Semiconductor solder ball screening device adopting electroforming method

Abstract

The utility model discloses an electroforming method semiconductor solder ball screening device which comprises a shell, a first material pushing assembly, an upper screen, a second material pushing assembly and a lower screen. An upper sieve plate and a lower sieve plate are horizontally arranged in the shell at an interval up and down, and the upper sieve plate and the lower sieve plate are horizontally and transversely connected with the shell in a sliding mode and abut against the left inner side face of the shell respectively, so that the semiconductor solder balls are subjected to double screening; a first material pushing assembly is arranged in the shell relative to the upper part of the upper sieve plate, the semiconductor solder balls are flatly laid on the upper sieve plate through the first material pushing assembly, and the screened semiconductor solder balls on the upper sieve plate are collected; a second material pushing assembly is arranged in the shell and located between the upper screen plate and the lower screen plate, the semiconductor tin balls obtained after primary screening are flatly laid on the lower screen plate through the second material pushing assembly, and the semiconductor tin balls obtained after screening on the lower screen plate are collected. The screening efficiency is improved, and the phenomenon that the screening holes are blocked is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor solder balls, in particular to a semiconductor solder ball screening device using an electroforming method. Background Art

[0002] After the semiconductor solder balls are prepared, they are usually screened and classified by particle size through a screening device for subsequent use; however, the existing screening devices are prone to clogging during the screening process, which affects subsequent use; in addition, after the screening is completed, semiconductor solder balls of different particle sizes still need to be collected manually, which is time-consuming and labor-intensive, and has low work efficiency. Therefore, the above problems need to be solved urgently. Summary of the invention

[0003] The technical problem to be solved by the utility model is to provide an electroplating semiconductor solder ball screening device. Through the coordinated use of an upper sieve plate, a first pushing assembly, a lower sieve plate and a second pushing assembly, it is not only convenient to spread the semiconductor solder balls on the corresponding upper sieve plate and the lower sieve plate, thereby improving the screening efficiency, but also avoiding the occurrence of sieve hole blockage.

[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions: the utility model is an electroplating semiconductor solder ball screening device, and its innovation lies in: comprising a shell, a first pusher assembly, an upper screen, a second pusher assembly and a lower screen; the shell is a vertically arranged hollow rectangular structure, and an upper screen plate and a lower screen plate matching it are arranged horizontally and parallelly inside the shell at upper and lower intervals, and the upper screen plate and the lower screen plate are respectively connected to the shell horizontally and laterally for sliding, and are respectively pressed against the left inner side surface of the shell, thereby performing double screening of the semiconductor solder balls; a first pusher assembly is arranged inside the shell relative to directly above the upper screen plate, and the semiconductor solder balls are spread flat on the upper screen plate by the first pusher assembly, and the semiconductor solder balls screened on the upper screen plate are collected by the first pusher assembly; a second pusher assembly is also arranged inside the shell relative to between the upper screen plate and the lower screen plate, and the semiconductor solder balls that have been screened once are spread flat on the lower screen plate by the second pusher assembly, and the semiconductor solder balls that have been screened on the lower screen plate are collected by the second pusher assembly.

[0005] Preferably, the sieve hole diameter of the upper sieve plate is larger than the sieve hole diameter of the lower sieve plate, and the difference between the sieve hole diameters of the two is 6μm; the sieve hole diameter of the upper sieve plate is smaller than the maximum particle size of the semiconductor solder ball, and the sieve hole diameter of the lower sieve plate is larger than the minimum particle size of the semiconductor solder ball.

[0006] Preferably, a first fixing block is horizontally aligned on the right side of the upper sieve plate, and the first fixing block is a rectangular structure matching the upper sieve plate; the left side of the first fixing block is fixedly connected to the right side of the upper sieve plate, and its right side extends horizontally and vertically out of the right outer side of the shell; first limiting plates are horizontally and symmetrically provided on the upper and lower sides of the first fixing block that exceeds the shell part, each of the first limiting plates is a rectangular structure, and its left end face is vertically fixedly connected to the right outer side of the shell; a first pin is vertically provided in the middle position of the upper surface of the first limiting plate, and The lower end of the first pin shaft vertically downwardly penetrates the upper first limit plate, the first fixed block and the lower first limit plate in sequence, thereby locking and positioning the horizontal lateral sliding of the upper screen plate; a first sealing gasket is also horizontally fixed at the joint of the first fixed block and the shell, and the first sealing gasket is a hollow rectangular structure matching the first fixed block, and is embedded and fixedly connected to the shell; a first handle is also vertically provided on the right side of the first fixed block, and the first handle and the two first limit plates are arranged without interfering with each other, so that the upper screen plate can be pulled and pulled by the first handle.

[0007] Preferably, a second fixing block is horizontally aligned on the right side of the lower sieve plate, and the second fixing block is a rectangular structure matching the lower sieve plate; the left side of the second fixing block is fixedly connected to the right side of the lower sieve plate, and its right side extends horizontally and vertically out of the right outer side of the shell; second limiting plates are horizontally and symmetrically provided on the upper and lower sides of the second fixing block that exceeds the shell, each of the second limiting plates is a rectangular structure, and its left end face is vertically fixedly connected to the right outer side of the shell; a second pin is vertically provided in the middle position of the upper surface of the second limiting plate, and The lower end of the second pin shaft vertically penetrates the upper second limit plate, the second fixed block and the lower second limit plate in sequence, thereby locking and positioning the horizontal lateral sliding of the lower screen plate; a second sealing gasket is also horizontally fixed at the joint of the second fixed block and the shell, and the second sealing gasket is a hollow rectangular structure matching the second fixed block, and is embedded and fixedly connected to the shell; a second handle is also vertically provided on the right side of the second fixed block, and the second handle and the two second limit plates are arranged without interfering with each other, so that the lower screen plate can be pulled and pulled by the second handle.

[0008] Preferably, it also includes a first discharge pipe, a second discharge pipe, a third discharge pipe and a guide plate; a first discharge pipe is also obliquely provided on the left outer side surface of the shell relative to the position of the upper sieve plate, and the right end of the first discharge pipe is obliquely extended upward to the left end of the upper surface of the upper sieve plate, and then horizontally extends out of the left inner side surface of the shell, and does not interfere with the movement of the first pushing assembly and the pulling and pulling movement of the upper sieve plate, respectively, and then the semiconductor solder balls screened on the upper sieve plate are pushed to the first discharge pipe for classification and collection through the first pushing assembly; a second discharge pipe is also obliquely provided on the left outer side surface of the shell relative to the position of the lower sieve plate, and the right end of the second discharge pipe is obliquely extended upward to the left end of the upper surface of the lower sieve plate, and then horizontally extends out of the left inner side surface of the shell, and does not interfere with the movement of the second pushing assembly and the pulling and pulling movement of the lower sieve plate, respectively, and then the semiconductor solder balls screened on the lower sieve plate are pushed to the second discharge pipe for classification and collection through the second pushing assembly; A third discharge pipe is obliquely provided on the left outer side surface near its bottom end and relative to the position below the lower sieve plate. The right end of the third discharge pipe obliquely extends upward to the left end of the inner bottom surface of the shell body, and then horizontally extends out of the left inner side surface of the shell body; a guide plate matching it is obliquely provided inside the shell body relative to directly below the lower sieve plate, and the guide plate is spaced apart from the lower sieve plate and does not interfere with the pulling and pulling action of the lower sieve plate; the right end of the guide plate is fixedly connected to the corresponding position of the right inner side surface of the shell body , and its left end is inclined downward toward the third discharge pipe, the left end of the upper surface of the guide plate is arranged at the right end of the third discharge pipe near its lower edge, and its inclination angle is smaller than the inclination angle of the third discharge pipe, and the semiconductor solder balls after double screening are collected and collected at the third discharge pipe for classification; pneumatic valves are provided in the first discharge pipe, the second discharge pipe and the third discharge pipe, and the corresponding pneumatic valves are used to control the opening and closing of the first discharge pipe, the second discharge pipe and the third discharge pipe respectively.

[0009] Preferably, it also includes a feed pipe and a sealing cover; a feed pipe is obliquely embedded and connected on the left outer side surface of the shell relative to just above the first discharge pipe, and the lower end of the feed pipe extends obliquely downward to the interior of the shell, and is spaced just above the first discharge pipe and does not interfere with the movement of the first pushing assembly; a sealing cover matching the feed pipe is horizontally sleeved on the upper end of the feed pipe, and the two are sealed and screwed, so that the semiconductor solder balls to be screened are added to the interior of the shell through the feed pipe.

[0010] Preferably, the first push assembly includes a first electric push rod, a second electric push rod, a first push brush, a connecting rod, a reinforcing rod and a second sliding block; two first electric push rods are horizontally and transversely screwed together at a front-rear interval on the right outer side surface of the shell relative to the upper screen plate, and a reinforcing rod is obliquely provided between the tail of each of the first electric push rods and the right outer side surface of the shell, and the corresponding first electric push rod is reinforced and fixed by the reinforcing rod; each of the first electric push rods has no effect on the disassembly action of the first pin shaft, and the pushing ends of the two first electric push rods move synchronously; the pushing end of each of the first electric push rods extends horizontally and vertically to the inside of the shell, and is respectively fixedly connected to the tail of the corresponding second electric push rod arranged vertically, thereby driving the second electric push rod to make horizontal and transverse reciprocating movements inside the shell relative to just above the upper screen plate; A connecting rod is also vertically provided at the tail end of each of the second electric push rods, and the upper end of each of the connecting rods is horizontally and laterally slidably connected to the inner top surface of the shell through a second slider; the pushing end of each of the second electric push rods is vertically arranged downward, and the pushing ends of the two second electric push rods move synchronously, and a first pushing brush matching the width of the upper sieve plate is longitudinally arranged between the pushing ends of the two second electric push rods, and the fixed ends of the first pushing brush are respectively linked to the pushing ends of the two second electric push rods, and the pushing ends thereof are arranged toward the upper sieve plate and in contact with the upper surface of the upper sieve plate, and then, through the cooperation of the first electric push rod and the second electric push rod, the first pushing brush performs horizontal and transverse reciprocating movement, and at the same time, spreads the semiconductor solder balls flat on the upper sieve plate, and also pushes the screened semiconductor solder balls on the upper sieve plate to the first discharge pipe through the first pushing brush.

[0011] Preferably, the second push assembly and the second discharge pipe are arranged without interfering with each other, and have no influence on the pulling and pulling action of the upper sieve plate and the lower sieve plate; the second push assembly comprises a motor, a coupling, a flange, a threaded rod, a guide rail, a first slider, an upper push brush and a lower push brush; flanges are vertically symmetrically arranged at left and right intervals between the upper sieve plate and the lower sieve plate in the interior of the shell, and each of the flanges is respectively screwed and fixed to the left and right inner side surfaces of the shell, and is respectively arranged at intervals with the upper sieve plate and the lower sieve plate; threaded rods are horizontally and laterally arranged at intervals in the middle position between the two flanges, the left ends of the two threaded rods are respectively rotatably connected to the flange on the right side, and the left ends thereof are respectively coaxially linked to the right end of the corresponding coupling, and the left end of each coupling extends horizontally and vertically out of the flange on the left side and the left outer side surface of the shell in sequence, and is respectively linked to the output end of the corresponding motor; the two motors are horizontally and laterally arranged at intervals in front and back, and the actions of the two are synchronized, and they are respectively screwed and fixed to the corresponding positions of the left outer side surface of the shell; at the middle position between the two flanges, the left ends of the two threaded rods are respectively rotatably connected to the flange on the right side, and the left ends thereof are respectively coaxially linked to the right end of the corresponding coupling, and the left end of each coupling extends horizontally and vertically out of the flange on the left side and the left outer side surface of the shell, and are respectively linked to the output end of the corresponding motor; the two motors are horizontally and laterally arranged at intervals in front and back, and the actions of the two are synchronized, and they are respectively screwed and fixed to the corresponding positions of the left outer side surface of the shell; at the middle position between the two threaded rods, the left ends of the two threaded rods are respectively rotatably connected to Guide rails are also provided horizontally and symmetrically between the two flanges on the upper and lower sides, and the left and right ends of each guide rail are respectively screwed and fixed with the corresponding flange; a first slider is also sleeved on each threaded rod, and the two first sliders are arranged in front and back alignment, each first slider is screwed with the corresponding threaded rod, and is respectively connected with the corresponding two guide rails in a horizontal and transverse sliding manner; a lower push brush matching the width of the lower screen plate is also provided on the lower surface of the two first sliders, and the pushing end of the lower push brush is arranged in the direction of the lower screen plate. , and contacts with the upper surface of the lower sieve plate; an upper pushing brush matching the width of the upper sieve plate is also provided on the upper surfaces of the two first sliding blocks, and the pushing end of the upper pushing brush is arranged toward the upper sieve plate and contacts with the lower surface of the upper sieve plate; driven by the motor, the upper pushing brush and the lower pushing brush move horizontally with the first sliding block to avoid clogging of the sieve holes of the upper sieve plate and the lower sieve plate, while also spreading the semiconductor solder balls after the first screening on the lower sieve plate, and pushing the semiconductor solder balls after the screening on the lower sieve plate to the second discharge pipe through the lower pushing brush.

[0012] Beneficial effects of the utility model:

[0013] (1) The utility model uses the upper sieve plate, the first pusher assembly, the lower sieve plate and the second pusher assembly in coordination, which not only facilitates the laying of semiconductor solder balls on the corresponding upper sieve plate and the lower sieve plate, thereby improving the screening efficiency, but also avoids the occurrence of sieve hole blockage;

[0014] (2) The utility model realizes the automatic classification and collection of semiconductor solder balls of different particle sizes through the coordinated use of the first pushing component and the second pushing component, which saves time and labor and improves work efficiency;

[0015] (3) The upper sieve plate and the lower sieve plate of the utility model are both connected by a pull-out sliding connection, which is convenient for quick replacement when the sieve holes are damaged, saving time and labor and improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 The utility model is a structural schematic diagram of a semiconductor solder ball screening device using an electroforming method.

[0018] Figure 2 for Figure 1 An enlarged schematic diagram of the second pusher assembly.

[0019] Among them, 1-shell; 2-feed pipe; 3-sealing cover; 4-upper sieve plate; 5-first fixed block; 6-first limit plate; 7-first pin shaft; 8-first handle; 9-first discharge pipe; 10-lower sieve plate; 11-second discharge pipe; 12-second fixed block; 13-second limit plate; 14-second pin shaft; 15-second handle; 16-third discharge pipe; 17-guide plate; 18-first electric push rod; 19-second electric push rod; 20-first push brush; 21-connecting rod; 22-reinforcement rod; 23-motor; 24-coupling; 25-threaded rod; 26-guide rail; 27-first slider; 28-upper push brush; 29-lower push brush. DETAILED DESCRIPTION

[0020] The technical solution of the utility model will be clearly and completely described below through specific implementation methods.

[0021] The utility model discloses an electroforming semiconductor solder ball screening device, comprising a housing 1, a first material pushing assembly, an upper screen, a second material pushing assembly and a lower screen; the specific structure is as follows Figure 1 , Figure 2 As shown, the shell 1 is a vertically arranged hollow rectangular structure, and an upper sieve plate 4 and a lower sieve plate 10 are horizontally and parallelly arranged inside the shell 1 at upper and lower intervals. The upper sieve plate 4 and the lower sieve plate 10 are respectively connected to the shell 1 in a horizontal and transverse sliding manner, and are respectively pressed against the left inner side surface of the shell 1, thereby performing double screening of the semiconductor solder balls; wherein, the sieve hole diameter of the upper sieve plate 4 is larger than the sieve hole diameter of the lower sieve plate 10, and the difference between the sieve hole diameters of the two is 6μm; the sieve hole diameter of the upper sieve plate 4 is smaller than the maximum particle size of the semiconductor solder balls, and the sieve hole diameter of the lower sieve plate 10 is larger than the minimum particle size of the semiconductor solder balls.

[0022] like Figure 1 As shown, a first fixing block 5 is horizontally aligned on the right side of the upper sieve plate 4, and the first fixing block 5 is a rectangular parallelepiped structure matching the upper sieve plate 4; the left side of the first fixing block 5 is fixedly connected to the right side of the upper sieve plate 4, and its right side extends horizontally and vertically out of the right outer side of the shell 1; first limiting plates 6 are horizontally and symmetrically arranged on the upper and lower sides of the part of the first fixing block 5 that exceeds the shell 1, and each first limiting plate 6 is a rectangular structure, and its left end face is vertically fixedly connected to the right outer side of the shell 1; a first pin shaft 7 is vertically arranged in the middle position of the upper surface of the upper first limiting plate 6, and The lower end of the first pin shaft 7 vertically penetrates the upper first limit plate 6, the first fixed block 5 and the lower first limit plate 6 in sequence, thereby locking and positioning the horizontal lateral sliding of the upper screen plate 4; a first sealing gasket is also horizontally fixed at the joint of the first fixed block 5 and the shell 1, and the first sealing gasket is a hollow rectangular structure matching the first fixed block 5, and is embedded and fixedly connected to the shell 1; a first handle 8 is also vertically provided on the right side of the first fixed block 5, and the first handle 8 and the two first limit plates 6 are arranged without interfering with each other, so that the upper screen plate 4 can be pulled and pulled by the first handle 8.

[0023] like Figure 1 As shown, a second fixing block 12 is horizontally aligned on the right side of the lower screen plate 10, and the second fixing block 12 is a rectangular parallelepiped structure matching the lower screen plate 10; the left side of the second fixing block 12 is fixedly connected to the right side of the lower screen plate 10, and its right side extends horizontally and vertically out of the right outer side of the shell 1; second limiting plates 13 are horizontally and symmetrically arranged on the upper and lower sides of the second fixing block 12 that exceeds the shell 1, and each second limiting plate 13 is a rectangular structure, and its left end face is vertically fixedly connected to the right outer side of the shell 1; a second pin 14 is vertically arranged in the middle position of the upper surface of the upper second limiting plate 13, and the second pin 14 is vertically arranged on the middle position of the upper surface of the upper second limiting plate 13. The lower ends of the two pin shafts 14 vertically penetrate the upper second limit plate 13, the second fixed block 12 and the lower second limit plate 13 in sequence, thereby locking and positioning the horizontal lateral sliding of the lower screen plate 10; a second sealing gasket is also horizontally fixed at the joint between the second fixed block 12 and the shell 1, and the second sealing gasket is a hollow rectangular structure matching the second fixed block 12, and is embedded and fixedly connected to the shell 1; a second handle 15 is also vertically provided on the right side of the second fixed block 12, and the second handle 15 and the two second limit plates 13 are arranged without interfering with each other, so that the lower screen plate 10 can be pulled and pulled by the second handle 15.

[0024] The utility model is provided with a first pusher assembly inside the housing 1 directly above the upper sieve plate 4, and the semiconductor solder balls are spread on the upper sieve plate 4 by the first pusher assembly, and the semiconductor solder balls screened on the upper sieve plate 4 are collected by the first pusher assembly; Figure 1 As shown, a first discharge pipe 9 is obliquely provided on the left outer side surface of the shell 1 at a position relative to the upper sieve plate 4, and the right end of the first discharge pipe 9 is obliquely extended upward to the left end of the upper surface of the upper sieve plate 4, and then horizontally extends out of the left inner side surface of the shell 1, and does not interfere with the action of the first pushing assembly and the pulling action of the upper sieve plate 4, respectively, and then the semiconductor solder balls after screening on the upper sieve plate 4 are pushed to the first discharge pipe 9 by the first pushing assembly for classification and collection; the utility model is provided with a pneumatic valve in the first discharge pipe 9, and then the opening and closing of the first discharge pipe 9 is controlled by the corresponding pneumatic valve.

[0025] like Figure 1 As shown, a feed pipe 2 is obliquely embedded and connected to the left outer side surface of the shell 1 relative to the top of the first discharge pipe 9. The lower end of the feed pipe 2 extends obliquely downward to the interior of the shell 1, and is spaced apart just above the first discharge pipe 9 so as not to interfere with the movement of the first pushing assembly. A sealing cover 3 matching the feed pipe 2 is horizontally sleeved on the upper end of the feed pipe 2, and the two are sealed and screwed, so that the semiconductor solder balls to be screened are added into the shell 1 through the feed pipe 2.

[0026] The first pusher assembly of the utility model comprises a first electric push rod 18, a second electric push rod 19, a first pusher brush 20, a connecting rod 21, a reinforcing rod 22 and a second slider; Figure 1 As shown, two first electric push rods 18 are horizontally and transversely screwed at intervals on the right outer side of the housing 1 relative to the upper screen plate 4, and a reinforcing rod 22 is obliquely provided between the tail of each first electric push rod 18 and the right outer side of the housing 1, and the corresponding first electric push rod 18 is reinforced and fixed by the reinforcing rod 22; each first electric push rod 18 has no effect on the disassembly action of the first pin shaft 7, and the pushing ends of the two first electric push rods 18 act synchronously;

[0027] like Figure 1As shown, the pushing end of each first electric push rod 18 extends horizontally and vertically to the inside of the shell 1, and is fixedly connected to the tail of the corresponding second electric push rod 19 arranged vertically, thereby driving the second electric push rod 19 to make horizontal and transverse reciprocating movements inside the shell 1 relative to the upper part of the upper screen plate 4; a connecting rod 21 is also vertically provided at the tail of each second electric push rod 19, and the upper end of each connecting rod 21 is horizontally and transversely slidably connected to the inner top surface of the shell 1 through a second slider; the pushing end of each second electric push rod 19 is arranged vertically downward, and the pushing ends of the two second electric push rods 19 move synchronously. A first pushing brush 20 matching the width of the upper sieve plate 4 is longitudinally provided between the pushing ends of the two second electric push rods 19. The fixed ends of the first pushing brush 20 are respectively linked to the pushing ends of the two second electric push rods 19, and its pushing end is arranged toward the upper sieve plate 4 and contacts with the upper surface of the upper sieve plate 4. Then, through the cooperation of the first electric push rod 18 and the second electric push rod 19, the first pushing brush 20 performs horizontal reciprocating movement, and while spreading the semiconductor solder balls flat on the upper sieve plate 4, the first pushing brush 20 also pushes the screened semiconductor solder balls on the upper sieve plate 4 to the first discharge pipe 9.

[0028] The utility model further provides a second pusher assembly inside the housing 1 between the upper sieve plate 4 and the lower sieve plate 10, and the semiconductor solder balls after the first screening are spread on the lower sieve plate 10 by the second pusher assembly, and the semiconductor solder balls after the screening on the lower sieve plate 10 are collected by the second pusher assembly; Figure 1 As shown, a second discharge pipe 11 is obliquely provided on the left outer side surface of the shell 1 at a position relative to the lower sieve plate 10, and the right end of the second discharge pipe 11 obliquely extends upward to the left end of the upper surface of the lower sieve plate 10, and then horizontally extends out of the left inner side surface of the shell 1, and does not interfere with the action of the second pusher assembly and the pulling action of the lower sieve plate 10, respectively, and then the semiconductor solder balls that have been screened on the lower sieve plate 10 are pushed to the second discharge pipe 11 by the second pusher assembly for classification and collection;

[0029] like Figure 1As shown, a third discharge pipe 16 is obliquely provided on the left outer side surface of the shell 1 near its bottom end and relative to the position below the lower screen plate 10. The right end of the third discharge pipe 16 obliquely extends upward to the left end of the inner bottom surface of the shell 1, and then horizontally extends out of the left inner side surface of the shell 1; a guide plate 17 matching with the lower screen plate 10 is obliquely provided inside the shell 1 relative to the lower part of the lower screen plate 10, and the guide plate 17 is spaced apart from the lower screen plate 10 and does not interfere with the pulling action of the lower screen plate 10; the right end of the guide plate 17 corresponds to the right inner side surface of the shell 1 The guide plate 17 is fixedly connected in position, and its left end is tilted downward toward the third discharge pipe 16. The left end of the upper surface of the guide plate 17 is arranged at the right end of the third discharge pipe 16 near its lower edge, and its tilt angle is smaller than the tilt angle of the third discharge pipe 16, and the semiconductor solder balls after double screening are collected and collected in the third discharge pipe 16 for classification. The utility model is provided with pneumatic valves in the second discharge pipe 11 and the third discharge pipe 16, and the second discharge pipe 11 and the third discharge pipe 16 are controlled to be on and off by the corresponding pneumatic valves.

[0030] The second pusher assembly of the utility model is arranged without interfering with the second discharge pipe 11, and has no influence on the pulling and pulling action of the upper sieve plate 4 and the lower sieve plate 10; wherein, the second pusher assembly includes a motor 23, a coupling 24, a flange, a threaded rod 25, a guide rail 26, a first slider 27, an upper pusher brush 28 and a lower pusher brush 29; Figure 1 , Figure 2 As shown, flanges are vertically symmetrically arranged at left and right intervals inside the shell 1 relative to the upper sieve plate 4 and the lower sieve plate 10, and each flange is screwed and fixed to the left and right inner sides of the shell 1, and is spaced apart from the upper sieve plate 4 and the lower sieve plate 10; threaded rods 25 are horizontally and transversely arranged at intervals between the two flanges, and the left ends of the two threaded rods 25 are respectively rotatably connected to the right side flange, and the left ends thereof are respectively coaxially linked to the right ends of the corresponding couplings 24, and the left end of each coupling 24 extends horizontally and vertically out of the left side flange and the left outer side of the shell 1 in sequence, and is respectively linked to the output end of the corresponding motor 23; the two motors 23 are horizontally and transversely arranged at intervals between the front and the back, and the two actions are synchronized, and they are respectively screwed and fixed to the corresponding positions of the left outer side of the shell 1;

[0031] like Figure 1 , Figure 2As shown, guide rails 26 are horizontally spaced and symmetrically arranged on the upper and lower sides of each threaded rod 25 relative to the two flanges, and the left and right ends of each guide rail 26 are respectively screwed and fixed to the corresponding flanges; a first slider 27 is also sleeved on each threaded rod 25, and the two first sliders 27 are arranged in front and back alignment, each first slider 27 is screwed to the corresponding threaded rod 25, and is respectively connected to the corresponding two guide rails 26 in a horizontal and transverse sliding manner; a lower push brush 29 matching the width of the lower screen plate 10 is also arranged on the lower surface of the two first sliders 27, and the pushing end of the lower push brush 29 is arranged toward the lower screen plate 10 and is connected to the lower screen plate 10. The upper surface of the sieve plate 10 is in contact with the upper surface of the sieve plate 10; an upper pushing brush 28 matching the width of the upper sieve plate 4 is also provided on the upper surfaces of the two first sliding blocks 27, and the pushing end of the upper pushing brush 28 is arranged toward the upper sieve plate 4 and in contact with the lower surface of the upper sieve plate 4; under the drive of the motor 23, the upper pushing brush 28 and the lower pushing brush 29 of the utility model move horizontally with the first sliding block 27 to avoid clogging of the sieve holes of the upper sieve plate 4 and the lower sieve plate 10, and also spread the semiconductor solder balls after the first screening on the lower sieve plate 10, and push the semiconductor solder balls after the screening on the lower sieve plate 10 to the second discharge pipe 11 through the lower pushing brush 29.

[0032] The working principle of the utility model is as follows: first, semiconductor solder balls are added into the housing 1 through the feed pipe 2, and with the cooperation of the first electric push rod 18 and the second electric push rod 19, the semiconductor solder balls are spread on the upper sieve plate 4 for screening through the first push brush 20; after the screening of the semiconductor solder balls on the upper sieve plate 4 is completed, the first push brush 20 is used to push the screened semiconductor solder balls on the upper sieve plate 4 to the first discharge pipe 9 for classification and collection under the cooperation of the first electric push rod 18 and the second electric push rod 19; then, the motor 23 Driven by the motor 23, the semiconductor solder balls that have been screened once are spread on the lower sieve plate 10 for screening by the push-down brush 29, and at the same time, the push-up brush 28 is used to prevent the sieve holes of the upper sieve plate 4 from being blocked; after the screening of the semiconductor solder balls on the lower sieve plate 10 is completed, driven by the motor 23, the push-down brush 29 is used to push the screened semiconductor solder balls on the lower sieve plate 10 to the second discharge pipe 11 for classification and collection, and the semiconductor solder balls that have been double screened are collected to the third discharge pipe 16 through the guide plate 17 for classification and collection.

[0033] Beneficial effects of the utility model:

[0034] (1) The utility model uses the upper sieve plate 4, the first pusher assembly, the lower sieve plate 10 and the second pusher assembly in coordination, which not only facilitates the laying of semiconductor solder balls on the corresponding upper sieve plate 4 and the lower sieve plate 10, thereby improving the screening efficiency, but also avoids the occurrence of sieve hole blockage;

[0035] (2) The utility model realizes the automatic classification and collection of semiconductor solder balls of different particle sizes through the coordinated use of the first pushing component and the second pushing component, which saves time and labor and improves work efficiency;

[0036] (3) The upper sieve plate 4 and the lower sieve plate 10 of the utility model are both connected by a pull-out sliding connection, which is convenient for rapid replacement when the sieve holes are damaged, saving time and effort and improving work efficiency.

[0037] The embodiments described above are merely descriptions of preferred implementation modes of the present invention, and are not intended to limit the concept and scope of the present invention. Without departing from the design concept of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary engineering and technical personnel in the field should fall within the protection scope of the present invention. The technical contents for which protection is sought in the present invention have been fully recorded in the technical requirements.

Claims

1. An electroforming semiconductor solder ball screening device, characterized in that: It includes a shell, a first pusher assembly, an upper screen, a second pusher assembly and a lower screen; the shell is a vertically arranged hollow rectangular structure, and an upper screen plate and a lower screen plate matching it are horizontally and parallelly arranged inside the shell, and the upper screen plate and the lower screen plate are respectively connected to the shell horizontally and laterally in a sliding manner, and are respectively pressed against the left inner side surface of the shell, thereby performing double screening of semiconductor solder balls; a first pusher assembly is arranged inside the shell directly above the upper screen plate, and the semiconductor solder balls are spread flat on the upper screen plate by the first pusher assembly, and the semiconductor solder balls screened on the upper screen plate are collected by the first pusher assembly; a second pusher assembly is also arranged inside the shell between the upper screen plate and the lower screen plate, and the semiconductor solder balls that have been screened once are spread flat on the lower screen plate by the second pusher assembly, and the semiconductor solder balls that have been screened on the lower screen plate are collected by the second pusher assembly.

2. The electroforming semiconductor solder ball screening device according to claim 1, characterized in that: The sieve hole diameter of the upper sieve plate is larger than that of the lower sieve plate, and the difference between the sieve hole diameters is 6 μm; the sieve hole diameter of the upper sieve plate is smaller than the maximum particle size of the semiconductor solder ball, and the sieve hole diameter of the lower sieve plate is larger than the minimum particle size of the semiconductor solder ball.

3. The electroforming semiconductor solder ball screening device according to claim 1, characterized in that: A first fixing block is also horizontally aligned on the right side of the upper sieve plate, and the first fixing block is a rectangular structure matching the upper sieve plate; the left side of the first fixing block is fixedly connected to the right side of the upper sieve plate, and its right side extends horizontally and vertically out of the right outer side of the shell; first limiting plates are also horizontally and symmetrically provided on the upper and lower sides of the first fixing block that exceeds the shell part, each of the first limiting plates is a rectangular structure, and its left end face is vertically fixedly connected to the right outer side of the shell; a first pin is also vertically provided in the middle position of the upper surface of the first limiting plate, and the The lower end of the first pin shaft vertically penetrates the upper first limit plate, the first fixed block and the lower first limit plate in sequence, thereby locking and positioning the horizontal lateral sliding of the upper screen plate; a first sealing gasket is also horizontally fixed at the joint of the first fixed block and the shell, and the first sealing gasket is a hollow rectangular structure matching the first fixed block, and is embedded and fixedly connected to the shell; a first handle is also vertically provided on the right side of the first fixed block, and the first handle and the two first limit plates are arranged without interfering with each other, so that the upper screen plate can be pulled and pulled by the first handle.

4. The electroforming semiconductor solder ball screening device according to claim 1, characterized in that: A second fixing block is also horizontally aligned on the right side of the lower screen plate, and the second fixing block is a rectangular parallelepiped structure matching the lower screen plate; the left side of the second fixing block is fixedly connected to the right side of the lower screen plate, and its right side extends horizontally and vertically out of the right outer side of the shell; second limiting plates are also horizontally and symmetrically provided on the upper and lower sides of the second fixing block that exceeds the shell part, each of the second limiting plates is a rectangular structure, and its left end face is vertically fixedly connected to the right outer side of the shell; a second pin is also vertically provided in the middle position of the upper surface of the second limiting plate, and the The lower end of the second pin shaft vertically penetrates the upper second limit plate, the second fixed block and the lower second limit plate in sequence, thereby locking and positioning the horizontal lateral sliding of the lower screen plate; a second sealing gasket is also horizontally fixed at the joint of the second fixed block and the shell, and the second sealing gasket is a hollow rectangular structure matching the second fixed block, and is embedded and fixedly connected to the shell; a second handle is also vertically provided on the right side of the second fixed block, and the second handle and the two second limit plates are arranged without interfering with each other, so that the lower screen plate can be pulled and pulled by the second handle.

5. The electroforming semiconductor solder ball screening device according to claim 3, characterized in that: The cam is an assembly made of a plurality of threaded rods and a plurality of threaded rods, and the plurality of threaded rods are connected to the plurality of threaded rods, wherein the plurality of threaded rods have the plurality of threaded rods and a plurality of threaded rods connected to the plurality of threaded rods. A third discharge pipe is also obliquely provided on the side near its bottom end and relative to the position below the lower sieve plate, and the right end of the third discharge pipe is obliquely extended upward to the left end of the inner bottom surface of the shell body, and then horizontally extends out of the left inner side surface of the shell body; a guide plate matching it is also obliquely provided inside the shell body relative to directly below the lower sieve plate, and the guide plate is spaced apart from the lower sieve plate and does not interfere with the pulling and pulling action of the lower sieve plate; the right end of the guide plate is fixedly connected to the corresponding position of the right inner side surface of the shell body, and its left end is obliquely arranged downward in the direction of the third discharge pipe, the left end of the upper surface of the guide plate is arranged at the right end of the third discharge pipe near its lower edge, and its inclination angle is smaller than the inclination angle of the third discharge pipe, and the semiconductor solder balls after double screening are collected and collected at the third discharge pipe for classification; pneumatic valves are provided in the first discharge pipe, the second discharge pipe and the third discharge pipe, and the corresponding pneumatic valves are used to control the opening and closing of the first discharge pipe, the second discharge pipe and the third discharge pipe respectively.

6. The electroforming semiconductor solder ball screening device according to claim 5, characterized in that: It also includes a feed pipe and a sealing cover; a feed pipe is obliquely embedded and connected to the left outer side surface of the shell relative to the top of the first discharge pipe, and the lower end of the feed pipe extends obliquely downward to the inside of the shell, and is spaced apart just above the first discharge pipe and does not interfere with the movement of the first pushing assembly; a sealing cover matching the feed pipe is horizontally sleeved on the upper end of the feed pipe, and the two are sealed and screwed, so that the semiconductor solder balls to be screened are added to the inside of the shell through the feed pipe.

7. The electroforming semiconductor solder ball screening device according to claim 5, characterized in that: The first pushing assembly includes a first electric push rod, a second electric push rod, a first pushing brush, a connecting rod, a reinforcing rod and a second sliding block; two first electric push rods are horizontally and laterally screwed together at a front-to-rear interval on the right outer side surface of the shell relative to the upper screen plate, and a reinforcing rod is obliquely provided between the tail of each of the first electric push rods and the right outer side surface of the shell, and the corresponding first electric push rod is reinforced and fixed by the reinforcing rod; each of the first electric push rods has no effect on the disassembly action of the first pin shaft, and the pushing ends of the two first electric push rods move synchronously; the pushing ends of each of the first electric push rods extend horizontally and vertically to the interior of the shell, and are respectively fixedly connected to the tail of the corresponding second electric push rod arranged vertically, thereby driving the second electric push rod to make horizontal and horizontal reciprocating movements inside the shell relative to just above the upper screen plate; in each A connecting rod is also vertically provided at the tail of the second electric push rod, and the upper end of each connecting rod is horizontally and laterally slidably connected to the inner top surface of the shell through a second slider; the pushing end of each second electric push rod is vertically arranged downward, and the pushing ends of the two second electric push rods move synchronously, and a first pushing brush matching the width of the upper sieve plate is longitudinally arranged between the pushing ends of the two second electric push rods, and the fixed ends of the first pushing brush are respectively linked to the pushing ends of the two second electric push rods, and the pushing ends thereof are arranged toward the upper sieve plate and contact with the upper surface of the upper sieve plate, and then through the cooperation of the first electric push rod and the second electric push rod, the first pushing brush performs horizontal and transverse reciprocating movement, and at the same time as the semiconductor solder balls are spread flat on the upper sieve plate, the semiconductor solder balls after screening on the upper sieve plate are pushed to the first discharge pipe through the first pushing brush.

8. The electroforming semiconductor solder ball screening device according to claim 5, characterized in that: The second pushing assembly and the second discharging pipe are arranged without interfering with each other, and have no influence on the pulling and pulling action of the upper sieve plate and the lower sieve plate; the second pushing assembly includes a motor, a coupling, a flange, a threaded rod, a guide rail, a first slider, an upper pushing brush and a lower pushing brush; flanges are vertically symmetrically arranged at left and right intervals between the upper sieve plate and the lower sieve plate inside the shell, and each flange is screwed and fixed to the left and right inner side surfaces of the shell, and is arranged at intervals with the upper sieve plate and the lower sieve plate respectively; threaded rods are horizontally and laterally arranged at intervals in the middle position between the two flanges, and the left ends of the two threaded rods are respectively rotatably connected to the flange on the right side, and the left ends thereof are respectively coaxially linked to the right end of the corresponding coupling, and the left end of each coupling extends horizontally and vertically out of the flange on the left side and the left outer side surface of the shell in sequence, and is respectively linked to the output end of the corresponding motor; the two motors are horizontally and laterally arranged at intervals in front and back, and the actions of the two motors are synchronized, and they are screwed and fixed to the corresponding positions of the left outer side surface of the shell respectively; at the upper and lower positions of each threaded rod Guide rails are also arranged horizontally and spaced apart from each other on both sides of the two flanges, and the left and right ends of each guide rail are respectively screwed and fixed to the corresponding flanges; a first slider is also sleeved on each threaded rod, and the two first sliders are arranged front and back in alignment, each first slider is respectively screwed to the corresponding threaded rod, and is respectively connected to the corresponding two guide rails in a horizontal and transverse sliding manner; a lower push brush matching the width of the lower screen plate is also arranged on the lower surface of the two first sliders, and the pushing end of the lower push brush is arranged toward the lower screen plate. and in contact with the upper surface of the lower sieve plate; an upper pushing brush matching the width of the upper sieve plate is also provided on the upper surfaces of the two first sliding blocks, and the pushing end of the upper pushing brush is arranged toward the upper sieve plate and in contact with the lower surface of the upper sieve plate; driven by the motor, the upper pushing brush and the lower pushing brush move horizontally with the first sliding block to avoid clogging of the sieve holes of the upper sieve plate and the lower sieve plate, and also spread the semiconductor solder balls after the first screening on the lower sieve plate, and push the semiconductor solder balls after the screening on the lower sieve plate to the second discharge pipe through the lower pushing brush.

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