Semiconductor refrigeration system, refrigeration equipment and cooling clothes

Abstract

The utility model discloses a semiconductor refrigeration system, refrigeration equipment and cooling clothes, the semiconductor refrigeration system comprises a semiconductor refrigerator, a first heat exchanger, a second heat exchanger and a heat exchange fan, the semiconductor refrigerator is provided with a first end face and a second end face which are opposite, the first heat exchanger is connected with the first end face, and the second heat exchanger is connected with the second end face. The second heat exchanger is connected with the second end face, and the first heat exchanger and the second heat exchanger are each provided with a heat exchange channel. An air outlet of the heat exchange fan faces the air inlet end of the heat exchange channel. According to the semiconductor refrigeration system, the refrigeration equipment and the cooling clothes, the problem that in the prior art, a semiconductor refrigeration system is low in refrigeration efficiency can be effectively solved, and meanwhile the semiconductor refrigeration system, the refrigeration equipment and the cooling clothes have the advantages of being reasonable in structural arrangement and high in refrigeration efficiency.

Description

Technical Field

[0001] The utility model relates to the field of household appliances, in particular to a semiconductor refrigeration system, refrigeration equipment and cooling clothing. Background Art

[0002] Semiconductor refrigeration uses the thermoelectric effect of materials, with semiconductor refrigerators as the core refrigeration components. By connecting cold-end and hot-end heat exchangers at the cold and hot ends of the semiconductor refrigerator to form a refrigeration system, the heat exchange between the hot-end heat exchanger and the ambient space and the cold-end heat exchanger to the load are realized. By adjusting the working voltage or current of the semiconductor refrigerator, the cooling capacity output by the semiconductor refrigerator can be controlled, which brings great convenience to users.

[0003] Compared with existing refrigeration systems, semiconductor refrigeration systems are significantly smaller and more portable, providing a more suitable application scenario for semiconductor refrigeration technology to regulate temperature in small spaces. Therefore, they are often used in outdoor scenarios where loads need to be cooled and cooled. Since semiconductor refrigeration systems are commonly used outdoors, in order to improve the overall portability of the equipment, the overall structure of the equipment is generally being further optimized and reduced in size. However, as the structure is compressed, the refrigeration effect of the equipment is also compressed, resulting in a problem of low refrigeration efficiency. Utility Model Content

[0004] The purpose of the utility model is to provide a semiconductor refrigeration system, refrigeration equipment and cooling clothing, which can effectively solve the problem of low refrigeration efficiency of semiconductor refrigeration systems in the prior art, and at the same time have the advantages of reasonable structural setting and high refrigeration efficiency.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A semiconductor refrigeration system, comprising a semiconductor refrigerator, a first heat exchanger, a second heat exchanger and a heat exchange fan, wherein the semiconductor refrigerator is provided with a first end face and a second end face opposite to each other, the first heat exchanger is connected to the first end face, the second heat exchanger is connected to the second end face, and the first heat exchanger and the second heat exchanger are both provided with a heat exchange channel;

[0007] The air outlet of the heat exchange fan is arranged toward the air inlet end of the heat exchange channel.

[0008] Preferably, at least one heat exchange fan is provided.

[0009] Preferably, it further comprises an air guide plate, wherein the guide plate is arranged between the semiconductor refrigerator and the heat exchange fan.

[0010] Preferably, the air guide plate is provided with a hinged end, and the hinged end is arranged close to the semiconductor refrigerator, and the air guide plate swings around the hinged end as an axis.

[0011] Preferably, the hinged end is connected to the semiconductor refrigerator.

[0012] Preferably, the first heat exchanger and the second heat exchanger have the same structure, and the first heat exchanger and the second heat exchanger are symmetrically arranged with respect to the semiconductor refrigerator.

[0013] Preferably, the first heat exchanger and the second heat exchange plate both include heat exchange plates and heat exchange fins;

[0014] The heat exchange plate of the first heat exchanger is connected to the first end surface, and the heat exchange plate of the second heat exchanger is connected to the second end surface;

[0015] The heat exchange fins are provided in plurality, and the gaps between the plurality of heat exchange fins are installed on the outer side wall of the heat exchange plate, and the heat exchange channel is provided between two adjacent heat exchange fins.

[0016] Preferably, the heat exchange plate and the heat exchange fins extend in a vertical direction, and the heat exchange fan is installed at the bottom of the semiconductor refrigerator.

[0017] A refrigeration device using the semiconductor refrigeration system;

[0018] It also includes a shell, the shell is provided with an air inlet, a cooling outlet and a heat dissipation outlet; the semiconductor refrigeration system is installed inside the shell;

[0019] The first end face is the cold end face of the semiconductor refrigerator, the second end face is the hot end face of the semiconductor refrigerator, and the air inlet of the heat exchange fan is arranged close to the air inlet, the air outlet end of the heat exchange channel of the first heat exchanger is arranged close to the refrigeration outlet, and the air outlet end of the heat exchange channel of the second heat exchanger is arranged close to the heat dissipation outlet.

[0020] A cooling suit using the above refrigeration device;

[0021] It also includes a body structure, the refrigeration device is installed on the body structure, the refrigeration outlet is located inside the body structure, and the heat dissipation outlet is located outside the body structure.

[0022] The technical solution provided by the embodiment of the utility model may have the following beneficial effects:

[0023] 1. A heat exchange fan is provided at the cooling inlet of the semiconductor refrigerator, which is conducive to further compressing the volume of the semiconductor refrigeration system and making its structure smaller and more portable.

[0024] 2. An air guide plate for distributing the heat exchange amount between the first heat exchanger and the second heat exchanger is added between the semiconductor refrigerator and the heat exchange fan, so as to distribute the total air volume of the heat exchange fan to the first heat exchanger and the second heat exchanger, and ensure that the heat exchange amount of the hot end heat exchanger is greater than the heat exchange amount of the cold end heat exchanger, thereby achieving a match between the heat exchange amount and the cold (heat) output, and achieving the purpose of improving the cooling capacity of the semiconductor refrigeration system. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of an embodiment of a semiconductor refrigeration system of the utility model.

[0026] Figure 2 It is a structural schematic diagram of another embodiment of a semiconductor refrigeration system of the utility model.

[0027] Figure 3 The utility model is a schematic structural diagram of an embodiment of a semiconductor refrigerator, a first heat exchanger and a second heat exchanger in a semiconductor refrigeration system.

[0028] Figure 4 It is a structural schematic diagram of another embodiment of a semiconductor refrigerator, a first heat exchanger and a second heat exchanger in a semiconductor refrigeration system of the utility model.

[0029] Figure 5 The utility model is a structural schematic diagram of a refrigeration device.

[0030] Among them: semiconductor refrigerator 1, PN thermocouple pair crystal grains 11, metal substrate 12, insulating layer 121, metal substrate layer 122, ceramic substrate 13, ceramic substrate layer 131, metal cladding layer 132, first heat exchanger 2, heat exchange plate 21, heat exchange fins 22, second heat exchanger 3, heat exchange fan 4, air guide plate 5, hinged end 51, shell 6, air inlet 61, cooling outlet 62, heat dissipation outlet 63. DETAILED DESCRIPTION

[0031] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0032] The technical solution provides a semiconductor refrigeration system, comprising a semiconductor refrigerator 1, a first heat exchanger 2, a second heat exchanger 3 and a heat exchange fan 4, wherein the semiconductor refrigerator 1 is provided with a first end face and a second end face opposite to each other, the first heat exchanger 2 is connected to the first end face, the second heat exchanger 3 is connected to the second end face, and the first heat exchanger 2 and the second heat exchanger 3 are both provided with a heat exchange channel;

[0033] The air outlet of the heat exchange fan 4 is arranged toward the air inlet end of the heat exchange channel.

[0034] Since semiconductor refrigeration systems are commonly used outdoors, in order to improve the overall portability of the device, the overall structure of the device is generally developing towards a trend of being further optimized and reduced in size. However, as the structure is compressed, the refrigeration effect of the device is also compressed, resulting in a problem of low refrigeration efficiency. Based on this, this technical solution proposes a semiconductor refrigeration system, such as Figure 1-4 As shown, it can effectively solve the problem of low refrigeration efficiency of semiconductor refrigeration systems in the prior art, and at the same time has the advantages of reasonable structural setting and high refrigeration efficiency.

[0035] Specifically, Figure 1 As shown, the semiconductor refrigeration system proposed in this scheme includes a first heat exchanger 2, a semiconductor refrigerator 1, a second heat exchanger 3, and a heat exchange fan 4 connected in sequence. It should be noted that the semiconductor refrigerator 1 of this scheme is made using the Peltier effect. The Peltier effect refers to the phenomenon that when a direct current passes through a galvanic couple composed of two semiconductor materials, one end of the galvanic couple absorbs heat and the other end releases heat; in other words, the semiconductor refrigerator 1 is made of two semiconductor materials to form a hot end and a cold end. The cold end continuously absorbs heat to achieve cooling; the hot end continuously releases heat to achieve heat dissipation.

[0036] Furthermore, in order to improve the cooling effect of the semiconductor refrigerator 1, the semiconductor refrigeration system in the prior art generally has a cooling fan at the cooling end of the semiconductor refrigerator 1 and a heat dissipation fan at the heat dissipation end, so that the refrigeration system needs to be equipped with at least two fans; and in order to avoid the mutual influence of the cooling airflow and the heat dissipation airflow, the two fans are generally required to be separated, which is very unfavorable for the development of the refrigeration system towards a smaller, more compact and more portable direction.

[0037] Therefore, in order to further reduce the volume of the semiconductor refrigeration system and make its structure smaller and more portable, the present invention provides a heat exchange fan 4 at the refrigeration inlet of the semiconductor refrigerator 1, which may be an axial flow fan, a centrifugal fan or a butterfly fan.

[0038] For the convenience of description, the first end face is described as the cold end face of the semiconductor refrigerator 1, that is, when the semiconductor refrigeration system of this scheme is working, the heat exchange gas is transported by the heat exchange fan 4. Since the air outlet of the heat exchange fan 4 is arranged toward the air inlet end of the heat exchange channel of the first heat exchanger 2 and the second heat exchanger 3, the heat exchange gas is separated into two heat exchange air flows at the air outlet of the heat exchange fan 4:

[0039] As the first end face is cooled, since the first heat exchanger 2 is connected to the first end face and heat is conducted between the two, the cold energy generated by the first end face will be conducted to the first heat exchanger 2. When one of the heat exchange airflows enters the heat exchange channel of the first heat exchanger 2, it will carry the cold energy on the first heat exchanger 2 to generate a refrigeration airflow.

[0040] As the second end surface generates heat, since the second heat exchanger 3 is connected to the second end surface and there is a heat conduction connection between the two, the heat generated by the second end surface will be conducted to the second heat exchanger 3. When another heat exchange airflow enters the heat exchange channel of the second heat exchanger 3, it will carry the heat on the second heat exchanger 3 to generate a heat dissipation airflow.

[0041] It should be noted that since the heat exchange fan 4 in this solution is arranged at the cooling inlet of the semiconductor refrigerator 1, its number and spatial arrangement will be more flexible than the fan arranged at the cooling outlet of the semiconductor refrigerator 1, and can be selected according to the actual application scenario of the semiconductor refrigeration system, such as based on a comprehensive consideration of the two perspectives of cooling capacity and volume.

[0042] To further explain, at least one heat exchange fan 4 is provided.

[0043] In order to further reduce the volume of the semiconductor refrigeration system and make the semiconductor refrigeration system lighter, the present solution preferably has one heat exchange fan 4 .

[0044] Further explanation is given, the air guide plate 5 is also included, and the air guide plate 5 is arranged between the semiconductor refrigerator 1 and the heat exchange fan 4.

[0045] For semiconductor refrigerators, the cooling capacity Q c , heat production Q h And electrical input power P i Satisfy Q h =Q c +P i =(1+1 / cop)Q c , where cop is the cooling coefficient, i.e. cop = Q c / P i Since the conversion efficiency of semiconductor refrigeration is relatively low, assuming cop = 0.5, then Q h =3Q c, that is, the cop value decreases as the temperature difference between the hot and cold ends of the refrigerator increases, and vice versa. It can be seen that the heat transfer capacity Q of the hot end of the semiconductor refrigerator h Much higher than the cold end heat transfer Q c .

[0046] Therefore, in one embodiment, when the first heat exchanger 2 and the second heat exchanger 3 of this solution share a heat exchange fan 4, in order to achieve the best cooling effect, the heat exchange at the hot end needs to be higher than the heat exchange at the cold end. To meet the above conditions, this solution also adds an air guide plate 5 between the semiconductor refrigerator 1 and the heat exchange fan 4 for distributing the heat exchange between the first heat exchanger 2 and the second heat exchanger 3. Figure 2 As shown, the total air output of the heat exchange fan 4 is allocated to the first heat exchanger 2 and the second heat exchanger 3 to ensure that the heat exchange of the hot end heat exchanger is greater than the heat exchange of the cold end heat exchanger, thereby achieving a match between the heat exchange and the cold (heat) production, thereby achieving the purpose of improving the cooling capacity of the semiconductor refrigeration system.

[0047] It should be noted that the present invention does not limit the inclination angle, area size and structural shape of the air guide plate 5, and it can be selected according to the actual application scenario of the semiconductor refrigeration system, such as by comprehensively considering the cooling capacity and volume.

[0048] To further explain, the air guide plate 5 is provided with a hinged end 51 , and the hinged end 51 is provided close to the semiconductor refrigerator 1 , and the air guide plate 5 swings around the hinged end 51 as an axis.

[0049] As a preference of this embodiment, the air guide plate is designed to be a swingable plate-like structure. On the one hand, during the production process of the refrigeration system, it is convenient to match the first heat exchanger 2 and the second heat exchanger 3 with the heat exchange fans 4 with different air outputs, thereby improving the applicability of the assembly process. On the other hand, during the use of the semiconductor refrigeration system, the user can adjust the heat exchange capacity of the first heat exchanger 2 and the second heat exchanger 3 according to his own usage requirements, thereby meeting personalized needs.

[0050] To further explain, the hinged end 51 is connected to the semiconductor refrigerator 1 .

[0051] In some embodiments, the hinged end 51 of the air guide plate 5 may also be connected to the semiconductor refrigerator 1 to effectively separate the two heat exchange airflows of the heat exchange fan 4 and improve the regulation accuracy of the cold (heat) output.

[0052] It is further explained that the first heat exchanger 2 and the second heat exchanger 3 have the same structure, and the first heat exchanger 2 and the second heat exchanger 3 are symmetrically arranged with respect to the semiconductor refrigerator 1 .

[0053] In addition, in order to avoid the semiconductor refrigeration system from generating internal stress during production or use due to its asymmetric mechanical structure, thereby affecting the stability of the product, the present solution also adopts a symmetrical heat exchanger structure for the first heat exchanger 2 and the second heat exchanger 3 to further improve the stability and reliability of the semiconductor refrigerator 1.

[0054] Further, the first heat exchanger 2 and the second heat exchange plate 3 both include a heat exchange plate 21 and a heat exchange fin 22;

[0055] The heat exchange plate 21 of the first heat exchanger 2 is connected to the first end surface, and the heat exchange plate 21 of the second heat exchanger 3 is connected to the second end surface;

[0056] The heat exchange fins 22 are provided in plurality, and the plurality of heat exchange fins 22 are installed at intervals on the outer wall of the heat exchange plate 21 , and the heat exchange channel is provided between two adjacent heat exchange fins 22 .

[0057] Furthermore, the first heat exchanger 2 and the second heat exchanger 3 of the present solution both adopt a structure of a combination of a heat exchange plate 21 and a heat exchange fin 22 to achieve cooling and heat dissipation of the heat exchange gas, with a simple structure and reliable performance. A plurality of heat exchange fins 22 are installed at intervals on the outer wall of the heat exchange plate 21 to form a through heat exchange flow channel to guide the air, thereby increasing the contact area between the heat exchange airflow and the heat exchanger (2, 3), accelerating the heat exchange between the surrounding environment and the heat exchanger (2, 3), and thus improving the cooling rate of the semiconductor refrigerator.

[0058] To further explain, the heat exchange plate 21 and the heat exchange fins 22 are both extended in the vertical direction, and the heat exchange fan 4 is installed at the bottom of the semiconductor refrigerator 1 .

[0059] Furthermore, according to the semiconductor refrigeration theory, the cooling capacity Q of the semiconductor refrigerator 1 is c for:

[0060] Q c =N(α p -α n )IT c -K(T h -T c )-0.5I 2 R i ,

[0061] Among them, N, α p , α n , I, K, T h , T c , R iThey are the number of PN couple grains, the Seebeck coefficient of p-type material, the Seebeck coefficient of n-type material, the operating current, the thermal conductivity of the refrigerator, the hot end temperature, the cold end temperature and the internal resistance of the semiconductor refrigerator 1. The cooling coefficient (or conversion efficiency) is cop = Q c / P i , where P i is the electrical input power of the semiconductor refrigerator 1. It can be seen that the cooling capacity and cooling efficiency of the semiconductor refrigerator 1 are both related to the hot end temperature T of the semiconductor refrigerator 1. h When other parameters are relatively fixed, T h The smaller the temperature, the lower the hot end temperature of the semiconductor refrigerator 1. c The larger the cop, the better the cooling effect. Therefore, one solution to increase the cooling capacity of the refrigeration system is to reduce the hot end temperature T of the semiconductor refrigerator 1. h , and reduce the hot end temperature T h The most direct way is to improve the heat dissipation effect of the semiconductor refrigerator 1. Therefore, in order to improve the heat dissipation effect of the semiconductor refrigerator 1, this solution also optimizes the extension direction of the heat exchange plate 21 and the heat exchange fins 22 to improve the cooling effect of the semiconductor refrigerator 1 by accelerating heat dissipation.

[0062] Preferably, the first heat exchanger 2 is connected to the first end surface by welding or gluing, and the second heat exchanger 3 is connected to the second end surface by welding or gluing.

[0063] Compared with the mechanical connection structure of the prior art, since the semiconductor refrigerator 1 and the heat exchangers (2, 3) at both ends of the present invention adopt a welding or pasting connection structure, the effective connection between the semiconductor refrigerator 1 and the heat exchanger is ensured, thereby ensuring that the cold and heat generated in the semiconductor refrigerator 1 can be directly and effectively output, avoiding the loss of cold and heat in the mechanical connection structure, solving the problem of low refrigeration efficiency of the semiconductor refrigeration system in the prior art, and having the advantages of reasonable structural setting and high refrigeration efficiency.

[0064] Furthermore, the omission of the mechanical connection structure is also beneficial to reduce the risk of thermal short circuit between the cold end and the hot end of the semiconductor refrigerator 1 caused by the mechanical connection structure, thereby improving the cooling capacity and conversion efficiency of the semiconductor refrigeration system, while improving the consistency and stability of product quality.

[0065] It should be noted that the welding connection in this scheme refers to the fact that the semiconductor refrigerator 1 and the two heat exchangers can be welded with conventional solder to form an integrated semiconductor refrigeration system, while the adhesive connection refers to the fact that the semiconductor refrigerator 1 and the two heat exchangers can be cured with conventional thermal conductive adhesive to form an integrated semiconductor refrigeration system.

[0066] Preferably, the semiconductor refrigerator 1 comprises a first substrate, a PN couple crystal grain 11 and a second substrate which are connected in sequence, and the outer surface of the first substrate is the first end surface, and the outer surface of the second substrate is the second end surface;

[0067] The first substrate and the second substrate are any one of a metal substrate 12 and a ceramic substrate 13 .

[0068] Furthermore, the semiconductor refrigerator 1 in the present embodiment includes a first substrate, a PN couple crystal 11 and a second substrate which are sequentially connected. For the convenience of further detailed description, the first substrate is designated as a cooling end and the second substrate is designated as a heat dissipation end.

[0069] When the semiconductor refrigerator 1 of this solution is working, current is passed through the PN couple crystal grain 11. When the current flows through the PN couple crystal grain 11, the heat generated by the current is transferred from the first substrate to the second substrate, so the first substrate starts to cool and the second substrate starts to dissipate heat. During the cooling process of the first substrate, the cold energy generated by the first substrate will gradually be transferred to the first heat exchanger 2, thereby achieving the effect of cooling and cooling.

[0070] In a preferred embodiment of the present technical solution, both the first substrate and the second substrate can be any one of a metal substrate 12 and a ceramic substrate 13. That is, the first substrate and the second substrate can be both a metal substrate 12 and a ceramic substrate 13; in addition, when the first substrate is a metal substrate 12, the second substrate can be a ceramic substrate 13; and when the first substrate is a ceramic substrate 13, the second substrate can be a metal substrate 12. It should be noted that the specific choice of the first substrate and the second substrate can be selected according to the actual application scenario of the semiconductor refrigeration system, such as the comprehensive consideration of the two perspectives of heat transfer matching and cost performance.

[0071] Preferably, the metal substrate 12 includes an insulating layer 121 and a metal substrate layer 122 which are sequentially arranged from the inside to the outside, and the metal substrate layer 122 is a copper layer or an aluminum layer.

[0072] like Figure 3 As shown, the metal substrate 12 used in this solution includes at least a two-layer structure, and the material of the metal substrate layer 122 is preferably copper or aluminum.

[0073] Preferably, the ceramic substrate 13 includes a ceramic substrate layer 131 and a metal cladding layer 132 which are sequentially arranged from the inside to the outside, and the metal cladding layer 132 is a copper layer or a molybdenum-manganese alloy layer.

[0074] like Figure 4 As shown, the ceramic substrate 13 used in this solution includes at least a two-layer structure, and the material of the metal cladding layer 132 is preferably copper or molybdenum-manganese alloy.

[0075] Preferably, the ceramic substrate layer 131 includes a plurality of ceramic substrates, and the ceramic substrate layer 131 is formed by splicing the plurality of ceramic substrates, and stress gaps are left between the ceramic substrates.

[0076] The cooling capacity of the semiconductor refrigerator 1 is proportional to the logarithm of the PN couple to the grain 11. At the same time, it is limited by the thermal conductivity of the ceramic substrate, the heat flux density of the hot end of the semiconductor refrigerator 1, and the integration process level of the PN couple to the grain. The integration of the PN couple to the grain 11 in the semiconductor refrigerator 1 has certain limitations, so the cooling capacity of the semiconductor refrigerator 1 is positively correlated with the substrate area, that is, the larger the cooling capacity of the semiconductor refrigerator 1, the larger the substrate area. When a large-area substrate is welded to a heat exchanger, a large stress will be generated inside the semiconductor refrigerator 1.

[0077] As for the ceramic substrate layer 131, it is relatively brittle and it is difficult to effectively reduce the influence of the internal pressure of the semiconductor refrigerator 1 on the product stability like the metal substrate layer 122 with better toughness. Therefore, in order to effectively release the internal stress of the ceramic substrate 13 and improve the stability and reliability of the semiconductor refrigerator 1 during operation, the present solution makes the ceramic substrate layer 131 in the ceramic substrate 13 be spliced ​​by several ceramic substrates, and leaves a stress gap (not shown in the figure) between the ceramic substrates for releasing the internal stress, and at the same time, the metal coating layer 132 is coated on its outer surface, so as to obtain a complete ceramic substrate 13.

[0078] It should be noted that the more ceramic substrates there are per unit area, the smaller the internal stress of the ceramic substrate 13 is, and the greater the stability and reliability of the semiconductor refrigerator 1 during operation. However, it should be noted that the number of ceramic substrates in the ceramic substrate 13 needs to be selected based on the actual application scenario of the semiconductor refrigeration system, such as the size of the internal stress and the circuit direction in the semiconductor refrigerator 1.

[0079] Preferably, the ceramic substrate and the hot end of the PN couple crystal grain 11 are bonded to each other.

[0080] Since condensed water may accumulate at the cold end of the semiconductor refrigerator 1 during operation, in order to avoid the accumulation of condensed water affecting the normal operation of the PN couple pair of crystal grains 11, the present scheme preferably applies the stress structure scheme of the ceramic substrate 13 to the hot end of the PN couple pair of crystal grains 11 to further improve the stability and reliability of the operation of the semiconductor refrigerator 1.

[0081] Preferably, the area of ​​the ceramic substrate is ≥300cm 2 .

[0082] In a more preferred embodiment of the present technical solution, the minimum area of ​​the single-chip ceramic substrate is optimized to take into account both the production difficulty and the reliability of the semiconductor refrigerator 1.

[0083] Preferably, the PN couple pair crystal grains 11 are provided with a plurality of pairs, and each pair of the PN couple pair crystal grains 11 occupies an area of ​​0.05 to 0.1 mm 2 .

[0084] In another more preferred embodiment of the present technical solution, the integration degree of the PN couple pair crystal grains 11 is optimized to take into account both the cooling capacity and integration difficulty of the semiconductor refrigerator 1 .

[0085] Preferably, the semiconductor refrigerator 1 is located at the center of the hot-end heat exchanger, and the hot-end heat exchanger is the first heat exchanger 2 or the second heat exchanger 3 .

[0086] According to semiconductor refrigeration theory, the cooling capacity of semiconductor refrigerator 1 is Q c for:

[0087] Q c =N(α p -α n )IT c -K(T h -T c )-0.5I 2 R i ,

[0088] Among them, N, α p , α n , I, K, T h , T c , R i They are the number of PN couple grains, the Seebeck coefficient of p-type material, the Seebeck coefficient of n-type material, the operating current, the thermal conductivity of the refrigerator, the hot end temperature, the cold end temperature and the internal resistance of the semiconductor refrigerator 1. The cooling coefficient (or conversion efficiency) is cop = Q c / P i , where P i is the electrical input power of the semiconductor refrigerator 1. It can be seen that the cooling capacity and cooling efficiency of the semiconductor refrigerator 1 are both related to the hot end temperature T of the semiconductor refrigerator 1. h When other parameters are relatively fixed, T h The smaller the temperature, the lower the hot end temperature of the semiconductor refrigerator 1. c The larger the cop, the better the cooling effect. Therefore, one solution to increase the cooling capacity of the refrigeration system is to reduce the hot end temperature T of the semiconductor refrigerator 1. h , and reduce the hot end temperature T hThe most direct way is to improve the heat dissipation effect of the semiconductor refrigerator 1. Therefore, in order to improve the heat dissipation effect of the semiconductor refrigerator 1, the present solution also attaches the semiconductor refrigerator 1 to the center of the hot end heat exchanger.

[0089] Preferably, the shape of the heat exchange plate 21 of the hot-end heat exchanger is any one of circular, square, elliptical and rectangular, and the hot-end heat exchanger is the first heat exchanger 2 or the second heat exchanger 3 .

[0090] Furthermore, in order to ensure the heat dissipation effect of the semiconductor refrigerator 1, the present solution also optimizes the shape of the heat exchange plate 21 of the hot end heat exchanger to take into account the heat dissipation effect and processing difficulty of the heat exchanger. In some embodiments, the present solution further optimizes the shape of the heat exchange plate 21 of the hot end heat exchanger to be circular or square.

[0091] Preferably, the heat exchange plate 21 of the hot end heat exchanger is in a rectangular shape, with a length of L and a width of D, then:

[0092] L / D≤2.

[0093] In other embodiments, if the heat exchange plate 21 of the hot end heat exchanger must be made into a rectangular shape due to processing conditions or installation position limitations, the slight defects caused by the shape of the heat exchange plate 21 can be overcome by optimizing its aspect ratio.

[0094] A refrigeration device using the semiconductor refrigeration system;

[0095] The invention also comprises a shell 6, wherein the shell 6 is provided with an air inlet 61, a cooling outlet 62 and a heat dissipation outlet 63; the semiconductor refrigeration system is installed inside the shell 6;

[0096] The first end face is the cold end face of the semiconductor refrigerator 1, the second end face is the hot end face of the semiconductor refrigerator 1, and the air inlet of the heat exchange fan 4 is arranged close to the air inlet 61, the air outlet end of the heat exchange channel of the first heat exchanger 2 is arranged close to the cooling outlet 62, and the air outlet end of the heat exchange channel of the second heat exchanger 3 is arranged close to the heat dissipation outlet 63.

[0097] The present application also provides a refrigeration device, such as Figure 5 As shown, it includes the semiconductor refrigeration system and the housing 6 mentioned in the above scheme. For example, when the refrigeration device is working, the semiconductor refrigeration system is energized, at which time the first end face of the semiconductor refrigerator 1 starts to cool, the second end face starts to generate heat, the heat exchange fan 4 starts to rotate, and the heat exchange gas enters the air inlet of the heat exchange fan 4 through the air inlet 61 of the housing 6, and is separated into two heat exchange air flows at the air outlet of the heat exchange fan 4.

[0098] As the first end face is cooled, since the first heat exchanger 2 is connected to the first end face and heat is conducted between the two, the cold energy generated by the first end face will be conducted to the first heat exchanger 2. When one of the heat exchange airflows enters the heat exchange channel of the first heat exchanger 2, it will carry the cold energy on the first heat exchanger 2, be discharged from the refrigeration outlet 62 and be delivered to the load connected to the refrigeration equipment.

[0099] As the second end surface generates heat, since the second heat exchanger 3 is connected to the second end surface and there is a heat conduction connection between the two, the heat generated by the second end surface will be conducted to the second heat exchanger 3. When another heat exchange airflow enters the heat exchange channel of the second heat exchanger 3, it will carry the heat on the second heat exchanger 3 and be discharged from the refrigeration device through the heat dissipation outlet 63.

[0100] A cooling suit using the above refrigeration device;

[0101] The garment body structure is also included, the refrigeration device is installed on the garment body structure, the refrigeration outlet 62 is located inside the garment body structure, and the heat dissipation outlet 63 is located outside the garment body structure.

[0102] For people who work continuously in outdoor environments without air conditioning, especially in high temperature environments, such as police officers standing guard in hot summer weather, construction workers working under the scorching sun, or maintenance personnel performing related maintenance work outdoors at high altitudes, they often have to overcome various discomforts caused by high temperatures to continue working for a period of time. When working in high temperature conditions wearing ordinary clothes, people will sweat, and sweat will migrate to the surface of clothes through diffusion and transmission, and some heat will be taken away by sweat evaporation. However, the evaporation source provided by sweat evaporation is limited, so the heat taken away is also limited. Especially when working continuously for a period of time in a high temperature environment, ordinary clothes cannot achieve the effect of cooling within a certain period of time.

[0103] Therefore, in order to meet the needs of users, especially those working outdoors in high temperatures, the present application also provides a cooling garment, including the refrigeration device and garment body structure (not shown in the figure) mentioned in the above scheme, so that the refrigeration outlet 62 of the refrigeration device is facing the inside of the garment body structure, so that the cold air output through the refrigeration outlet 62 takes away part of the heat generated by the human body, thereby realizing continuous cycle refrigeration and cooling of the cooling garment, thereby improving the user experience.

[0104] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0105] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps described in these embodiments do not limit the scope of the utility model. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0106] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present utility model; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0107] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0108] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0109] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0110] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A semiconductor refrigeration system, characterized in that: The invention comprises a semiconductor refrigerator, a first heat exchanger, a second heat exchanger and a heat exchange fan, wherein the semiconductor refrigerator is provided with a first end face and a second end face opposite to each other, the first heat exchanger is connected to the first end face, the second heat exchanger is connected to the second end face, and the first heat exchanger and the second heat exchanger are both provided with a heat exchange channel; The air outlet of the heat exchange fan is arranged toward the air inlet end of the heat exchange channel.

2. A semiconductor refrigeration system according to claim 1, characterized in that: At least one heat exchange fan is provided.

3. A semiconductor refrigeration system according to claim 1, characterized in that: It also includes an air guide plate, which is arranged between the semiconductor refrigerator and the heat exchange fan.

4. A semiconductor refrigeration system according to claim 3, characterized in that: The air guide plate is provided with a hinged end, and the hinged end is arranged close to the semiconductor refrigerator, and the air guide plate swings around the hinged end as an axis.

5. A semiconductor refrigeration system according to claim 4, characterized in that: The hinged end is connected to the semiconductor refrigerator.

6. A semiconductor refrigeration system according to claim 1, characterized in that: The first heat exchanger and the second heat exchanger have the same structure, and the first heat exchanger and the second heat exchanger are symmetrically arranged with respect to the semiconductor refrigerator.

7. A semiconductor refrigeration system according to claim 1, characterized in that: The first heat exchanger and the second heat exchanger both include heat exchange plates and heat exchange fins; The heat exchange plate of the first heat exchanger is connected to the first end surface, and the heat exchange plate of the second heat exchanger is connected to the second end surface; The heat exchange fins are provided in plurality, and the gaps between the plurality of heat exchange fins are installed on the outer side wall of the heat exchange plate, and the heat exchange channel is provided between two adjacent heat exchange fins.

8. A semiconductor refrigeration system according to claim 7, characterized in that: The heat exchange plate and the heat exchange fins both extend in a vertical direction, and the heat exchange fan is installed at the bottom of the semiconductor refrigerator.

9. A refrigeration device, characterized in that: Use the semiconductor refrigeration system according to any one of claims 1 to 8; It also includes a shell, the shell is provided with an air inlet, a cooling outlet and a heat dissipation outlet; the semiconductor refrigeration system is installed inside the shell; The first end face is the cold end face of the semiconductor refrigerator, the second end face is the hot end face of the semiconductor refrigerator, and the air inlet of the heat exchange fan is arranged close to the air inlet, the air outlet end of the heat exchange channel of the first heat exchanger is arranged close to the refrigeration outlet, and the air outlet end of the heat exchange channel of the second heat exchanger is arranged close to the heat dissipation outlet.

10. A cooling suit, characterized in that: Use of the refrigeration device according to claim 9; It also includes a body structure, the refrigeration device is installed on the body structure, the refrigeration outlet is located inside the body structure, and the heat dissipation outlet is located outside the body structure.

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