Magnetic annular semiconductor refrigeration assembly

Abstract

The utility model provides a magnetic attraction annular semiconductor refrigeration assembly which comprises an annular semiconductor refrigeration piece, the annular semiconductor refrigeration piece comprises a refrigeration face and a heating face, a heat dissipation device is arranged on one side of the heating face, the heat dissipation device comprises a heat conduction piece with a certain length, and the heat conduction piece makes contact with the heating face to conduct heat transfer. One end of the heat conducting piece forms a ring matched with the annular semiconductor chilling plate in shape; the other end of the heat conduction piece is provided with a heat dissipation piece used for increasing the heat dissipation area or the heat storage amount. And a magnetic part with magnetism is arranged on the inner ring or the outer ring of the annular semiconductor chilling plate. According to the scheme, due to the structural characteristics of the annular semiconductor chilling plate, a space for accommodating the charging coil and the magnet is formed in the annular semiconductor chilling plate, and the annular semiconductor chilling plate, the charging coil and the magnet can be basically arranged on the same plane, so that the cooling capacity generated by the refrigerating surface can be directly conducted away without conduction through the charging coil and the magnet; and the refrigeration effect is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wireless charging equipment, in particular to a magnetically attracted annular semiconductor refrigeration component. Background Art

[0002] With the increasing demand for fast charging technology from mobile terminal users, various manufacturers have stepped up their research on fast charging technology. As the research deepened, it was found that while increasing the charging power, the heat generated at the contact point between the mobile terminal and the wireless charging device was particularly serious. When the temperature reached a certain value, the charging power could not be increased and the expected effect could not be achieved. Therefore, it was necessary to find a way to cool it down.

[0003] Semiconductor refrigeration sheets are widely used to dissipate heat from components that need to be cooled due to their small size and fast cooling. A patent document with authorization announcement number CN218352234U discloses a cooling device for a vehicle-mounted wireless charging seat, including a semiconductor refrigeration plate and a control unit. The semiconductor refrigeration plate is installed on the vehicle-mounted wireless charging seat. When the wireless charging seat is working, the control unit is used to control the semiconductor refrigeration plate to export the heat from the vehicle-mounted wireless charging seat. This solution actively exports the heat accumulated in the vehicle-mounted wireless charging seat area during the charging process and then dissipates the heat, so that the cooling fan is away from the vehicle-mounted wireless charging seat, ensuring heat dissipation while avoiding noise pollution.

[0004] However, whether it is a car-mounted wireless charging stand, a desktop wireless charging stand, or a portable power bank, a charging coil and a magnet are required. In the cooling device of the above structure, the charging coil and the magnet can only be set on the semiconductor refrigeration plate, that is, the cold energy generated by the semiconductor refrigeration plate needs to be transferred to the mobile terminal through the charging coil and the magnet. This process will cause a large amount of cold energy loss, resulting in poor cooling effect.

[0005] Therefore, it is necessary to design a new structure to solve the problem of poor refrigeration effect. Utility Model Content

[0006] In order to solve the problems existing in the prior art, the utility model provides a magnetic annular semiconductor refrigeration component. By setting an annular refrigeration plate, the charging coil and the magnet are set on the inner circle or outer circle of the refrigeration plate, so that the coldness of the refrigeration plate can be directly transferred to the mobile terminal, which can effectively improve the refrigeration effect.

[0007] To achieve the above-mentioned purpose, the technical solution of the utility model is: a magnetic annular semiconductor refrigeration component, including an annular semiconductor refrigeration plate, the annular semiconductor refrigeration plate includes a cooling surface and a heating surface, a heat dissipation device is provided on one side of the heating surface, the heat dissipation device includes a heat conductive member with a length, the heat conductive member contacts the heating surface for heat transfer; one end of the heat conductive member forms a ring shape matching the shape of the annular semiconductor refrigeration plate; a heat dissipation member for increasing the heat dissipation area or heat storage is provided at the other end of the heat conductive member; a magnetic member with magnetism is provided on the inner ring or outer ring of the annular semiconductor refrigeration plate.

[0008] With the above arrangement, the structural features of the annular semiconductor refrigeration plate allow it to have space inside for accommodating the charging coil and the magnet. The annular semiconductor refrigeration plate, the charging coil and the magnet can be arranged basically in the same plane. Then, the cold generated by the cooling surface can be directly conducted away without the need for conduction through the charging coil and the magnet, thereby greatly improving the cooling effect. At the same time, the heat conductive element can promptly conduct the heat generated by the heating surface to the heat sink, and the heat can be dissipated through the heat sink, thereby further improving the cooling effect of the annular semiconductor refrigeration plate. The semiconductor refrigeration plate, the heat conductive element and the heat sink do not need to be stacked in the height direction, thereby effectively reducing the thickness of the entire refrigeration assembly. Magnetic elements can be arranged on the inner or outer ring of the annular semiconductor refrigeration plate to achieve magnetic adsorption of the mobile terminal, thereby improving the convenience of charging the mobile terminal. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the utility model;

[0010] Figure 2 It is a schematic diagram of the exploded structure of an embodiment of the utility model;

[0011] Figure 3 This is a schematic diagram of another implementation of the heat sink in the embodiment of the utility model;

[0012] Figure 4 This is a schematic diagram of the exploded structure of another embodiment of the utility model. DETAILED DESCRIPTION

[0013] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0014] like Figures 1 to 4 As shown, a magnetic annular semiconductor refrigeration component includes an annular semiconductor refrigeration plate 1.

[0015] To simplify the structure, in this embodiment, the cross-section of the annular semiconductor refrigeration plate 1 is set to a circular ring shape. Of course, the cross-section of the annular semiconductor refrigeration plate 1 can also be any required shape, such as a rectangle, a diamond or an ellipse. The cross-sectional shape does not affect the function as long as it can meet the needs. In this way, the center of the annular semiconductor refrigeration plate 1 has an accommodating space. Since the annular semiconductor refrigeration plate 1 is a mature existing technology, its specific structure is not repeated here.

[0016] The annular semiconductor refrigeration plate 1 has a cooling surface 10 and a heating surface 11. After power is turned on, the temperature of the cooling surface 10 drops rapidly to achieve cooling, while the temperature of the heating surface 11 rises rapidly.

[0017] A heat dissipation device is provided on one side of the heating surface 11 , and the heat dissipation device includes a heat conductive member 21 having a length, and the heat conductive member 21 contacts the heating surface 11 for heat transfer; one end of the heat conductive member 21 forms a ring shape matching the shape of the annular semiconductor refrigeration plate 1 .

[0018] In this embodiment, the heat conducting member 21 is a copper tube, the middle of which is bent to form a ring that matches the shape of the annular semiconductor cooling plate 1; and both ends of the copper tube extend in parallel in a direction away from the ring. This arrangement can simplify the processing of the copper tube.

[0019] A heat dissipation member 22 for increasing the heat dissipation area or the heat storage amount is provided at the other end of the heat conducting member 21 .

[0020] In this embodiment, the heat sink 22 is a heat sink fin group, which is closely connected to the heat conductor 21 to dissipate heat. To reduce costs, the heat sink fin group is usually made of aluminum alloy, and of course, the heat sink fin group can also be made of copper alloy.

[0021] In order to enhance the heat dissipation of the heat dissipation fin group, a heat dissipation fan (not shown) is further provided on the heat dissipation fin group, and the air inlet of the heat dissipation fan is close to the heat dissipation fin group to enhance air convection and improve the heat dissipation effect.

[0022] The heat dissipation device further includes a heat storage member 23 . In this embodiment, the heat storage member 23 is designed to be annular. The outer diameter of the heat storage member 23 is larger than the outer diameter of the heat conductive member 21 ; the inner diameter of the heat storage member 23 is smaller than or equal to the outer diameter of the heat conductive member 21 .

[0023] The heat conducting member 21 has an annular end embedded in the heat storage member 23. Usually, when the installation space is sufficient, the top surface of the heat conducting member 21 is flush with the top surface of the heat storage member 23, but when necessary, the top surface of the heat conducting member 21 can be set lower than the top surface of the heat storage member 23, that is, the heat conducting member 21 is embedded deeper in the heat storage member 23, so that the height of the combined assembly can be compressed and the assembly can be thinner.

[0024] Usually, in order to reduce the cost, the heat storage member 23 is made of aluminum alloy. Of course, the heat storage member 23 can also be made of copper alloy.

[0025] The heat storage element 23 can not only be used to store heat, but also can dissipate a portion of the heat due to its heat dissipation area.

[0026] As another implementation of this embodiment, the heat storage member 23 is circular (not shown), and the outer diameter of the heat storage member 23 is larger than the outer diameter of the heat conductive member 21; a receiving cavity is provided on the heat storage member 23, and the receiving cavity extends inward from the side in contact with the heat conductive member 21.

[0027] In addition to the above embodiments, the heat storage element 23 may also be rectangular (not shown), and a through hole or a receiving cavity is provided on the heat storage element 23 .

[0028] A magnetic member having magnetic properties is provided on the inner ring or the outer ring of the annular semiconductor refrigeration plate 1 .

[0029] In this embodiment, the magnetic component is a magnet 3, which is arranged on the outer ring of the annular semiconductor cooling plate 1. The magnet 3 can be made into a single small piece or a whole ring, which can be used to adsorb the mobile terminal.

[0030] A cooling member 4 which can cover both the annular semiconductor refrigeration plate 1 and the magnet 3 is provided on one side of the cooling surface of the annular semiconductor refrigeration plate 1 .

[0031] The cooling member 4 may be made of metal material or thermally conductive silicone etc. The cooling member 4 is used for contacting with the mobile terminal. In the present embodiment, the cooling member 4 is formed by deep drawing and then stamping of aluminum alloy.

[0032] like Figure 3 As shown, as another embodiment, when the cooling power is low, the heat sink can be a heat sink 22b, and grooves are cut on the surface of the heat sink 22b to increase the heat dissipation area. In this way, there is no need to equip the heat sink 22b with a cooling fan, which can reduce the production cost.

[0033] like Figure 4 As shown, as another embodiment, the difference is that the heat conducting member is a VC liquid cooling heat spreader 21c, and the end of the VC liquid cooling heat spreader 21c that contacts the annular semiconductor refrigeration plate 1 forms a ring that matches the shape of the annular semiconductor refrigeration plate 1.

[0034] VC liquid cooling vapor chamber 21c is also called vacuum chamber vapor chamber or temperature plate. VC is the English name of Vapor Chamber. VC liquid cooling vapor chamber 21c is a component that transfers heat efficiently. It is a mature existing technology and its specific structure is not described in detail here.

[0035] During assembly, silicone grease is applied between the cooling surface 10 and the cooling member 4 and between the heating surface 11 and the heat conducting member 21 to improve the efficiency of cooling and heat conducting.

[0036] In this solution, the structural features of the annular semiconductor refrigeration plate 1 provide a space inside it for accommodating the charging coil and the magnet. The annular semiconductor refrigeration plate 1, the charging coil and the magnet 3 can be arranged basically in the same plane. Then, the cold generated by the cooling surface 10 can be directly conducted away without the need for conduction through the charging coil and the magnet 3, thereby greatly improving the cooling effect. At the same time, the heat conductor 21 can promptly conduct the heat generated by the heating surface 11 to the heat sink 22, and the heat is dissipated through the heat sink 22, thereby further improving the cooling effect of the annular semiconductor refrigeration plate 1. Arranging the magnet 3 in the inner ring or the outer ring of the annular semiconductor refrigeration plate 1 can realize magnetic adsorption of the mobile terminal, thereby improving the convenience of charging the mobile terminal.

Claims

1. A magnetic annular semiconductor refrigeration component, comprising an annular semiconductor refrigeration plate, the annular semiconductor refrigeration plate comprising a cooling surface and a heating surface, characterized in that: A heat dissipation device is provided on one side of the heating surface, the heat dissipation device includes a heat conducting member having a length, the heat conducting member contacts the heating surface to transfer heat; one end of the heat conducting member is formed into a ring shape matching the shape of the annular semiconductor refrigeration plate; a heat dissipation member is provided on the other end of the heat conducting member for increasing the heat dissipation area or the heat storage amount; A magnetic part is provided on the inner ring or the outer ring of the annular semiconductor refrigeration plate.

2. The magnetic annular semiconductor refrigeration component according to claim 1, characterized in that: The heat dissipation device further comprises a heat storage component, and one end of the heat conducting component having a ring shape is embedded in the heat storage component.

3. The magnetic annular semiconductor refrigeration component according to claim 2, characterized in that: The top surface of the heat conducting member is lower than the top surface of the heat storing member.

4. The magnetic annular semiconductor refrigeration component according to claim 1, characterized in that: The magnetic component is a magnet, and a cooling member capable of covering both the annular semiconductor refrigeration plate and the magnet is provided on one side of the cooling surface of the annular semiconductor refrigeration plate.

5. The magnetic annular semiconductor refrigeration component according to claim 1, characterized in that: The heat conducting member is a copper tube, the middle portion of which is bent to form a ring that matches the shape of the annular semiconductor refrigeration plate; both ends of the copper tube extend in parallel in a direction away from the ring.

6. The magnetic annular semiconductor refrigeration component according to claim 1, characterized in that: The heat conducting member is a VC liquid cooling vapor chamber, and one end of the VC liquid cooling vapor chamber in contact with the annular semiconductor refrigeration plate forms a ring shape that matches the shape of the annular semiconductor refrigeration plate.

7. The magnetic annular semiconductor refrigeration component according to claim 2, characterized in that: The heat storage element is annular, and the outer diameter of the heat storage element is larger than the outer diameter of the heat conducting element; the inner diameter of the heat storage element is smaller than or equal to the outer diameter of the heat conducting element.

8. The magnetic annular semiconductor refrigeration component according to claim 2, characterized in that: The heat storage element is circular, and its outer diameter is larger than that of the heat conducting element. A receiving cavity is provided on the heat storage element, and the receiving cavity extends inward from a side in contact with the heat conducting element.

9. The magnetic annular semiconductor refrigeration component according to claim 2, characterized in that: The heat storage element is rectangular and is provided with a through hole or a receiving cavity.

10. The magnetic annular semiconductor refrigeration component according to claim 1, characterized in that: The heat sink is a heat sink fin group or a heat sink block; It also includes a heat dissipation fan, which is used to dissipate heat from the heat dissipation fin group.

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