Laser cutting supporting platform device

Abstract

The utility model discloses a laser cutting supporting platform device, and relates to the technical field of supporting platforms. Comprising a supporting base, a groove is formed in the top of the supporting base, a plurality of sets of supporting parts are longitudinally arranged in the groove, a first airflow channel is formed between the supporting part on the outermost side and the side wall of the supporting base, a second airflow channel is formed between the longitudinal supporting parts, and a third airflow channel is formed between the transverse supporting parts; a plurality of vacuum holes are formed in the supporting seat 1, are connected with a vacuum pump through guide pipes and are used for adsorbing a chip placed at the top of the supporting part. According to the utility model, the top of the supporting table is provided with the first bump and the second bump, the height of the first bump and the height of the second bump are matched with the height of the substrate of the chip, and the formed first accommodating cavity and the formed second accommodating cavity can accommodate components and soldering points formed on the front surface or the back surface of the chip, so that the chip can be stably placed on the supporting table; and the machining precision is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of support platforms, in particular to a laser cutting support platform device. Background Art

[0002] Laser cutting is required in the chip manufacturing process. Laser cutting has the advantages of high precision, non-contact, fast, flexible, clean and pollution-free in chip manufacturing. It can meet the needs of precise cutting in the chip manufacturing process and improve production efficiency and quality.

[0003] The existing chip cutting still has the following problems:

[0004] There are passive components on both sides of the chip substrate. After the chip substrate is placed, the substrate surface may tilt, affecting the cutting accuracy;

[0005] When vacuum adsorbing chips in the prior art, the chip may be offset due to unbalanced force on the adsorption surface of the chip, thereby affecting the cutting accuracy. Utility Model Content

[0006] The purpose of the utility model is to provide a laser cutting support platform device to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a laser cutting support platform device, comprising a support seat, a groove is formed on the top of the support seat, a plurality of groups of support parts are longitudinally arranged in the groove, a first airflow channel is formed between the outermost support part and the side wall of the support seat, a second airflow channel is formed between the longitudinal support parts, and a third airflow channel is formed between the transverse support parts;

[0008] The support base 1 is provided with a plurality of vacuum holes, which are connected to a vacuum pump through a conduit and are used to absorb the chip placed on the top of the support portion.

[0009] Furthermore, a plurality of vacuum holes are provided, which are evenly distributed on the third airflow channel and the first airflow channel.

[0010] Furthermore, the support portion includes a support platform, a first protrusion and a second protrusion are formed on the top of the support platform, a first accommodating cavity is formed between one side of the first protrusion and a side of the second protrusion, and a second accommodating cavity is formed between the other side of the first protrusion and the support platform.

[0011] Furthermore, the height of the second bump is 600 micrometers to 700 micrometers, and the height of the first bump is 650 micrometers to 750 micrometers.

[0012] Furthermore, a height difference between the first bump and the second bump is D, and D is 50-100 microns.

[0013] Furthermore, the second air flow channel and the third air flow channel have the same channel width.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] The laser cutting support platform device is provided with a first bump and a second bump on the top of the support platform. The heights of the first bump and the second bump are adapted to the substrate of the chip. The formed first accommodating cavity and the second accommodating cavity can accommodate components and solder points formed on the front or back of the chip, so that the chip can be stably placed on the support platform, thereby improving the processing accuracy.

[0016] At the same time, the vacuum holes are dispersed and set as flow channel design. This setting increases the stability of the adsorption airflow, so that the product is evenly stressed and balanced. It can not only stably adsorb the product during cutting to ensure the stability of the cutting size, but also ensure that the product is stably supported after cutting, further improving the processing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is an axial view of the utility model;

[0018] Figure 2 It is a top view of the utility model;

[0019] Figure 3 This is a front view of the support portion of the utility model;

[0020] Figure 4 This is the air flow diagram of the utility model during vacuum adsorption;

[0021] Figure 5 This is a chip placement diagram for the utility model.

[0022] In the figure: 1, support seat; 2, support part; 201, support platform; 202, first bump; 203, second bump; 301, first air flow channel; 302, second air flow channel; 303, third air flow channel; 4, vacuum hole; 5, chip. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] The utility model is applied to PCBA packaging type products with passive components on both sides of the substrate. Because the surface of the substrate is uneven and the passive components on both sides are not protected by molding, and the unit spacing is relatively small, the traditional Jig Saw process cannot overcome it, and only the laser cutting process can be used. This product has higher requirements for flatness and vacuum, and it is required not to damage the passive components, so the design of the support platform is very important.

[0025] like Figure 1-Figure 5 As shown, the utility model provides a technical solution: a laser cutting support platform device, including a support seat 1, a groove is formed on the top of the support seat 1, and a plurality of groups of support parts 2 are longitudinally arranged in the groove. The specific number of groups is determined by engineers according to different chip sizes. A first airflow channel 301 is formed between the outermost support part 2 and the side wall of the support seat 1, a second airflow channel 302 is formed between the longitudinal support parts 2, and a third airflow channel 303 is formed between the transverse support parts 2;

[0026] A plurality of vacuum holes 4 are provided on the support base 1. It can be known that the vacuum holes 4 are connected to a vacuum pump through a conduit for adsorbing a chip 5 placed on the top of the support portion 2.

[0027] That is, when in use, the chip is placed on the top of the support part 2. After the placement is completed, the vacuum pump is started through the controller to form a negative pressure between the bottom surface of the chip and the groove through the vacuum hole 4, thereby completing the adsorption of the chip 5.

[0028] In addition, if Figure 1 and Figure 2 As shown, there are multiple vacuum holes 4, which are equidistantly distributed on the third airflow channel 303 and the first airflow channel 301. In a specific embodiment of the present scheme, in order to ensure the stability of the airflow on the four sides of the vacuum hole 4, the channel widths of the second airflow channel 302 and the third airflow channel 303 are equal.

[0029] In this solution, the vacuum holes 4 are dispersedly arranged and designed as flow channels. This arrangement increases the stability of the adsorption airflow, allows the product to be evenly stressed and balanced, and can not only stably adsorb the product during cutting to ensure the stability of the cutting size, but also ensure that the product is stably supported after cutting.

[0030] To ensure the smooth implementation of the plan, Figure 3 and Figure 5 As shown, it is necessary to know that the support part 2 includes a support platform 201, and a first protrusion 202 and a second protrusion 203 are integrally formed on the top of the support platform 201, a first accommodating cavity is formed between one side of the first protrusion 202 and the side of the second protrusion 203, and a second accommodating cavity is formed between the other side of the first protrusion 202 and the support platform 201.

[0031] like Figure 5 As shown, since components and solder points are formed on both the front and back sides of the chip 5, in order to ensure the stable placement of the chip 5 and adapt to chips 5 of different sizes, the height of the second bump 203 is set to 600 microns-700 microns, and the height of the first bump 202 is set to 650 microns-750 microns. In a specific embodiment of the present scheme, the height of the second bump 203 is 650 microns, and the height of the first bump 202 is 700 microns.

[0032] The height difference between the first bump 202 and the second bump 203 is set to D. In the above specific embodiment, D is 50 micrometers.

[0033] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is limited by the attached embodiments and their equivalents.

Claims

1. A laser cutting support platform device, comprising a support seat (1), characterized in that: The support seat (1) has a groove formed on the top, and a plurality of groups of support parts (2) are longitudinally arranged in the groove, a first air flow channel (301) is formed between the outermost support part (2) and the side wall of the support seat (1), a second air flow channel (302) is formed between the longitudinal support parts (2), and a third air flow channel (303) is formed between the transverse support parts (2); A plurality of vacuum holes (4) are provided on the support seat (1), and the vacuum holes (4) are connected to a vacuum pump via a conduit and are used to absorb a chip (5) placed on the top of the support portion (2).

2. The laser cutting support platform device according to claim 1, characterized in that: The vacuum holes (4) are provided in plurality and are distributed equidistantly on the third airflow channel (303) and the first airflow channel (301).

3. The laser cutting support platform device according to claim 1, characterized in that: The support portion (2) comprises a support platform (201), a first convex block (202) and a second convex block (203) are formed on the top of the support platform (201), a first accommodating cavity is formed between one side of the first convex block (202) and the side of the second convex block (203), and a second accommodating cavity is formed between the other side of the first convex block (202) and the support platform (201).

4. The laser cutting support platform device according to claim 3, characterized in that: The height of the second bump (203) is 600 micrometers to 700 micrometers, and the height of the first bump (202) is 650 micrometers to 750 micrometers.

5. The laser cutting support platform device according to claim 4, characterized in that: The height difference between the first bump (202) and the second bump (203) is D, and D is 50-100 microns.

6. The laser cutting support platform device according to claim 1, characterized in that: The second airflow channel (302) and the third airflow channel (303) have the same channel width.

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