Wafer processing cutting device capable of removing dust

Abstract

The utility model discloses a wafer processing cutting device capable of removing dust, which comprises a bearing frame, a control panel is arranged on the surface of the bearing frame and can control the starting and stopping of the operation of the bearing frame and the cutting device, a water conveying assembly is arranged on one side of the bearing frame, and a water outlet is arranged on the other side of the bearing frame. Water spraying treatment can be conducted on the interior of a containing frame installed on the top of the bearing frame; the wafer processing device further comprises a driving assembly which can be used for processing wafers placed in the material placing disc at the inner position of the placing frame; and a water outlet cleaning mechanism is installed on one side of the interior of the containing frame and can clean waste chips generated by machining of the driving assembly, and therefore the waste chips can be conveniently collected and treated. According to the wafer processing cutting device capable of removing dust, the water outlet cleaning mechanism is arranged, a control panel is used for controlling a water conveying assembly to be started and stopped, waste chips can flow into the collecting box through a discharging opening, and therefore the waste chips can be better collected and treated.

Description

Technical Field

[0001] The utility model relates to the technical field related to wafer processing, in particular to a wafer processing cutting device capable of removing dust. Background Art

[0002] Wafer refers to the silicon chip used in the manufacture of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer to become IC products with specific electrical functions. As the demand for wafers increases, the efficiency of wafer processing and production needs to be improved. Therefore, wafer cutting equipment is needed for processing, such as:

[0003] Publication number CN113059280A discloses a cutting device for chip wafer processing. The cutting device has an upper brush plate structure, which can be manually shaken and turned by the handle after cutting is completed, so that the upper brush bristles continuously brush the workbench to clean the debris on the workbench and prevent the debris from affecting the processing of the next chip wafer. The debris on the workbench is cleaned after the wafer is fixed. However, due to the large amount of tiny debris generated during high-speed cutting, when only cleaning with a brush, a certain amount of debris will still remain, which is inconvenient to clean, and may still affect the processing of the next wafer.

[0004] Therefore, we propose a wafer processing cutting device with dust removal function which can solve the above problems well. Utility Model Content

[0005] The purpose of the utility model is to provide a cutting device for wafer processing with dust removal, so as to solve the problem raised by the above background technology that the wafer cutting devices currently on the market will generate a large amount of tiny debris when cutting at high speed during use, and when only cleaning with a brush, certain debris will still remain, which is inconvenient to clean, and may still affect the processing of the next wafer.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a dust-removable wafer processing cutting device, comprising a load-bearing frame, wherein a control panel is installed on the surface of the load-bearing frame to control the start and stop of the cutting device of the load-bearing frame, and a water delivery component is installed on one side of the load-bearing frame to spray water on the placement rack installed on the top of the load-bearing frame;

[0007] Also includes:

[0008] A group of placement racks are fixed at the top of the load-bearing frame, and a driving component is installed at one side of the inner side of the placement rack, and the driving component can be used to process the wafers in the material placing tray placed at the inner side of the placement rack;

[0009] A water outlet cleaning mechanism is installed at one side of the interior of the placement rack, which can clean the waste chips generated by the processing of the drive components, thereby facilitating the collection and treatment of the waste chips.

[0010] As a preferred technical solution of the present application, the water outlet cleaning mechanism includes a water supply component, and the output end of the water supply component is connected to one end of a water spray head, one side of the water spray head is arranged on one side of a partition plate, the partition plate is fixed inside the placement rack, and a movable groove is provided on the inner side of the partition plate, a discharge port is provided on one side of the placement rack and the load-bearing rack near the water spray head, and a collection box is provided directly below the discharge port, through which waste chips can be collected and processed in a centralized manner, and the water supply component can remove dust from the materials placed inside the discharge tray through the water spray head.

[0011] As a preferred technical solution of the present application, a transparent door panel is provided on the surface of the load-bearing frame, and one side of the transparent door panel corresponds to one side of the collecting box, which can facilitate the collection and processing of the collecting box and the collection and processing of the waste inside the feeding electric push rod.

[0012] As a preferred technical solution of the present application, the driving assembly includes a sliding base slidably arranged on the inner bottom surface of the placement rack, and two groups of longitudinal electric push rods are installed on one side of the sliding base, the output end position of the longitudinal electric push rod is fixed on one side of the high-speed motor, the outer side of the high-speed motor is fixed in the ring of the limiting guide frame, and the longitudinal position of the limiting guide frame can be stably adjusted by the longitudinal electric push rod, and a group of cutting blades are connected to the output end position of the high-speed motor, and in addition, one side position of the sliding base is fixed to the output end position of the front and rear electric push rods, and the position of the sliding base can be adjusted, and a groove is provided at the bottom of the sliding base, and the inner wall of the groove is attached to the guide block fixed on the inner bottom surface of the placement rack, and the front and rear positions of the sliding base can be adjusted, so that the driving assembly can be adjusted to meet the purpose of cutting.

[0013] As a preferred technical solution of the present application, one end of the cutting blade is arranged below the water spray head, and the outer side of the cutting blade passes through the interior of the movable groove. At the same time, the height of the movable groove is greater than the height of the high-speed motor and the movement of the cutting blade, and the distance moved by the cutting blade in the movable groove can be adjusted.

[0014] As a preferred technical solution of the present application, a material discharge tray is provided inside the placement rack, and the rear side position of the material discharge tray is connected to the output end position of the feeding electric push rod, so as to facilitate pushing out the material discharge tray and the wafers placed inside the material discharge tray after opening the door panel, and a fixing mechanism is provided at the top position of the material discharge tray, the fixing mechanism includes a material discharge trough opened at the top position of the material discharge tray, a fixed block fixed at an equal angle at the outer side position of the material discharge trough, and the end position of the fixed block is rotatably connected to a reset shaft, and the other end position of the reset shaft is fixed on one side of the bonding plate, which can conveniently drive the material discharge tray to move inside the placement rack.

[0015] As the preferred technical solution of the present application, a torsion spring is embedded on the outer side of the reset shaft to facilitate driving the bonding plate to reset on one side of the fixed block. In addition, a rubber pad is fixed on the lower side of the bonding plate to prevent damage to the wafer, and the wafer can be further protected.

[0016] Compared with the prior art, the utility model has the beneficial effect that the wafer processing cutting device with dust removal is provided with a water outlet cleaning mechanism, and the water supply component is controlled to start and stop by using a control panel, so that the water source can be sprayed through a water sprinkler head, and the waste chips generated by the processed wafers can be dusted and collected, and the waste chips will flow into the interior of the collection box through the discharge port, so that the waste chips can be better collected and processed. The specific contents are as follows:

[0017] 1. By setting up a transparent door panel, the collection box placed on one side of the transparent door panel can be conveniently collected and processed by opening the transparent door panel, which can ensure continued use in the future;

[0018] Furthermore, a placement rack is fixedly arranged so that the placement rack can block the water source sprayed by the sprinkler head to a certain extent.

[0019] 2. By setting up a driving assembly, the longitudinal electric push rod can drive the high-speed motor to change the longitudinal direction on the top of the sliding base through the limit guide frame, so that the cutting blade can be adjusted inside the moving groove, and when cutting, the front and rear electric push rods drive the sliding base to slide on the outside of the guide block, which can facilitate the adjustment of the cutting direction;

[0020] Furthermore, a material placing tray is provided, and the wafer is placed on the top of the material placing tray, and the provided bonding plate is rotated at one side of the fixed block through the reset shaft, so that the edge of the wafer can be limited by bonding the bonding plate;

[0021] Furthermore, through the setting of the feeding electric push rod, the feeding electric push rod can be started by opening the door panel, so that the discharge tray is pushed and processed by the feeding electric push rod, and the wafer on the top of the discharge tray can be replaced. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0023] Figure 2 This is a schematic diagram of the cross-sectional structure of the placement rack of the utility model;

[0024] Figure 3 This is a schematic diagram of the cross-sectional structure of the weighing frame of the utility model when viewed from above;

[0025] Figure 4 This is a schematic diagram of the main structure of the drive assembly of the utility model;

[0026] Figure 5 This is a schematic diagram of the main structure of the discharge tray of the utility model;

[0027] Figure 6 For this utility model Figure 5 Enlarged structural diagram at A in the middle.

[0028] In the figure: 1. load-bearing frame; 101. transparent door panel; 2. control panel; 3. water delivery assembly; 301. sprinkler head; 4. placement rack; 401. open door panel; 5. drive assembly; 501. sliding base; 502. longitudinal electric push rod; 503. high-speed motor; 504. limit guide frame; 505. cutting blade; 506. front and rear electric push rod; 507. guide block; 6. partition plate; 7. moving trough; 8. discharge tray; 9. discharge trough; 10. fixed block; 11. reset shaft; 12. bonding plate; 13. discharge port; 14. collection box; 15. feeding electric push rod. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] See also Figure 1-Figure 6 , the utility model provides a technical solution:

[0031] Embodiment 1: In order to solve the problem that the existing cutting device will have waste chips when in use, which makes it inconvenient to process the next group of wafers, the specific reference is to the attached Figure 1 -Attached Figure 3, including a load-bearing frame 1, wherein a control panel 2 is installed on the surface of the load-bearing frame 1, which can control the start and stop of the cutting device of the load-bearing frame 1, a water supply component 3 is installed on one side of the load-bearing frame 1, which can spray water on the placement frame 4 installed on the top of the load-bearing frame 1; a water outlet cleaning mechanism is installed on one side of the placement frame 4, which can clean the waste generated by the driving component 5, so as to facilitate the collection and treatment of the waste. The water outlet cleaning mechanism includes a water supply component 3, and the output end of the water supply component 3 is connected to one end of the water spray head 301, one side of the water spray head 301 is set on one side of the partition plate 6, the partition plate 6 is fixed inside the placement frame 4, and a movable groove 7 is opened on the inner side of the partition plate 6, a feeding port 13 is opened on one side of the placement frame 4 and the load-bearing frame 1 near the water spray head 301, and a collection box 14 is opened directly below the feeding port 13, and the waste can be collected and treated in a centralized manner through the collection box 14. A transparent door panel 101 is provided on the surface of the load-bearing frame 1, and one side of the transparent door panel 101 corresponds to one side of the collection box 14, so that the collection box 14 can be easily collected and processed. By starting the closed and open door panel 401, when the waste generated by the wafer processing by the cutting blade 505 is processed, the water delivery component 3 is controlled by the control panel 2 to perform water treatment, so that the water delivery component 3 can spray the water source through the water spray head 301, and the water spray head 301 provided in addition can clean the waste on the top of the discharge tray 8, so that the water source and the waste can be transported to the inside of the collection box 14 through the discharge port 13, and the collection box 14 can be observed through the transparent door panel 101, and the collection box 14 can be taken away by opening the transparent door panel 101, so that the waste can be collected and processed.

[0032] Embodiment 2: In order to process the wafer more conveniently, the wafer on the top of the material tray 8 is processed. For details, please refer to the attached Figure 1 , Attachment Figure 2 and attached Figure 4A set of placing racks 4 is fixed at the top position of the load-bearing frame 1, and a driving component 5 is installed at one side of the inner position of the placing rack 4, and the driving component 5 can be used to process the wafers in the material placing tray 8 placed at the inner position of the placing rack 4; the driving component 5 includes a sliding base 501 slidably arranged on the inner bottom surface of the placing rack 4, and two sets of longitudinal electric push rods 502 are installed on one side of the sliding base 501, and the output end position of the longitudinal electric push rod 502 is fixed on one side of the high-speed motor 503, and the outer side of the high-speed motor 503 is fixed on The longitudinal position of the limiting guide frame 504 can be stably adjusted within the ring of the limiting guide frame 504 through the longitudinal electric push rod 502. A group of cutting blades 505 are connected to the output end of the high-speed motor 503. In addition, one side of the sliding base 501 is fixed to the output end of the front and rear electric push rods 506, and the position of the sliding base 501 can be adjusted. A groove is provided at the bottom of the sliding base 501, and the inner wall of the groove is attached to the guide block 507 fixed on the inner bottom surface of the placement frame 4, so that the front and rear position of the sliding base 501 can be adjusted. One end of the cutting blade 505 is set below the water spray head 301, and the outer side of the cutting blade 505 passes through the interior of the movable groove 7. At the same time, the height of the movable groove 7 is greater than the height of the high-speed motor 503 and the movement of the cutting blade 505. When it is necessary to place the discharge tray 8, the control panel 2 can be used to control the longitudinal electric push rod 502 to start and stop, so that the longitudinal electric push rod 502 can drive the high-speed motor 503 to move, and the high-speed motor 503 can be adjusted in height at the top position of the sliding base 501 through the limiting guide frame 504. At this time, the cutting blade 505 can be driven to be raised, and then the discharge tray 8 can be placed under the cutting blade 505. When cutting is required, the front and rear electric push rods 506 can be started, so that the sliding base 501 can drive the high-speed motor 503 and the limiting guide frame 504 to perform cutting, so that the cutting blade 505 can slide inside the movable groove 7, and the cutting blade 505 can cut the wafer.

[0033] Embodiment 3: In order to prevent the wafer from shifting when cutting the wafer, please refer to the attached Figure 2 , Attachment Figure 5 and attached Figure 6A material discharge tray 8 is arranged inside the placement rack 4, and the rear side position of the material discharge tray 8 is connected to the output end position of the feeding electric push rod 15, so as to push out the material discharge tray 8 and the wafers placed inside the material discharge tray 8 after opening the door panel 401. A fixing mechanism is arranged at the top position of the material discharge tray 8, and the fixing mechanism includes a material discharge trough 9 opened at the top position of the material discharge tray 8, and a fixing block 10 fixed at an equal angle at the outer side position of the material discharge trough 9. The end position of the fixing block 10 is rotatably connected with a reset shaft 11, and the other end position of the reset shaft 11 is fixed to one side of the bonding plate 12. A torsion spring is embedded on the outer side of the reset shaft 11, which is convenient for driving the bonding plate 12 to reset on one side of the fixed block 10. In addition, a rubber pad is fixed on the lower side of the bonding plate 12 to prevent damage to the wafer. When the wafer is placed between the inside of the discharge trough 9, the bonding plate 12 can be opened to allow the bonding plate 12 to rotate on one side of the fixed block 10 through the reset shaft 11, so that the bonding plate 12 can be flipped. Then, the bonding plate 12 can be closed to limit the edge of the wafer. In addition, a feeding electric push rod 15 is provided, and the feeding electric push rod 15 is used to drive the discharge tray 8 to push the material, which can effectively facilitate the loading and unloading of materials.

[0034] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0035] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer processing cutting device capable of removing dust, comprising a load-bearing frame (1), wherein a control panel (2) is installed on the surface of the load-bearing frame (1) for controlling the start and stop of the cutting device of the load-bearing frame (1), and a water delivery component (3) is installed on one side of the load-bearing frame (1) for spraying water into a placement frame (4) installed on the top of the load-bearing frame (1); It is characterized in that Also includes: A group of placement racks (4) are fixed at the top of the load-bearing frame (1), and a driving assembly (5) is installed at one side of the interior of the placement rack (4), and the driving assembly (5) can be used to process the wafers in the material placing tray (8) placed at the interior of the placement rack (4); A water outlet cleaning mechanism is installed at one side of the interior of the placement rack (4), which can clean the waste chips generated by the processing of the drive component (5), thereby facilitating the collection and processing of the waste chips.

2. A wafer processing cutting device capable of removing dust according to claim 1, characterized in that: The water outlet cleaning mechanism comprises a water delivery component (3), and the output end of the water delivery component (3) is connected to one end of a water spray head (301), one side of the water spray head (301) is arranged on one side of a partition plate (6), the partition plate (6) is fixed inside a placement rack (4), and a movable groove (7) is provided on the inner side of the partition plate (6), a discharge port (13) is provided on one side of the placement rack (4) and the load-bearing rack (1) near the water spray head (301), and a collection box (14) is provided directly below the discharge port (13), and waste scraps can be collected and processed in a centralized manner through the collection box (14).

3. The wafer processing cutting device capable of removing dust according to claim 2, characterized in that: A transparent door panel (101) is provided on the surface of the load-bearing frame (1), and one side of the transparent door panel (101) corresponds to one side of the collection box (14), so that the collection box (14) can be easily collected and processed.

4. The wafer processing cutting device capable of removing dust according to claim 1, characterized in that: The driving assembly (5) comprises a sliding base (501) slidably arranged on the inner bottom surface of the placement rack (4), and two groups of longitudinal electric push rods (502) are installed on one side of the sliding base (501), the output end position of the longitudinal electric push rod (502) is fixed on one side of the high-speed motor (503), the outer side of the high-speed motor (503) is fixed in the ring of the limiting guide frame (504), and the longitudinal position of the limiting guide frame (504) can be stably adjusted by the longitudinal electric push rod (502), the output end position of the high-speed motor (503) is connected to a group of cutting blades (505), and one side position of the sliding base (501) is fixed to the output end position of the front and rear electric push rods (506), so that the position of the sliding base (501) can be adjusted, and a groove is provided at the bottom of the sliding base (501), the inner wall of the groove is in contact with the guide block (507) fixed on the inner bottom surface of the placement rack (4), so that the front and rear position of the sliding base (501) can be adjusted.

5. The wafer processing cutting device capable of removing dust according to claim 4, characterized in that: One end of the cutting blade (505) is arranged below the water spray head (301), and the outer side of the cutting blade (505) penetrates the interior of the moving groove (7), and the height of the moving groove (7) is greater than the height of the high-speed motor (503) and the movement of the cutting blade (505).

6. The wafer processing cutting device capable of removing dust according to claim 1, characterized in that: A material discharge tray (8) is arranged inside the placement rack (4), and the rear side position of the material discharge tray (8) is connected to the output end position of the feeding electric push rod (15), so as to facilitate pushing out the material discharge tray (8) and the wafers placed inside the material discharge tray (8) after opening the door panel (401). A fixing mechanism is arranged at the top position of the material discharge tray (8), and the fixing mechanism includes a material discharge trough (9) opened at the top position of the material discharge tray (8), and a fixing block (10) fixed at an equal angle to the outer side position of the material discharge trough (9). The end position of the fixing block (10) is rotatably connected to a reset shaft (11), and the other end position of the reset shaft (11) is fixed to one side of the bonding plate (12).

7. The wafer processing cutting device capable of removing dust according to claim 6, characterized in that: A torsion spring is embedded on the outer side of the reset shaft (11) to facilitate driving the bonding plate (12) to reset on one side of the fixed block (10). In addition, a rubber pad is fixed on the lower side of the bonding plate (12) to prevent damage to the wafer.

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