of manpower. Utility Model Content

[0003] Based on this, it is necessary to provide an aging board detection device and an aging test system.

[0004] In some embodiments of the present disclosure, an aging board detection device includes: an aging board and a driver board. The aging board includes: a printed circuit board, and a plurality of test sockets respectively arranged on the printed circuit board. The test socket is used to plug in the device to be tested to form a detection loop. The driver board is connected to the printed circuit board, and includes: a voltage driving module and a current sampling module. Among them, the voltage driving module is used to provide a reverse driving voltage to the detection loop through the printed circuit board. The current sampling module is used to obtain the detection current output by the device to be tested under the reverse driving voltage, so as to determine the on and off of the test socket according to the detection current.

[0005] In some embodiments of the present disclosure, the aging board detection device further includes a host computer connected to the current sampling module and configured to display the on / off status of each test socket according to the detection current obtained by the current sampling module.

[0006] In some embodiments of the present disclosure, the reverse driving voltage is a negative voltage with an absolute value less than or equal to 5V.

[0007] In some embodiments of the present disclosure, a printed circuit board is provided with a plurality of channel slots corresponding to the test sockets. There are a plurality of driver boards, which correspond one to one with the channel slots. The channel slots are used to plug in the driver boards.

[0008] In some embodiments of the present disclosure, an aging circuit, an aging test circuit and a device test circuit respectively connected to the test socket are also provided on the printed circuit board; wherein the driving board is connected to the aging test circuit via a channel slot.

[0009] In some embodiments of the present disclosure, the test socket includes: a fuse.

[0010] In some other embodiments of the present disclosure, the test socket includes: a series structure of a fuse and a resistor.

[0011] In some embodiments of the present disclosure, the device under test includes: a diode. A plurality of test sockets include at least one first test socket for plugging the diode. A fuse is used to connect the cathode of the diode. A current sampling module is used to connect the anode of the diode.

[0012] In some embodiments of the present disclosure, the device under test includes: a transistor. A plurality of test sockets include at least one second test socket for plugging the transistor. A fuse is used to connect the collector of the transistor. A current sampling module is used to connect the gate of the transistor. The emitter of the transistor is floating.

[0013] In some embodiments of the present disclosure, the device under test includes: an insulated gate field effect transistor or an insulated gate bipolar transistor. The multiple test sockets include at least one third test socket for plugging the insulated gate field effect transistor or the insulated gate bipolar transistor. The fuse is used to connect the collector of the insulated gate field effect transistor or the insulated gate bipolar transistor. The current sampling module is used to connect the gate and emitter of the insulated gate field effect transistor or the insulated gate bipolar transistor.

[0014] In some embodiments of the present disclosure, an aging test system is further provided, including: the aging board detection device as described in any of the above embodiments.

[0015] The above-mentioned aging board detection equipment and aging test system utilize the characteristic that when a reverse driving voltage is applied to a device, the device can generate leakage current, and the principle of ensuring that the reverse driving voltage does not interfere with the assessment result, and design a detection circuit to quickly detect the on-off status of each detection circuit on the aging board, and avoid device assessment failure caused by aging board problems, thereby effectively improving the detection efficiency (including aging board detection efficiency and device detection efficiency). In addition, the aging board detection equipment and aging test system provided by the utility model have fast detection speed, high compatibility, and simple and easy operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to better describe and illustrate the embodiments and / or examples of the utility models disclosed herein, reference may be made to one or more drawings. The additional details or examples used to describe the drawings should not be considered as limiting the scope of any of the disclosed utility models, the embodiments and / or examples currently described, and the best modes of these utility models currently understood.

[0017] Figure 1 It is an equivalent circuit diagram of a test socket detection circuit on an aging board in the related art;

[0018] Figure 2It is another equivalent circuit diagram of a test socket detection circuit on an aging board in the related art;

[0019] Figure 3 is a structural schematic diagram of an aging board detection device in some embodiments of the present disclosure;

[0020] Figure 4 is a schematic structural diagram of another aging board detection device in some embodiments of the present disclosure;

[0021] Figure 5 is a display schematic diagram of a host computer user operation interaction interface in some embodiments of the present disclosure;

[0022] Figure 6 is an equivalent circuit diagram of a first test socket detection loop on an aging board in some embodiments of the present disclosure;

[0023] Figure 7 is an equivalent circuit diagram of a second test socket detection circuit on an aging board in some embodiments of the present disclosure;

[0024] Figure 8 It is an equivalent circuit diagram of a third test socket detection loop on an aging board in some embodiments of the present disclosure. DETAILED DESCRIPTION

[0025] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0027] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there are no intervening elements or layers. "Connection" in this specification should be understood as "electrical connection", "communication connection" and the like if the connected circuits, modules, units, etc. have transmission of electrical signals or data to each other. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.

[0028] Spatially relative terms such as "under," "below," "below," "under," "above," "above," etc., may be used herein for ease of description to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, the spatially relative terms are intended to include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, then the elements or features described as "under other elements" or "under" or "under" will be oriented as "on" the other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. The device may be oriented otherwise (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0029] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be a limitation of the present invention. When used herein, the singular forms of "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It is understood that "at least one" refers to one or more, and "multiple" refers to two or more. "At least part of an element" refers to part or all of an element. It should also be understood that the terms "compose" and / or "include" when used in this specification determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0030] Embodiments of the utility model are described herein with reference to cross-sectional views that are schematic diagrams of ideal embodiments (and intermediate structures) of the utility model. In this way, variations from the shapes shown due to, for example, manufacturing techniques and / or tolerances can be expected. Therefore, embodiments of the utility model should not be limited to the specific shapes of the zones shown herein, but include shape deviations due to, for example, manufacturing. For example, an implanted region shown as a rectangle typically has rounded or curved features and / or an implant concentration gradient at its edges, rather than a binary change from an implanted region to a non-implanted region. Similarly, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation is performed. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show the actual shape of the region of the device and are not intended to limit the scope of the utility model.

[0031] Take the reliability aging test for discrete devices as an example. When conducting an electrical stress test on discrete devices, the discrete devices need to be inserted into the test socket of the aging board first, and then the aging board is placed in a testing device (such as an oven) to apply electrical stress to the discrete devices. However, before inserting the discrete devices into the aging board, a multimeter needs to be used to test the connection lines of the test socket in the aging board. This usually leads to the following two situations.

[0032] In the first case, see Figure 1 If a fuse 11 and a resistor 12 are connected in series in the connection circuit of the test socket on the aging board, a detection loop needs to be formed to measure the resistance value from the power supply terminal VCC to the drain terminal D of the discrete device.

[0033] In the second case, see Figure 2 If there is only fuse 11 in the connection line of the test socket on the aging board, it is necessary to detect whether the single test socket on the aging board is conductive. The detection method is to set the multimeter to the ohm range, and then connect the two ends of the test lead to the power supply terminal VCC and the drain terminal D of the discrete device to form a detection circuit for detection. However, the number of test sockets on conventional aging boards is large, and measuring each test socket is cumbersome and consumes a lot of manpower.

[0034] Based on this, the utility model provides an aging board detection device and an aging test system, which utilizes the characteristic that a device can generate leakage current when a reverse driving voltage is applied to the device, and the principle of ensuring that the reverse driving voltage does not interfere with the assessment result, and designs a detection circuit to quickly detect the on-off status of each detection circuit on the aging board, and avoid device assessment failure caused by aging board problems, thereby effectively improving the detection efficiency (including aging board detection efficiency and device detection efficiency). In addition, the aging board detection device and aging test system provided by the utility model have fast detection speed, high compatibility, and simple and easy operation.

[0035] In some embodiments of the present disclosure, please refer to Figure 3 The aging board detection equipment includes: an aging board 10 and a driving board 20. The aging board 10 includes: a printed circuit board 101, and a plurality of test sockets 102 respectively arranged on the printed circuit board 101. The test socket 102 is used to plug in the device under test 30 to form a detection loop. The driving board 20 is connected to the printed circuit board 101, and includes: a voltage driving module 201 and a current sampling module 202. Among them, the voltage driving module 201 is used to provide a reverse driving voltage to the detection loop through the printed circuit board 101. The current sampling module 202 is used to obtain the detection current output by the device under test 30 under the reverse driving voltage, so as to determine the on and off of the test socket 102 according to the detection current.

[0036] In some embodiments of the present disclosure, please refer to Figure 4 The aging board detection device further includes a host computer 40. The host computer 40 is connected to the current sampling module 202 and is used to display the on / off status of each test socket 102 according to the detection current obtained by the current sampling module 202.

[0037] For example, the host computer 40 is a computer or a single-chip microcomputer that can directly send operation instructions, and can generally provide a user operation interaction interface and display feedback data to the user.

[0038] In some examples, the host computer 40 includes but is not limited to electronic devices with display functions such as computers, mobile phones, tablets or display touch screens. The host computer 40 can determine the on-off status of the detection circuit according to the value of the detection current and display it intuitively. Figure 5 An exemplary display of a user operation interactive interface in the host computer 40 is given. For example, the number of test sockets 102 in the aging board 10 is 80, and the user operation interactive interface of the host computer 40 can clearly indicate the on / off status of each test socket 102 through textual description. In addition, the user operation interactive interface of the host computer 40 can also clearly indicate the value of the detection current corresponding to each test socket 102 through data or curve graphs. In addition, the user operation interactive interface of the host computer 40 can also have other menu information or label information, which is not limited in the embodiments of the present disclosure.

[0039] In some embodiments of the present disclosure, the reverse driving voltage provided by the voltage driving module 201 can be a negative voltage with an absolute value less than or equal to 5V, so that when the reverse driving voltage is applied to the device under test 30, a small leakage current will be generated. The leakage current can be, for example, less than or equal to 5mA, and the leakage current will not interfere with the test results.

[0040] It can be understood that the voltage driving module 201 can be implemented as a switch control circuit connected to the power supply voltage terminal. The embodiment of the present disclosure does not limit the specific circuit structure of the voltage driving module 201, and is limited to being able to provide a reverse driving voltage to the detection circuit. Similarly, the current sampling module 202 can be any current sampling circuit or sensor with a current sampling function. The embodiment of the present disclosure does not limit the specific circuit structure of the current sampling module 202, and is limited to being able to obtain the detection current output by the device under test 30 under the reverse driving voltage.

[0041] In some embodiments of the present disclosure, the printed circuit board 101 is provided with a plurality of channel slots corresponding to the test socket 102. There are a plurality of driving boards 20, which correspond to the channel slots one by one. The channel slots are used to plug the driving boards 20.

[0042] Here, it can be understood that a channel slot can be prepared in the printed circuit board 101 first, and then when the test socket 102 of the aging board 10 needs to be tested, the driving board 20 can be plugged into the corresponding channel slot.

[0043] In some embodiments of the present disclosure, the printed circuit board 101 is further provided with an aging circuit, an aging test circuit and a device test circuit respectively connected to the test socket 102; wherein the driving board 20 is connected to the aging test circuit via a channel slot.

[0044] Here, it can be understood that a variety of metal wirings or gold fingers can be provided on the printed circuit board 101 to implement circuits with a variety of different functions, such as the aforementioned aging circuit, aging test circuit, and device test circuit. Among them, the aging circuit can be used to perform power-on aging on the device under test 30. The aging test circuit is used to provide the aforementioned reverse drive voltage and / or sampling detection current. The device test circuit can be used to perform electrical testing on the device under test 30.

[0045] It should be added that, in some examples, the test socket 102 includes, for example, a fuse 11. In other examples, the test socket 102 includes, for example, a series structure of a fuse 11 and a resistor 12. Thus, to match different types of devices under test 30, the detection circuit formed in the aging board 10 can be implemented in a variety of different ways. Figure 6~Figure 8 In the figure, the series structure including the fuse 11 and the resistor 12 in the test socket 102 is taken as an example to show the equivalent circuit diagrams of the detection circuits corresponding to three different types of devices under test 30.

[0046] In some embodiments of the present disclosure, please refer to Figure 6The device under test 30 includes: a diode. The plurality of test sockets 102 include at least one first test socket 102A for plugging a diode. The fuse 11 is used to connect the cathode N of the diode, for example, it can be connected to the cathode N of the diode through a resistor 12. The current sampling module 202 is used to connect the anode P of the diode, for example, it can be connected to the anode P of the diode through an aging test circuit. In addition, optionally, the node of the current sampling module 202 connected to the anode P of the diode is also grounded GND.

[0047] In some embodiments of the present disclosure, please refer to Figure 7 , the device under test 30 includes: a transistor. The multiple test sockets 102 include at least one second test socket 102B for plugging the transistor. The fuse 11 is used to connect the collector C of the transistor, for example, it can be connected to the collector C of the transistor through a resistor 12. The current sampling module 202 is used to connect the gate G of the transistor, for example, it can be connected to the gate G of the transistor through an aging test circuit. The emitter E of the transistor can be floating. In addition, optionally, the node where the current sampling module 202 connects the gate G of the transistor is also grounded GND.

[0048] In some embodiments of the present disclosure, please refer to Figure 8 , the device under test 30 includes: an insulated gate field effect transistor or an insulated gate bipolar transistor. The multiple test sockets 102 include at least one third test socket 102C for plugging in the insulated gate field effect transistor or the insulated gate bipolar transistor. The fuse 11 is used to connect the collector C of the insulated gate field effect transistor or the insulated gate bipolar transistor, for example, it can be connected to the collector C of the insulated gate field effect transistor or the insulated gate bipolar transistor through a resistor 12. The current sampling module 202 is used to connect the gate G and the emitter E of the insulated gate field effect transistor or the insulated gate bipolar transistor, for example, it can be connected to the gate G and the emitter E of the insulated gate field effect transistor or the insulated gate bipolar transistor through an aging test circuit. In addition, optionally, the node where the current sampling module 202 connects the gate G and the emitter E of the insulated gate field effect transistor or the insulated gate bipolar transistor is also grounded GND.

[0049] In some embodiments of the present disclosure, an aging test system is also provided, which may include: the aging board detection device as described in any of the above embodiments. For example, the aging test system may also include other related components such as an alarm device, a device testing device, a high temperature test device, and an operating platform. The embodiments of the present disclosure are not limited to this.

[0050] In the description of this specification, the descriptions with reference to the terms "some embodiments", "other embodiments", "ideal embodiments", etc., mean that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the utility model. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0051] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A burn-in board detection device, characterized in that: include: Aging board, including: Printed circuit boards; A plurality of test sockets are respectively arranged on the printed circuit board; the test sockets are used to plug in the device to be tested to form a detection loop; A driving board, connected to the printed circuit board, comprises: A voltage driving module, used for providing a reverse driving voltage to the detection circuit through the printed circuit board; The current sampling module is used to obtain the detection current output by the device under test under the reverse driving voltage, so as to determine the on / off state of the test socket according to the detection current.

2. The aging board detection device according to claim 1 is characterized in that: Also includes: The host computer is connected to the current sampling module and is used to display the on / off status of each of the test sockets according to the detection current obtained by the current sampling module.

3. The aging board detection device according to claim 1 is characterized in that: The reverse driving voltage is a negative voltage whose absolute value is less than or equal to 5V.

4. The aging board detection device according to claim 1 is characterized in that: The printed circuit board is provided with a plurality of channel slots corresponding to the test sockets; the number of the driving boards is multiple and corresponds one-to-one to the channel slots; the channel slots are used to plug the driving boards.

5. The aging board detection device according to claim 4 is characterized in that: The printed circuit board is also provided with an aging circuit, an aging test circuit and a device test circuit respectively connected to the test socket; Wherein, the driving board is connected to the aging test circuit through the channel slot.

6. The aging board detection device according to any one of claims 1 to 5, characterized in that: The test socket comprises: a fuse; Alternatively, the test socket includes: a series structure of a fuse and a resistor.

7. The aging board detection device according to claim 6, characterized in that: The device under test includes: a diode; Wherein, the plurality of test sockets include at least one first test socket for plugging the diode; The fuse is used to connect the cathode of the diode; The current sampling module is used to connect the anode of the diode.

8. The aging board detection device according to claim 6, characterized in that: The device under test includes: a triode; Among them, the multiple test sockets include at least one second test socket for plugging the transistor; the fuse is used to connect the collector of the transistor; the current sampling module is used to connect the gate of the transistor; the emitter of the transistor is floating.

9. The aging board detection device according to claim 6, characterized in that: The device under test includes: an insulated gate field effect transistor or an insulated gate bipolar transistor; Among them, the multiple test sockets include at least one third test socket for plugging in the insulated gate field effect transistor or the insulated gate bipolar transistor; the fuse is used to connect the collector of the insulated gate field effect transistor or the insulated gate bipolar transistor; the current sampling module is used to connect the gate and emitter of the insulated gate field effect transistor or the insulated gate bipolar transistor.

10. An aging test system, characterized in that: include: The aging board detection device as described in any one of claims 1 to 9.

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