Laser module with high-thermal-conductivity tube shell

Abstract

The utility model provides a laser module with a high thermal conductivity tube shell, which belongs to the technical field of illumination light sources and comprises a copper substrate and a plurality of tube shell modules, and each of the tube shell modules comprises an oxygen-free copper bottom plate, a kovar ring and a ceramic tube shell; wherein the ceramic tube shell is installed on the upper surface of the copper substrate in a surface mounting packaging mode, four tube shell bonding pads are symmetrically arranged at the bottom of the ceramic tube shell, and the kovar ring is fixedly connected to the bottom of the inner side wall of the ceramic tube shell; according to the utility model, the oxygen-free copper base plate, the kovar ring and the ceramic tube shell are installed in a surface-mounted packaging mode, the packaging size of the laser is greatly reduced, and the oxygen-free copper base plate, the kovar ring and the ceramic tube shell can be utilized to carry out heat conduction efficiently, so that heat dissipation of the laser is facilitated. And the surface-mounted element has the characteristics of small size, light weight, high thermal conductivity, convenience in installation and easiness in circuit integration.

Description

Technical Field

[0001] The utility model relates to a laser module, in particular to a laser module with a tube shell having high thermal conductivity, and belongs to the technical field of lighting light sources. Background Art

[0002] With the continuous advancement of packaging technology, the packaging of laser chips has a trend of miniaturization. Lasers in the visible light band need to be sealed to ensure their lifespan. Common packaging forms include TO packaging, which is divided into 9mm packaging and 5.6mm packaging. These are all circular coaxial packaging forms.

[0003] In order to reduce the size, Osram of Germany developed a 3.8mm coaxial package. Fig.14 As shown in the figure, the diameter of the metal tube holder represents the meaning of its parameters, and 3.8mm means that the diameter of the metal tube holder is 3.8mm. Its characteristics are small pins, simple packaging, convenience and low cost.

[0004] For larger volumes or when more pins are required, or when fiber coupling is required, the design is as follows Fig.15 The rectangular tube shell shown is mostly made of metal material, and has pins extending from the bottom or side walls.

[0005] Kyocera Corporation of Japan has also developed tube shells with ceramic shell walls, such as Fig.16 As shown, its main thermal conductivity is 260w / mk and the thermal conductivity of tungsten copper as the carrier is 175W / mk. The main reason why the thermal conductive material is tungsten copper is that the thermal expansion coefficients of tungsten copper and ceramic are close. After the two are welded together at high temperature, the deformation is small and there will be no cracking.

[0006] However, the volume problem is the biggest problem of the above packaging forms. Therefore, a laser module with a tube shell with high thermal conductivity is proposed. Utility Model Content

[0007] In view of this, the utility model provides a laser module with a tube shell with high thermal conductivity to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial choice.

[0008] The technical solution of the embodiment of the utility model is implemented as follows: a laser module with a tube shell with high thermal conductivity includes a copper substrate and a plurality of tube shell modules, wherein the plurality of tube shell modules each include an oxygen-free copper base plate, a Kovar ring and a ceramic tube shell;

[0009] The ceramic tube shell is installed on the upper surface of the copper substrate in the form of a surface mount package, four tube shell pads are symmetrically arranged at the bottom of the ceramic tube shell, the kovar ring is fixedly connected to the bottom of the inner wall of the ceramic tube shell, and the oxygen-free copper base plate is fixedly connected to the bottom of the kovar ring.

[0010] Further preferably, SiC ceramics are evenly installed on one side of the inner wall of the ceramic tube shell, edge-emitting laser chips are installed on the upper surface of the SiC ceramics, reflectors are evenly installed in the middle of the inner wall of the ceramic tube shell, and a photodiode is installed on one side of the inner wall of the ceramic tube shell.

[0011] Further preferably, four first metallized regions are symmetrically provided at the bottom of the inner side wall of the ceramic tube shell, a third metallized region is provided on the upper surface of the ceramic tube shell, and a second metallized region is provided at the bottom of the inner side wall of the ceramic tube shell.

[0012] Further preferably, two silver-copper welding sheets are provided between the oxygen-free copper base plate and the kovar ring, and between the kovar ring and the ceramic tube shell, the oxygen-free copper base plate is welded to the bottom of the kovar ring through the silver-copper welding sheet, and the top of the kovar ring is welded to the bottom of the second metallized area through the silver-copper welding sheet.

[0013] Further preferably, an oxygen-free copper boss is provided on one side of the upper surface of the copper substrate, a circuit wiring area is provided on the other side of the upper surface of the copper substrate, a thermal and electrical isolation area is provided on the outer side of the oxygen-free copper boss, the upper surface of the copper substrate is coated with an insulating layer, the upper surface of the insulating layer is coated with a conductive layer, the upper surface of the conductive layer is coated with an ink layer, the upper surface of the ink layer is coated with a marking layer, and the thickness of the conductive layer is 0.15mm-0.2mm.

[0014] Further preferably, two connecting terminals are symmetrically mounted on one side of the upper surface of the copper substrate, a temperature measuring element is mounted on the other side of the upper surface of the copper substrate, and the bottoms of the two connecting terminals and the temperature measuring element are connected to the conductive layer.

[0015] Further preferably, a sealing window piece is provided above the ceramic tube shell, a fourth metallized area is provided at the bottom of the sealing window piece, a light-transmitting area is provided in the middle of the sealing window piece, and the fourth metallized area is welded to the upper surface of the third metallized area.

[0016] Further preferably, the thickness of the ceramic tube shell is greater than or equal to 0.6 mm, and the thickness of the sealing window piece is 0.2-1.0 mm.

[0017] The embodiment of the utility model has the following advantages due to the adoption of the above technical solution:

[0018] 1. The utility model uses an oxygen-free copper base plate, a Kovar ring and a ceramic tube shell to install in the form of a surface mount package, thereby greatly reducing the size of the laser package, and can use the oxygen-free copper base plate, the Kovar ring and the ceramic tube shell to efficiently conduct heat to dissipate the heat of the laser.

[0019] Second, the utility model also has the characteristics of small size, light weight, high thermal conductivity, convenient installation and easy circuit integration of the surface mount component.

[0020] The above summary is for the purpose of description only and is not limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the utility model will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 It is a structural diagram of the utility model;

[0023] Figure 2 It is an isometric view of the ceramic tube shell of the utility model;

[0024] Figure 3 It is a schematic diagram of the top view of the ceramic tube shell of the utility model;

[0025] Figure 4 It is a bottom view structural diagram of the ceramic tube shell of the utility model;

[0026] Figure 5 The exploded diagram of the oxygen-free copper base plate, the Kovar ring and the ceramic shell of the utility model;

[0027] Figure 6 It is a schematic diagram of the cross-sectional structure of the ceramic tube shell of the utility model;

[0028] Figure 7 This is a schematic diagram of the cross-sectional structure of the copper substrate of the utility model;

[0029] Figure 8 This is a schematic diagram of the top view of the copper substrate of the utility model;

[0030] Fig. 9 For this utility model Figure 7 A schematic diagram of the enlarged structure of region A;

[0031] Fig.10 It is a schematic diagram of the heat conduction path of the laser chip of the utility model;

[0032] Fig.11 This is an isometric view of the sealing window piece of the utility model;

[0033] Fig.12 This is a schematic diagram of the bottom view structure of the sealing window piece of the utility model;

[0034] Fig.13 This is a schematic diagram of the application of the utility model in a laser projection device;

[0035] Fig.14 It is a schematic diagram of the existing coaxial packaging structure;

[0036] Fig.15 This is a physical picture of the existing multi-pin packaged products;

[0037] Fig.16 This is a physical picture of an existing tube shell product with ceramic shell wall.

[0038] Figure numerals: 1. edge-emitting laser chip; 2. SiC ceramic; 3. oxygen-free copper base plate; 4. Kovar ring; 5. ceramic tube shell; 6. reflector; 7. silver-copper solder pad; 8. copper substrate; 9. temperature measuring element; 10. connecting terminal; 11. photodiode; 12. first metallization area; 13. tube shell pad; 14. second metallization area; 15. third metallization area; 16. oxygen-free copper boss; 17. thermoelectric isolation area; 18. circuit wiring area; 19. insulating layer; 20. conductive layer; 21. ink layer; 22. marking layer; 23. sealing window piece; 24. light-transmitting area; 25. fourth metallization area. DETAILED DESCRIPTION

[0039] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0040] It should be noted that the terms "first", "second", "symmetrical", "array", etc. are only used to distinguish between description and position description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the definition of "first", "symmetrical", etc. can explicitly or implicitly include one or more of these features; similarly, when the number of certain features is not limited in the form of words such as "two" or "three", it should be noted that this feature also explicitly or implicitly includes one or more feature quantities.

[0041] The embodiments of the present utility model are described in detail below with reference to the accompanying drawings.

[0042] like Figure 1-13As shown, the embodiment of the utility model provides a laser module with a tube shell with high thermal conductivity, including a copper substrate 8 and a plurality of tube shell modules, wherein the plurality of tube shell modules each include an oxygen-free copper base plate 3, a Kovar ring 4 and a ceramic tube shell 5;

[0043] Among them, the ceramic tube shell 5 is installed on the upper surface of the copper substrate 8 in the form of a surface mount package, four tube shell pads 13 are symmetrically provided at the bottom of the ceramic tube shell 5, the kovar ring 4 is fixedly connected to the bottom of the inner wall of the ceramic tube shell 5, and the oxygen-free copper base plate 3 is fixedly connected to the bottom of the kovar ring 4.

[0044] In one embodiment, SiC ceramics 2 are evenly installed on one side of the inner wall of the ceramic tube shell 5, edge-emitting laser chips 1 are installed on the upper surface of the SiC ceramics 2, reflectors 6 are evenly installed in the middle of the inner wall of the ceramic tube shell 5, and photodiodes 11 are installed on one side of the inner wall of the ceramic tube shell 5;

[0045] The photodiode 11 is used to detect the light emission status of the laser. When the laser is degraded, it can be judged directly through the data fed back by the photodiode 11, which is convenient for future maintenance and inspection.

[0046] In one embodiment, four first metallized regions 12 are symmetrically provided at the bottom of the inner side wall of the ceramic tube shell 5, a third metallized region 15 is provided on the upper surface of the ceramic tube shell 5, a second metallized region 14 is provided at the bottom of the inner side wall of the ceramic tube shell 5, two silver-copper welding pieces 7 are provided between the oxygen-free copper bottom plate 3 and the kovar ring 4, and between the kovar ring 4 and the ceramic tube shell 5, the oxygen-free copper bottom plate 3 is welded to the bottom of the kovar ring 4 through the silver-copper welding piece 7, and the top of the kovar ring 4 is welded to the bottom of the second metallized region 14 through the silver-copper welding piece 7;

[0047] The oxygen-free copper base plate 3 and the kovar ring 4 are welded together through the silver-copper welding sheet 7 , and the kovar ring 4 is welded to the second metallization region 14 of the ceramic tube shell 5 through the silver-copper welding sheet 7 .

[0048] In one embodiment, an oxygen-free copper boss 16 is provided on one side of the upper surface of the copper substrate 8, a circuit wiring area 18 is provided on the other side of the upper surface of the copper substrate 8, a thermal and electrical isolation area 17 is provided on the outer side of the oxygen-free copper boss 16, an insulating layer 19 is coated on the upper surface of the copper substrate 8, a conductive layer 20 is coated on the upper surface of the insulating layer 19, an ink layer 21 is coated on the upper surface of the conductive layer 20, a marking layer 22 is coated on the upper surface of the ink layer 21, and the thickness of the conductive layer 20 is 0.15 mm-0.2 mm.

[0049] In one embodiment, two connection terminals 10 are symmetrically mounted on one side of the upper surface of the copper substrate 8, a temperature measuring element 9 is mounted on the other side of the upper surface of the copper substrate 8, and the bottoms of the two connection terminals 10 and the temperature measuring element 9 are both connected to the conductive layer 20;

[0050] The temperature of the copper substrate 8 is detected by the temperature measuring element 9, and the operating temperature of the laser chip is indirectly detected.

[0051] In one embodiment, a sealing window sheet 23 is provided above the ceramic tube shell 5, a fourth metallized area 25 is provided at the bottom of the sealing window sheet 23, a light-transmitting area 24 is provided in the middle of the sealing window sheet 23, and the fourth metallized area 25 is welded to the upper surface of the third metallized area 15;

[0052] The sealing window plate 23 is welded and fixed to the ceramic tube package 5 by using the fourth metallization area 25 and the third metallization area 15 to seal the ceramic tube package 5 .

[0053] During the preparation of the utility model, the ceramic tube shell 5 is firstly preformed by HTCC method and high temperature sintering method, and a cavity is formed inside the ceramic tube shell. Figure 3 and Figure 4 As shown, the oxygen-free copper base plate 3, the Kovar ring 4 and the ceramic tube shell 5 are stacked vertically, and then the silver-copper solder sheet 7 is placed between the three. The specific stacking effect is as follows Figure 5 As shown, silver-copper solder is then used for welding to form a heat dissipation shell with high thermal conductivity, and then a third metallized area 15 is set at the shell opening to facilitate subsequent welding of the sealing window sheet 23. In order to achieve a smaller volume, the thickness of the ceramic shell needs to be greater than or equal to 0.6 mm. If it is less than this thickness, it will have a certain impact on the sealing. In order to reduce welding stress, the three are only welded in the vertical direction, and a certain amount of expansion space is reserved on the side. In order to increase the heat dissipation capacity, the oxygen-free copper bottom plate 3 needs to be designed to be maximized, that is, the width of the oxygen-free copper bottom plate 3 is the same as the overall width of the ceramic shell 5.

[0054] Since the tube shell wall is relatively thin, the sealing window sheet 23 is sealed by brazing, and parallel sealing welding cannot be used. In order to achieve a small volume, the thickness of the glass is generally set to 0.2-1.0 mm.

[0055] After the oxygen-free copper base plate 3, the Kovar ring 4, the ceramic tube shell 5, the silver-copper solder sheet 7 and the silver-copper solder are stacked together, the whole is placed in a vacuum furnace for secondary welding and forming. After welding, it should be ensured that the oxygen-free copper base plate 3 and the tube shell pad 13 at the bottom of the ceramic tube shell 5 are basically on the same plane after welding and forming, and the positive and negative tolerances should be compensated by the solder sheet welded to the copper substrate 8 later. The general tolerance is ±0.025mm.

[0056] The Kovar ring 4 is used to balance the stress between ceramic and oxygen-free copper to avoid ceramic fracture. Its material is Kovar or 10# steel, and the thermal expansion coefficient is between that of copper and ceramic. Kovar material is preferred. The solder can be silver-copper high-temperature welding to ensure sealing;

[0057] The thermal expansion coefficient and thermal conductivity of Kovar alloy, alumina ceramic, oxygen-free copper, and tungsten copper are shown in the following table:

[0058] Material Name Thermal expansion coefficient (ppm / ℃) Thermal conductivity (W / m·k) Alumina ceramics 5.5 20～45 Kovar Alloy 10.4 17.3 Oxygen-free copper 17.7 401 Tungsten Copper 85 / 15 ～6.5 180～200 Aluminum Nitride 4.5 170～230 SiC ～4.5 360～490

[0059] It can be seen that the expansion coefficient of Kovar is between that of ceramic and oxygen-free copper, which can effectively reduce the tension between them. The thermal conductivity of oxygen-free copper is about 1 times higher than that of tungsten copper, which can effectively reduce the thermal resistance of the overall package.

[0060] Therefore, using a Kovar ring 4 for transition between the oxygen-free copper base plate 3 and the ceramic tube shell 5 can effectively reduce the deformation of the ceramic and improve the yield rate of the product. Using oxygen-free copper instead of tungsten copper can greatly improve the thermal conductivity of the tube shell. The operating temperature of the final chip is reduced. Directly welding and sealing oxygen-free copper and ceramics will cause the ceramic to be cracked or the oxygen-free copper to be deformed during the cooling process from high temperature to low temperature, so that it cannot be used normally.

[0061] After welding, the surface metal parts are nickel-plated and gold-plated and retained.

[0062] The ceramic tube shell 5 adopts a single-sided substrate of a thermoelectric separation type, as shown in FIG. Figure 7-Figure 9 As shown, the heat transfer path and the electrical transfer path are separated. The bottom surface is an oxygen-free copper structure, and an insulating layer 19 is coated on it. The thickness is between 0.15mm and 0.2mm to isolate electricity and heat. On top of the insulating layer 19 is a conductive layer 20 for arranging conductive lines. Its thickness should be determined according to the actual current flowing through. In this example, a 105um thick copper foil is used. On top of the conductive layer 20, there is an ink layer 21, i.e., a solder mask layer, to prevent other conductive materials from mistakenly connecting the wires. The top layer is a marking layer 22.

[0063] The purpose of using a single-layer board is to maximize the thermal conductivity and limit the thermal resistance of the entire thermal path to the minimum. Single-layer boards are easy to process and have low costs.

[0064] The heat conduction path of the entire laser chip is as follows Fig.10 shown.

[0065] The reflector 6 is made of K9 glass or low melting point glass, which is characterized by a small size and needs to be plated with a high reflective dielectric film. In order to ensure a firm bond and increase the bonding area, a right-angle prism is used, and its inclined surface is used as a reflective surface. The surface in contact with the bottom surface is metallized.

[0066] The corresponding positions in the ceramic tube shell 5 are coated with sintered silver edge emitting laser chip 1, SiC ceramic 2, reflector 6 and photodiode 11, and then placed in a sintering furnace for curing. After curing, the ceramic tube shell 5 is welded and sealed with a sealing window plate 23 coated with an anti-reflection film and a SAC welding ring. Before sealing, nitrogen needs to be filled to replace the water vapor, oxygen, etc. inside the ceramic tube shell 5.

[0067] The sealing window 23 is made of ultra-thin glass, and the glass grade can be D263. TiPtAu is sputtered on the part of the glass that contacts the fourth metallized area 25, and the upper and lower light-transmitting parts are plated with an anti-reflection film of the wavelength to be passed. The overall pass rate is greater than 98%. Fig.12 shown.

[0068] The welded tube shell module is configured according to the needs with low temperature solder and welded to the copper substrate. The solder here can be 40-50℃ lower than SAC for gradient welding. The melting point temperature of commonly used solders is as follows:

[0069] Material Name Melting point℃ Thermal conductivity W / m·k other <![CDATA[Silver Copper Ag 72 Cu 28 > 780 352 Hard solder <![CDATA[Gold Tin Sn 20 Au 80 > 280 50 <![CDATA[ Tin-silver-copper Sn 96.5 Ag3Cu 0.5 ]]> 217 58 <![CDATA[Tin Indium Silver Sn 77.2 In 20 Ag 2.8 > 175 54 <![CDATA[Gold Germanium Au 88 Ge 12 > 350 44

[0070] The preferred solder is tin-indium-silver Sn77.2In20Ag2.8, which is lead-free and has good thermal conductivity. The temperature is about 40°C lower than that of tin-silver-copper Sn96.5Ag3Cu0.5 solder. It can be in the form of solder sheets or solder paste, which can be applied on the circuit board in the form of screen printing, and then the components are attached to the copper substrate by a placement machine, and then placed in a vacuum furnace for soldering.

[0071] During the soldering process, the shell pads 13 need to be aligned with the pads on the copper substrate 8, and the heat conduction paths need to be aligned.

[0072] Then, a temperature measuring element 9 for measuring temperature is arranged on the copper substrate 8 to detect the temperature of the copper substrate 8 and indirectly detect the working temperature of the laser chip.

[0073] A photodiode 11 is also placed inside the ceramic tube shell 5 to detect the light emission status of the laser. When the laser is degraded, it can be judged directly through the data fed back by the photodiode 11, which is convenient for future maintenance and inspection.

[0074] The packaged ceramic tube shell 5 is used as a basic unit, and multiple units can be combined to form a high-power, multi-wavelength laser output. Fig.13As shown, module 1 can be a blue laser module with a central wavelength of 450nm, module 2 is a green laser module with a central wavelength of 520-525nm, and the electrodes of the two are led out through the wiring terminals; module 3 and module 4 are red light modules with a central wavelength of 638nm-645nm. After the two modules are connected in series, the electrodes are led out through the connection terminal 10. Thus, the output of the three-primary color light source module is realized. By selecting the power combination of different chips, it can be applied in laser projection equipment.

[0075] The above are only specific implementations of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A laser module with a tube shell with high thermal conductivity, comprising a copper substrate (8) and a plurality of tube shell modules, characterized in that: Several of the tube-shell modules include an oxygen-free copper base plate (3), a Kovar ring (4) and a ceramic tube shell (5); The ceramic tube shell (5) is mounted on the upper surface of the copper substrate (8) in the form of a surface mount package, four tube shell pads (13) are symmetrically arranged at the bottom of the ceramic tube shell (5), the kovar ring (4) is fixedly connected to the bottom of the inner wall of the ceramic tube shell (5), and the oxygen-free copper base plate (3) is fixedly connected to the bottom of the kovar ring (4).

2. The laser module with a high thermal conductivity tube shell according to claim 1, characterized in that: SiC ceramics (2) are evenly mounted on one side of the inner wall of the ceramic tube shell (5), edge-emitting laser chips (1) are mounted on the upper surface of the SiC ceramics (2), reflecting mirrors (6) are evenly mounted in the middle of the inner wall of the ceramic tube shell (5), and a photodiode (11) is mounted on one side of the inner wall of the ceramic tube shell (5).

3. The laser module with a high thermal conductivity tube shell according to claim 1, characterized in that: Four first metallized regions (12) are symmetrically arranged at the bottom of the inner side wall of the ceramic tube shell (5), a third metallized region (15) is arranged on the upper surface of the ceramic tube shell (5), and a second metallized region (14) is arranged at the bottom of the inner side wall of the ceramic tube shell (5).

4. The laser module with a high thermal conductivity tube shell according to claim 3, characterized in that: Two silver-copper welding sheets (7) are provided between the oxygen-free copper base plate (3) and the kovar ring (4), and between the kovar ring (4) and the ceramic tube shell (5); the oxygen-free copper base plate (3) is welded to the bottom of the kovar ring (4) via the silver-copper welding sheets (7), and the top of the kovar ring (4) is welded to the bottom of the second metallized area (14) via the silver-copper welding sheets (7).

5. The laser module with a high thermal conductivity tube shell according to claim 1, characterized in that: An oxygen-free copper boss (16) is provided on one side of the upper surface of the copper substrate (8), a circuit wiring area (18) is provided on the other side of the upper surface of the copper substrate (8), a thermal and electrical isolation area (17) is provided on the outer side of the oxygen-free copper boss (16), an insulating layer (19) is coated on the upper surface of the copper substrate (8), a conductive layer (20) is coated on the upper surface of the insulating layer (19), an ink layer (21) is coated on the upper surface of the conductive layer (20), and a marking layer (22) is coated on the upper surface of the ink layer (21), and the thickness of the conductive layer (20) is 0.15 mm-0.2 mm.

6. The laser module with a high thermal conductivity tube shell according to claim 5, characterized in that: Two connection terminals (10) are symmetrically mounted on one side of the upper surface of the copper substrate (8), and a temperature measuring element (9) is mounted on the other side of the upper surface of the copper substrate (8); the bottoms of the two connection terminals (10) and the temperature measuring element (9) are both connected to the conductive layer (20).

7. The laser module with a high thermal conductivity tube shell according to claim 3, characterized in that: A sealing window sheet (23) is provided above the ceramic tube shell (5), a fourth metallized area (25) is provided at the bottom of the sealing window sheet (23), a light-transmitting area (24) is provided in the middle of the sealing window sheet (23), and the fourth metallized area (25) is welded to the upper surface of the third metallized area (15).

8. The laser module with a high thermal conductivity tube shell according to claim 7, characterized in that: The thickness of the ceramic tube shell (5) is greater than or equal to 0.6 mm, and the thickness of the sealing window sheet (23) is 0.2-1.0 mm.

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