CPU cooling device

Abstract

The utility model discloses a central processing unit (CPU) cooling device, which relates to the technical field of computer hardware, and comprises a heat dissipation base, a plurality of heat conduction pipes are arranged on two sides of the heat dissipation base, a plurality of uniformly arranged heat dissipation fins are arranged on the heat conduction pipes, and the bottom ends of the heat conduction pipes penetrate through the heat dissipation base. Cooling mechanisms are arranged on the two sides of the heat dissipation fins, a fixing mechanism is arranged on the heat dissipation base, a protection mechanism is arranged at the outer end of the fixing mechanism, the cooling mechanisms can cool the heat dissipation fins in an accelerated mode, the cooling device is fixed to a mainboard through the fixing mechanism, and the protection mechanism can protect the heat dissipation fins when the cooling device is installed. And the mainboard is protected from being damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of computer hardware, in particular to a CPU cooling device. Background Art

[0002] The CPU of a computer system is the core component of the computer. Most of the energy of the CPU is released in the form of heat during operation, which causes the CPU temperature to rise. Since the electron mobility increases under high temperature conditions, the computing stability of the CPU system is reduced in high temperature environments. Therefore, the cooling system of the CPU chip plays a vital role in the stability of the computer computing system.

[0003] At present, the CPU's heat dissipation method mainly absorbs the heat generated by the CPU through the heat sink. The heat dissipation effect is limited and the heat dissipation efficiency is low. When installing the cooling device, the fixing structure is generally hard-connected to make a hard contact between the base and the CPU. If the fixing is too tight, the CPU will be damaged, and if the fixing is too loose, it will easily become loose.

[0004] Based on this, a CPU cooling device is now provided, which can eliminate the disadvantages of the existing device. Utility Model Content

[0005] The utility model aims to provide a CPU cooling device to solve the problems of limited heat dissipation effect and low heat dissipation efficiency in the existing cooling device. When installing the cooling device, the fixing structure is generally fixed by hard connection, so that the base and the CPU are in hard contact. Too tight fixing may damage the CPU, and too loose fixing may easily occur.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A CPU cooling device comprises a heat dissipation base, a plurality of heat conduction pipes are arranged on both sides of the heat dissipation base, a plurality of evenly arranged heat dissipation fins are arranged on the heat conduction pipes, the bottom ends of the heat conduction pipes mutually penetrate the heat dissipation base, cooling mechanisms are arranged on both sides of the heat dissipation fins, a fixing mechanism is arranged on the heat dissipation base, and a protective mechanism is arranged on the outer end of the fixing mechanism.

[0008] On the basis of the above technical solutions, the present invention also provides the following optional technical solutions:

[0009] In an optional solution: the cooling mechanism includes a fan, the fan is located on both sides of the heat dissipation fins, and fixing frames are provided at four corners of the heat dissipation fins. The fan is fixedly connected to the fixing frame by a plurality of third screws.

[0010] In an optional solution: the two groups of fans are arranged in a positive direction on both sides of the heat dissipation fins and have the same wind direction.

[0011] In an optional solution: a mounting frame is provided on the upper surface of the heat dissipation base, and the mounting frame is fixedly connected to the heat dissipation base by a plurality of first screws.

[0012] In an optional solution: a second screw is provided at the outer end of the mounting frame, a gasket is provided above the mounting frame and outside the second screw, and a first spring is provided between the gasket and the mounting frame.

[0013] In an optional solution: a rubber pad is arranged below the mounting frame and outside the second screw, and a second spring is arranged between the rubber pad and the mounting frame.

[0014] In an optional solution: the heat pipe is made of copper.

[0015] In an optional solution: the heat sink fins are made of aluminum.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] The utility model has cooling mechanisms on both sides of the heat dissipation fins, a fixing mechanism on the heat dissipation base, and a protective mechanism on the outer end of the fixing mechanism. The cooling mechanism can accelerate the cooling of the heat dissipation fins, and the cooling device is fixed on the mainboard through the fixing mechanism. The protective mechanism can protect the mainboard from damage when the cooling device is installed. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall structure of the utility model from the first perspective.

[0019] Figure 2 This is a schematic diagram of the overall structure of the utility model from a second viewing angle.

[0020] Figure 3 This is a schematic diagram of the overall structure of the utility model from a third viewing angle.

[0021] Notes on figure numbers: 1. heat sink; 2. heat pipe; 3. heat sink fin; 4. mounting frame; 5. first screw; 6. gasket; 7. first spring; 8. rubber pad; 9. second spring; 10. second screw; 11. fixing frame; 12. fan; 13. third screw. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0023] Example 1

[0024] In one embodiment, Figure 1-Figure 3As shown, a CPU cooling device comprises a heat dissipation base 1, a plurality of heat pipes 2 are arranged on both sides of the heat dissipation base 1, a plurality of evenly arranged heat dissipation fins 3 are arranged on the heat pipes 2, the bottom ends of the heat pipes 2 mutually penetrate the heat dissipation base 1, cooling mechanisms are arranged on both sides of the heat dissipation fins 3, a fixing mechanism is arranged on the heat dissipation base 1, a protective mechanism is arranged on the outer end of the fixing mechanism, the cooling mechanism can accelerate the cooling of the heat dissipation fins, the cooling device is fixed on the mainboard by the fixing mechanism, and the protective mechanism can protect the mainboard from damage when the cooling device is installed.

[0025] In one embodiment, Figure 1 As shown, the cooling mechanism includes a fan 12, which is located on both sides of the heat dissipation fins 3. A fixing frame 11 is provided at the four corners of the heat dissipation fins 3. The fan 12 is fixedly connected to the fixing frame 11 by a plurality of third screws 13, which is convenient for disassembly and cleaning.

[0026] In one embodiment, Figure 1 and Figure 3 As shown, two groups of fans 12 are arranged in the positive direction on both sides of the heat dissipation fins 3, with the same wind direction, so that one group of fans 12 blows air onto the heat dissipation fins 3, and the other group blows air outward to accelerate heat dissipation.

[0027] In one embodiment, Figure 2 As shown, a mounting frame 4 is provided on the upper surface of the heat dissipation base 1 , and the mounting frame 4 is fixedly connected to the heat dissipation base 1 by a plurality of first screws 5 and can be disassembled.

[0028] In one embodiment, Figure 2 As shown, a second screw 10 is provided at the outer end of the mounting frame 4, a gasket 6 is provided above the mounting frame 4 and located outside the second screw 10, and a first spring 7 is provided between the gasket 6 and the mounting frame 4. During the installation process, the second screw 10 presses the gasket 6 downward, so that the gasket 6 presses the first spring 7, thereby preventing the second screw 10 from squeezing the mounting frame 4 too hard during the installation process and causing damage.

[0029] Example 2

[0030] In one embodiment, Figure 2 As shown, a rubber pad 8 is provided below the mounting frame 4 and outside the second screw 10, and a second spring 9 is provided between the rubber pad 8 and the mounting frame 4. During installation, the rubber pad 8 contacts the mainboard to protect the mainboard and prevent the mounting frame 4 from directly contacting the mainboard and causing damage.

[0031] In one embodiment, Figure 1 As shown, the heat pipe 2 is made of copper, which has excellent thermal conductivity and can quickly transfer heat to the heat sink, thereby improving the overall heat dissipation efficiency.

[0032] In one embodiment, Figure 1 As shown, the heat dissipation fins 3 are made of aluminum, which has a high thermal conductivity and is light in weight, thereby reducing the weight of the entire heat dissipation system.

[0033] The above embodiment discloses a CPU cooling device. When in use, the heat sink base 1 is brought into contact with the CPU and is installed on the mainboard through the second screw 10. During installation, the rubber pad 8 is in contact with the mainboard to protect the mainboard and prevent the mounting frame 4 from directly contacting the mainboard and causing damage. Fans 12 are installed on both sides of the heat sink fins 3. Two groups of fans 12 are arranged in a positive direction on both sides of the heat sink fins 3 with the same wind direction, so that one group of fans 12 blows air onto the heat sink fins 3 and the other group blows air outward to accelerate heat dissipation. The heat sink base 1 absorbs CPU heat and transfers it to the heat pipe 2. The heat sink fins absorb the heat from the heat pipe 2 and the heat is discharged by the fans 12.

[0034] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A CPU cooling device, comprising a heat dissipation base (1), a plurality of heat conduction pipes (2) are arranged on both sides of the heat dissipation base (1), a plurality of evenly arranged heat dissipation fins (3) are arranged on the heat conduction pipes (2), the bottom ends of the heat conduction pipes (2) mutually penetrate the heat dissipation base (1), characterized in that: Cooling mechanisms are arranged on both sides of the heat dissipation fins (3), a fixing mechanism is arranged on the heat dissipation base (1), and a protective mechanism is arranged on the outer end of the fixing mechanism.

2. The CPU cooling device according to claim 1, characterized in that: The cooling mechanism comprises a fan (12), the fan (12) being located on both sides of the heat dissipation fin (3), a fixing frame (11) being provided at four corners of the heat dissipation fin (3), and the fan (12) being fixedly connected to the fixing frame (11) by a plurality of third screws (13).

3. The CPU cooling device according to claim 2, characterized in that: The two groups of fans (12) are arranged in a positive direction on both sides of the heat dissipation fins (3) and have the same wind direction.

4. The CPU cooling device according to claim 1, characterized in that: A mounting frame (4) is provided on the upper surface of the heat dissipation base (1), and the mounting frame (4) is fixedly connected to the heat dissipation base (1) via a plurality of first screws (5).

5. The CPU cooling device according to claim 4, characterized in that: The outer end of each mounting frame (4) is provided with a second screw (10), a gasket (6) is provided above the mounting frame (4) and outside the second screw (10), and a first spring (7) is provided between the gasket (6) and the mounting frame (4).

6. The CPU cooling device according to claim 5, characterized in that: A rubber pad (8) is arranged below the mounting frame (4) and outside the second screw (10), and a second spring (9) is arranged between the rubber pad (8) and the mounting frame (4).

7. The CPU cooling device according to claim 1, characterized in that: The heat conducting pipe (2) is made of copper.

8. The CPU cooling device according to claim 1, characterized in that: The heat dissipation fins (3) are made of aluminum.

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