Lens module and terminal device

Abstract

A lens module comprises a circuit board, a reinforcing plate, a photosensitive chip and a wire. The circuit board is provided with a through hole; the reinforcing plate comprises a reinforcing part and a boss, the boss protrudes relative to the reinforcing part, the reinforcing part is located on one side of the circuit board, and the boss is located in the through hole and spaced from the circuit board; the photosensitive chip is positioned on one side of the boss and is accommodated in the through hole; the wire is positioned on one side, deviating from the reinforcing plate, of the circuit board and the photosensitive chip and is electrically connected with the photosensitive chip and the circuit board; wherein the side, deviating from the circuit board, of the reinforcing plate, the boss deviating from the reinforcing part are connected through an arc surface, and the projection width of the arc surface in the stacking direction of the circuit board and the reinforcing plate is smaller than or equal to 0.03 mm. The utility model further provides a terminal device.

Description

Technical Field

[0001] The present application relates to the field of lens technology, and in particular to a lens module and a terminal device. Background Art

[0002] The structural design in the lens module can affect the production cost of the lens module. For example, the length of the gold wire in the lens module, which is used to electrically connect the circuit board and the photosensitive chip, affects the production cost of the lens module. Utility Model Content

[0003] In view of this, it is necessary to provide a lens module that can reduce production costs.

[0004] A lens module includes a circuit board, a reinforcement plate, a photosensitive chip and a wire. The circuit board is provided with a through hole; the reinforcement plate includes a reinforcement part and a boss, the boss protrudes relative to the reinforcement part, the reinforcement part is located on one side of the circuit board, the boss is located in the through hole and is spaced from the circuit board; the photosensitive chip is located on one side of the boss and is accommodated in the through hole; the wire is located on the side of the circuit board and the photosensitive chip away from the reinforcement plate and electrically connects the photosensitive chip and the circuit board; wherein, on the side of the reinforcement plate away from the circuit board, the boss is connected to the reinforcement part via an arc surface, and the projection width of the arc surface along the direction in which the circuit board and the reinforcement plate are stacked is less than or equal to 0.03 mm.

[0005] In some embodiments of the present application, the reinforcement plate includes a groove, which is formed by the reinforcement portion and the boss, and the groove is located on a side of the boss away from the photosensitive chip.

[0006] In some embodiments of the present application, the lens module further includes a heat sink, which is located in the groove.

[0007] In some embodiments of the present application, the heat sink is made of thermally conductive silicone.

[0008] In some embodiments of the present application, the circuit board includes a first hard board portion, a second hard board portion, and a soft board portion located between the first hard board portion and the second hard board portion, and the through hole is opened in the first hard board portion.

[0009] In some embodiments of the present application, the lens module further includes a bearing seat, which is disposed on a surface of the first hard plate portion away from the reinforcement portion and corresponds to a position of the photosensitive chip, and the bearing seat is spaced apart from the photosensitive chip.

[0010] In some embodiments of the present application, a wire connects the photosensitive chip and the first hard board portion, and the wire is spaced apart from the supporting seat.

[0011] In some embodiments of the present application, the lens module further includes a filter, which is located on a side of the carrier away from the photosensitive chip and is spaced apart from the photosensitive chip.

[0012] In some embodiments of the present application, the reinforcement plate is made of stainless steel.

[0013] A terminal device includes a lens module.

[0014] The lens module provided in the embodiment of the present application includes a reinforcement plate. The reinforcement plate can be formed into a boss raised relative to the reinforcement part through a stamping process, so that the connection between the boss and the reinforcement part forms an arc surface with a smaller R angle, which can reduce the distance between the circuit board and the boss, reduce the length of the wire, and thus reduce the production cost of the lens module; in addition, the reinforcement plate formed by the stamping process also has a simple stamping process, reduces the production time, and thus can further reduce the production cost; further, when the boss is formed by the stamping process, a groove is simultaneously formed, that is, there is no need for an additional process for forming the groove, and the groove can accommodate a heat sink, which can improve the heat dissipation performance of the lens module without increasing the height of the lens module. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the structure of a terminal device provided in an embodiment of the present application.

[0016] Figure 2 A schematic diagram of the structure of a lens module provided in an embodiment of the present application.

[0017] Figure 3 for Figure 2 An exploded view of the lens module is shown.

[0018] Figure 4 for Figure 2 The lens module shown is an exploded view from another orientation.

[0019] Figure 5 for Figure 2 The cross-sectional schematic diagram of the lens module along the VV direction is shown.

[0020] Figure 6 for Figure 5 An enlarged schematic cross-sectional view of region VI is shown.

[0021] Figure 7 A schematic cross-sectional view of a partial area of ​​a lens module provided in another embodiment of the present application.

[0022] Main component symbols

[0023]

[0024] DETAILED DESCRIPTION

[0025] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth to facilitate a full understanding of the present application, and the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this article are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes all and any combination of one or more related listed items.

[0027] In the embodiments of the present application, for the convenience of description and not to limit the present application, the term "connection" used in the patent application specification and claims of the present application is not limited to physical or mechanical connection, whether direct or indirect. "Up", "down", "above", "below", "left", "right", etc. are only used to indicate relative position relationship. When the absolute position of the described object changes, the relative position relationship also changes accordingly.

[0028] See also Figure 1 The embodiment of the present application provides a terminal device 200, which is a product having a lens module 100, including but not limited to a mobile phone, a camera, a monitor, a camera, a drone, etc. The lens module 100 may have a zoom and / or anti-shake function, and the type of the lens module 100 is not limited, and may be a periscope lens, a vertical lens, etc. In this embodiment, the terminal device 200 is a mobile phone, and the lens module 100 may be a front camera or a rear camera. In other embodiments, the type of the lens module 100 may be replaced according to the specific type of the terminal device 200.

[0029] Please also read Figure 2 , Figure 3 , Figure 4 and Figure 5 The lens module 100 may include a circuit board 10, a reinforcement plate 20, a photosensitive chip 30, a support seat 40, a filter 50, a lens holder 60 and a lens 70, etc., which are roughly arranged according to the arrangement direction of the reinforcement plate 20, the circuit board 10, the support seat 40 and the lens holder 60. The photosensitive chip 30 is located in the circuit board 10, the filter 50 is located in the support seat 40, and the lens 70 can be accommodated in the lens holder 60.

[0030] The circuit board 10 can be a soft board, a hard board or a combination of soft and hard board. In the present embodiment, the circuit board 10 is a combination of soft and hard board, and the circuit board 10 includes a first hard board portion 11, a second hard board portion 12 and a soft board portion 13 located between the first hard board portion 11 and the second hard board portion 12. An electrical connection portion 14 is installed on one surface of the second hard board portion 12, and the electrical connection portion 14 is arranged on the surface of the second hard board portion 12. The electrical connection portion 14 is used to realize signal transmission between the lens module 100 and other components in the terminal device 200. The electrical connection portion 14 can be a connector or a gold finger. When the circuit board 10 is installed in the terminal device 200, the soft board portion 13 facilitates the bending of the circuit board 10.

[0031] The first hard plate portion 11 is provided with a through hole 112, which penetrates two opposite surfaces of the first hard plate portion 11 along the arrangement direction, and is approximately located in the center area of ​​the first hard plate portion 11. In this embodiment, the through hole 112 is square in shape, and in other embodiments, the shape of the through hole 112 is not limited to square.

[0032] The reinforcing plate 20 includes a reinforcing portion 21 and a boss 23. The reinforcing portion 21 and the boss 23 are an integral structure. The boss 23 is located in the central area of ​​the reinforcing portion 21. The boss 23 protrudes relative to the reinforcing portion 21. The reinforcing plate 20 may be made of stainless steel.

[0033] The reinforcing part 21 is located at one side of the first hard plate part 11, and a first colloid 15 can be arranged between the reinforcing part 21 and the first hard plate part 11 to bond the reinforcing part 21 and the first hard plate part 11. The shape of the first colloid 15, the shape of the reinforcing part 21 and the shape of the first hard plate part 11 are all adapted, and the reinforcing plate 20 is used to reinforce the first hard plate part 11 to increase the strength of the first hard plate part 11.

[0034] The boss 23 is located in the through hole 112, and the photosensitive chip 30 is located on one side of the boss 23 and is received in the through hole 112. A second colloid 33 may be provided between the photosensitive chip 30 and the boss 23 to bond the photosensitive chip 30 and the boss 23. The side walls of the boss 23 and the side walls of the photosensitive chip 30 are spaced from the side walls of the first hard plate portion 11 to reserve a certain safety distance, so as to prevent the photosensitive chip 30 from colliding with the first hard plate portion 11 and damaging the photosensitive chip 30 when the terminal device 200 is hit.

[0035] The photosensitive chip 30 is electrically connected to the first hard board portion 11 through a wire 31, and the wire 31 connects the surface of the photosensitive chip 30 away from the boss 23 and the surface of the first hard board portion 11 away from the reinforcing portion 21. The wire 31 is usually made of gold wire, which has a high cost.

[0036] Please also read Figure 6In this embodiment, the reinforcing plate 20 is formed by a stamping process, for example, a steel plate is stamped to form the reinforcing plate 20 including the reinforcing portion 21 and the boss 23. In the reinforcing plate 20 formed by the stamping process, the width W of the R angle between the boss 23 and the reinforcing portion 21 is relatively small. Specifically, the reinforcing plate 20 is away from the side of the circuit board 10, and the boss 23 is away from the reinforcing portion 21 and connected by an arc surface. The projection width W of the arc surface along the direction in which the circuit board 10 and the reinforcing plate 20 are stacked is less than or equal to 0.03 mm, for example, it can be 0.01 mm, 0.02 mm, etc. The smaller the R angle between the boss 23 and the reinforcing portion 21, the smaller the distance between the first hard plate portion 11 and the boss 23 can be, which is conducive to reducing the length of the wire 31, that is, reducing the span of the wire 31, thereby reducing the cost. In addition, the reinforcing plate 20 is formed by a stamping process, and the height of the boss 23 to be formed can be easily adjusted; and the stamping process is simple to operate, takes a short production time, and can effectively save time costs.

[0037] The reinforcement plate 20 formed by the stamping process also includes a groove 25. The boss 23 and the reinforcement part 21 are arranged to form the groove 25. The groove 25 is located on the side of the boss 23 away from the photosensitive chip 30. That is, the step of forming the boss 23 forms the groove 25 simultaneously without adding additional processes.

[0038] See also Figure 7 In some embodiments, the lens module 100 further includes a heat sink 27, which may be thermally conductive silicone. The heat sink 27 is located in the groove 25 and may be connected to the surface of the boss 23 facing away from the photosensitive chip 30. When the photosensitive chip 30 generates heat during operation, the heat may be directly transferred to the heat sink 27 through the boss 23 to quickly dissipate the heat and maintain the temperature stability of the photosensitive chip 30 during operation.

[0039] In other embodiments, the reinforcing plate 20a can be formed by chemical etching, for example, the area of ​​a steel plate where the boss 23a is to be formed is masked, and the reinforcing portion 21a with a reduced thickness is formed by chemical etching. The R angle of the reinforcing plate 20a formed by chemical etching is relatively large, usually greater than 0.05 mm. As the height of the boss 23a increases, the R angle will further increase, and the distance between the first hard plate portion 11a and the boss 23a will increase accordingly, that is, the width W1 of the through hole 112a is widened, which will increase the length of the wire 31a, which is not conducive to reducing costs; in addition, compared with the stamping process, it is difficult to simultaneously form the groove 25 in the step of forming the boss 23a.

[0040] Other electronic components 114 may be disposed on the surface of the first hard board portion 11 away from the reinforcing portion 21 . The electronic components 114 may be passive components such as resistors, capacitors, diodes, transistors, relays, and electrically erasable programmable read-only memories (EEPROM).

[0041] The bearing seat 40 is arranged on the surface of the first hard plate part 11 away from the reinforcing part 21. The bearing seat 40 is roughly a rectangular parallelepiped. The bearing seat 40 is provided with a receiving hole 41 that passes through the bearing seat 40. The receiving hole 41 corresponds to the position of the photosensitive chip 30. The surrounding area of ​​the bearing seat 40 is arranged on the first hard plate part 11. The area of ​​the bearing seat 40 adjacent to the receiving hole 41 is recessed in the direction away from the first hard plate part 11 to form a receiving groove 43. The electronic component 114 is arranged on the surface of the first hard plate part 11 and is received in the receiving groove 43, so as to reserve a certain safety distance between the bearing seat 40 and the overall thickness of the lens module 100 is not increased. In addition, the bearing seat 40 is spaced apart from the wire 31, and the position of the bearing seat 40 does not interfere with the arrangement of the wire 31.

[0042] The optical filter 50 is disposed on a side of the support base 40 away from the photosensitive chip 30. A third colloid 51 may be disposed between the optical filter 50 and the support base 40. The third colloid 51 bonds the optical filter 50 and the support base 40. The optical filter 50 and the photosensitive chip 30 are spaced apart. In this embodiment, the shape of the optical filter 50 is rectangular, and the third colloid 51 is annular, so as to be disposed around the optical filter 50.

[0043] The mirror base 60 is located on the surface of the supporting base 40 away from the circuit board 10. The mirror base 60 is a hollow structure. The mirror base 60 is provided with an internal thread 61. The lens 70 is provided with an external thread 71 adapted to the internal thread 61. The lens 70 can be accommodated in the mirror base 60 through the meshing action of the internal thread 61 and the external thread 71.

[0044] The lens module 100 provided in the embodiment of the present application includes a reinforcement plate 20. The reinforcement plate 20 can be formed into a boss 23 protruding relative to the reinforcement part 21 through a stamping process, so that the connection between the boss 23 and the reinforcement part 21 forms an arc surface with a smaller R angle, which can reduce the distance between the circuit board 10 and the boss 23, reduce the length of the wire 31, and thus reduce the production cost of the lens module 100; in addition, the reinforcement plate 20 formed by the stamping process also has a simple stamping process, reduces the production time, and thus can further reduce the production cost; further, when the boss 23 is formed by the stamping process, the groove 25 is simultaneously formed, that is, there is no need for an additional process to form the groove 25, and the heat sink 27 can be accommodated in the groove 25, which can improve the heat dissipation performance of the lens module 100 without increasing the height of the lens module 100.

[0045] The above implementation modes are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred implementation modes, a person skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A lens module, characterized in that: include: A circuit board is provided with a through hole; A reinforcing plate, comprising a reinforcing portion and a boss, wherein the boss protrudes relative to the reinforcing portion, the reinforcing portion is located at one side of the circuit board, and the boss is located in the through hole and spaced apart from the circuit board; A photosensitive chip is located on one side of the boss and accommodated in the through hole; and A wire, located on a side of the circuit board and the photosensitive chip away from the reinforcing plate and electrically connecting the photosensitive chip and the circuit board; The reinforcing plate is away from the side of the circuit board, the boss is away from the reinforcing part and is connected via an arc surface, and the projection width of the arc surface along the direction in which the circuit board and the reinforcing plate are stacked is less than or equal to 0.03 mm.

2. The lens module according to claim 1, characterized in that: The reinforcement plate includes a groove, which is formed by the reinforcement part and the boss, and the groove is located on a side of the boss away from the photosensitive chip.

3. The lens module according to claim 2, characterized in that: The lens module also includes a heat sink, and the heat sink is located in the groove.

4. The lens module according to claim 3, characterized in that: The heat sink is made of thermally conductive silicone.

5. The lens module according to claim 1, characterized in that: The circuit board includes a first hard board portion, a second hard board portion, and a soft board portion located between the first hard board portion and the second hard board portion, and the through hole is opened in the first hard board portion.

6. The lens module according to claim 5, characterized in that: The lens module also includes a bearing seat, which is arranged on a surface of the first hard plate portion away from the reinforcement portion and corresponds to the position of the photosensitive chip, and the bearing seat is spaced apart from the photosensitive chip.

7. The lens module according to claim 6, characterized in that: The wire connects the photosensitive chip and the first hard board part, and the wire is spaced apart from the supporting seat.

8. The lens module according to claim 6, characterized in that: The lens module also includes a filter, which is located on a side of the supporting base away from the photosensitive chip and is spaced apart from the photosensitive chip.

9. The lens module according to claim 1, characterized in that: The reinforcement plate is made of stainless steel.

10. A terminal device, characterized in that: The terminal device comprises the lens module described in any one of claims 1-9.

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