Electronic component heat dissipation device

Abstract

The utility model discloses an electronic component heat dissipation device which comprises a box body, one end of the box body is provided with an opening, a heat conduction gasket and a heat dissipation assembly are sequentially arranged on the side, away from the opening, of the box body, the heat conduction gasket is embedded in the side, away from the opening, of the box body, and the heat dissipation assembly comprises a heat dissipation plate and a plurality of heat dissipation fins. The heat dissipation plate covers the side, away from the box body, of the heat conduction gasket, the heat dissipation plate is detachably connected with the box body, the heat dissipation fins are fixedly arranged on the side, away from the heat conduction gasket, of the heat dissipation plate, and the multiple heat dissipation fins are arranged side by side at intervals. The utility model provides a heat dissipation device for electronic components, which is high in heat dissipation efficiency and can timely dissipate generated heat, thereby ensuring normal operation of the electronic components and prolonging the service life of the electronic components.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, in particular to a heat dissipation device for electronic components. Background Art

[0002] At present, electronic components are widely used in the industrial field. When working for a long time, electronic components will generate a lot of heat. When the current is continuous, the resistance will continuously generate heat. The heat generated will cause the temperature of the electronic components to rise, thus affecting the operation of the electronic components and even causing damage. Therefore, there is an urgent need for an efficient heat dissipation device to dissipate the generated heat in time, reduce the temperature of the electronic components, thereby ensuring their normal operation and extending their service life. Utility Model Content

[0003] The utility model aims to provide an electronic component heat dissipation device with high heat dissipation efficiency, capable of timely dissipating the generated heat, thereby ensuring the normal operation of the electronic components and extending the service life.

[0004] The technical solution adopted by the electronic component heat dissipation device disclosed in the utility model is:

[0005] A heat dissipation device for electronic components comprises a box body, one end of the box body is open, a side of the box body away from the opening is provided with a thermally conductive gasket and a heat dissipation assembly in sequence, the thermally conductive gasket is embedded in the side of the box body away from the opening, the heat dissipation assembly comprises a heat sink and a plurality of heat dissipation fins, the heat sink cover is arranged on the side of the thermally conductive gasket away from the box body, and the heat sink is detachably connected to the box body, the heat dissipation fins are fixedly arranged on the side of the heat sink away from the thermally conductive gasket, and a plurality of the heat dissipation fins are arranged side by side at intervals.

[0006] As a preferred solution, the heat sink and the heat sink fins are both made of die-cast aluminum, and the heat sink and the plurality of heat sink fins are integrally die-cast.

[0007] As a preferred solution, the heat sink is detachably connected to the box body by screws.

[0008] As a preferred solution, the shape of the thermally conductive gasket matches the shape of the bottom surface of the inner cavity of the box.

[0009] As a preferred solution, the thermally conductive gasket is made of thermally conductive silicone.

[0010] As a preferred solution, a temperature sensor is provided in the box.

[0011] The beneficial effect of the electronic component heat dissipation device disclosed by the utility model is that the heat generated by the electronic components on the circuit board is transferred to the heat dissipation assembly through the thermal pad, and the heat dissipation plate and the heat dissipation fins are in contact with the outside air to exchange heat, thereby improving the heat dissipation efficiency, timely dissipating the heat generated by the electronic components when working, reducing the temperature of the electronic components when working, ensuring the normal operation of the electronic components, and extending the service life. In addition, the heat dissipation plate can be detachably installed on the box body, which is not only convenient for the disassembly and assembly of the heat dissipation assembly, but also convenient for the replacement of the thermal pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 The utility model is a structural schematic diagram of an electronic component heat dissipation device.

[0013] Figure 2 It is a structural schematic diagram of an electronic component heat dissipation device of the utility model from another perspective.

[0014] Figure 3 The utility model is a cross-sectional view of a heat dissipation device for electronic components.

[0015] 10. Box body; 20. Thermal conductive pad; 30. Heat sink; 31. Heat sink fins. DETAILED DESCRIPTION

[0016] The present invention is further described and illustrated below in conjunction with specific embodiments and accompanying drawings:

[0017] Please refer to Figures 1 to 3 A heat dissipation device for electronic components includes a box body 10, one end of the box body 10 is open, a thermally conductive gasket 20 and a heat dissipation assembly are sequentially arranged on a side of the box body 10 away from the opening, the thermally conductive gasket 20 is made of thermally conductive silicone material, the thermally conductive gasket 20 is embedded in the side of the box body 10 away from the opening, the heat dissipation assembly includes a heat dissipation plate 30 and a plurality of heat dissipation fins 31, the heat dissipation plate 30 is covered on a side of the thermally conductive gasket 20 away from the box body 10, and the heat dissipation plate 30 is detachably connected to the box body 10, the heat dissipation fins 31 are fixedly arranged on a side of the heat dissipation plate 30 away from the thermally conductive gasket 20, and the plurality of heat dissipation fins 31 are arranged side by side at intervals.

[0018] In the above scheme, the thermal conductivity of the silicone thermal pad 20 is not limited, and the heat can be quickly conducted away.

[0019] The thermal resistance is small, so the heat generated by the electronic components on the circuit board is quickly transferred to the heat dissipation assembly through the thermal pad 20, and the heat dissipation plate 30 and the heat dissipation fins 31 are in contact with the outside air to exchange heat, thereby improving the heat dissipation efficiency, timely dissipating the heat generated by the electronic components when working, reducing the temperature of the electronic components when working, ensuring the normal operation of the electronic components, and extending the service life. In addition, the heat dissipation plate 30 can be detachably installed on the box body 10, which is not only convenient for the disassembly and assembly of the heat dissipation assembly, but also convenient for the replacement of the thermal pad 20.

[0020] Please refer to Figure 2 The heat sink 30 and the heat sink fins 31 are both made of die-cast aluminum, and the heat sink 30 and the heat sink fins 31 are integrally die-cast.

[0021] In the above scheme, the integral die-casting is convenient for mass production, maintains consistency and is low in cost. In addition, the surfaces of the heat sink 30 and the heat sink fins 31 are treated with anti-oxidation to ensure that the product is not easily oxidized and prolong the service life.

[0022] Please refer to Figure 2 The heat sink 30 is detachably connected to the box body 10 by screws.

[0023] In the above solution, the detachable connection by screws has a stable structure and is easy to disassemble and assemble, and the heat sink 30 only needs to reserve mounting holes during production.

[0024] Please refer to Figure 3 The shape of the thermally conductive pad 20 matches the shape of the bottom surface of the inner cavity of the box body 10 .

[0025] In the above solution, the contact area between the thermally conductive gasket 20 and the surface of the box body 10 is increased, which can not only improve the heat conduction efficiency but also make the heat dissipation more uniform.

[0026] Please refer to Figure 2 A temperature sensor is provided in the box body 10.

[0027] In the above scheme, the temperature sensor can monitor the temperature in the box 10 in real time, and take timely measures when the temperature is too high to prevent accidents. Furthermore, an installation space can be opened in the whole row of heat dissipation fins 31 for arranging a heat dissipation fan, and the heat dissipation fan is electrically connected to the temperature sensor. When the temperature is too high, the heat dissipation fan is turned on to blow air toward the gaps between the heat dissipation fins 31, further accelerating the heat exchange between the heat dissipation fins 31 and the air, thereby improving the heat dissipation efficiency.

[0028] The utility model provides an electronic component heat dissipation device. The heat generated by the electronic components on the circuit board is transferred to the heat dissipation assembly through the heat conductive pad. The heat dissipation plate and the heat dissipation fins are in contact with the outside air to exchange heat, thereby improving the heat dissipation efficiency, timely dissipating the heat generated by the electronic components when working, reducing the temperature of the electronic components when working, ensuring the normal operation of the electronic components, and extending the service life. In addition, the heat dissipation plate can be detachably installed on the box body, which is not only convenient for the disassembly and assembly of the heat dissipation assembly, but also convenient for the replacement of the heat conductive pad.

[0029] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit the protection scope of the utility model. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the utility model.

Claims

1. An electronic component heat dissipation device, characterized in that: It includes a box body, one end of which is open, and a thermally conductive gasket and a heat dissipation component are sequentially arranged on a side of the box body away from the opening, the thermally conductive gasket is embedded in the side of the box body away from the opening, the heat dissipation component includes a heat sink and a plurality of heat dissipation fins, the heat sink cover is arranged on a side of the thermally conductive gasket away from the box body, and the heat sink is detachably connected to the box body, the heat dissipation fins are fixedly arranged on a side of the heat sink away from the thermally conductive gasket, and a plurality of the heat dissipation fins are arranged side by side at intervals.

2. An electronic component heat dissipation device as claimed in claim 1, characterized in that: The heat sink and the heat sink fins are both made of die-cast aluminum, and the heat sink and the heat sink fins are integrally die-cast.

3. The electronic component heat dissipation device according to claim 1, characterized in that: The heat sink is detachably connected to the box body via screws.

4. The electronic component heat dissipation device according to claim 1, characterized in that: The shape of the thermally conductive pad matches the shape of the bottom surface of the inner cavity of the box.

5. The electronic component heat dissipation device according to claim 1, characterized in that: The thermally conductive gasket is made of thermally conductive silicone material.

6. The electronic component heat dissipation device according to claim 1, characterized in that: A temperature sensor is arranged in the box.

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