Repair device

Abstract

The utility model is suitable for the technical field of die bonding, and provides a repairing device, which comprises a rack, a clamp mechanism, a crystal removing swing arm assembly, a tin dispensing mechanism, a feeding working group, a die bonding swing arm assembly and a swing arm power unit. Compared with a repairing device in the prior art, in the process that the defective chips are removed from the products by the crystal removing swing arm assembly and are far away from the products, the crystal fixing swing arm assembly can obtain new chips under the driving of the swing arm power unit, and new solder paste is printed at the positions, where the defective chips are removed, of the products by the solder paste dispensing mechanism. According to the utility model, a new chip is installed at a new solder paste for spot printing, and the crystal removing swing arm assembly and the crystal fixing swing arm assembly are driven by the swing arm power unit to move synchronously, so that bad chip removal and new chip installation on a product can be carried out quickly and alternately, and the repair work efficiency and the production efficiency are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of solid crystal, and in particular relates to a repair device. Background Art

[0002] Die bonding refers to taking the chip off the wafer and fixing it on the product. The bonding process is usually completed by a die bonding machine. Since there are errors in the working of the die bonding machine, these errors will lead to bad chips during the bonding process, such as chip leakage, chip sideways, chip flipping or chip skew on the product. The presence of bad chips will reduce the quality of the product. It is necessary to use a repair device to repair the product to remove the bad chips on the product and reinstall new chips. However, most of the existing repair devices have technical problems of low working efficiency when in use, which seriously affects the production efficiency of the product. Utility Model Content

[0003] The utility model aims to provide a repair device, aiming to solve the technical problem of low working efficiency of the repair device in the prior art when in use.

[0004] The utility model is implemented as follows: a rework device is used to rework products in front of a furnace, and the rework device comprises a frame, a clamp mechanism, a crystal picking swing arm assembly, a tinning mechanism, a crystal fixing swing arm assembly and a swing arm power unit; the clamp mechanism is arranged on the frame, the clamp mechanism is used to support the product, and the clamp mechanism is also used to adjust the position of the product; the crystal picking swing arm assembly is used to remove defective chips and old solder paste on the product; the tinning mechanism is arranged on the frame, and the tinning mechanism is used to print new solder paste at the position where the defective chip is removed on the product; the crystal fixing swing arm assembly is used to install the new chip on the product and print new solder paste The position of the new solder paste; the swing arm power unit is arranged on the frame, and the crystal picking swing arm assembly and the crystal bonding swing arm assembly are both connected to the driving end of the swing arm power unit; the swing arm power unit is used to drive the crystal picking swing arm assembly and the crystal bonding swing arm assembly to move synchronously, and alternately move to the waiting area of ​​the product, and the tinning mechanism can avoid the two components when the crystal picking swing arm assembly and the crystal bonding swing arm assembly move to the waiting area, and can also perform the new solder paste spot printing operation after the crystal picking swing arm assembly moves out of the waiting area and before the crystal bonding swing arm assembly moves to the waiting area, and the waiting area is the area where the defective chips are located.

[0005] In an optional embodiment, the crystal picking swing arm assembly includes a first swing arm and a crystal picking nozzle, the first end of the first swing arm is connected to the driving end of the swing arm power unit, and the crystal picking nozzle is arranged at the second end of the first swing arm, the crystal picking nozzle is used to push the defective chip and at least part of the old solder paste under the action of the first swing arm to separate the defective chip and at least part of the old solder paste from the product, and the crystal picking nozzle is also used to communicate with an external negative pressure device to absorb the separated defective chip through negative pressure and scrape off the old solder paste.

[0006] In an optional embodiment, the crystal picking swing arm assembly further includes a filter unit, which is connected to the air outlet side of the crystal picking nozzle, and is used to filter the airflow from the crystal picking nozzle into the external negative pressure device.

[0007] In an optional embodiment, the crystal picking nozzle includes a nozzle part and a nozzle cover, the nozzle cover is mounted on the outside of the nozzle part, and the inner wall of the nozzle cover is spaced apart from the nozzle part, the lower end of the nozzle part protrudes from the nozzle cover, the nozzle cover is used to be connected to the external negative pressure device, the nozzle part is used to contact the defective chip and loosen the defective chip, and the nozzle cover is used to absorb the defective chip and the old solder paste.

[0008] In an optional embodiment, the crystal picking nozzle further includes a position measuring unit, and the position measuring unit is used to measure the position height of the product.

[0009] In an optional embodiment, the die bonding swing arm assembly includes a second swing arm and a die bonding nozzle, the first end of the second swing arm is connected to the driving end of the swing arm power unit, the die bonding nozzle is arranged at the second end of the second swing arm, and the die bonding nozzle is used to be connected to an external negative pressure device pipeline to absorb the new chip through negative pressure.

[0010] In an optional embodiment, the tinning mechanism includes a tinning bracket, a tinning swing arm assembly and a tin supply device, the tinning bracket is arranged on the frame, the tinning swing arm assembly is arranged on the tinning bracket, the tin supply device is arranged on the tinning bracket, the tin supply device is used to provide and hold solder paste, and the tinning swing arm assembly is used to dip the solder paste in the tin supply device and print new solder paste on the position of the product where the defective chips are removed.

[0011] In an optional embodiment, the rework device also includes a feed conveying mechanism, which is used to transport products to the clamping mechanism. The feed conveying mechanism includes a feed base, a fixed side plate, an adjustable side plate and a material blocking assembly. The feed base is arranged on the frame, and the fixed side plate and the adjustable side plate are spaced apart on the feed base. The adjustable side plate has the freedom to move along a first direction relative to the fixed side plate and the feed base, and the first direction is a direction perpendicular to the plate surface of the fixed side plate. Conveying units are arranged on the fixed side plate and the adjustable side plate, and the conveying unit is used to support and transport the product. The material blocking assembly is located between the fixed side plate and the adjustable side plate.

[0012] In an optional embodiment, the rework device also includes a feeding working group, which is used to provide new chips. The feeding working group includes a crystal ring feeding mechanism, a crystal ring transporting mechanism, a crystal ring rotating platform and a pin mechanism. The crystal ring feeding mechanism is arranged on the frame, and the crystal ring feeding mechanism is used to accommodate and store crystal rings. The crystal ring rotating platform is arranged on the frame, and the crystal ring rotating platform is used to support the crystal ring and adjust the position of the crystal ring. The crystal ring transporting mechanism is arranged on the frame and located between the crystal ring feeding mechanism and the crystal ring rotating platform. The crystal ring transporting mechanism is used to transport the crystal ring from the crystal ring feeding mechanism to the crystal ring rotating platform. The pin mechanism is arranged on the frame and located below the working end of the crystal ring rotating platform. The pin mechanism is used to separate the chip from the crystal ring.

[0013] In an optional embodiment, the clamp mechanism includes a clamp base, a first sliding part, a second sliding part, a clamp frame and a lifting assembly, the clamp base is arranged on the frame, the first sliding part is slidably arranged on the clamp base, the second sliding part is slidably arranged on the first sliding part, and the sliding direction of the first sliding part is set at an angle to the sliding direction of the second sliding part, and the clamp frame and the lifting assembly are both arranged on the second sliding part.

[0014] The technical effect of the utility model relative to the prior art is: by providing a clamp mechanism on the frame, the product can be fixed and the position of the product can be adjusted, and a swing arm power unit is also provided on the frame, and a crystal removal swing arm assembly and a crystal fixing swing arm assembly are also connected to the driving end of the swing arm power unit, and the crystal removal swing arm assembly and the crystal fixing swing arm assembly can be driven by the swing arm power unit to move synchronously to achieve the alternation of bad chip removal and new chip installation on the product. Compared with the rework device in the prior art, when rework is performed on the product, the crystal removal swing arm assembly can be first driven by the swing arm power unit to the product to remove bad chips, and after the bad chips are removed, the swing arm power unit drives the crystal removal swing arm assembly to leave the product, and then the tinning mechanism can print new solder paste at the position where the bad chips are removed on the product. While the crystal removing swing arm assembly removes defective chips from the product and keeps them away from the product, the crystal bonding swing arm assembly can obtain new chips under the drive of the swing arm power unit, and after the tinning mechanism prints new solder paste at the position where the defective chips are removed from the product, the new chip can be installed at the printed new solder paste position. The swing arm power unit drives the crystal removing swing arm assembly and the crystal bonding swing arm assembly to move synchronously, thereby realizing rapid alternation between removing defective chips and installing new chips on the product, thereby improving the efficiency of rework work and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments of the utility model or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 It is a structural schematic diagram of a repair device provided by an embodiment of the utility model;

[0017] Figure 2 It is a schematic structural diagram of the installation state of the crystal removal swing arm assembly and the crystal fixing swing arm assembly used in the embodiment of the utility model;

[0018] Figure 3 It is a structural schematic diagram of the crystal removal swing arm assembly used in the embodiment of the utility model;

[0019] Figure 4 yes Figure 3 A schematic diagram of the enlarged structure at A in the middle;

[0020] Figure 5 It is a structural schematic diagram of the tinning mechanism used in the embodiment of the utility model;

[0021] Figure 6It is a structural schematic diagram of the feeding and conveying mechanism adopted in the embodiment of the utility model;

[0022] Figure 7 It is a structural schematic diagram of the feeding working group adopted in the embodiment of the utility model;

[0023] Figure 8 It is a structural schematic diagram of the clamp mechanism used in the embodiment of the utility model.

[0024] Description of reference numerals:

[0025] 1. Frame; 2. Crystal picking swing arm assembly; 21. First swing arm; 22. Crystal picking nozzle; 221. Nozzle; 222. Nozzle cover; 23. Filter unit; 3. Crystal fixing swing arm assembly; 31. Second swing arm; 32. Crystal fixing nozzle; 4. Tinning mechanism; 41. Tinning swing arm assembly; 411. Third swing arm; 412. Tinning swing arm power unit; 413. Tin needle; 414. Swing arm mounting seat; 42. Tin supply device; 421. Tin tray; 422. Tin supply support seat; 423. Tin tray driving mechanism; 424. Scraper assembly; 43. Tinning bracket; 5. Feed conveying mechanism; 51. Feed base; 52. Fixed side plate; 53. Adjustable side plate; 54. Material blocking assembly; 55. Conveying unit; 6. Feeding working group; 61. Crystal ring feeding mechanism; 62. Crystal ring transport mechanism; 63. Crystal ring rotating platform; 64. Ejector mechanism; 7. Clamp mechanism; 71. Clamp base; 72. First sliding part; 73. Second sliding part; 74. Clamp frame; 75. Lifting assembly; 8. Swing arm power unit; 9. Waste containing structure. DETAILED DESCRIPTION

[0026] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0027] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0028] In this embodiment, according to Figure 1The XYZ rectangular coordinate system established in the definition is: the side located in the positive direction of the X axis is defined as the front, and the side located in the negative direction of the X axis is defined as the back; the side located in the positive direction of the Y axis is defined as the right, and the side located in the negative direction of the Y axis is defined as the left; the side located in the positive direction of the Z axis is defined as the top, and the side located in the negative direction of the Z axis is defined as the bottom.

[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0030] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0032] Please refer to Figure 1As shown, in an embodiment of the utility model, a rework device is provided for rework of products in front of a furnace, and the rework device includes a frame 1, a clamp mechanism 7, a crystal removal swing arm assembly 2, a tinning mechanism 4, a crystal fixing swing arm assembly 3 and a swing arm power unit 8. The clamp mechanism 7 is arranged on the frame 1, and the clamp mechanism 7 is used to support the product and adjust the position of the product. The crystal removal swing arm assembly 2 is used to remove defective chips and old solder paste on the product. The tinning mechanism 4 is arranged on the frame 1, and the tinning mechanism 4 is used to print new solder paste at the position where the defective chip is removed on the product. The crystal fixing swing arm assembly 3 is used to install the new chip at the position where the new solder paste is printed on the product. The swing arm power unit 8 is arranged on the frame 1, and the crystal picking swing arm assembly 2 and the crystal bonding swing arm assembly 3 are both connected to the driving end of the swing arm power unit 8, and the relative position between the crystal picking swing arm assembly 2 and the crystal bonding swing arm assembly 3 remains fixed. The swing arm power unit 8 is used to drive the crystal picking swing arm assembly 2 and the crystal bonding swing arm assembly 3 to move synchronously and alternately to the product's waiting area for operation, and the tinning mechanism 4 can avoid the crystal picking swing arm assembly 2 and the crystal bonding swing arm assembly 3 when they move to the waiting area for operation, and can also perform the operation of spot printing new solder paste after the crystal picking swing arm assembly 2 moves out of the waiting area for operation and before the crystal bonding swing arm assembly 3 moves to the waiting area for operation. The waiting area for operation is the area where the defective chips are located.

[0033] Specifically, in the process of solid crystal, firstly, the solder paste needs to be evenly dotted on the designated area of ​​the product, and then the chip needs to be fixed and glued to the designated area of ​​the product. Finally, the product with glue dotted and solid crystal is placed in a reflow oven, and the chip and solid crystal solder paste are heated to achieve eutectic welding. Among them, the product can refer to a bracket, and the product can also be a substrate, such as a PCB (Printed Circuit Board) substrate and other structures. Pre-furnace refers to before the product enters the reflow oven to heat the eutectic; rework refers to removing defective chips and old solder paste, and installing new chips after dotting new solder paste at the location of the defective chip. A bad chip may refer to a chip on the product that has installation problems such as skewed position, flipping, or poor adhesion.

[0034] The rack 1 refers to a supporting component with a certain height. The rack 1 may have a bearing surface, which is used to install and support other parts of the equipment. The bearing surface can be set in the horizontal direction. The clamp mechanism 7 refers to a component that can clamp the product and adjust the position of the product. The position adjustment of the product by the clamp mechanism 7 is mainly adjusted in the horizontal direction. The tinning mechanism 4 refers to a component that can print solder paste on a specified part of an object. The feeding working group 6 refers to a working group composed of multiple mechanisms. The feeding working group 6 can separate the chips on the crystal ring and transport them to the crystal retrieval position to provide new chips.

[0035] The crystal picking swing arm assembly 2 refers to an assembly with a certain length, and its function is to loosen the defective chips on the product and then remove them. The crystal picking swing arm assembly 2 can loosen the defective chips on the product and then connect the old solder paste to scrape them off when the clamp mechanism 7 drives the position of the product to change. The crystal picking swing arm assembly 2 can also loosen the defective chips on the product and then scrape them off together with the old solder paste through its own movement; the crystal fixing swing arm assembly 3 also refers to an assembly with a certain length, and its function is to transport and install the chips provided by the feeding working group 6 on the product; the swing arm power unit 8 refers to a component that can drive the object to move. The crystal picking swing arm assembly 2 and the crystal fixing swing arm assembly 3 are both connected to the driving end of the swing arm power unit 8, so that the crystal picking swing arm assembly 2 and the crystal fixing swing arm assembly 3 can move under the action of the swing arm power unit 8. The swing arm power unit 8 mainly drives the crystal picking swing arm assembly 2 and the crystal fixing swing arm assembly 3 to swing in the horizontal direction and rise and fall in the vertical direction.

[0036] The rework device provided in this embodiment can fix and adjust the position of the product by arranging a clamp mechanism 7 on the frame 1, and a swing arm power unit 8 is also arranged on the frame 1, and a crystal picking swing arm assembly 2 and a crystal fixing swing arm assembly 3 are also connected to the driving end of the swing arm power unit 8. The swing arm power unit 8 can drive the crystal picking swing arm assembly 2 and the crystal fixing swing arm assembly 3 to move synchronously to achieve the alternating removal of defective chips and installation of new chips on the product. The tinning mechanism 4 can avoid the crystal picking swing arm assembly 2 and the crystal fixing swing arm assembly 3 when they are moved to the area to be operated, and can also perform a new solder paste spot printing operation after the crystal picking swing arm assembly 2 is moved out of the area to be operated and before the crystal fixing swing arm assembly 3 is moved to the area to be operated. Compared with the rework device in the prior art, when rework is performed on a product, the swing arm power unit 8 can first be used to drive the crystal removal swing arm assembly 2 to the product to remove defective chips. After the defective chips are removed, the swing arm power unit 8 drives the crystal removal swing arm assembly 2 to leave the waiting area, and then the tinning mechanism 4 can print new solder paste at the position where the defective chips are removed on the product. In the process of the crystal removal swing arm assembly 2 removing the defective chips from the product and moving them away from the product, the solid crystal swing arm assembly 3 can obtain new chips under the drive of the swing arm power unit 8, and after the tinning mechanism 4 prints new solder paste at the position where the defective chips are removed from the product, the new chips are installed at the printed new solder paste. The swing arm power unit 8 drives the crystal removal swing arm assembly 2 and the solid crystal swing arm assembly 3 to move synchronously, so that the defective chips are removed and the new chips are installed in the waiting area of ​​the product in a rapid alternating manner, thereby improving the efficiency of the rework and production efficiency.

[0037] In an optional embodiment, the swing arm power unit 8 may include a hollow motor and a rotary driver, and the hollow motor and the rotary driver may form a UW axis assembly. The W axis assembly drives the crystal picking swing arm assembly 2 and the crystal fixing swing arm assembly 3 to swing, and the U axis assembly drives the crystal picking swing arm assembly 2 and the crystal fixing swing arm assembly 3 to rise and fall, thereby making the use of the swing arm power unit 8 more convenient.

[0038] In one embodiment, see Figure 2 and Figure 3 The crystal picking swing arm assembly 2 includes a first swing arm 21 and a crystal picking nozzle 22. The first end of the first swing arm 21 is connected to the driving end of the swing arm power unit 8, and the crystal picking nozzle 22 is arranged at the second end of the first swing arm 21. The crystal picking nozzle 22 is used to push the defective chips and at least part of the old solder paste under the action of the first swing arm 21, so that the defective chips and at least part of the old solder paste are separated from the product. The crystal picking nozzle 22 is also used to connect with an external negative pressure device to suck the separated defective chips through negative pressure and scrape off the old solder paste. Specifically, the external negative pressure device refers to a component or pipeline that can generate negative pressure. The external negative pressure device can be an independent vacuum device, such as a vacuum pump or other components. The external negative pressure device can also refer to a vacuum pipeline system in a production plant. The first swing arm 21 refers to a component with a certain length, and the crystal picking nozzle 22 refers to a nozzle with a certain length. Negative pressure can be generated at the crystal picking nozzle 22 by connecting the crystal picking nozzle 22 with the pipeline of the external negative pressure device.

[0039] When removing the defective chips and old solder paste on the product, the first swing arm 21 can be driven to rotate by the swing arm power unit 8 until the crystal removal nozzle 22 is located above the product, and then the position of the product is adjusted by the clamp mechanism 7 to make the crystal removal nozzle 22 contact the defective chip on the product, and finally the product is driven by the clamp mechanism 7 to make a relative movement between the product and the crystal removal nozzle 22, so that the defective chip can be pushed by the crystal removal nozzle 22 to loosen the defective chip and detach it from the product, and in the process of pushing the defective chip, the old solder paste can also be scraped off the product. At the same time, after the defective chip and the old solder paste are separated from the product, the external negative pressure device can generate negative pressure at the crystal removal nozzle 22 to absorb the defective chip and transport the defective chip away by the swing of the first swing arm 21, thereby improving the overall work efficiency of product repair.

[0040] In one embodiment, see Figure 3The crystal picking swing arm assembly 2 also includes a filter unit 23, which is connected to the air outlet side of the crystal picking nozzle 22, and is used to filter the airflow entering the external negative pressure device from the crystal picking nozzle 22. Specifically, the filter unit 23 refers to a component that can filter the gas passing through it, and the filter unit 23 can be a filter material arranged at the air outlet of the crystal picking nozzle 22, and the filter unit 23 can also be a filter material arranged at the air inlet of the external negative pressure device. The filter unit 23 can also include a cavity with a certain accommodating space, and a filter material arranged in the cavity. Through the setting of the filter unit 23, the gas entering the external negative pressure device can be filtered to prevent the old solder paste from entering the external negative pressure device, and the old solder paste can also be recycled and reused to reduce production costs.

[0041] In one embodiment, see Figure 4 The crystal picking nozzle 22 includes a nozzle portion 221 and a nozzle sleeve 222 mounted outside the nozzle portion 221. The inner wall of the nozzle sleeve 222 is spaced apart from the nozzle portion 221, and the lower end of the nozzle portion 221 protrudes from the nozzle sleeve 222. The nozzle sleeve 222 is used to communicate with an external negative pressure device, the nozzle portion 221 is used to contact and loosen the defective chip, and the nozzle sleeve 222 is used to absorb the defective chip and the old solder paste. Specifically, the nozzle portion 221 refers to a component having a certain hardness, and a vent hole may be provided inside the nozzle portion 221, and the vent hole is connected to the external negative pressure device, and the nozzle portion 221 may also be a solid component. The nozzle sleeve 222 refers to a cylindrical component having a certain internal space. By sleeved the nozzle sleeve 222 on the outside of the nozzle portion 221, and the inner wall of the nozzle sleeve 222 is spaced apart from the nozzle portion 221, the nozzle portion 221 can be connected to the external negative pressure device through a pipeline. At the same time, a nozzle sleeve 222 is provided at the lower end of the nozzle portion 221. When the crystal picking nozzle 22 is used to remove defective chips and old solder paste, the defective chips can be pushed through the lower end of the nozzle portion 221 and the old solder paste can be scraped off at the same time. At the same time, the defective chips and the old solder paste can be absorbed by the gap between the nozzle sleeve 222 and the nozzle portion 221, so that the pushing and absorption of the defective chips do not affect each other, thereby making the use of the crystal picking nozzle 22 more convenient.

[0042] In an alternative embodiment, see Figure 4 The nozzle part 221 is made of ceramic material. The nozzle part 221 adopts ceramic material to make itself have a certain hardness to facilitate the removal of defective chips and old solder paste. At the same time, the product itself will not be damaged during the scraping work, making the rework work safer and more reliable.

[0043] In one embodiment, see Figure 4The crystal picking nozzle 22 also includes a position measuring unit, which is used to measure the position height of the product. Specifically, the position measuring unit refers to a component that can measure the position or height of an object. The position measuring unit can adopt a linear displacement sensor, a photoelectric sensor or a Hall effect sensor. The position measuring unit can be integrated on the crystal picking nozzle 22, or it can be independently installed near the crystal picking nozzle 22 on the first swing arm 21. Through the setting of the position measuring unit, the crystal picking nozzle 22 can detect the height of the product when it is working, so that the height position of the product or the crystal picking nozzle 22 can be adjusted accordingly, so that the removal of defective chips can be more accurate, and the work efficiency of rework can be improved.

[0044] In one embodiment, see Figure 2 The crystal bonding swing arm assembly 3 includes a second swing arm 31 and a crystal bonding nozzle 32. The first end of the second swing arm 31 is connected to the driving end of the swing arm power unit 8. The second end of the second swing arm 31 extends in a direction away from the swing arm power unit 8. The crystal bonding nozzle 32 is arranged at the second end of the second swing arm 31. The crystal bonding nozzle 32 is used to connect with the negative pressure device to absorb the new chip. Specifically, the second swing arm 31 also refers to a component with a certain length. By arranging the crystal bonding nozzle 32 on the second end of the second swing arm 31, the crystal bonding nozzle 32 can move along an arc when the swing arm power unit 8 drives the second swing arm 31 to rotate, and during the movement of the crystal bonding nozzle 32, negative pressure can be generated at the crystal bonding nozzle 32 to absorb the new chip, and finally the transportation and installation of the new chip are realized. The crystal bonding swing arm assembly 3 can make the crystal bonding operation more convenient and simple by combining the second swing arm 31 with the crystal bonding nozzle 32, thereby improving the overall work efficiency of the entire rework operation.

[0045] In an alternative embodiment, see Figure 2 , the angle between the first swing arm 21 and the second swing arm 31 can be 180°, that is, the first swing arm 21 and the second swing arm 31 are located on the same straight line. By locating the first swing arm 21 and the second swing arm 31 on the same straight line, the crystal removal swing arm assembly 2 and the crystal fixing swing arm assembly 3 can be rotated synchronously while the crystal removal swing arm assembly 2 and the crystal fixing swing arm assembly 3 can also be alternately operated.

[0046] In one embodiment, see Figure 2 A waste containing structure 9 is arranged on the frame 1. The waste containing structure 9 can be a waste box, a containing slot opened on the frame 1, etc. An opening is arranged on the top of the waste box. After the crystal picking nozzle 22 on the crystal picking swing arm assembly 2 sucks the defective chip through negative pressure, the crystal picking nozzle 22 can be moved to the top of the waste box by the swing of the first swing arm 21, and then the crystal picking nozzle 22 stops working and no longer provides negative pressure. At this time, the defective chip will fall into the waste box, thereby realizing the collection of the defective chip and making the recycling of the defective chip more convenient.

[0047] In one embodiment, see Figure 5 The tinning mechanism 4 includes a tinning bracket 43, a tinning swing arm assembly 41 and a tin supply device 42. The tinning bracket 43 is arranged on the frame 1, the tinning swing arm assembly 41 is arranged on the tinning bracket 43, and the tin supply device 42 is arranged on the tinning bracket 43. The tin supply device 42 is used to provide and hold solder paste. The tinning swing arm assembly 41 is used to dip the solder paste in the tin supply device 42 and print new solder paste on the position where the defective chips are removed on the product. Specifically, the tinning bracket 43 refers to a supporting component with a certain height, and its function is to support the tinning swing arm assembly 41 and the tin supply device 42. The tin supply device 42 refers to a component that can provide solder paste, and the tin dipping arm assembly 41 refers to a component that can dip the solder paste in the tin supply device 42 and print it on the bracket belt. During the operation of the tinning mechanism 4, the product can be supported by the clamping mechanism 7, and the tin dipping arm assembly 41 can dip the solder paste in the tin supply device 42 and then print it on the position on the product where defective chips are to be removed, making the entire tinning operation more convenient and quick.

[0048] In an alternative embodiment, see Figure 5 The tin supply device 42 includes a tin tray 421, a tin supply support seat 422, a tin tray driving mechanism 423 and a scraper assembly 424. The tin supply support seat 422 is arranged on the tin point bracket 43. The tin tray 421 is rotatably arranged on the tin supply support seat 422. The tin tray 421 is used to accommodate solder paste. The tin tray driving mechanism 423 is arranged on the tin supply support seat 422 and is used to drive the tin tray 421 to rotate. The scraper assembly 424 is arranged on the tin supply support seat 422, and at least a part of the scraper assembly 424 extends into the tin tray 421, and is used to scrape the solder paste in the tin tray 421 to make the thickness of the solder paste uniform.

[0049] Specifically, the tin supply support seat 422 refers to a support component with a certain volume, and the tin supply support seat 422 and the tin point bracket 43 can be connected by welding, fasteners or clamping. The tin tray 421 refers to a disc-shaped component with a certain accommodating space. The tin tray 421 can have a depression of a certain depth to form the above-mentioned accommodating space. The opening of the tin tray 421 is generally set upward to prevent the solder paste contained in the tin tray 421 from leaking out. The tin tray 421 is rotatably arranged on the tin supply support seat 422, which means that the tin tray 421 can be rotated relative to the tin supply support seat 422, wherein the rotation direction of the tin tray 421 is generally horizontal; the tin tray 421 can be connected to the tin supply support seat 422 through a rotating shaft, or by arranging a plurality of rollers arranged around the tin tray 421 on the tin supply support seat 422, so that the tin tray 421 can be supported while also being rotatable. The tin pan 421 may be disposed below the outlet of the solder paste container so that the solder paste can flow into the tin pan 421 during operation, thereby replenishing the solder paste in the tin pan 421 .

[0050] The tin tray driving mechanism 423 refers to a component that can drive an object to rotate, such as a power unit such as a motor or a hydraulic motor. The tin tray driving mechanism 423 may also include a tin tray 421 transmission unit for connecting the driving end of the power unit to the tin tray 421. The scraper assembly 424 refers to a component with a certain volume. The scraper assembly 424 is arranged on the tin supply support seat 422, by at least partially extending the scraper assembly 424 into the tin tray 421 and being spaced apart on the bottom surface of the tin tray 421. In this way, during the rotation of the tin tray 421, the scraper assembly 424 will scrape the solder paste in the tin tray 421 to keep the thickness of the solder paste behind the scraper assembly 424 consistent.

[0051] During the operation of the tin supply device 42, the tin plate 421 is driven to rotate by the tin plate driving mechanism 423, so that a relative movement is generated between the tin plate 421 and the scraper assembly 424, so that the scraper assembly 424 scrapes the solder paste in the tin plate 421, thereby ensuring that the depth of the solder paste after the scraper assembly 424 scrapes remains constant. At this time, the tin-dipping swing arm assembly 41 can dip the solder paste in the area after the scraper assembly 424 scrapes, ensuring that the amount of solder paste dipped by the tin-dipping swing arm assembly 41 is constant each time, thereby ensuring the consistency of the amount of tin dotted, and improving the installation quality of the new chip on the product.

[0052] In one embodiment, see Figure 5 The tinning swing arm assembly 41 includes a swing arm mounting seat 414, a tinning swing arm power group 412, a third swing arm 411 and a tinning needle 413. The swing arm mounting seat 414 is connected to the tinning bracket 43. The third swing arm 411 is connected to the driving end of the tinning swing arm power group 412. The tinning needle 413 is arranged at the end of the third swing arm 411 away from the tinning swing arm power group 412. The tinning swing arm power group 412 is arranged on the swing arm mounting seat 414, and the tinning swing arm power group 412 is used to drive the third swing arm 411 to swing and move in the vertical direction. Specifically, the swing arm mounting seat 414 refers to a supporting component with a certain volume. The tinning swing arm power group 412 refers to a component that can drive an object to swing and lift, and the tinning swing arm power group 412 is arranged on the swing arm mounting seat 414. The third swing arm 411 is a component with a certain length. The third swing arm 411 is connected to the driving end of the tinning swing arm power group 412. The tinning needle 413 is set at the end of the third swing arm 411 and can move together when the third swing arm 411 swings. The tinning swing arm assembly 41 can control the swing of the third swing arm 411 and adjust the vertical height of the third swing arm 411 through the tinning swing arm power group 412, so that the tinning needle 413 can dip the solder paste and then print it on the product, so that the entire tinning operation can be more convenient and quick.

[0053] In one embodiment, see Figure 6The rework device also includes a feed conveying mechanism 5, which is used to transport products to the clamp mechanism 7. The feed conveying mechanism 5 includes a feed base 51, a fixed side plate 52, an adjustable side plate 53 and a material blocking assembly 54. The feed base 51 is arranged on the frame 1, and the fixed side plate 52 and the adjustable side plate 53 are arranged on the feed base 51 at intervals. The adjustable side plate 53 has the freedom to move along a first direction relative to the fixed side plate 52 and the feed base 51. The first direction is a direction perpendicular to the plate surface of the fixed side plate 52. Conveying units 55 are arranged on the fixed side plate 52 and the adjusting side plate 53. The conveying units 55 are used to support and transport products. The material blocking assembly 54 is located between the fixed side plate 52 and the adjusting side plate 53. Specifically, the feed base 51 refers to a supporting component with a certain volume, the fixed side plate 52 and the adjustable side plate 53 both refer to plate-shaped components with a certain height, and the fixed side plate 52 and the adjustable side plate 53 are spaced apart to form a channel structure for limiting the position of the product, wherein the fixed side plate 52 can be installed on the feed base 51 by welding, fastener connection or clamping;

[0054] The adjustable side plate 53 can be connected to the feed base 51 through a sliding structure, and the gap between the adjustable side plate 53 and the fixed side plate 52 can be adjusted according to the specifications of the product. The sliding structure can be a slide rail slider structure, or a slide rail roller structure. The conveying unit 55 refers to a component that can support and push the product to move. The conveying unit 55 can include a conveyor belt group and a conveying power unit. The blocking component 54 refers to a component that can block the product. The blocking component 54 can include a flip baffle and a pushing unit. The flipping of the flip baffle can be pushed by the pushing unit to achieve blocking the product and allowing the product to pass. Through the setting of the feed conveying mechanism 5, the product can be transported to the clamping mechanism 7, realizing the automatic feeding of the product. At the same time, the feeding speed and frequency can be controlled by the blocking component 54, which can make the use of the feed conveying mechanism 5 more convenient.

[0055] In one embodiment, see Figure 7The rework device also includes a feeding working group 6, which is used to provide new chips. The feeding working group 6 includes a crystal ring feeding mechanism 61, a crystal ring transporting mechanism 62, a crystal ring rotating platform 63 and a pin mechanism 64. The crystal ring feeding mechanism 61 is arranged on the frame 1, and the crystal ring feeding mechanism 61 is used to accommodate and store the crystal ring. The crystal ring rotating platform 63 is arranged on the frame 1, and the crystal ring rotating platform 63 is used to support the crystal ring and adjust the position of the crystal ring. The crystal ring transporting mechanism 62 is arranged on the frame 1 and is located between the crystal ring feeding mechanism 61 and the crystal ring rotating platform 63. The crystal ring transporting mechanism 62 is used to transport the crystal ring from the crystal ring feeding mechanism 61 to the crystal ring rotating platform 63. The pin mechanism 64 is arranged on the frame 1 and is located below the working end of the crystal ring rotating platform 63. The pin mechanism 64 is used to separate the chip from the crystal ring. When working, the crystal ring transport mechanism 62 can take the crystal ring from the crystal ring feeding mechanism 61 and place it on the crystal ring rotating platform 63, and can also put the empty crystal ring on the crystal ring rotating platform 63 back into the crystal ring feeding mechanism 61. The crystal ring can be supported and the position of the crystal ring can be adjusted by the crystal ring rotating platform 63, and then the chip on the crystal ring can be separated by the ejector mechanism 64, so that the crystal bonding swing arm assembly 3 can take the chip away and install it at the position of printing new solder paste, which can make the chip supply more convenient.

[0056] In another alternative embodiment, see Figure 2 The frame 1 is also provided with a first camera unit and a second camera unit. The first camera unit is located above the clamp mechanism 7 and is used to detect the product bonding condition. The first camera unit can also capture an image of the product. After acquiring the above image, the computer can analyze the product to obtain the position of the defective chip on the product. The second camera unit is arranged above the crystal ring rotating platform 63 and can capture the crystal bonding nozzle 32 on the crystal bonding swing arm assembly 3 to determine the position of the chip on the crystal bonding nozzle 32, thereby realizing accurate judgment of the chip position.

[0057] In one embodiment, see Figure 8The clamp mechanism 7 includes a clamp base 71, a first sliding part 72, a second sliding part 73, a clamp frame 74 and a lifting assembly 75. The clamp base 71 is arranged on the frame 1, the first sliding part 72 is slidably arranged on the clamp base 71, the second sliding part 73 is slidably arranged on the first sliding part 72, and the sliding direction of the first sliding part 72 is arranged at an angle with the sliding direction of the second sliding part 73. The clamp frame 74 and the lifting assembly 75 are both arranged on the second sliding part 73. Specifically, the clamp frame 74 is used to clamp and fix the product, and the lifting assembly 75 can adjust the height of the product to a certain extent. The position adjustment of the clamp frame 74 can be achieved by sliding the first sliding part 72 and the second sliding part 73, making the position adjustment of the product more convenient. In addition, a sliding unit is arranged between the clamp base 71 and the first sliding part 72 and between the first sliding part 72 and the second sliding part 73. The sliding unit can be a slide rail slider structure or a roller sliding structure. A driving unit is arranged between the clamp base 71 and the first sliding part 72 and between the first sliding part 72 and the second sliding part 73. The driving unit can be a motor screw structure, or a linear motor, a cylinder or a hydraulic cylinder. The driving unit can respectively push the second sliding part 73 or the first sliding part 72 to move, so that the position of the clamp frame 74 can be automatically adjusted, making the use of the entire clamp mechanism 7 more convenient.

[0058] The above description is only a preferred embodiment of the utility model, and only specifically describes the technical principle of the utility model. These descriptions are only for explaining the principle of the utility model and cannot be interpreted as limiting the protection scope of the utility model in any way. Based on the explanation here, any modification, equivalent replacement and improvement made within the spirit and principle of the utility model, and other specific implementation methods of the utility model that can be associated with the technicians in this field without creative labor, should be included in the protection scope of the utility model.

Claims

1. A repair device for repairing products in front of a furnace, characterized in that: It includes a frame, a clamp mechanism, a crystal picking swing arm assembly, a tinning mechanism, a crystal fixing swing arm assembly and a swing arm power unit; the clamp mechanism is arranged on the frame, the clamp mechanism is used to support the product, and the clamp mechanism is also used to adjust the position of the product; the crystal picking swing arm assembly is used to remove defective chips and old solder paste on the product; the tinning mechanism is arranged on the frame, the tinning mechanism is used to print new solder paste on the position where the defective chips are removed from the product; the crystal fixing swing arm assembly is used to install the new chip on the position where the new solder paste is printed on the product; and the swing arm power unit is arranged on the frame, the crystal picking swing arm assembly and the crystal fixing swing arm assembly are both connected to the driving end of the swing arm power unit; The swing arm power unit is used to drive the crystal picking swing arm assembly and the crystal bonding swing arm assembly to move synchronously and alternately to the waiting area for operation of the product, and the tinning mechanism can avoid the two components when the crystal picking swing arm assembly and the crystal bonding swing arm assembly move to the waiting area for operation, and can also perform a new solder paste printing operation after the crystal picking swing arm assembly moves out of the waiting area for operation and before the crystal bonding swing arm assembly moves to the waiting area for operation, and the waiting area for operation is the area where the defective chips are located.

2. The repair device according to claim 1, characterized in that: The crystal picking swing arm assembly includes a first swing arm and a crystal picking nozzle, the first end of the first swing arm is connected to the driving end of the swing arm power unit, and the crystal picking nozzle is arranged at the second end of the first swing arm, the crystal picking nozzle is used to push the defective chip and at least part of the old solder paste under the action of the first swing arm to separate the defective chip and at least part of the old solder paste from the product, and the crystal picking nozzle is also used to communicate with an external negative pressure device to absorb the separated defective chip through negative pressure and scrape off the old solder paste.

3. The repair device according to claim 2, characterized in that: The crystal picking swing arm assembly also includes a filter unit, which is connected to the air outlet side of the crystal picking nozzle, and is used to filter the airflow entering the external negative pressure device from the crystal picking nozzle.

4. The repair device according to claim 3, characterized in that: The crystal picking nozzle includes a nozzle part and a nozzle cover, the nozzle cover is sleeved on the outside of the nozzle part, and the inner wall of the nozzle cover is spaced apart from the nozzle part, the lower end of the nozzle part protrudes from the nozzle cover, the nozzle cover is used to be connected with the external negative pressure device, the nozzle part is used to contact with the defective chip and loosen the defective chip, and the nozzle cover is used to absorb the defective chip and the old solder paste.

5. The repair device according to claim 4, characterized in that: The crystal picking nozzle further includes a position measuring unit, and the position measuring unit is used to measure the position of the product.

6. The repair device according to claim 1, characterized in that: The die bonding swing arm assembly includes a second swing arm and a die bonding nozzle, wherein the first end of the second swing arm is connected to the driving end of the swing arm power unit, the die bonding nozzle is arranged at the second end of the second swing arm, and the die bonding nozzle is used to be connected to an external negative pressure device pipeline to absorb the new chip through negative pressure.

7. The repair device according to any one of claims 1 to 6, characterized in that: The tinning mechanism includes a tinning bracket, a tinning swing arm assembly and a tin supply device. The tinning bracket is arranged on the frame, the tinning swing arm assembly is arranged on the tinning bracket, and the tin supply device is arranged on the tinning bracket. The tin supply device is used to provide and hold solder paste, and the tinning swing arm assembly is used to dip the solder paste in the tin supply device and print new solder paste on the position of the product where the defective chips are rejected.

8. The repair device according to any one of claims 1 to 6, characterized in that: The rework device also includes a feed conveying mechanism, which is used to transport products to the clamp mechanism. The feed conveying mechanism includes a feed base, a fixed side plate, an adjustable side plate and a material blocking assembly. The feed base is arranged on the frame, and the fixed side plate and the adjustable side plate are arranged on the feed base at intervals. The adjustable side plate has the freedom to move along a first direction relative to the fixed side plate and the feed base, and the first direction is a direction perpendicular to the plate surface of the fixed side plate. Conveying units are arranged on the fixed side plate and the adjustable side plate, and the conveying unit is used to support and transport products. The material blocking assembly is located between the fixed side plate and the adjustable side plate.

9. The repair device according to any one of claims 1 to 6, characterized in that: The repair device also includes a feeding working group, which is used to provide new chips. The feeding working group includes a crystal ring feeding mechanism, a crystal ring transporting mechanism, a crystal ring rotating platform and a pin mechanism. The crystal ring feeding mechanism is arranged on the frame, and the crystal ring feeding mechanism is used to accommodate and store crystal rings. The crystal ring rotating platform is arranged on the frame, and the crystal ring rotating platform is used to support the crystal ring and adjust the position of the crystal ring. The crystal ring transporting mechanism is arranged on the frame and located between the crystal ring feeding mechanism and the crystal ring rotating platform. The crystal ring transporting mechanism is used to transport the crystal ring from the crystal ring feeding mechanism to the crystal ring rotating platform. The pin mechanism is arranged on the frame and located below the working end of the crystal ring rotating platform. The pin mechanism is used to separate the chip from the crystal ring.

10. The repair device according to any one of claims 1 to 6, characterized in that: The clamp mechanism includes a clamp base, a first sliding part, a second sliding part, a clamp frame and a lifting assembly, the clamp base is arranged on the frame, the first sliding part is slidably arranged on the clamp base, the second sliding part is slidably arranged on the first sliding part, and the sliding direction of the first sliding part and the sliding direction of the second sliding part are arranged at an angle, and the clamp frame and the lifting assembly are both arranged on the second sliding part.

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