Semiconductor sampling detection grabbing mechanism

Abstract

The utility model discloses a semiconductor sampling inspection grabbing mechanism which comprises a shell and a connecting seat, an avoiding hole is formed in the shell, a threaded rod is arranged in the avoiding hole, the bottom end of the threaded rod is rotatably connected with the connecting seat, a power assembly is arranged in the shell, a plurality of guide grooves are formed in the connecting seat, and the guide grooves are connected with the threaded rod. A guide groove is formed in the bottom of the shell, a sliding column is fixedly connected to one side of the guide groove, a plurality of avoiding grooves are formed in the bottom of the shell, connecting rods are movably connected into the avoiding grooves, sliding grooves are formed in the connecting rods, and the sliding column is in sliding connection with the sliding grooves. According to the utility model, not only can wafers of different sizes be transversely and vertically clamped through the cooperative use of the connecting rod and the connecting block, but also the position of the second gear can be fixed through the cooperative use of the elastic ball and the arc-shaped groove, so that the working efficiency is improved. And parts between the shell and the connecting seat can be protected through the folding rubber sleeve.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor detection, in particular to a semiconductor sampling detection grabbing mechanism. Background Art

[0002] Semiconductor refers to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Some semiconductors will be sampled and tested after processing to check the processing results of the semiconductor.

[0003] Currently, most semiconductor grippers on the market use mechanical arms to drive hard vacuum suction cups to grab wafers cut from silicon rods. Wafers are mostly placed in two ways: flat and vertical. However, the common gripping mechanisms on the market are mostly flat grippers, which are not conducive to grabbing vertically placed wafers, resulting in limitations in their use. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a semiconductor sampling detection grabbing mechanism.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A semiconductor sampling detection grabbing mechanism comprises a shell and a connecting seat, wherein a avoidance hole is provided inside the shell, a threaded rod is provided in the avoidance hole, and the bottom end of the threaded rod is rotatably connected to the connecting seat, a power assembly is provided inside the shell, a plurality of guide grooves are provided inside the connecting seat, a sliding column is fixedly connected to one side of the guide groove, a plurality of avoidance grooves are provided at the bottom of the shell, a connecting rod is movably connected in the avoidance groove, and the connecting rod slides inside the guide groove, a sliding groove is provided inside the connecting rod, and the sliding column is slidably connected to the sliding groove, the bottom end of the connecting rod is movably connected to a connecting frame, the bottom of the connecting frame is movably connected to a connecting block, and a suction cup is installed at the bottom of the connecting block.

[0007] As a further solution of the utility model, the power assembly includes a rotating groove, which is opened inside the outer shell, and an installation groove is opened inside the outer shell, and the rotating groove is communicated with the installation groove, and the interiors of the rotating groove and the installation groove are respectively key-connected with a first gear and a second gear, and the first gear is meshed with the second gear, and the threaded rod is threadedly connected to the first gear.

[0008] As a further solution of the utility model, a rotation groove is opened on one side of the shell, and the second gear extends out of the rotation groove.

[0009] As a further solution of the utility model, a plurality of arc-shaped grooves are provided on the top of the installation groove.

[0010] As a further solution of the utility model, an elastic ball is fixedly connected to the top of the second gear, and the elastic ball is engaged with the arc-shaped groove.

[0011] As a further solution of the utility model, a foldable rubber sleeve is fixedly connected to the bottom of the connecting seat, and the foldable rubber sleeve is fixed to the bottom of the outer shell.

[0012] As a further solution of the utility model, the outer wall of the shell is fixedly connected with a plurality of mounting seats.

[0013] The beneficial effects of the utility model are:

[0014] 1. Through the coordinated use of the connecting rod and the connecting block, the device can clamp wafers of different sizes horizontally and vertically, thereby expanding the use range of the device and improving the flexibility of the device.

[0015] 2. The position of the second gear is fixed by using the elastic ball in conjunction with the arc-shaped groove, thereby improving the use effect of the device.

[0016] 3. By setting the foldable rubber sleeve, the foldable rubber sleeve can be extended or shortened following the movement of the connecting seat, thereby protecting the components between the housing and the connecting seat, thereby improving the protection effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a three-dimensional structural diagram of a semiconductor sampling detection grabbing mechanism proposed by the utility model;

[0018] Figure 2 It is a partial cross-sectional structural schematic diagram of a semiconductor sampling detection grabbing mechanism proposed by the utility model;

[0019] Figure 3 This is a partial enlarged structural diagram of a semiconductor sampling detection grabbing mechanism proposed by the utility model;

[0020] Figure 4 The utility model provides an enlarged structural diagram of a connecting frame of a semiconductor sampling detection grabbing mechanism.

[0021] In the figure: 1. outer shell; 2. avoidance groove; 3. folding rubber sleeve; 4. connecting seat; 5. mounting seat; 6. rotating groove; 7. guide groove; 8. avoidance hole; 9. first gear; 10. connecting rod; 11. slide groove; 12. slide column; 13. second gear; 14. elastic ball; 15. mounting groove; 16. arc groove; 17. connecting block; 18. connecting frame; 19. suction cup. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. The described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0023] Reference Figure 1-Figure 4 A semiconductor sampling detection grabbing mechanism includes a shell 1 and a connecting seat 4. The shell 1 is provided with an avoidance hole 8, and a threaded rod is provided in the avoidance hole 8, and the bottom end of the threaded rod is rotatably connected to the connecting seat 4. The shell 1 is provided with a power assembly, and the connecting seat 4 is provided with a plurality of guide grooves 7. A slide column 12 is fixed to one side of the guide groove 7 by bolts, and the guide groove 7 can guide and limit the slide column 12. The bottom of the shell 1 is provided with a plurality of avoidance grooves 2, and a connecting rod 10 is rotatably connected in the avoidance groove 2, and the connecting rod 10 slides in the guide groove 7. A slide groove 11 is provided in the connecting rod 10, and the slide column 12 is slidably connected to the slide groove 11. The plurality of connecting rods 10 are opened to make The slide column 12 moves upward along the slide groove 11, and multiple connecting rods 10 are closed to make the slide column 12 move downward along the slide groove 11. The bottom end of the connecting rod 10 is rotatably connected to the connecting frame 18, and the bottom of the connecting frame 18 is rotatably connected to the connecting block 17. A suction cup 19 is installed at the bottom of the connecting block 17. The connecting block 17 is rotated upward to bend the connecting block 17 upward to the required angle, so that the suction cup 19 moves from the bottom end position of the connecting rod 10 to the side position, and the power component causes the first gear 9 to drive the threaded rod to move downward, thereby moving the connecting seat 4 downward. At this time, the connecting rod 10 is retracted inward along the guide groove 7, so that the suction cup 19 moves toward the middle to contact and clamp the vertically placed wafer.

[0024] In the present utility model, it should be noted that the connecting frame 18 is manually rotated so that the connecting frame 18 rotates horizontally along the bottom end of the connecting rod 10, so that the connecting block 17 at the bottom drives the suction cup 19 to rotate as a whole, and the power assembly includes a rotating groove 6, the rotating groove 6 is opened inside the shell 1, and the interior of the shell 1 is provided with a mounting groove 15, and the rotating groove 6 is connected with the mounting groove 15, and the interiors of the rotating groove 6 and the mounting groove 15 are key-connected with the first gear 9 and the second gear 13 respectively, and the first gear 9 is meshed with the second gear 13, the threaded rod is threadedly connected with the first gear 9, a rotating groove 6 is opened on one side of the shell 1, and the second gear 13 extends out of the rotating groove 6, and the second gear 13 is manually rotated so that the first gear 9 drives the threaded rod to move downward The second gear 13 is moved so that the connecting seat 4 moves downward. A plurality of arc grooves 16 are provided on the top of the mounting groove 15. An elastic ball 14 is bonded to the top of the second gear 13, and the elastic ball 14 is engaged with the arc groove 16. The second gear 13 rotates so that the elastic ball 14 enters the arc groove 16 corresponding thereto, thereby fixing the position of the second gear 13. A folding rubber sleeve 3 is bonded to the bottom of the connecting seat 4, and the folding rubber sleeve 3 is fixed to the bottom of the outer shell 1. The folding rubber sleeve 3 can protect the components between the outer shell 1 and the connecting seat 4. When the connecting seat 4 moves, the folding rubber sleeve 3 can extend or shorten with it. The outer wall of the outer shell 1 is fixed with a plurality of mounting seats 5 by bolts, which is convenient for the staff to connect the device to an external machine.

[0025] Working principle: When the device needs to be used, the staff first rotates the connecting block 17 upward to bend the connecting block 17 upward to the required angle, thereby moving the suction cup 19 from the bottom position of the connecting rod 10 to the side position, and then the staff manually rotates the second gear 13 to make the first gear 9 drive the threaded rod to move downward, thereby moving the connecting seat 4 downward. At this time, the connecting rod 10 moves inward along the guide groove 7, thereby making the suction cup 19 move closer to the middle to contact and clamp the vertically placed wafer. At the same time, the sliding column 12 moves downward along the slide groove 11, and at the same time, the second gear 13 rotates to make the elastic ball 14 enter the corresponding arc-shaped groove 16, thereby fixing the position of the second gear 13. In addition, the staff can rotate the connecting frame 18 horizontally as needed, so that the connecting frame 18 and the connecting block 17 and suction cup 19 at the bottom thereof rotate as a whole.

[0026] Finally, it should be noted that: for those skilled in the art, they can still modify the technical solutions recorded in the above embodiments, or replace some of the technical features therein with equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this utility model shall be included in the protection scope of this utility model.

Claims

1. A semiconductor sampling detection grabbing mechanism, comprising a housing (1) and a connecting seat (4), characterized in that: The shell (1) is provided with an avoidance hole (8), a threaded rod is provided in the avoidance hole (8), and the bottom end of the threaded rod is rotatably connected to the connecting seat (4). The shell (1) is provided with a power assembly. The connecting seat (4) is provided with a plurality of guide grooves (7) in the interior, and a slide column (12) is fixedly connected to one side of the guide groove (7). The bottom of the shell (1) is provided with a plurality of avoidance grooves (2), and a connecting rod (10) is movably connected in the avoidance groove (2), and the connecting rod (10) slides in the guide groove (7). The connecting rod (10) is provided with a slide groove (11), and the slide column (12) is slidably connected to the slide groove (11). The bottom end of the connecting rod (10) is movably connected to a connecting frame (18), and the bottom of the connecting frame (18) is movably connected to a connecting block (17), and a suction cup (19) is installed at the bottom of the connecting block (17).

2. A semiconductor sampling detection grabbing mechanism according to claim 1, characterized in that: The power assembly comprises a rotating groove (6), the rotating groove (6) is arranged inside the housing (1), a mounting groove (15) is arranged inside the housing (1), and the rotating groove (6) is communicated with the mounting groove (15), a first gear (9) and a second gear (13) are key-connected inside the rotating groove (6) and the mounting groove (15), respectively, the first gear (9) is meshed with the second gear (13), and the threaded rod is threadedly connected with the first gear (9).

3. A semiconductor sampling detection grabbing mechanism according to claim 2, characterized in that: A rotation groove (6) is provided on one side of the housing (1), and the second gear (13) extends out of the rotation groove (6).

4. A semiconductor sampling detection grabbing mechanism according to claim 2, characterized in that: A plurality of arc-shaped grooves (16) are formed on the top of the installation groove (15).

5. A semiconductor sampling detection grabbing mechanism according to claim 4, characterized in that: An elastic ball (14) is fixedly connected to the top of the second gear (13), and the elastic ball (14) is engaged with the arc-shaped groove (16).

6. A semiconductor sampling detection grabbing mechanism according to claim 1, characterized in that: The bottom of the connecting seat (4) is fixedly connected to a foldable rubber sleeve (3), and the foldable rubber sleeve (3) is fixed to the bottom of the outer shell (1).

7. A semiconductor sampling detection grabbing mechanism according to claim 1, characterized in that: The outer wall of the housing (1) is fixedly connected with a plurality of mounting seats (5).

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