DFB semiconductor laser

Abstract

The utility model relates to a DFB semiconductor laser, which comprises an instrument body and a connecting piece, the connecting piece comprises a positioning part and side edge connecting parts, the positioning part is arranged on the instrument body, two ends of the positioning part extend to the upper part of a grating extension part of the instrument body, the side edge connecting parts are symmetrically arranged on the positioning part, and the side edge connecting parts are in contact with the grating extension part of the instrument body. The lower supporting pieces are distributed in intervals of adjacent grating extension parts of the instrument body at equal intervals through the positioning parts, and the upper supporting pieces are arranged between the lower supporting pieces and the positioning parts, are connected with the instrument body through the positioning parts, are matched with the side edge connecting parts to be positioned on the instrument body and wrap the grating extension parts. Meanwhile, the lower carrying piece penetrates through the grating extension part and stops below the grating extension part, then one end of the upper supporting piece is connected with the positioning part, the other end of the upper supporting piece is buckled to the side edge connecting part and the lower carrying piece, and finally a protective cover type component is formed, so that the grating extension part is protected during laser packaging and storage, and the possibility of deformation caused by external contact is reduced.

Description

Technical Field

[0001] The utility model relates to the field of lasers, in particular to a DFB semiconductor laser. Background Art

[0002] DFB semiconductor laser is a distributed feedback semiconductor laser. It is a side-emitting semiconductor laser that uses a grating filter device on the basis of the FP laser to make the device have only one longitudinal mode output. It is widely used in optical fiber communication, gas spectrum measurement, metrology, atomic physics and other fields.

[0003] During the current production of DFB semiconductor lasers, due to their specific grating epitaxial structure, the body of the laser needs to be packaged by a corresponding packaging mechanism. However, during the transfer of existing DFB semiconductor lasers, the outer grating epitaxial part is easily affected by foreign objects, causing deformation of some epitaxial parts, thereby affecting production quality. Utility Model Content

[0004] Based on the above description, the utility model provides a DFB semiconductor laser to solve the problem that the grating epitaxial part of the DFB semiconductor laser is easily deformed.

[0005] The technical solution of the utility model to solve the above technical problems is as follows:

[0006] A DFB semiconductor laser, comprising:

[0007] The instrument body, which emits laser light through an external pigtail detector;

[0008] A connecting member, comprising a positioning portion and a side connecting portion, wherein the positioning portion is arranged on the instrument body, and both ends of the positioning portion extend above the grating extension portion of the instrument body, and the side connecting portion is symmetrically arranged on the positioning portion, and the side connecting portion contacts the grating extension portion of the instrument body;

[0009] A lower supporting member, which is distributed at equal distances in the intervals between adjacent grating extension parts of the instrument body through the positioning portion;

[0010] The upper supporting member is arranged between the lower supporting member and the positioning portion.

[0011] On the basis of the above technical solution, the present invention can also be improved as follows.

[0012] Furthermore, the positioning portion includes a cover plate and a side pressure plate, the side pressure plate is symmetrically arranged on the cover plate, the cover plate is arranged on the instrument body through the side pressure plate, and the side pressure plate is tightly attached to the instrument body.

[0013] Furthermore, a docking groove is provided on the side pressure plate, and the side pressure plate contacts the grating extension part of the instrument body through the docking groove.

[0014] Furthermore, an anti-slip groove is provided at the connection between the side pressure plate and the cover plate.

[0015] Furthermore, the lower supporting member includes a bending portion and a supporting portion, the bending portion is arranged on the side pressure plate, the bending portion is in contact with the grating extension portion of the instrument body, the bending portion is located in the interval between adjacent grating extension portions of the instrument body, and the supporting portion is arranged on the bending portion.

[0016] Furthermore, the upper support member includes a support plate, a gusset plate and an insertion rod, the gusset plate is arranged on one end of the support plate, and the insertion rods are distributed at equal distances on the other end of the support plate.

[0017] Furthermore, the gusset plate is connected to the side connecting portion and the supporting portion, and a limiting protrusion is provided on the gusset plate, and the limiting protrusion is located between adjacent supporting portions.

[0018] Furthermore, a socket is provided on the side pressure plate, the cover plate is in contact with the side pressure plate, and the insertion rod is connected to the socket.

[0019] Compared with the prior art, the technical solution of this application has the following beneficial technical effects:

[0020] The utility model is provided with an instrument body, a connecting piece, a lower supporting piece and an upper supporting piece, which are connected to the instrument body through a positioning part, and are positioned on the instrument body in cooperation with a side connecting part, and the grating extension part is covered therein, and at the same time, the lower supporting piece passes through the grating extension part and stops below it, and then one end of the upper supporting piece is connected to the positioning part, and the other end is buckled onto the side connecting part and the lower supporting piece, and finally a protective cover-like component is formed outside the grating extension part of the instrument body, so as to realize the protection of the grating extension part when the laser is packaged and stored, and reduce the possibility of deformation caused by external contact. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic structural diagram of a DFB semiconductor laser provided in an embodiment of the utility model;

[0022] Figure 2 for Figure 1 A structural diagram from another perspective;

[0023] Figure 3 for Figure 2 A partial enlarged schematic diagram of the middle A area;

[0024] Figure 4 This is a schematic diagram of the structure of the connecting member in the embodiment of the utility model;

[0025] Figure 5 This is a schematic diagram of the structure of the upper support member in the embodiment of the utility model;

[0026] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0027] 1. Instrument body; 2. Connecting piece; 21. Positioning part; 211. Cover plate; 212. Side pressure plate; 22. Side connecting part; 3. Lower supporting piece; 31. Bending part; 32. Support part; 4. Upper supporting piece; 41. Support plate; 42. Buckle plate; 43. Insert rod. DETAILED DESCRIPTION

[0028] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0030] It will be appreciated that spatial relationship terms such as "under", "beneath", "below", "under", "above", "above", etc., may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, spatial relationship terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, the element or feature described as "under other elements" or "under it" or "under it" will be oriented as "on" the other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0031] See also Figure 1-5 A DFB semiconductor laser comprises an instrument body 1, a connecting member 2, a lower supporting member 3 and an upper supporting member 4, wherein the connecting member 2 comprises a positioning portion 21 arranged on the instrument body 1, both ends of the positioning portion 21 extend to above the grating extension portion of the instrument body 1, and side connecting portions 22 are symmetrically arranged on the positioning portion 21, and the side connecting portions 22 are in contact with the grating extension portion of the instrument body 1, and the lower supporting member 3 is equidistantly distributed in the interval between adjacent grating extension portions of the instrument body 1 through the positioning portion 21, and the upper supporting member 4 is arranged between the lower supporting member 3 and the positioning portion 21.

[0032] Based on the above, this embodiment is connected to the instrument body 1 through the positioning part 21, so that the side connection part 22 moves along the side of the instrument body 1, and then the positioning part 21 contacts the grating extension part of the instrument body 1, and cooperates with the side connection part 22 to cover the grating extension part. At the same time, the lower support part 3 passes through the grating extension part and stops below it, and then the upper support part 4 is placed on the side connection part 22 and pushed along the side connection part 22 until the upper support part 4 is connected to the positioning part 21, the upper support part 4 stops moving, and at the same time, the other end of the upper support part 4 is buckled onto the side connection part 22 and the lower support part 3, forming a protective cover-like component outside the grating extension part of the instrument body 1, so as to realize the storage and protection of the grating extension part of the laser packaging and reduce the possibility of deformation caused by external contact.

[0033] See also Figure 1-5 The positioning portion 21 includes a cover plate 211 and a side pressure plate 212. The side pressure plate 212 is symmetrically arranged on the cover plate 211. The cover plate 211 is arranged on the instrument body 1 through the side pressure plate 212. The side pressure plate 212 is tightly attached to the instrument body 1. A docking groove is opened on the side pressure plate 212. The side pressure plate 212 contacts the grating extension part of the instrument body 1 through the docking groove.

[0034] The positioning portion 21 is connected to the instrument body 1 to contact the grating extension part for positioning. In this embodiment, the cover plate 211 is combined with the side pressure plates 212 so that the distance between the side pressure plates 212 is not greater than the width of the instrument body 1 itself. In this way, the cover plate 211 exerts an extrusion effect on the side pressure plates 212 toward the middle. After the side pressure plates 212 contact the grating extension part through the contact groove, the movement of the whole body stops and is restricted to the instrument body 1.

[0035] The side connecting part 22 is positioned outside the grating extension part by the side pressure plate 212, and the interval between them is designed to be no greater than the length of the grating extension part of the instrument body 1. In this way, the side connecting part 22 is clamped in the middle outside the grating extension part of the instrument body 1 by the plate, so that the connecting part 2 is positioned and installed on the instrument body 1.

[0036] Taking into account certain limitations in connecting the connecting piece 2 to the instrument body 1, an anti-slip groove is provided at the connection between the side pressure plate 212 and the cover plate 211 in this embodiment. The anti-slip groove increases the force-bearing area on the side pressure plate 212, making it convenient for the staff to remove the integral connecting piece 2 and assemble the instrument body 1.

[0037] See also Figure 1-5 The lower supporting member 3 includes a bending portion 31 and a supporting portion 32. The bending portion 31 is arranged on the side pressure plate 212. The bending portion 31 contacts the grating extension portion of the instrument body 1. The bending portion 31 is located in the interval between adjacent grating extension portions of the instrument body 1. The supporting portion 32 is arranged on the bending portion 31.

[0038] Based on the lower supporting member 3 as a component of the outer protective cover component of the grating extension part of the instrument body 1, after the side pressure plate 212 contacts the grating extension part, the bending part 31 and the supporting part 32 pass through the gap of the grating extension part together, the bending part 31 abuts on the grating extension part, and the supporting part 32 is located below the middle of the gap, so that a gap is left between the supporting part 32 and the grating extension part, forming a protective cover component below the grating extension part.

[0039] See also Figure 1-5 The upper support member 4 includes a support plate 41, a buckle plate 42 and an insertion rod 43. The buckle plate 42 is arranged on one end of the support plate 41, and the insertion rod 43 is evenly distributed on the other end of the support plate 41. A socket is opened on the side pressure plate 212, the support plate 41 is in contact with the side pressure plate 212, and the insertion rod 43 is connected to the socket.

[0040] It should be noted that the support portion 32 is located below the grating extension portion, one end of the upper support member 4 is connected to the side connection portion 22 and the support portion 32 through a buckle plate 42, and the other end is connected to the side pressure plate 212 by an insertion rod 43, and the support plate 41 is covered on the grating extension portion. In this way, the support plate 41, the side connection portion 22 and the support portion 32 form an outer protective component with a gap at the bottom, which protects the grating extension portion, thereby reducing the possibility of deformation of the grating extension portion when the instrument body 1 is packaged and stored.

[0041] Based on the buckle plate 42 connecting the side connection part 22 and the support part 32, the buckle plate 42 of this embodiment is connected to the side connection part 22 and the support part 32, and a limiting protrusion is provided on the buckle plate 42, and the limiting protrusion is located between adjacent support parts 32. When the buckle plate 42 is connected to the side connection part 22 and the support part 32, the support part 32 is matched with the limiting protrusion, and when the buckle plate 42 stops moving, the limiting protrusion is stuck between adjacent support parts 32, thereby realizing the connection restriction on the other end of the support part 32, and enhancing the stability of one side of the support part 32 constituting the peripheral protection component.

[0042] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A DFB semiconductor laser, characterized in that: include The instrument body (1) emits laser light through an external pigtail detector; A connecting member (2), comprising a positioning portion (21) and a side connecting portion (22), wherein the positioning portion (21) is arranged on the instrument body (1), and both ends of the positioning portion (21) extend above the grating extension portion of the instrument body (1), and the side connecting portion (22) is symmetrically arranged on the positioning portion (21), and the side connecting portion (22) is in contact with the grating extension portion of the instrument body (1); A lower supporting member (3) is distributed at equal distances in the intervals between adjacent grating extension portions of the instrument body (1) through the positioning portion (21); An upper support member (4) is arranged between the lower supporting member (3) and the positioning portion (21).

2. The DFB semiconductor laser according to claim 1, characterized in that: The positioning portion (21) comprises a cover plate (211) and a side pressure plate (212), wherein the side pressure plate (212) is symmetrically arranged on the cover plate (211), and the cover plate (211) is arranged on the instrument body (1) via the side pressure plate (212), and the side pressure plate (212) is in close contact with the instrument body (1).

3. The DFB semiconductor laser according to claim 2, characterized in that: The side pressure plate (212) is provided with a docking groove, and the side pressure plate (212) contacts the grating extension portion of the instrument body (1) through the docking groove.

4. The DFB semiconductor laser according to claim 2, characterized in that: An anti-slip groove is provided at the connection between the side pressure plate (212) and the cover plate (211).

5. The DFB semiconductor laser according to claim 2, characterized in that: The lower supporting member (3) comprises a bending portion (31) and a supporting portion (32); the bending portion (31) is arranged on a side pressure plate (212); the bending portion (31) is in contact with a grating extension portion of an instrument body (1); the bending portion (31) is located within a gap between adjacent grating extension portions of the instrument body (1); and the supporting portion (32) is arranged on the bending portion (31).

6. The DFB semiconductor laser according to claim 5, characterized in that: The upper support member (4) comprises a support plate (41), a buckle plate (42) and an insertion rod (43); the buckle plate (42) is arranged on one end of the support plate (41), and the insertion rod (43) is distributed at equal distances on the other end of the support plate (41).

7. The DFB semiconductor laser according to claim 6, characterized in that: The buckle plate (42) is connected to the side connection portion (22) and the support portion (32), and a limiting protrusion is provided on the buckle plate (42), and the limiting protrusion is located between adjacent support portions (32).

8. The DFB semiconductor laser according to claim 6, characterized in that: The side pressure plate (212) is provided with an insertion hole, the support plate (41) is in contact with the side pressure plate (212), and the insertion rod (43) is connected to the insertion hole.

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