Sensor device

Abstract

The utility model relates to the technical field of semiconductor luminescence, and discloses a sensor device, which comprises a substrate, an optical chip, a light-transmitting glue layer, a high-reflection glue layer and a fence part. The optical chips are arranged on the substrate, and the number of the optical chips is at least two. The light-transmitting glue layer at least covers a part of the upper surface of the optical chip. The side face of the light-transmitting glue layer is provided with a reflecting face used for reflecting edge large-angle light. And the high-reflection glue layer tightly covers the reflecting surface, or tightly covers the reflecting surface and the side surface of the optical chip, or tightly covers the reflecting surface, the side surface of the optical chip and a part of the upper surface. The enclosure part is arranged on the base plate. And the enclosure part covers the high-reflection glue layer. The side, away from the substrate, of the enclosure part extends to the position above the reflecting surface. According to the utility model, the reflecting surface and the high-reflection adhesive layer are arranged, so that edge wide-angle light can be fully utilized, the light energy utilization rate is improved, and the detection accuracy of a sensor device is further improved. Meanwhile, the high-reflection glue layer can enable the connection between the optical chip and the substrate to be firmer, and the reliability of the whole sensor device is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor light emitting, and in particular relates to a sensor device. Background Art

[0002] A sensor device is a device that can detect light signals and convert them into electrical signals. Working principle: The sensor device is a collection of at least two or two groups of optical chips that emit and receive light. The light emitting chip emits a light beam, which passes through the optical system to illuminate the object to be measured. The light beam reflected or absorbed by the object passes through the optical system to illuminate the photosensitive area of ​​the photosensitive chip. The sensor device converts the light signal into an electrical signal, and finally outputs it after being processed by the signal processing circuit. The structure and manufacturing method of the existing sensor device are as follows:

[0003] Prior art 1:

[0004] Step A1: Refer to Figure 3 At least two optical chips 2 are fixed on the substrate 1, and a transparent adhesive layer 3 is covered on the optical chip 2. The transparent adhesive layer 3 has the function of encapsulating the optical chip 2 and adjusting the outgoing light and the received light. The transparent adhesive layer 3 covers all the optical chips 2 as a whole, that is, the substrate 1 around the optical chip 2 is covered by the transparent adhesive layer.

[0005] Step A2: Refer to Figure 4 , grooves 6 are cut on the transparent adhesive layer 3 around the optical chip 2 and between adjacent optical chips 2. The substrate 1 in the area where the groove 6 is located is exposed, so that the enclosure 4 formed in the subsequent process is directly connected to the substrate 1. This setting is because the adhesion between the enclosure 4 and the transparent adhesive layer 3 is not as strong as the adhesion between the enclosure 4 and the substrate 1, which improves the reliability of the sensor device.

[0006] Step A3: Cover the enclosure 4 directly in the groove 6 or on the side and part of the top surface of the groove 6 and the adjacent light-transmitting adhesive layer 3 by dispensing, injection molding or molding, referring to Figure 5 The enclosure 4 has the function of preventing the emitted light / received light of different optical chips 2 from interfering with each other and preventing crosstalk.

[0007] The method of the prior art 1 adopts dispensing, injection molding or molding to directly form the enclosure 4 in the groove 6.

[0008] Prior art 2: Steps A1 and A2 are the same as prior art 1, except for step A3. Figure 6 Step A3: prefabricate the enclosure 4 matching the groove 6, apply adhesive to the bottom of the enclosure 4, insert the enclosure 4 into the groove 6 and glue it to the substrate 1, and form a Figure 7 sensor devices.

[0009] The production process of the prior art 1 and 2 is complicated, and the groove 6 needs to be cut in advance. Especially in the prior art 2, since the size of the groove 6 is small, the processing accuracy of the enclosure 4 and the assembly accuracy of the enclosure 4 and the groove 6 are very high, the processing difficulty is great, and the yield and production efficiency are low.

[0010] In addition, the large-angle edge light of the prior art 1 and 2 is reflected multiple times between the enclosure 4 and the optical chip 2, and most of it is absorbed by the optical chip 2, with very little emitted from the front of the optical chip 2, resulting in light energy loss.

[0011] Based on the above, the problem to be solved at present is: to provide a sensor device with high light energy utilization, high accuracy, simple structure and reliability. Utility Model Content

[0012] The utility model aims to provide a sensor device, aiming to solve the problems of low light energy utilization, poor light control effect, low accuracy, complex structure and poor reliability of the sensor device in the prior art.

[0013] The utility model is implemented as follows: a sensor device comprises:

[0014] substrate;

[0015] An optical chip, which is disposed on the substrate, and the number of the optical chips is at least 2;

[0016] A light-transmitting adhesive layer, which at least covers a portion of the upper surface of the optical chip; a side surface of the light-transmitting adhesive layer is provided with a reflecting surface for reflecting edge large-angle light;

[0017] A high-reflective adhesive layer, which is provided on the substrate and tightly covers the reflective surface, or tightly covers the reflective surface and the side surface of the optical chip, or tightly covers the reflective surface, the side surface of the optical chip and a part of the upper surface;

[0018] The enclosure portion is arranged on the substrate; the enclosure portion covers the high-reflection adhesive layer; and the side of the enclosure portion away from the substrate extends to above the reflective surface.

[0019] Furthermore, the high-reflective adhesive layer covers part or all of the upper surface of the substrate.

[0020] Furthermore, the light-transmitting adhesive layer covers part or all of the upper surface of the optical chip; or the light-transmitting adhesive layer covers the upper surface and part of the side surfaces of the optical chip, or the light-transmitting adhesive layer covers the upper surface and all the side surfaces of the optical chip.

[0021] Furthermore, the light-transmitting adhesive layer is not higher than the enclosure portion.

[0022] Furthermore, the upper surface of the light-transmitting adhesive layer is a curved surface or a flat surface.

[0023] Furthermore, the optical chip includes a light-emitting chip and a photosensitive chip.

[0024] Compared with the prior art, the sensor device provided by the utility model has the following beneficial effects:

[0025] The utility model is provided with a reflective surface 31 and a high-reflective adhesive layer 5, so that the light incident on the interface between the reflective surface 31 and the high-reflective adhesive layer 5 is fully reflected toward the front of the optical chip 2 or the photosensitive area of ​​the optical chip 2, and the reflected light propagates in the direction close to the optical axis, and finally emerges from the front of the optical chip 2 or is incident on the photosensitive area, thereby reducing the absorption of large-angle light at the edge by the enclosure 4, reducing the design difficulty and manufacturing accuracy of the reflective surface 31, improving the utilization rate of light energy, improving the brightness, and thus improving the accuracy of sensor device detection. The high-reflective adhesive layer 5 can connect the optical chip 2 and the substrate 1, making the entire structure connection more stable and reliable. In addition, the high-reflective adhesive layer 5 covers the side of the optical chip 2, so that the optical chip 2 can not only dissipate heat through the substrate 1 connected to the bottom, but also dissipate heat through the high-reflective adhesive layer 5 connected to the side, thereby making the heat dissipation effect of the optical chip 2 better and the product service life longer. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the cross-sectional structure of the sensor device provided by the utility model;

[0027] Figure 2 It is a schematic cross-sectional structure diagram of the first embodiment of the sensor device provided by the utility model;

[0028] Figure 3 It is a schematic diagram of the state after the step A1 of the sensor device manufacturing method of the prior art 1 and the prior art 2 is implemented;

[0029] Figure 4 It is a schematic diagram of the state after the step A2 of the sensor device manufacturing method of the prior art 1 and the prior art 2 is implemented;

[0030] Figure 5 It is a schematic diagram of the state after the step A3 of the sensor device manufacturing method of the prior art 1 is implemented;

[0031] Figure 6 It is a schematic diagram of the implementation process of step A3 of the sensor device manufacturing method of the prior art II;

[0032] Figure 7 It is a schematic diagram of the state after the step A3 of the sensor device manufacturing method of the prior art 2 is implemented;

[0033] In the figure: 1-substrate; 2-optical chip; 3-light-transmitting adhesive layer; 31-reflecting surface; 4-enclosing part; 5-high-reflective adhesive layer; 6-groove. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0035] The implementation of the present utility model is described in detail below in conjunction with specific embodiments.

[0036] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present utility model, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0037] Reference Figure 1-2 As shown, it is a preferred embodiment provided by the utility model.

[0038] The sensor device includes a substrate 1, an optical chip 2, a light-transmitting adhesive layer 3, a highly reflective adhesive layer 5 and a blocking portion 4, as shown in FIG. Figure 1 . The optical chip 2 is arranged on the substrate 1, and the number of the optical chips 2 is at least 2. The optical chip 2 includes a light-emitting chip for emitting light and a photosensitive chip for receiving light. The optical chip 2 can also be set as a combination of several groups of optical chip 2 arrays. The light-transmitting adhesive layer 3 at least covers the upper surface of the optical chip 2, and is used to encapsulate the optical chip 2 and optically adjust the emitted light / received light. The covering method of the light-transmitting adhesive layer 3: 1. Only covering part or all of the upper surface of the optical chip 2; 2. Covering the upper surface and part of the side of the optical chip 2; 3. Covering the upper surface and all the side of the optical chip 2. According to the expected optical shaping effect, the upper surface of the light-transmitting adhesive layer 3 can be set as a curved surface or a flat surface.

[0039] The side of the light-transmitting adhesive layer 3 is provided with a reflective surface 31 for reflecting light at large angles at the edge. The reflective surface 31 is a plane or a curved surface in the shape of an inverted cone, that is, the side of the light-transmitting adhesive layer 3 is set as a plane or a curved surface at a certain angle to the upper surface of the optical chip 2. The high-reflective adhesive layer 5 covers the reflective surface 31 in the following ways: 1. Only the reflective surface 31 is tightly covered; 2. The reflective surface 31 and the side of the optical chip 2 are covered; 3. The reflective surface 31 and the side and part of the upper surface of the optical chip 2 are covered. The high-reflective adhesive layer 5 covers part or all of the upper surface of the substrate 1. Light is incident on the interface between the reflective surface 31 and the high-reflective adhesive layer 5 and is reflected. The reflected light propagates in the direction close to the optical axis and finally emerges from the front of the optical chip 2 or is incident on the photosensitive area. The high-reflective adhesive layer 5 is used to cut off the light emitted at large angles from the side or edge and make full use of it; it also plays a role in fixing the optical chip 2 to the substrate 1, making the entire structure more stable and reliable. This setting utilizes the large-angle edge light that is not easily utilized on the edges, improves the utilization rate of light energy, increases the overall brightness, and further improves the accuracy of the sensor device.

[0040] The enclosure 4 is used to separate the optical chips 2 to prevent light interference between different optical chips 2, which affects the accuracy and reliability of the sensor device. The enclosure 4 is arranged around the high-reflective adhesive layer 5. The enclosure 4 extends from the side of the substrate 1 to the top of the side of the light-transmitting adhesive layer 3, and surrounds the upper surface of the light-transmitting adhesive layer 3 to prevent light from crossing. Preferably, the highest point of the light-transmitting adhesive layer 3 is not higher than the highest point of the enclosure 4.

[0041] The covering manner of the optical chips 2 and the light-transmitting adhesive layer 3 in each sensor device of the present invention, as well as the connection manner of the optical chip 2 and the enclosure 4 can be the same or different, and the above-mentioned arrangements are all within the scope of the present invention.

[0042] Embodiment 1: The sensor device comprises a substrate 1, an optical chip 2, a light-transmitting adhesive layer 3, a highly reflective adhesive layer 5 and a blocking portion 4, referring to Figure 2 . The optical chips 2 include two and are arranged on the substrate 1. The upper surface of one optical chip 2 is covered with a light-transmitting adhesive layer 3, and the upper surface of the other optical chip 2 is partially covered with the light-transmitting adhesive layer 3. A reflective surface 31 is arranged on the side of the light-transmitting adhesive layer 3. The upper surface of the light-transmitting adhesive layer 3 is arranged as a convex surface. The high-reflective adhesive layer 5 covers the side and reflective surface 31 of one optical chip 2, and covers the side, part of the upper surface and reflective surface 31 of another optical chip 2. The enclosure 4 is arranged on the substrate 1, and the lower part of the enclosure 4 tightly covers the four sides of the high-reflective adhesive layer 5, and the upper part of the enclosure 4 extends to the top of the side of the light-transmitting adhesive layer 3 and surrounds the four sides of the upper surface of the light-transmitting adhesive layer 3.

[0043] This does not limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A sensor device, characterized in that: include: substrate(1); An optical chip (2) disposed on the substrate (1), the number of the optical chips (2) being at least 2; A light-transmitting adhesive layer (3) which at least covers a portion of the upper surface of the optical chip (2); a side surface of the light-transmitting adhesive layer (3) is provided with a reflecting surface (31) for reflecting edge large-angle light; A high-reflective adhesive layer (5), which is provided on the substrate (1) and tightly covers the reflective surface (31), or tightly covers the reflective surface (31) and the side surface of the optical chip (2), or tightly covers the reflective surface (31), the side surface of the optical chip (2) and part of the upper surface; A blocking portion (4) is provided on the substrate (1); the blocking portion (4) covers the high-reflection adhesive layer (5); and a side of the blocking portion (4) away from the substrate (1) extends to above the reflective surface (31).

2. The sensor device according to claim 1, characterized in that The high-reflective adhesive layer (5) covers part or all of the upper surface of the substrate (1).

3. The sensor device according to claim 1, characterized in that: The light-transmitting adhesive layer (3) covers part or all of the upper surface of the optical chip (2); or the light-transmitting adhesive layer (3) covers the upper surface and part of the side surfaces of the optical chip (2); or the light-transmitting adhesive layer (3) covers the upper surface and all the side surfaces of the optical chip (2).

4. The sensor device according to claim 1, characterized in that The light-transmitting adhesive layer (3) is not higher than the enclosure portion (4).

5. The sensor device according to claim 1, characterized in that: The upper surface of the light-transmitting adhesive layer (3) is a curved surface or a flat surface.

6. The sensor device according to claim 1, characterized in that The optical chip (2) comprises a light-emitting chip and a photosensitive chip.

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