Injection head structure of semiconductor packaging mold

Abstract

The utility model discloses an injection head structure of a semiconductor packaging mould, which comprises an injection head main body, a material blocking mechanism is arranged at the bottom of the inner side of the injection head main body, the material blocking mechanism is composed of a material blocking mechanism outer shell and a material blocking mechanism inner component, a feeding cavity is arranged above the inner side of the material blocking mechanism outer shell, and the material blocking mechanism inner component is arranged in the feeding cavity. An inner component mounting cavity is formed in the lower portion of the inner side of the material blocking mechanism outer shell, and the feeding cavity communicates with the inner component mounting cavity through a connecting opening. The injection head is composed of the injection head body and the material blocking mechanism installed at the bottom of the inner side of the injection head body, the injection head body is in threaded connection with the material blocking mechanism, and when the material blocking mechanism operates and materials stop entering the injection head body, the material blocking cover is pushed by the spring to move upwards and block the connecting opening, so that the injection head body is prevented from being damaged. Therefore, the material in the injection head main body is prevented from continuously flowing downwards, and the material leakage amount of the injection head main body can be effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of mold injection heads, in particular to a semiconductor packaging mold injection head structure. Background Art

[0002] Injection mold refers to the plastic in the heated barrel of the injection machine, which is melted by heat and pushed by the screw or douser to enter the mold cavity through the nozzle and the mold's pouring system, where the plastic hardens and takes shape.

[0003] After the injection is completed, the injection head of the existing semiconductor packaging mold will leak material, which not only causes material waste, but also causes the sprue to be too large and inconvenient to trim. Utility Model Content

[0004] The utility model aims to provide a semiconductor packaging mold injection head structure to solve the problems in the prior art.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor packaging mold injection head structure, including an injection head body, a material blocking mechanism is installed at the inner bottom of the injection head body, the material blocking mechanism is composed of an outer shell of the material blocking mechanism and an internal component of the material blocking mechanism, a feed cavity is opened on the upper inner side of the outer shell of the material blocking mechanism, an internal component installation cavity is opened on the lower inner side of the outer shell of the material blocking mechanism, the feed cavity and the internal component installation cavity are connected through a connecting port, the internal component of the material blocking mechanism is composed of a positioning column, a spring and a material blocking cover, a spring installation cavity is opened on the upper inner side of the positioning column, the spring is arranged in the spring installation cavity, and the material blocking cover is sleeved on the upper outer surface of the positioning column.

[0006] Preferably, the feed cavity is a spherical concave structure, and there is a smooth transition between the inner wall of the feed cavity and the inner wall of the injection head body, and the connecting port is opened at the middle position of the inner bottom of the feed cavity.

[0007] Preferably, a mounting seat is provided at the lower outer portion of the positioning column, a connecting seat is provided at the lower inner portion of the outer shell of the material blocking mechanism, and the inner component of the material blocking mechanism is connected to the outer shell of the material blocking mechanism by screws.

[0008] Preferably, a material blocking mechanism installation groove is provided at the lower inner side of the injection head body, the material blocking mechanism is threadedly connected to the injection head body, and a screwing platform is provided at the lower outer side of the outer shell of the material blocking mechanism.

[0009] Preferably, the injection head is composed of an injection port and an injection tube arranged below the injection port, and the injection port and the injection tube are arranged coaxially, and the injection port is a funnel-shaped structure.

[0010] Compared with the prior art, the beneficial effects of the utility model are as follows: the injection head of the utility model is composed of an injection head main body and a material blocking mechanism installed at the inner bottom of the injection head main body, the injection head main body and the material blocking mechanism are threadedly connected, the injection head main body of the utility model can be used alone or in conjunction with the material blocking mechanism, and on the premise that the injection head main body is equipped with the material blocking mechanism, when the material is squeezed into the interior of the injection head main body, the material blocking cover will move downward under the extrusion of the material, thereby opening the connecting port, and then the material enters the interior of the material blocking mechanism, and then is injected into the mold, when the material stops entering the injection head main body, the material blocking cover moves upward under the push of the spring and blocks the connecting port, thereby preventing the material inside the injection head main body from continuing to flow downward, in summary, the material blocking mechanism can effectively reduce the amount of material leakage from the injection head main body. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0012] Figure 1 It is a schematic diagram of the overall external structure of the utility model;

[0013] Figure 2 It is a schematic diagram of the overall internal structure of the utility model;

[0014] Figure 3 It is a schematic diagram of the upper structure of the material blocking mechanism of the utility model;

[0015] Figure 4 It is a schematic diagram of the lower structure of the material blocking mechanism of the utility model.

[0016] In the figure: 1. Injection head body; 2. Injection port; 3. Injection tube; 4. Material blocking mechanism mounting groove; 5. Material blocking mechanism; 6. Material blocking mechanism outer shell; 7. Internal component mounting cavity; 8. Internal component of material blocking mechanism; 9. Positioning column; 10. Spring mounting cavity; 11. Spring; 12. Material blocking cover; 13. Connecting port; 14. Feeding cavity; 15. Screwing table; 16. Mounting seat; 17. Connecting seat. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the utility model. Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the utility model for which protection is sought, but merely represents the selected embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the utility model.

[0018] See also Figure 1-4 In an embodiment of the utility model, a semiconductor packaging mold injection head structure includes an injection head body 1, a material blocking mechanism 5 is installed at the inner bottom of the injection head body 1, the material blocking mechanism 5 is composed of an outer shell 6 of the material blocking mechanism and an inner component 8 of the material blocking mechanism, a feed cavity 14 is opened on the inner upper side of the outer shell 6 of the material blocking mechanism, an inner component installation cavity 7 is opened on the inner lower side of the outer shell 6 of the material blocking mechanism, the feed cavity 14 is connected to the inner component installation cavity 7 through a connecting port 13, the inner component 8 of the material blocking mechanism is composed of a positioning column 9, a spring 11 and a material blocking cover 12, a spring installation cavity 10 is opened on the inner upper side of the positioning column 9, and the spring 11 is arranged on the spring installation cavity 11. In the cavity 10, a material blocking cover 12 is sleeved on the upper outer surface of the positioning column 9, a mounting seat 16 is provided on the outer lower part of the positioning column 9, a connecting seat 17 is provided on the inner lower part of the outer shell 6 of the material blocking mechanism, the inner component 8 of the material blocking mechanism is connected to the outer shell 6 of the material blocking mechanism by screws, a material blocking mechanism mounting groove 4 is provided on the inner lower part of the injection head body 1, the material blocking mechanism 5 is threadedly connected to the injection head body 1, a screwing platform 15 is provided on the outer lower part of the outer shell 6 of the material blocking mechanism, and the injection head 1 is composed of a material injection port 2 and an injection tube 3 arranged below the material injection port 2, and the material injection port 2 and the injection tube 3 are coaxially arranged, and the material injection port 2 is a funnel-shaped structure.

[0019] The feed chamber 14 is a spherical concave structure, and there is a smooth transition between the inner wall of the feed chamber 14 and the inner wall of the injection head body 1. The connecting port 13 is opened at the middle position of the inner bottom of the feed chamber 14. This structure can effectively prevent material from being retained at the connection position between the injection head body 1 and the material blocking mechanism 5.

[0020] The working principle of the utility model is: the injection head of the utility model is composed of an injection head main body 1 and a material blocking mechanism 5 installed at the inner bottom of the injection head main body 1, the injection head main body 1 and the material blocking mechanism 5 are threadedly connected, the injection head main body 1 of the utility model can be used alone, and can also be used together with the material blocking mechanism 5. Under the premise that the injection head main body 1 is equipped with the material blocking mechanism 5, when the material is squeezed into the injection head main body 1, the material blocking cover 12 will move downward under the extrusion of the material, thereby opening the connecting port 13, and then the material enters the material blocking mechanism 5, and then is injected into the mold. When the material stops entering the injection head main body 1, the material blocking cover 12 moves upward under the push of the spring 11 and blocks the connecting port 13, thereby preventing the material inside the injection head main body 1 from continuing to flow downward. In summary, the material blocking mechanism 5 can effectively reduce the amount of material leakage of the injection head main body 1.

[0021] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A semiconductor packaging mold injection head structure, comprising an injection head body (1), characterized in that: A material blocking mechanism (5) is installed at the bottom of the inner side of the injection head body (1), and the material blocking mechanism (5) is composed of an outer shell (6) of the material blocking mechanism and an inner component (8) of the material blocking mechanism. A feed cavity (14) is opened at the upper inner side of the outer shell (6) of the material blocking mechanism, and an inner component installation cavity (7) is opened at the lower inner side of the outer shell (6) of the material blocking mechanism. The feed cavity (14) and the inner component installation cavity (7) are connected via a connecting port (13). The inner component (8) of the material blocking mechanism is composed of a positioning column (9), a spring (11) and a material blocking cover (12). A spring installation cavity (10) is opened at the upper inner side of the positioning column (9), and the spring (11) is arranged in the spring installation cavity (10). The material blocking cover (12) is sleeved on the upper outer surface of the positioning column (9).

2. The semiconductor packaging mold injection head structure according to claim 1, characterized in that: The feed cavity (14) is a spherical concave structure, and there is a smooth transition between the inner wall of the feed cavity (14) and the inner wall of the injection head body (1), and the connection port (13) is opened at the middle position of the inner bottom of the feed cavity (14).

3. The semiconductor packaging mold injection head structure according to claim 1, characterized in that: A mounting seat (16) is provided at the lower outer portion of the positioning column (9), a connecting seat (17) is provided at the lower inner portion of the outer shell (6) of the material blocking mechanism, and the inner component (8) of the material blocking mechanism is connected to the outer shell (6) of the material blocking mechanism by means of screws.

4. The semiconductor packaging mold injection head structure according to claim 1, characterized in that: A material blocking mechanism installation groove (4) is provided at the lower inner side of the injection head body (1); the material blocking mechanism (5) is threadedly connected to the injection head body (1); and a screwing platform (15) is provided at the lower outer side of the outer shell (6) of the material blocking mechanism.

5. The semiconductor packaging mold injection head structure according to claim 1, characterized in that: The injection head body (1) is composed of an injection port (2) and an injection tube (3) arranged below the injection port (2), and the injection port (2) and the injection tube (3) are arranged coaxially, and the injection port (2) is a funnel-shaped structure.

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