Semiconductor testing device

Abstract

The utility model relates to the technical field of semiconductor testing, and provides a semiconductor testing device. The semiconductor testing device comprises a testing mechanism, a conveying track arranged on one side of the testing mechanism along a second direction, a first carrying mechanism and a plurality of second carrying mechanisms. The testing mechanism comprises a plurality of testing modules which are arranged at intervals in the first direction, and each testing module is at least provided with a material waiting station and a testing station which are arranged at intervals in the second direction; the conveying track is divided into a feeding butt joint section, a testing feeding section and a discharging butt joint section in the first direction, and the testing feeding section and the multiple testing modules are arranged correspondingly. The test feeding section is provided with a material taking station and a discharging station in a spaced mode along the conveying path. The semiconductor testing device can be used for testing a plurality of power semiconductors at the same time, the testing efficiency is improved, the testing time is shortened, continuous feeding and discharging states can be kept in the testing process, and the testing efficiency is further improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to a semiconductor testing device. Background Art

[0002] During the semiconductor manufacturing process, it is usually necessary to test it to ensure that the performance of the semiconductors shipped out of the factory meets the requirements. However, the existing testing involves manual loading and unloading, manual handling, etc., resulting in low overall testing efficiency; moreover, most of the testing is done on a single machine, which is difficult to meet the needs of large-scale rapid testing. Utility Model Content

[0003] Based on this, it is necessary to provide a semiconductor testing device that can be used for simultaneous testing of multiple power semiconductors, improve test efficiency, shorten test time, and maintain continuous loading and unloading during the test process, further improving test efficiency.

[0004] A semiconductor testing device, comprising:

[0005] A testing mechanism, the testing mechanism comprising a plurality of testing modules spaced apart along a first direction, each of the testing modules being provided with at least a material-waiting station and a testing station spaced apart along a second direction; the first direction and the second direction being arranged at an angle;

[0006] A conveying track is arranged on one side of the test mechanism along the second direction and close to the material waiting station, the conveying track is constructed with a conveying path extending along the first direction, the conveying track is divided into a loading docking section, a test loading section and a unloading docking section along the conveying path, and the test loading section is arranged corresponding to the plurality of test modules; wherein the test loading section is arranged with a material taking station and a material unloading station at intervals along the conveying path;

[0007] A first transport mechanism is used for transferring between the material taking station and the material waiting station, between the material waiting station and the material unloading station, and between various stations in the test loading section;

[0008] A plurality of second conveying mechanisms, each of which corresponds to one of the test modules, are configured to transfer between the corresponding material-waiting station and the test station along the second direction.

[0009] It can be understood that by setting up multiple test modules, the testing of multiple power semiconductors can be satisfied, and the power semiconductors that need to be tested or have been tested can be temporarily stored in the waiting station to keep the test uninterrupted. In this process, by using the cooperation of the conveyor track, the power semiconductors transferred from other processes can be transported to the material-retrieving station, so that the first conveying mechanism can transport it to the waiting station of one of the test modules, so that the second conveying mechanism can move it to the test station for testing; at the same time, the power semiconductor after the test in another test module is moved to the waiting station by the corresponding second conveying mechanism, so that the first conveying mechanism can move it to the unloading station. In this way, it can ensure that each test module is uninterruptedly loaded and tested, thereby improving the test efficiency. Moreover, the setting of the loading docking section and the unloading docking section can ensure the continuous and automatic loading and unloading of power semiconductors, further improving the test efficiency and shortening the test time.

[0010] In some embodiments, the testing mechanism includes a first machine and a supporting base plate installed on the first machine, and a plurality of the testing modules are integrated and installed on the supporting base plate; the conveying track is configured as a guide rail whose length extends along a first direction, and the guide rail is installed on the supporting base plate; or, the semiconductor testing device also includes a connecting arm, one end of the connecting arm is connected to the conveying track, and the other end is connected to the supporting base plate and / or the first machine.

[0011] In some embodiments, the conveying track includes a second machine and a mounting base plate connected to the second machine, each workstation on the conveying track is integrated and assembled on the mounting base plate, and at least the portion of the mounting base plate located in the test loading section extends along the second direction toward the waiting station to form a docking base plate; one end of the connecting arm is connected to the docking base plate, and the other end is connected to the supporting base plate and / or the first machine.

[0012] In some embodiments, the first transport mechanism is installed on the docking base plate and is located between the conveying track and each of the waiting stations; the first transport mechanism includes a first supporting beam, a robotic arm and a first picking component, the first supporting beam is installed on the mounting base plate, the length of the first supporting beam extends along a first direction, the robotic arm is connected to the first supporting beam and can move along the length direction of the first supporting beam, and the first picking component is connected to the robotic arm.

[0013] In some embodiments, the loading docking section and the unloading docking section respectively protrude from both sides of the testing mechanism along the first direction; and / or, the loading docking section, the test loading section and the unloading docking section all include support vertical plates that are opposite and spaced apart along the second direction and conveyor belts connected to the support vertical plates, and each of the support vertical plates is respectively equipped with one of the conveyor belts; and / or, the loading docking section is provided with a manual loading position, and the manual loading position and the conveyor belt corresponding to the loading docking section are spaced apart along the second direction.

[0014] In some embodiments, an empty tray station is arranged between the material picking station and the material unloading station, and the material picking station and the material unloading station are respectively provided with a code scanning station and a waste station; the two waste stations are arranged on both sides of the empty tray station along the first direction, and are arranged close to the empty tray station, and the code scanning station is correspondingly arranged on the side of each waste station away from the empty tray station, and the material picking station or the material unloading station is respectively provided on the side of each code scanning station away from the corresponding waste station.

[0015] In some embodiments, the material picking station corresponds to the material picking and waste station and the material picking and scanning station, and the material unloading station corresponds to the material unloading and waste station and the material unloading and scanning station; the conveying track also includes a support table for receiving materials; a support table is provided at least at the material picking and waste station and the material unloading and waste station, each of the support tables includes a plurality of support columns and a support plate, a plurality of the support columns are connected to the support plate and are arranged at intervals around the central axis of the support plate, and a plurality of the support columns lift the support plate away from the conveying surface of the conveying track.

[0016] In some embodiments, the unloading docking section is provided with a cache station for storing unloading trays; the conveying track also includes a first tray support provided at the empty tray station and a second tray support provided at the cache station, the first tray support and the second tray support both have a storage cavity and a discharge port connected to the storage cavity, the discharge port is located at the bottom of the storage cavity, and is used for discharging the trays.

[0017] In some of the embodiments, each of the test modules is further provided with a dewatering station, which is arranged between the waiting station and the testing station, and the second conveying mechanism can flow between the waiting station, the dewatering station and the testing station; and / or, the second conveying mechanism includes a second supporting beam and a second picking component, the length of the second supporting beam extends along the second direction, and the second picking component is connected to the second supporting beam and can move along the length direction of the second supporting beam.

[0018] In some embodiments, the semiconductor testing device also includes a three-phase electric cable, each of the test modules includes a power supply box, each of the power supply boxes is connected in parallel to the three-phase electric cable, and a switch is connected between each of the power supply boxes and the three-phase electric cable. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 A schematic diagram of a semiconductor testing device provided for this application;

[0021] Figure 2 A top view of a semiconductor testing device provided for the present application;

[0022] Figure 3 A first partial top view of the semiconductor testing device provided by the present application;

[0023] Figure 4 A first partial schematic diagram of a semiconductor testing device provided by the present application;

[0024] Figure 5 for Figure 4 A partial enlarged view of the middle A;

[0025] Figure 6 for Figure 4 A partial enlarged view of point B in the middle;

[0026] Figure 7 A second partial schematic diagram of the semiconductor testing device provided by the present application;

[0027] Figure 8 This is a schematic diagram of a control circuit in a semiconductor testing device provided in the present application.

[0028] Figure numerals: 10, test mechanism; 11, test module; 12, first machine; 13, support base plate; 20, conveying track; 21, second machine; 22, installation base plate; 23, support vertical plate; 24, conveyor belt; 26, support platform; 30, first conveying mechanism; 31, first support beam; 32, robot arm; 33, first picking component; 40, second conveying mechanism; 41, second support beam; 42, second picking component; 50, connecting arm; 111, power supply box; 112, switch gate; 201, loading docking section; 202, test loading section; 203, unloading docking section; 221, docking substrate ; 251, first tray bracket; 252, second tray bracket; 261, support column; 262, support plate; 321, base; 322, first arm body; 323, second arm body; 1101, waiting station; 1102, testing station; 1103, dewatering station; 2001, manual loading station; 2021, material picking station; 2022, empty tray station; 2023, material unloading station; 2024, material picking and scanning station; 2025, material picking and waste station; 2026, material unloading and scanning station; 2027, material unloading and waste station; 2031, cache station; 2501, storage cavity; 2502, discharge port. DETAILED DESCRIPTION

[0029] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0030] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0031] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0032] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0033] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more related listed items.

[0034] See also Figures 1 to 4 The present application provides a semiconductor testing device including a testing mechanism 10, a conveying track 20, a first transport mechanism 30 and a plurality of second transport mechanisms 40. The testing mechanism 10 includes a plurality of test modules 11 arranged at intervals along a first direction, and each test module 11 is at least provided with a material waiting station 1101 and a test station 1102 arranged at intervals along a second direction; the first direction and the second direction are arranged at an angle. The conveying track 20 is arranged on one side of the testing mechanism 10 along the second direction and close to the material waiting station 1101, and the conveying track 20 is constructed with a conveying path extending along the first direction, and the conveying track 20 is divided into a loading docking section 201, a test loading section 202 and a unloading docking section 203 along the conveying path, and the test loading section 202 is arranged corresponding to the plurality of test modules 11, and the test loading section 202 is arranged with a material taking station 2021 and a unloading station 2023 at intervals along the conveying path. The first conveying mechanism 30 is used for circulation between the material picking station 2021 and the material waiting station 1101, between the material waiting station 1101 and the material unloading station 2023, and between each station in the test loading section 202; at the same time, each second conveying mechanism 40 corresponds to a test module 11, and each second conveying mechanism 40 is used for circulation between the corresponding material waiting station 1101 and the test station 1102 along the second direction.

[0035] That is to say, the semiconductor testing device can meet the simultaneous testing of multiple power semiconductors by using the setting of multiple test modules 11, thereby improving the testing efficiency; and, by using the setting of the waiting station 1101, it can be used to temporarily store power semiconductors that need to be tested or have been tested, so as to maintain the uninterrupted feeding and testing of each test module 11. In this process, by using the cooperation of the conveying track 20, the power semiconductors transferred from other processes can be transported to the material taking station 2021, so that the first conveying mechanism 30 can convey it to the waiting station 1101 of one of the test modules 11, and the corresponding second conveying mechanism 40 can move the power semiconductor to be tested on the waiting station 1101 to the testing station 1102 for testing. At the same time, the power semiconductor after the test in another test module 11 is moved to the waiting station 1101 by the corresponding second conveying mechanism 40, and the first conveying mechanism 30 is convenient for moving the tested power semiconductor in the waiting station 1101 to the unloading station 2023. Then, the first transport mechanism 30 can also transport the power semiconductor to be tested located at the material taking station 2021 to the material waiting station 1101 of the test module 11 that has just taken the material, so as to ensure uninterrupted loading and testing. In addition, due to the arrangement of the loading docking section 201 and the unloading docking section 203 on the conveying track 20, continuous and automatic loading and unloading of power semiconductors can be ensured, further improving the test efficiency and shortening the test time.

[0036] The first direction may be the X-axis direction, and the second direction may be the Y-axis direction.

[0037] See also Figure 1 , Figure 2 and Figure 7 Optionally, the test mechanism 10 includes a first machine 12 and a support base plate 13 installed on the first machine 12, and a plurality of test modules 11 are integrated and installed on the support base plate 13. The first machine 12 can accommodate electrical structures used for each test module 11 to implement testing, and supports the support base plate 13 and each test module 11 installed on the support base plate 13 to ensure test stability; and, by using the setting of the support base plate 13, the integrated assembly of multiple test modules 11 is met, and they can be installed or transferred as an integral structure. Of course, based on the support of the first machine 12, rollers can be set at the bottom of the first machine 12 to facilitate moving the test mechanism 10 to different positions.

[0038] In some embodiments, the conveying track 20 is configured as a guide rail whose length extends along the first direction. At this time, the size of the supporting base plate 13 along the second direction can be increased, and the guide rail can be directly installed on the supporting base plate 13, and integrated with each test module 11 to improve the modularity of the entire semiconductor testing device. Furthermore, the guide rail can adopt a linear moving module, and the power semiconductor is placed in the tray, and the tray is slidably connected to the guide rail to meet the transportation of the power semiconductor. When the power semiconductor is transported to the material picking station 2021, the linear moving module can suspend transportation. At this time, the tray located at the unloading station 2023 also suspends transportation. Until all the power semiconductors on the material tray at the material picking station 2021 have been loaded, and the power semiconductors at the waiting station 1101 have been unloaded to the unloading station 2023; or, all the power semiconductors at the material picking station 2021 have been tested and are stored in the material tray at the unloading station 2023; then, the linear moving module can be started again to unload, and load to the material picking station 2021 while unloading.

[0039] See also Figure 2 and Figure 3 In an optional embodiment, the semiconductor testing device further includes a connection arm 50, one end of which is connected to the conveying track 20, and the other end of which is connected to the supporting base plate 13. That is to say, the conveying track 20 can be connected and aligned relative to the supporting base plate 13 via the connection arm 50, which not only satisfies the installation of the conveying track 20 relative to the testing mechanism 10, but also allows the two to be separated, for example, when the conveying track 20 fails and needs to be repaired or when the conveying track 20 needs to be interchanged between different semiconductor testing devices. At this time, the conveying track 20 is an independent structure, and the testing mechanism 10 is also an independent structure. It is only necessary to use the connection arm 50 to assemble the conveying track 20 and the testing mechanism 10. Therefore, the conveying track 20 and the testing mechanism 10 can be used separately or in combination.

[0040] Furthermore, the number of the connecting arms 50 is at least two, and they are arranged at intervals along the length direction (i.e., the first direction) of the conveying track 20 to ensure connection reliability. Further, the two ends of the connecting arms 50 along their own length direction can be detachably connected to the supporting bottom plate 13 and the conveying track 20, respectively, for easy disassembly, for example, they can be plugged into a socket, etc.

[0041] Please continue reading Figures 1 to 4In an optional embodiment, based on the connection mode of the engagement arm 50, the conveying track 20 includes a second platform 21 and a mounting base plate 22 connected to the second platform 21, and each station on the conveying track 20 is integrated and assembled on the mounting base plate 22. It can be understood that the second platform 21 is provided to accommodate the electrical structure used for conveying, and to support the mounting base plate 22 and each station structure integrated on the mounting base plate 22. Rollers can also be installed at the bottom of the second platform 21 to facilitate movement to different positions.

[0042] Among them, at least part of the mounting base plate 22 located in the test loading section 202 extends along the second direction toward the material waiting station 1101 to form a docking base plate 221, and one end of the connecting arm 50 is connected to the docking base plate 221, and the other end is connected to the supporting base plate 13. In other words, the setting of the docking base plate 221 is equivalent to increasing the size of the conveying track 20 along the second direction, which is more convenient for combination with the test mechanism 10; and, such a setting can correspondingly reduce the length of each connecting arm 50. Since the connecting arm 50 is a rod-shaped structure, the longer the length, the more likely the middle part is to be damaged by force. Therefore, when the length of the connecting arm 50 is reduced, its own structural strength is guaranteed, thereby improving the connection reliability. In addition, the setting of the docking base plate 221 can receive power semiconductors that fall due to handling errors, thereby improving safety.

[0043] like Figure 1 and Figure 2 As shown, further, the length of the test loading section 202 along the first direction is substantially the same as the length of the test mechanism 10 along the first direction, so that the loading docking section 201 and the unloading docking section 203 protrude from both sides of the test mechanism 10 along the first direction, respectively, to avoid occupying part of the space corresponding to the test module 11. Among them, the moving range of the first transport mechanism 30 is at least the same as the length of the test loading section 202 along the first direction, or greater than the length of the test loading section 202 along the first direction, so as to ensure a sufficient moving range, further improve the loading alignment and unloading alignment, and improve the test efficiency.

[0044] Furthermore, the loading docking section 201, the test loading section 202 and the unloading docking section 203 can be independent structures, that is, they each have a second machine 21 and a mounting base 22, and then the three sets of second machines 21 and mounting bases 22 are assembled into an integral structure; of course, the same second machine 21 and mounting base 22 can also be used together.

[0045] See also Figures 2 to 5In an optional embodiment, the loading docking section 201, the test loading section 202 and the unloading docking section 203 all include support uprights 23 arranged oppositely and at intervals along the second direction and conveyor belts 24 connected to the support uprights 23, and each support upright 23 is equipped with a conveyor belt 24. In this way, the conveying of the tray can be satisfied. Among them, the spacing between the three groups of conveyor belts 24 is small to ensure the continuity of the conveying. For example, the power semiconductors transferred through other processes can be stored in the tray, and the tray can be transported to the conveyor belt 24 on the loading docking section 201, and then transported to the conveyor belt 24 corresponding to the test loading section 202, and finally transferred to the material picking station 2021 for picking; at the same time, the power semiconductors after the test are placed in the tray at the unloading station 2023, and are transported to the conveyor belt 24 corresponding to the test loading section 202 and the unloading docking section 203, and then transported to the target position.

[0046] In actual use, the conveyor belt 24 is wound around the conveyor wheel, and a tensioning wheel or multiple spaced conveyor wheels may be provided to adjust the tension of the conveyor belt 24. The conveyor wheels corresponding to the two conveyor belts 24 opposite to each other in the second direction may be connected to a rotating shaft to ensure the same rotation speed, thereby achieving the conveying synchronization requirement of the two conveyor belts 24.

[0047] It should be noted that the principles of how to set the conveyor belt 24 and how to achieve conveyance are existing mature technologies and will not be described in detail here.

[0048] See also Figures 2 to 4 In an optional embodiment, with respect to the conveying track 20, an empty tray station 2022 is further provided between the material taking station 2021 and the material unloading station 2023, and the material taking station 2021 and the material unloading station 2023 are respectively provided with a code scanning station and a waste station. Among them, the two waste stations are respectively provided on both sides of the empty tray station 2022 along the first direction, and the two waste stations are both provided close to the empty tray station 2022, and each waste station is provided with a code scanning station on the side away from the empty tray station 2022, and each code scanning station is provided with a material taking station 2021 and a material unloading station 2023 on the side away from the corresponding waste station.

[0049] It can be understood that the setting of the code scanning station is used to scan and detect power semiconductors to ensure that they meet the test requirements and unloading requirements. The waste station is used to temporarily store power semiconductors that do not meet the requirements after being scanned and detected by the code scanning station. Among them, since the code scanning station can meet the model detection of power semiconductors and trays, the requirements met and not met here refer to the model of the tray on the conveying track 20, which is used to store power semiconductors of the same model in trays of corresponding models. Among them, the setting of the empty tray station 2022 is used to provide trays to the unloading station 2023, or to collect excess empty trays at the material picking station 2021.

[0050] Specifically, take the material picking station 2021 corresponding to the material picking waste station 2025 and the material picking code scanning station 2024, and the material unloading station 2023 corresponding to the material unloading waste station 2027 and the material unloading code scanning station 2026 as an example. In actual use, when the power semiconductor is transported to the material picking station 2021, the first transport mechanism 30 can pick up the power semiconductor and move it to the material picking code scanning station 2024 for code scanning detection. If the requirements are met, it will be transferred to the waiting station 1101 of one of the test modules 11. If the requirements are not met, it will be moved to the material tray of the material picking waste station 2025. At the same time, the power semiconductor after the inspection is moved to the material unloading code scanning station 2026 through the first transport mechanism 30 for code scanning detection. If the requirements are met, it will be moved to the material tray at the material unloading station 2023. If the requirements are not met, it will be moved to the material tray at the material unloading waste station 2027.

[0051] Since both the unloading waste station 2027 and the picking waste station 2025 are used to temporarily store power semiconductors that do not meet the requirements, it is necessary to ensure the stability of the waste stations. Figure 4 and Figure 6 As shown, in some embodiments, a support platform 26 is provided at both the unloading waste station 2027 and the picking waste station 2025, and a material tray can be placed on the support platform 26 to receive the power semiconductor. Specifically, the support platform 26 includes a plurality of support columns 261 and a support plate 262, and the plurality of support columns 261 are connected to the support plate 262 and are arranged at intervals around the central axis of the support plate 262, and the plurality of support columns 261 lift the support plate 262 away from the conveying surface of the conveying track 20, that is, the conveyor belt 24 for conveying the material tray, that is, the support plate 262 is located above the conveyor belt 24. Such a setting not only satisfies the stable supporting performance of the support platform 26, but also reduces the interference with the conveying of the material tray. In some specific embodiments, each of the four top corners of the support plate 262 is connected to a support column 261, and the support column 261 is fixed to the mounting base plate 22.

[0052] In an alternative embodiment, the above-mentioned support platform 26 can also be set at the material unloading station 2023 to stabilize the material connection. At this time, other manipulators can be used to pick up the entire material tray and move it to the target position; or, the manipulator can be used to move the material tray to the unloading docking section 203.

[0053] See also Figure 4 As shown, further, the material picking and scanning station 2024 and the material unloading scanning station 2026 are both provided with a scanner or an image collector to facilitate scanning the power semiconductor to obtain information. At the same time, a first material tray support 251 is provided at the empty tray station 2022, and the first material tray support 251 is configured with a storage cavity 2501 and a discharge port 2502 connected to the storage cavity 2501. The discharge port 2502 is arranged at the bottom of the storage cavity 2501, and multiple material trays are stacked and stored in the storage cavity 2501. The material tray at the bottom can be fed in or out from the discharge port. In actual use, when unloading is required, a material tray at the bottom can be placed on the corresponding conveyor belt 24, and the remaining material trays remain temporarily stored in the first material tray support 251; the lowered material tray can be transported to the unloading station 2023 via the conveyor belt 24 to receive the power semiconductors that have completed the test. Alternatively, after the material is taken at the material taking station 2021, the unloaded material tray can be conveyed to the bottom of the first material tray bracket 251 via the corresponding conveyor belt 24 to store the empty tray. A material blocking mechanism is provided at the bottom of the first material tray bracket 251 to ensure that the remaining material trays are stably kept in the storage cavity 2501 when the bottommost material tray is lowered to the conveyor belt 24 or a new material tray is loaded. It is worth noting that the structure of the material blocking mechanism is an existing mature technology, so it will not be described in detail.

[0054] Please continue reading Figure 4 In an optional embodiment, the unloading docking section 203 is provided with a buffer station 2031, which is used to store the trays (i.e., unloading trays) that have not been delivered in time, and the trays carry the tested power semiconductors. A second tray support 252 is provided at the buffer station 2031, and the structure of the second tray support 252 is basically the same as that of the first tray support 251, so it is not repeated here.

[0055] like Figure 3 As shown, in some embodiments, a manual loading position 2001 may be further provided in the test loading section 202, and the manual loading position 2001 is provided close to the first conveying mechanism 30 and is located on the side of the first conveying mechanism 30 facing the loading docking section 201. The manual loading position 2001 is used for manual loading, and is transported to the material waiting station 1101 through the first conveying mechanism 30. A support frame is provided at the manual loading position 2001 to support a tray carrying power semiconductors.

[0056] In an alternative embodiment, a manual loading position 2001 may be provided in the loading docking section 201 , or both the loading docking section 201 and the test loading section 202 may be provided with a manual loading position 2001 .

[0057] The above is a description of the conveying track 20 in the semiconductor testing device. The first conveying mechanism 30 and the testing module 11 will be described below respectively.

[0058] Please combine Figures 2 to 4 In an optional embodiment, the first handling mechanism 30 adopts a multi-joint manipulator to ensure flexibility and operating range. Specifically, the first handling mechanism 30 includes a first supporting beam 31, a mechanical arm 32 and a first pickup assembly 33. The mechanical arm 32 includes a base 321, a first arm body 322 rotatably connected to the base 321, and a second arm body 323 rotatably connected to the first arm body 322. The end of the second arm body 323 away from the first arm body 322 is rotatably connected to the first pickup assembly 33, and the base 321 is slidably connected to the first supporting beam 31. The first supporting beam 31 can adopt a linear module to drive the base 321 to move along the first direction. The base 321 drives the first pickup assembly 33 to move synchronously through the first arm body 322 and the second arm body 323. Among them, the first pickup assembly 33 has a plurality of suction nozzles to absorb power semiconductors by adsorption to achieve transportation at different workstations.

[0059] like Figure 2 and Figure 7 As shown, exemplarily, each test module 11 is also provided with a dewatering station 1103, and the dewatering station 1103 is arranged between the material-waiting station 1101 and the test station 1102, and the second transport mechanism 40 can flow between the material-waiting station 1101, the dewatering station 1103 and the test station 1102. Among them, the setting of the dewatering station 1103 is used to remove the residual moisture on the power semiconductor. In actual use, the power semiconductor will generate a high amount of heat when tested at the test station 1102, and the power semiconductor needs to be liquid-cooled to dissipate heat, which will lead to residual moisture on the power semiconductor. If these moisture cannot be removed in time and fully, it may cause an impact on subsequent tests, or even damage the power semiconductor. Therefore, in this embodiment, the setting of the dewatering station 1103 is utilized to facilitate timely and sufficient removal of moisture on the power semiconductor and ensure test safety. For example, a blowing plate can be provided at the dewatering station 1103 to remove moisture on the power semiconductor by blowing.

[0060] Furthermore, the material waiting station 1101 is provided with a carrier for temporarily storing power semiconductors. The test station 1102 is provided with a test structure for power semiconductor testing. According to different test requirements, the test structure can also be adjusted accordingly, and the test structure is an existing mature technology and will not be described here.

[0061] Furthermore, the second transport mechanism 40 includes a second support beam 41 and a second pickup assembly 42, the length of the second support beam 41 extends along the second direction, and the second pickup assembly 42 is connected to the second support beam 41 and can move along the length direction of the second support beam 41. The second support beam 41 can also use a linear module to drive the second pickup assembly 42 to move along the second direction to realize the transportation of power semiconductors between the material waiting station 1101, the test station 1102 and the water removal station 1103. The second pickup assembly 42 can be sucked by a nozzle or clamped by a clamping arm, as long as it can meet the requirements of picking up and placing power semiconductors.

[0062] like Figure 8 As shown, in an optional embodiment, the semiconductor test device also includes a three-phase electric cable, each test module 11 includes a power supply box 111, each power supply box 111 is connected in parallel to the three-phase electric cable, and a switch gate 112 is connected between each power supply box 111 and the three-phase electric cable. It can be understood that, precisely because the test mechanism 10 in the semiconductor test device includes multiple test modules 11, the multiple test modules 11 can be used for testing to improve the test efficiency. Therefore, in order to meet the power supply and test safety of each test module 11, the setting of the three-phase electric cable can have a higher power transmission capacity, which is suitable for high-power loads; and, since the three-phase electricity itself has a phase offset, it can provide current at different time intervals, thereby balancing the load and reducing power loss. In addition, the setting of the switch gate 112 can meet the individual control of each test module 11; and, due to the parallel setting of each power supply box 111, the test modules 11 do not interfere with each other.

[0063] It is worth noting that three-phase electricity is an existing mature technology and will not be discussed in detail here.

[0064] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0065] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

Claims

1. A semiconductor testing device, characterized in that: include: A testing mechanism (10), the testing mechanism (10) comprising a plurality of testing modules (11) arranged at intervals along a first direction, each of the testing modules (11) being provided with at least a material waiting station (1101) and a testing station (1102) arranged at intervals along a second direction; the first direction and the second direction being arranged at an angle; A conveying track (20) is arranged on one side of the test mechanism (10) along the second direction and close to the material waiting station (1101), the conveying track (20) is constructed with a conveying path extending along the first direction, the conveying track (20) is divided into a loading docking section (201), a test loading section (202) and a unloading docking section (203) along the conveying path, and the test loading section (202) is arranged corresponding to the plurality of test modules (11); wherein the test loading section (202) is provided with a material taking station (2021) and a material unloading station (2023) arranged at intervals along the conveying path; A first transport mechanism (30) is used for transferring between the material taking station (2021) and the material waiting station (1101), between the material waiting station (1101) and the material unloading station (2023), and between various stations in the test loading section (202); A plurality of second transport mechanisms (40), each of which corresponds to a test module (11), and is used for transferring between the corresponding material waiting station (1101) and the test station (1102) along the second direction.

2. The semiconductor testing device according to claim 1, wherein: The testing mechanism (10) comprises a first machine platform (12) and a supporting base plate (13) installed on the first machine platform (12), and a plurality of the testing modules (11) are integrally installed on the supporting base plate (13); The conveying track (20) is configured as a guide rail whose length extends along a first direction, and the guide rail is installed on the supporting base plate (13); or, the semiconductor testing device also includes a connecting arm (50), one end of the connecting arm (50) is connected to the conveying track (20), and the other end is connected to the supporting base plate (13) and / or the first machine (12).

3. The semiconductor testing device according to claim 2, characterized in that: The conveying track (20) comprises a second machine platform (21) and a mounting base plate (22) connected to the second machine platform (21); each station on the conveying track (20) is integrated and assembled on the mounting base plate (22), and at least a portion of the mounting base plate (22) located in the test loading section (202) extends along the second direction toward the waiting station (1101) to form a docking base plate (221); One end of the connecting arm (50) is connected to the docking base plate (221), and the other end is connected to the supporting base plate (13) and / or the first machine platform (12).

4. The semiconductor testing device according to claim 3, characterized in that: The first transport mechanism (30) is installed on the docking substrate (221) and is located between the conveying track (20) and each of the material waiting stations (1101); The first transport mechanism (30) comprises a first supporting beam (31), a mechanical arm (32) and a first picking assembly (33); the first supporting beam (31) is mounted on the mounting base plate (22); the length of the first supporting beam (31) extends along a first direction; the mechanical arm (32) is connected to the first supporting beam (31) and is movable along the length direction of the first supporting beam (31); and the first picking assembly (33) is connected to the mechanical arm (32).

5. The semiconductor testing device according to claim 3, characterized in that: The loading docking section (201) and the unloading docking section (203) respectively protrude from two sides of the testing mechanism (10) along the first direction; and / or, The loading docking section (201), the test loading section (202) and the unloading docking section (203) all comprise supporting upright plates (23) arranged opposite to each other and spaced apart along the second direction and conveyor belts (24) connected to the supporting upright plates (23), and each supporting upright plate (23) is respectively provided with one conveyor belt (24); and / or, The loading docking section (201) and / or the test loading section (202) is provided with an artificial loading position (2001), and the artificial loading position (2001) and the corresponding conveyor belt (24) are arranged at intervals along the second direction and avoid the moving path of the first transport mechanism (30).

6. The semiconductor testing device according to claim 1, wherein: An empty tray station (2022) is provided between the material taking station (2021) and the material unloading station (2023), and a code scanning station and a waste station are respectively provided at the material taking station (2021) and the material unloading station (2023); The two waste stations are arranged on both sides of the empty tray station (2022) along the first direction and are arranged close to the empty tray station (2022). The side of each waste station away from the empty tray station (2022) is correspondingly provided with the code scanning station, and the side of each code scanning station away from the corresponding waste station is respectively provided with the material picking station (221) or the material unloading station (223).

7. The semiconductor testing device according to claim 6, characterized in that: The material taking station (2021) corresponds to the material taking waste station (2025) and the material taking code scanning station (2024), and the material unloading station (2023) corresponds to the material unloading waste station (2027) and the material unloading code scanning station (2026); the conveying track (20) also includes a support platform (26) for receiving materials; A support platform (26) is provided at least at the waste material taking station (2025) and the waste material unloading station (2027), each of the support platforms (26) includes a plurality of support columns (261) and a support plate (262), the plurality of support columns (261) are connected to the support plate (262), and are arranged at intervals around the central axis of the support plate (262), and the plurality of support columns (261) lift the support plate (262) away from the conveying surface of the conveying track (20).

8. The semiconductor testing device according to claim 6, wherein: The blanking docking section (203) is provided with a buffer station (2031) for storing the blanking tray; The conveying track (20) also includes a first material tray support (251) arranged at the empty tray station (2022) and a second material tray support (252) arranged at the buffer station (2031), the first material tray support (251) and the second material tray support (252) both having a storage cavity (2501) and a discharge port (2502) connected to the storage cavity (2501), and the discharge port (2502) is located at the bottom of the storage cavity (2501) for discharging the material tray.

9. The semiconductor testing device according to claim 1, wherein: Each of the test modules (11) is further provided with a dewatering station (1103), the dewatering station (1103) being arranged between the material waiting station (1101) and the test station (1102), and the second transport mechanism (40) being capable of circulating between the material waiting station (1101), the dewatering station (1103) and the test station (1102); and / or, The second transport mechanism (40) comprises a second supporting beam (41) and a second picking assembly (42), wherein the length of the second supporting beam (41) extends along a second direction, and the second picking assembly (42) is connected to the second supporting beam (41) and is movable along the length direction of the second supporting beam (41).

10. The semiconductor testing device according to claim 1, wherein: The semiconductor testing device also includes a three-phase electric cable, each of the test modules (11) includes a power supply box (111), each of the power supply boxes (111) is connected in parallel to the three-phase electric cable, and a switch (112) is connected between each of the power supply boxes (111) and the three-phase electric cable.

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