Temperature adjusting device of chip test fixture and chip test equipment

Abstract

The utility model provides a temperature adjusting device of a chip testing jig and chip testing equipment, and relates to the technical field of jig temperature adjustment, the testing jig in the temperature adjusting device is provided with an air inlet, an air outlet and a first air channel, and a vortex tube is provided with a cold air outlet end communicated with the air inlet of the testing jig. The vortex tube is controlled to be opened and generate cold air, the cold air is sequentially transmitted to the air inlet, the first air channel and the air outlet through the cold air outlet end, the heating piece is arranged on the testing jig, and the switch assembly is connected with the vortex tube and the heating piece and is controlled to be opened and closed so as to control opening and closing of the vortex tube and the heating piece. According to the utility model, the vortex tube is additionally arranged, and the first air channel is arranged in the test fixture to be matched with the vortex tube, so that the test fixture is cooled, the surface temperature of the test fixture is not interfered, and the heating element and the vortex tube are opened and closed through the switch assembly, so that the heating and refrigerating capabilities are realized on the single test fixture.

Description

Technical Field

[0001] The utility model relates to the technical field of fixture temperature regulation, in particular to a temperature regulation device for a chip testing fixture and chip testing equipment. Background Art

[0002] When testing the electrical properties of a chip, in order to simulate the actual test results, the test must be performed at a specific temperature.

[0003] The existing technology using thermoelectric coolers as cooling sources has obvious defects when working. On the one hand, it is impossible to equip the same test fixture with a heating element and a thermoelectric cooler at the same time, resulting in the test fixture being unable to achieve continuous and efficient high-temperature and low-temperature conversion testing; on the other hand, because the thermoelectric cooler generates heat at the hot end that is difficult to effectively dissipate while cooling at its cold end, this part of heat will cause the local temperature of the test fixture to rise, causing thermal deformation of the test area, seriously affecting the accuracy of the test.

[0004] Existing chip test fixtures have problems such as inconvenient operation, low efficiency, and susceptibility to thermal balance problems when performing temperature control, especially when frequent switching between high and low temperature states is required for comprehensive electrical performance testing. There is an urgent need for a new solution that can realize heating and cooling functions on the same test fixture while avoiding the adverse effects of thermoelectric coolers to improve test quality and efficiency. Utility Model Content

[0005] One purpose of the utility model is to provide a temperature regulating device for a chip test fixture, so as to solve the problems in the prior art that it is inconvenient to switch between high and low temperature states when the chip is tested for electrical performance and the thermoelectric cooler affects the accuracy of the test.

[0006] Another object of the present invention is to provide a chip testing device having the temperature regulating device.

[0007] In particular, the utility model provides a temperature regulating device for a chip testing fixture, comprising:

[0008] A test fixture having an air inlet and an air outlet, wherein a first air passage connecting the air inlet and the air outlet is provided inside the test fixture;

[0009] a vortex tube having a cold air outlet end connected to the air inlet, the vortex tube being configured to be opened in a controlled manner and to generate cold air to be sequentially transmitted to the air inlet, the first air duct and the air outlet through the cold air outlet end, thereby cooling the test fixture;

[0010] a heating element, disposed on the test fixture, for heating the test fixture; and

[0011] The switch assembly is connected to the vortex tube and the heating element respectively, and the switch assembly is configured to be opened and closed in a controlled manner to control the opening and closing of the vortex tube and the heating element.

[0012] Optionally, it also includes:

[0013] A temperature control unit is connected to the switch assembly, and is configured to collect the actual temperature of the test fixture and compare it with a preset temperature to control the opening and closing of the switch assembly according to the comparison result.

[0014] Optionally, the temperature control unit includes:

[0015] A temperature sensor, disposed on the test fixture, for obtaining an actual temperature of the test fixture;

[0016] A temperature controller is connected to the switch assembly and the temperature sensor respectively. The temperature controller is configured to receive the actual temperature of the test fixture fed back by the temperature sensor and compare it with the preset temperature to control the opening and closing of the switch assembly according to the comparison result.

[0017] Optionally, the switch assembly comprises:

[0018] The solenoid valve is connected to the vortex tube and the temperature controller respectively, and is used for controlling the compressed air to enter the vortex tube under the control of the temperature controller, so that the vortex tube generates the cold air.

[0019] Optionally, the switch assembly further includes:

[0020] The relay is connected to the heating element and the temperature controller respectively, and is used for controlling the opening and closing of the heating element under the control of the temperature controller.

[0021] Optionally, the air inlet and the air outlet are arranged on the same side of the test fixture.

[0022] Optionally, a vacuum air inlet is provided on the test fixture, a second air channel connected to the vacuum air inlet is provided inside the test fixture, and the vacuum air inlet is connected to a vacuum pumping device to vacuumize through the second air channel, thereby adsorbing the chip to be tested.

[0023] Optionally, the vacuum air inlet is arranged between the air inlet and the air outlet.

[0024] Optionally, the vortex tube is provided with a compressed air inlet, and the compressed air inlet is connected to the solenoid valve.

[0025] In particular, the utility model provides a chip testing device, comprising the above-mentioned temperature regulating device.

[0026] The utility model cooperates with the vortex tube through the first air channel in the test fixture. When cooling is needed, the vortex tube generates cold air, which is transmitted to the air inlet, the first air channel and the air outlet in sequence through the cold air outlet end of the vortex tube, thereby cooling the test fixture and taking away the excess heat of the test fixture to achieve rapid cooling. Since the hot air generated by the vortex tube is far away from the fixture, the thermal imbalance problem caused by the thermoelectric cooler can be avoided, and the impact on the test accuracy can be avoided. In addition, the utility model also provides a heating element for heating the test fixture, and the opening and closing of the vortex tube and the heating element are controlled by the switch component to complete the switching of the heating and cooling of the test fixture, thereby improving the test efficiency and equipment utilization rate, and ensuring the stability of the chip test environment.

[0027] Based on the detailed description of the specific embodiments of the present invention in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other purposes, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0029] Figure 1 is a schematic structural diagram of a temperature regulating device of a chip testing fixture according to an embodiment of the utility model;

[0030] Figure 2 yes Figure 1 A schematic cross-sectional view of a chip test fixture in the temperature regulating device shown at one angle;

[0031] Figure 3 It is a schematic connection block diagram of a temperature adjustment device of a chip test fixture according to an embodiment of the utility model;

[0032] Figure 4 yes Figure 1 A schematic cross-sectional view of a chip testing fixture in the temperature regulating device shown in another angle.

[0033] Figure Number:

[0034] 100-temperature regulating device, 10-chip testing fixture, 11-air inlet, 12-air outlet, 13-first air duct, 14-vacuum air inlet, 15-second air duct, 20-vortex tube, 21-compressed air inlet, 22-cold air outlet, 30-heating element, 40-switch assembly, 41-solenoid valve, 42-relay, 50-temperature control unit, 51-temperature sensor, 52-temperature controller, 200-chip. DETAILED DESCRIPTION

[0035] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0036] Figure 1 1 is a schematic structural diagram of a temperature regulating device 100 of a chip testing fixture according to an embodiment of the present invention. Figure 2 yes Figure 1 FIG. 1 is a schematic cross-sectional view of a test fixture 10 in the temperature regulating device 100 at one angle. Figure 1 to Figure 2 As shown, the temperature regulating device 100 may generally include a test fixture 10, a vortex tube 20, a heating element 30 and a switch assembly 40. The test fixture 10 is provided with an air inlet 11 and an air outlet 12, and the interior of the test fixture 10 is provided with a first air duct 13 connecting the air inlet 11 and the air outlet 12. The vortex tube 20 has a cold air outlet end 22 connected to the air inlet 11 of the test fixture 10, and the vortex tube 20 is configured to be opened under control and generate cold air, so as to be transmitted to the air inlet 11, the first air duct 13 and the air outlet 12 in sequence through the cold air outlet end 22, forming a continuous cooling process from the air inlet 11 to the air outlet 12, and realizing effective cooling treatment of the test fixture 10. The heating element 30 is arranged on the test fixture 10, and the test fixture 10 can be heated according to actual needs, and cooperates with the vortex tube 20 to realize the ability to adjust the actual temperature of the test fixture 10 in both directions. The switch assembly 40 is connected to the vortex tube 20 and the heating element 30 respectively, and the switch assembly 40 is configured to be controlled to open and close to control the opening and closing of the vortex tube 20 and the heating element 30 .

[0037] This embodiment cooperates with the vortex tube 20 by setting the first air duct 13 on the test fixture 10. When cooling is needed, the vortex tube 20 generates cold air, which is transmitted to the air inlet 11, the first air duct 13 and the air outlet 12 in sequence through the cold air outlet end 22 of the vortex tube 20, thereby cooling the test fixture 10, taking away the excess heat of the test fixture 10, and achieving rapid cooling. In addition, this embodiment also provides a heating element 30 for heating the test fixture 10, and the opening and closing of the vortex tube 20 and the heating element 30 are controlled by the switch assembly 40 to complete the switching of heating and cooling of the test fixture 10, thereby improving the test efficiency and equipment utilization, and ensuring the stability of the chip 200 test environment.

[0038] In this embodiment, the vortex tube 20 is one of the core components of the temperature regulating device 100. With the help of the vortex tube 20, the compressed high-speed airflow generates a vortex to separate the cold and hot airflows. The generated cold air can reach as low as -46°C. The cold air in the vortex tube 20 is released from the cold air outlet end 22, and the hot air flow generated by the vortex tube 20 can be discharged away from the test fixture 10, ensuring that the surface temperature of the test fixture 10 is not disturbed and an ideal test environment is maintained. This avoids the problem of using thermoelectric coolers in the prior art to generate heat that is difficult to effectively dissipate, resulting in a local temperature increase in the test fixture 10, and will not cause thermal deformation of the test area, thereby ensuring the accuracy of the test.

[0039] In this embodiment, the temperature regulating device 100 also includes a temperature control unit 50 connected to the switch assembly 40. The temperature control unit 50 is configured to collect the actual temperature of the test fixture 10 and compare it with the preset temperature to control the opening and closing of the switch assembly 40 according to the comparison result. The temperature control unit 50 is responsible for the temperature control process of the entire temperature regulating device 100.

[0040] Among them, the temperature adjustment device 100 includes a temperature sensor 51 and a temperature controller 52. The temperature sensor 51 is arranged on the test fixture 10 and connected to the temperature controller 52. The temperature sensor 51 is used to obtain the actual temperature of the test fixture 10 and transmit the actual temperature of the test fixture 10 to the temperature controller 52. The temperature controller 52 is connected to the switch component 40, and the temperature controller 52 can be input with a preset temperature by the tester. The temperature controller 52 is configured to receive the actual temperature of the test fixture 10 fed back by the temperature sensor 51, and compare the actual temperature with the preset temperature. The temperature controller 52 controls the opening and closing of the switch component 40 according to the comparison result to ensure that the test fixture 10 is maintained at the preset temperature required for the test, thereby realizing closed-loop control of the test temperature.

[0041] Figure 3 FIG. 1 is a schematic connection block diagram of a temperature adjustment device 100 of a chip test fixture according to an embodiment of the present invention. Figure 3 As shown, and see Figure 1In this embodiment, the switch assembly 40 includes a solenoid valve 41, which is connected to the vortex tube 20 and the temperature controller 52 respectively, and is used to control the compressed air to enter the vortex tube 20 under the control of the temperature controller 52, so that the vortex tube 20 generates a cold air connection. The solenoid valve 41 responds to the temperature controller 52 connected thereto, and the temperature controller 52 controls the solenoid valve 41 to control whether the compressed air enters the vortex tube 20 according to the difference between the current actual temperature of the test fixture 10 and the preset temperature. In the process of testing the chip 200, the tester sets the preset temperature through the temperature controller 52, and the temperature sensor 51 collects the actual temperature of the test fixture 10. If the actual temperature is higher than the preset temperature, the temperature controller 52 controls the solenoid valve 41 to open, so as to deliver compressed air to the vortex tube 20, so that the vortex tube 20 generates cold air, and transmits the cold air to the first airway 13 of the test fixture 10 to cool the test fixture 10. If the actual temperature is lower than or equal to the preset temperature, the temperature controller 52 controls the solenoid valve 41 to close. Here, the vortex tube 20 is provided with a compressed air inlet 21, which is connected to a solenoid valve 41 for introducing compressed air into the vortex tube 20. The solenoid valve 41 controls whether the compressed air enters the vortex tube 20 under the control of a temperature controller 52.

[0042] like Figure 1 and Figure 3 As shown, in this embodiment, the switch assembly 40 also includes a relay 42, and the relay 42 is respectively connected to the heating element 30 and the temperature controller 52, and is used to control the opening and closing of the heating element 30 under the control of the temperature controller 52. The relay 42 responds to the temperature controller 52 connected thereto. The temperature controller 52 controls the relay 42 to adjust the opening and closing of the heating element 30 according to the difference between the current actual temperature of the test fixture 10 and the preset temperature. In the process of testing the chip 200, the tester sets the preset temperature through the temperature controller 52, and the temperature sensor 51 collects the actual temperature of the test fixture 10. If the actual temperature is lower than the preset temperature, the temperature controller 52 controls the relay 42 to open to turn on the heating element 30, so that the heating element 30 heats the test fixture 10. If the actual temperature is higher than or equal to the preset temperature, the temperature controller 52 controls the relay 42 to close to turn off the heating element 30.

[0043] In some specific embodiments, the air inlet 11 and the air outlet 12 are disposed on the same side of the test fixture 10. In other embodiments, the air inlet 11 and the air outlet 12 may also be disposed on different sides of the test fixture 10, depending on design requirements.

[0044] Figure 4 yes Figure 1 A schematic cross-sectional view of the test fixture 10 in the temperature regulating device 100 from another angle is shown. Figure 4As shown, in some specific embodiments, the test fixture 10 is provided with a vacuum air inlet 14, and the inside of the test fixture 10 is provided with a second air channel 15 connected to the vacuum air inlet 14, and the vacuum air inlet 14 is connected to a vacuum pumping device to vacuum through the second air channel 15, thereby adsorbing the chip to be tested 200. Here, the vacuum air inlet 14 is arranged between the air inlet 11 and the air outlet 12. That is, the vacuum air inlet 14, the air inlet 11 and the air outlet 12 are arranged on the same side of the test fixture 10.

[0045] The present invention further provides a chip 200 testing device, which includes the temperature adjustment device 100 as described in any of the above embodiments. The temperature adjustment device 100 is not described in detail here.

[0046] This embodiment realizes cold air generation through the vortex tube 20, and delivers the cold air to the test fixture 10 to realize cooling of the test fixture 10. In addition, combined with the heating element 30 and the switch assembly 40, the test fixture 10 can be accurately temperature-controlled in both directions. When the vortex tube 20 is working, it can separate the cold air and enter the inside of the test fixture 10 through the air inlet 11, and transmit it to the air outlet 12 along the first air duct 13, effectively reducing the temperature of the test fixture 10, as low as -46°C. Using the vortex tube 20 for cooling avoids interference from heat sources, ensures the temperature stability of the test area, and prevents the accuracy of the test from being affected by thermal deformation.

[0047] Furthermore, this embodiment monitors the actual temperature of the test fixture 10 in real time through the temperature sensor 51 and transmits the actual temperature value to the temperature controller 52. The temperature controller 52 controls the opening or closing of the vortex tube 20 and the heating element 30 through the switch assembly 40 based on the comparison result between the preset temperature and the actual temperature, so that the test fixture 10 is always kept within the ideal test temperature range.

[0048] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived from the contents disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A temperature regulating device for a chip testing fixture, characterized in that: include: A test fixture having an air inlet and an air outlet, wherein a first air passage connecting the air inlet and the air outlet is provided inside the test fixture; a vortex tube having a cold air outlet end connected to the air inlet, the vortex tube being configured to be opened in a controlled manner and generate cold air, so as to sequentially transmit the cold air to the air inlet, the first air duct and the air outlet through the cold air outlet end, thereby cooling the test fixture; A heating element, disposed on the test fixture, for heating the test fixture; as well as The switch assembly is connected to the vortex tube and the heating element respectively, and the switch assembly is configured to be opened and closed in a controlled manner to control the opening and closing of the vortex tube and the heating element.

2. The temperature adjustment device according to claim 1, characterized in that: Also includes: A temperature control unit is connected to the switch assembly, and is configured to collect the actual temperature of the test fixture and compare it with a preset temperature to control the opening and closing of the switch assembly according to the comparison result.

3. The temperature adjustment device according to claim 2, characterized in that: The temperature control unit comprises: A temperature sensor, disposed on the test fixture, for obtaining an actual temperature of the test fixture; A temperature controller is connected to the switch assembly and the temperature sensor respectively, and is configured to receive the actual temperature of the test fixture fed back by the temperature sensor and compare it with the preset temperature to control the opening and closing of the switch assembly according to the comparison result.

4. The temperature adjustment device according to claim 3, characterized in that: The switch assembly comprises: The solenoid valve is connected to the vortex tube and the temperature controller respectively, and is used for controlling the compressed air to enter the vortex tube under the control of the temperature controller, so that the vortex tube generates the cold air.

5. The temperature adjustment device according to claim 3, characterized in that: The switch assembly further comprises: The relay is connected to the heating element and the temperature controller respectively, and is used for controlling the opening and closing of the heating element under the control of the temperature controller.

6. The temperature adjustment device according to claim 1, characterized in that: The air inlet and the air outlet are arranged on the same side of the test fixture.

7. The temperature adjustment device according to claim 1, characterized in that: The test fixture is provided with a vacuum air inlet, and a second air channel connected to the vacuum air inlet is provided inside the test fixture. The vacuum air inlet is connected to a vacuum pumping device to vacuumize through the second air channel, thereby adsorbing the chip to be tested.

8. The temperature adjustment device according to claim 7, characterized in that: The vacuum air inlet is arranged between the air inlet and the air outlet.

9. The temperature adjustment device according to claim 4, characterized in that: The vortex tube is provided with a compressed air inlet, and the compressed air inlet is connected to the solenoid valve.

10. A chip testing device, characterized in that: The invention comprises a temperature regulating device as claimed in any one of claims 1 to 9.

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