Air gap type thermal switch, inflation device and dilution refrigerator

Abstract

The utility model discloses an air gap type thermal switch, an inflation device and a dilution refrigerator. The air gap type thermal switch comprises a thermal switch body and an adsorption pump communicated with the thermal switch body, and the adsorption pump is filled with an adsorbent; the air charging device comprises a four-way pipe, a first pipe opening of which is communicated with the air charging opening of the thermal switch main body; the pressure monitoring device is communicated with a second pipe orifice of the four-way pipe; the gas tank is communicated with a third pipe opening of the four-way pipe, heat conduction gas is stored in the gas tank, and the first valve is arranged on a communication path of the third pipe opening and the gas tank and used for controlling inflation of the air gap type heat switch. The vacuum pump is communicated with a fourth pipe orifice of the four-way pipe; the second valve is arranged on a communication path of the fourth pipe orifice and the vacuum pump and is used for controlling the air gap type thermal switch to vacuumize; and the sealing device is used for sealing the inflation inlet of the air gap type thermal switch. The inflation device can realize accurate control of the inflation amount of the heat conduction gas, and ensures the stability and consistency of the performance of the air gap type thermal switch.

Description

Technical Field

[0001] The utility model relates to the technical field of quantum computers, in particular to an air gap type thermal switch, an air charging device and a dilution refrigerator. Background Art

[0002] Quantum computers are physical devices that follow the laws of quantum mechanics to perform high-speed mathematical and logical operations, store and process quantum information. The main characteristics of quantum computers are fast operation speed, strong information processing capabilities, and a wide range of applications. Among the many quantum computing technology routes, the superconducting technology route has a very broad prospect, and quantum computers developed based on the superconducting technology route have attracted much attention in the industry.

[0003] The basic unit of superconducting quantum computing is a superconducting quantum chip, which needs to work in an ultra-low temperature environment, about 10mK to 20mK (Kelvins). Ultra-low temperature can effectively reduce the impact of environmental noise on superconducting quantum chips. Ultra-low temperature environment is usually provided by a dilution refrigerator, which uses graded refrigeration technology to form temperature zones with different temperatures. The quantum chip is usually set in the lowest temperature zone of the dilution refrigerator, and the signal source equipment and microwave monitoring equipment for controlling the quantum chip are usually set outside the dilution refrigerator; the different temperature zones in the dilution refrigerator are separated by cold plates, which can effectively reduce the interference of heat transfer between different temperature zones. However, when the quantum chip needs to be taken out, all temperature zones of the dilution refrigerator need to be restored to room temperature, and adjacent cold plates need to be thermally connected here. In addition, during the pre-cooling process of the dilution refrigerator, in order to speed up the pre-cooling speed, adjacent cold plates also need to be thermally connected. After pre-cooling, the thermal connection between the cold plates should be disconnected so that the dilution refrigeration can start working.

[0004] At present, it is commonly used to connect two adjacent cold plates through an air gap thermal switch to achieve thermal connection and thermal separation between the cold plates under different working conditions of the quantum chip. The air gap thermal switch is generally composed of a thermal switch body and an adsorption pump, and the adsorption pump needs to seal a certain amount of heat-conducting gas. When the air gap thermal switch is inflated, if the amount of heat-conducting gas cannot be accurately controlled, it is difficult to ensure the stability of the performance of the air gap thermal switch. At the same time, when the same batch of the same air gap thermal switches are inflated, it is difficult to ensure that the amount of heat-conducting gas filled in the adsorption pump is the same, so it is difficult to ensure the consistency of the performance of the same batch of air gap thermal switches.

[0005] It should be noted that the information disclosed in the background technology section of this application is only intended to deepen the understanding of the general background technology of this application, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Utility Model Content

[0006] The utility model aims to provide an air gap type thermal switch, an air charging device and a dilution refrigerator, wherein the air charging device can realize accurate control of the charging amount of heat-conducting gas to ensure the stability and consistency of the performance of the air gap type thermal switch.

[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0008] The first aspect of the utility model provides an inflation device for an air-gap thermal switch, the air-gap thermal switch comprising a thermal switch body, an adsorption pump connected to the thermal switch body, the adsorption pump being filled with an adsorbent; the characteristic is that the inflation device comprises: a four-way pipe, a first pipe port of which is connected to the inflation port of the thermal switch body; a pressure monitoring device connected to the second pipe port of the four-way pipe; a gas tank for storing heat-conducting gas internally connected to the third pipe port of the four-way pipe, and a first valve for controlling the inflation of the air-gap thermal switch on the communication path between the third pipe port and the gas tank; a vacuum pump connected to the fourth pipe port of the four-way pipe, and a second valve for controlling the vacuuming of the air-gap thermal switch on the communication path between the fourth pipe port and the vacuum pump; a sealing device for sealing the inflation port of the air-gap thermal switch.

[0009] The inflation device of the air gap type thermal switch as described above, further, the first valve includes a fine-tuning valve; and / or, the second valve includes a ball valve or an angle valve; and / or, the sealing device includes one of a manual cold welding pliers, a hydraulic sealing pliers, and an ultrasonic sealing machine; and / or, the pressure monitoring device includes a pressure transmitter.

[0010] The inflation device of the air gap type thermal switch as described above, further, a pressure reducing valve is provided on the communication path between the gas tank and the first valve.

[0011] In the above-mentioned filling device of the air-gap thermal switch, further, the heat-conducting gas includes helium.

[0012] The inflation device of the air gap type thermal switch as described above further comprises a cooling device for cooling the adsorption pump.

[0013] The inflation device of the air gap type thermal switch as described above, further, the cooling device is a tank filled with liquid nitrogen.

[0014] The inflation device of the air gap type thermal switch as described above further includes a controller, which is used to determine the closing time of the first valve during inflation based on the second pressure value monitored by the pressure monitoring device during inflation, and is used to determine the closing time of the second valve during vacuuming based on the first pressure value monitored by the vacuum pump during vacuuming.

[0015] The gas filling device of the air gap type thermal switch as described above, further, the controller comprises:

[0016] A collection module, used for collecting a first pressure value monitored by the pressure monitoring device during vacuuming and a second pressure value monitored by the pressure monitoring device during inflation;

[0017] A judging module, used for judging whether the first pressure value is equal to a preset first threshold value and whether the second pressure value is equal to a preset second threshold value;

[0018] And a control module is used to receive the judgment result of the judgment module and control the closing time of the first valve during inflation and the closing time of the second valve during vacuuming according to the judgment result.

[0019] The second aspect of the utility model provides an air gap type thermal switch, comprising a thermal switch body, an adsorption pump connected to the thermal switch body, and a heater installed on the adsorption pump, wherein the adsorption pump is filled with an adsorbent, and a gap filled with a heat-conducting gas is provided inside the thermal switch body, and the heat-conducting gas is filled into the adsorption pump through the above-mentioned inflation device.

[0020] The third aspect of the utility model provides a dilution refrigerator, comprising a plurality of cold plates, wherein a plurality of the above-mentioned air gap type heat switches are arranged between adjacent cold plates.

[0021] The beneficial effects of the utility model are:

[0022] The inflation device of the present application can effectively inflate the air-gap thermal switch. Specifically, the pipeline, the thermal switch body and the adsorption pump are first evacuated by a vacuum pump, and then the pipeline, the thermal switch body and the adsorption pump are inflated by a gas tank that stores the heat-conducting gas internally. Finally, a sealing device is used to seal the inflation pipeline at the tail of the thermal switch body. By setting a pressure monitoring device, the pressure value of the entire process can be accurately monitored. Since the change in the pressure value is closely related to the charging amount of the heat-conducting gas, the precise control of the charging amount of the heat-conducting gas can be achieved, thereby ensuring the stability and consistency of the performance of the air-gap thermal switch.

[0023] The air-gap thermal switch and the dilution refrigerator provided by the utility model use the above-mentioned inflation device to inflate the air-gap thermal switch therein, and thus have the same beneficial effects, which will not be described in detail herein. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram of the first structure of the inflation device of the air gap type thermal switch provided by the embodiment of the utility model;

[0025] Figure 2A second structural schematic diagram of the inflation device of the air gap type thermal switch provided by the embodiment of the utility model;

[0026] Figure 3 A schematic diagram of the structure of a controller provided in an embodiment of the utility model;

[0027] In the accompanying drawings: 1. thermal switch body; 2. adsorption pump; 3. four-way pipe; 4. gas tank; 5. pressure reducing valve; 6. first valve; 7. second valve; 8. vacuum pump; 9. sealing device; 10. cooling device; 11. pressure monitoring device; 12. controller; 121. acquisition module; 122. judgment module; 123. control module. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application, and cannot be interpreted as limitations on the present application.

[0029] In the description of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0031] Figure 1 A schematic diagram of the first structure of the inflation device of the air gap type thermal switch provided by the utility model embodiment; Figure 1As shown: The embodiment of the present application discloses an inflation device of an air gap type thermal switch, the air gap type thermal switch comprises a thermal switch body 1, an adsorption pump 2 connected to the thermal switch body 1, the adsorption pump 2 is filled with an adsorbent; the inflation device comprises: a four-way pipe 3, a first pipe opening of which is connected to the inflation port of the thermal switch body 1; a pressure monitoring device 11 connected to the second pipe opening of the four-way pipe 3; a gas tank 4 for storing heat-conducting gas internally connected to the third pipe opening of the four-way pipe 3, and a first valve 6 for controlling the inflation of the air gap type thermal switch on the communication path between the third pipe opening and the gas tank 4; a vacuum pump 8 connected to the fourth pipe opening of the four-way pipe 3, and a second valve 7 for controlling the vacuuming of the air gap type thermal switch on the communication path between the fourth pipe opening and the vacuum pump 8; a sealing device 9, used to seal the inflation port of the air gap type thermal switch.

[0032] The gas filling device of the present application can effectively fill the air gap type thermal switch. Specifically, the gas tank 4 and the first valve 6 are closed first, the second valve 7 and the vacuum pump 8 are opened, and the pipeline, the thermal switch body 1 and the adsorption pump 2 are evacuated by the vacuum pump 8. After the vacuum degree meets the requirements, the second valve 7 is closed, the gas tank 4 is opened, and the first valve 6 is slowly opened to fill the adsorption pump 2. The inflation pressure is observed by the pressure monitoring device 11, so that the adsorption pump 2 can effectively adsorb the gas; after the inflation pressure meets the requirements, the first valve 6 is closed, the inflation process is ended, and finally the sealing device 9 is used to seal the inflation pipeline at the tail of the thermal switch body 1. By setting the pressure monitoring device 11, the pressure value of the whole process can be accurately monitored. Since the change of the pressure value is closely related to the charging amount of the heat-conducting gas, the accurate control of the charging amount of the heat-conducting gas can be realized, thereby ensuring the stability and consistency of the performance of the air gap type thermal switch (specifically, by ensuring that the pressure value during the vacuuming process, the inflation process and the sealing process is a certain value, the accurate control of the amount of the heat-conducting gas injection is ensured).

[0033] In some implementations of this embodiment, the first valve 6 includes a fine-tuning valve; by selecting a needle valve as the first valve 6, the flow rate of the inflation can be adjusted very finely, thereby accurately controlling the total amount of the heat-conducting gas charged. Exemplarily, the fine-tuning valve is a needle valve.

[0034] In some implementations of this embodiment, the second valve 7 includes a ball valve or an angle valve; by selecting a ball valve or an angle valve as the second valve 7, complete opening or closing can be achieved quickly.

[0035] In some implementations of this embodiment, the sealing device 9 is one of a manual cold welding pliers, a hydraulic sealing pliers, and an ultrasonic sealing machine.

[0036] In some implementations of this embodiment, the pressure monitoring device 11 is a pressure transmitter. By selecting a pressure transmitter as the pressure monitoring device 11, the pressure change in the air gap thermal switch can be monitored in real time.

[0037] In some implementations of this embodiment, a pressure reducing valve 5 is provided on the communication path between the gas tank 4 and the first valve 6. By providing the pressure reducing valve 5, the pressure at the outlet of the gas tank 4 can be automatically adjusted and stabilized, ensuring that a predetermined working pressure is always maintained in the downstream pipeline of the pressure reducing valve 5.

[0038] In some implementations of this embodiment, the type of heat-conducting gas is not specifically limited, and may be helium, neon, argon or nitrogen. Preferably, the heat-conducting gas is helium, which has good thermal conductivity and can improve heat transfer efficiency.

[0039] In some implementations of this embodiment, the air-gap thermal switch's gas filling device further includes a cooling device 10 for cooling the adsorption pump 2. The provision of the cooling device 10 has the following advantages:

[0040] 1. Improve adsorption efficiency: Lowering the temperature can increase the efficiency of the adsorption pump 2 in adsorbing gas. At lower temperatures, the thermal motion of gas molecules slows down, making it easier to be adsorbed onto the adsorbent surface. The cooling device 10 provides a low temperature environment to make the adsorption process more efficient.

[0041] 2. Increased adsorption capacity: The adsorption capacity of the adsorbent is usually increased by cooling. At lower temperatures, the adsorbent surface can accommodate more gas molecules, so the adsorption capacity of the adsorption pump 2 is increased.

[0042] 3. Increase pump speed: The cooling device 10 also helps to increase the pump speed of the adsorption pump 2. The pump speed refers to the volume of gas that can be pumped per unit time by the adsorption pump 2. Through cooling, the adsorption process is faster, thereby increasing the pump speed.

[0043] 4. Reduce back leakage: The cooling device 10 also helps to reduce back leakage, that is, when the adsorption pump 2 is working, some adsorbed gas molecules are released again. Through the low temperature environment, the problem of back leakage can be minimized.

[0044] In general, placing the adsorption pump 2 in the cooling device 10 helps to improve the adsorption efficiency, adsorption capacity and pumping speed while reducing back leakage.

[0045] In some implementations of this embodiment, the cooling device 10 is a tank filled with liquid nitrogen. Specifically, the adsorption pump 2 is placed in the tank filled with liquid nitrogen to achieve cooling of the adsorption pump 2.

[0046] Figure 2A second structural schematic diagram of the air gap type thermal switch provided by the utility model embodiment; Figure 2 As shown: In some implementations of the present embodiment, the inflation device of the air gap type thermal switch also includes a controller 12, which is used to determine the closing time of the first valve 6 during inflation according to the second pressure value monitored by the pressure monitoring device 11 during inflation, and is used to determine the closing time of the second valve 7 during vacuuming according to the first pressure value monitored by the pressure monitoring device 11 during vacuuming.

[0047] Figure 3 A schematic diagram of the structure of the controller 12 provided in the embodiment of the utility model; Figure 3 As shown: Further, the controller 12 includes: an acquisition module 121, used to acquire the first pressure value monitored by the pressure monitoring device 11 during vacuuming and the second pressure value monitored by the pressure monitoring device 11 during inflation; a judgment module 122, used to judge whether the first pressure value is equal to the preset first threshold value and whether the second pressure value is equal to the preset second threshold value; and a control module 123, used to receive the judgment result of the judgment module 122 and control the closing time of the first valve 6 during inflation and the closing time of the second valve 7 during vacuuming according to the judgment result; specifically, during vacuuming, when the first pressure value is equal to the preset first threshold value, the second valve 7 is closed; during inflation, when the second pressure value is equal to the preset second threshold value, the first valve 6 is closed.

[0048] In addition, after closing the first valve 6 , it is necessary to continue to observe the third pressure value monitored by the pressure monitoring device 11 . When the third pressure value reaches a third threshold value, the sealing device 9 is used to seal the inflation pipeline at the tail of the thermal switch body 1 .

[0049] It should be noted that, after the first valve 6 is closed, the third pressure value monitored by the pressure monitoring device 11 continues to be observed. The reason why the third pressure value changes is that the adsorbent in the adsorption pump 2 adsorbs the heat-conducting gas.

[0050] The determination of the third threshold value and the second threshold value preset in the present application is related to the amount of heat-conducting gas charged in the air-gap thermal switch, and the amount of heat-conducting gas charged is related to the type and weight of the adsorbent in the adsorption pump 2. It is usually determined through a cooling test experiment. Specifically, for air-gap thermal switches of the same type and weight of adsorbent, different amounts of heat-conducting gas are charged; a cooling experiment is performed on the air-gap thermal switch filled with heat-conducting gas. During the cooling process, the air-gap thermal switch can effectively conduct heat exchange, and when it is reduced to a certain specified temperature, the air-gap thermal switch can be disconnected after stopping the heating of the adsorption pump 2. At this time, the amount of heat-conducting gas charged is the amount that meets the requirements. This charge is the difference between the preset second threshold value and the third threshold value. The specified temperature here is the temperature that the cold plate should reach during the pre-cooling stage of the dilution refrigerator.

[0051] Based on the same application concept, an embodiment of the present application also proposes an air gap type thermal switch, comprising a thermal switch body 1, an adsorption pump 2 connected to the thermal switch body 1, and a heater installed on the adsorption pump 2, wherein the adsorption pump 2 is filled with an adsorbent, and a gap filled with a heat-conducting gas is provided inside the thermal switch body 1, and the heat-conducting gas is filled into the adsorption pump 2 through the inflation device of the above-mentioned air gap type thermal switch.

[0052] The specific working principle of the air gap type thermal switch is as follows: when the air gap type thermal switch is applied to a dilution refrigerator, the two ends of the thermal switch body 1 are respectively connected to two adjacent cold plates diluted into the refrigerant; when the heater is heated (the heater is preferably installed on the outer wall of the adsorption pump 2), the temperature of the adsorption pump 2 rises, and the heat-conducting gas adsorbed on the adsorbent (the adsorbent is preferably activated carbon) in the adsorption pump 2 is released and filled into the gap of the thermal switch body 1, thereby realizing the conduction of the air gap type thermal switch; when the heater stops heating, the temperature of the adsorption pump 2 drops, and the adsorbent (the adsorbent is preferably activated carbon) in the adsorption pump 2 adsorbs the heat-conducting gas in the thermal switch body 1, thereby realizing the disconnection of the thermal switch.

[0053] Based on the same application concept, an embodiment of the present application further proposes a dilution refrigerator, comprising a plurality of cold plates, wherein a plurality of the above-mentioned air gap type heat switches are arranged between adjacent cold plates.

[0054] In the description of this specification, the description with reference to the terms "some embodiments" or "examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.

[0055] The above are only preferred embodiments of the present invention and do not limit the present invention in any way. Any technician in the relevant technical field, without departing from the scope of the technical solution of the present invention, may make any equivalent replacement or modification to the technical solution and technical content disclosed in the present invention, which shall be deemed as the content of the technical solution of the present invention and still fall within the protection scope of the present invention.

Claims

1. An air-gap thermal switch inflation device, the air-gap thermal switch comprising a thermal switch body, an adsorption pump connected to the thermal switch body, the adsorption pump being filled with an adsorbent; characterized in that: The inflatable device comprises: A four-way pipe, a first pipe opening of which is connected to the air charging port of the thermal switch body; a pressure monitoring device connected to the second pipe opening of the cross-piece; a gas tank for storing heat-conducting gas inside, which is communicated with the third pipe opening of the four-way pipe, and a first valve on the communication path between the third pipe opening and the gas tank for controlling the inflation of the air-gap thermal switch; a vacuum pump connected to the fourth pipe port of the four-way pipe, and a second valve on the communication path between the fourth pipe port and the vacuum pump for controlling the vacuuming of the air gap type thermal switch; A sealing device is used to seal the air filling port of the air gap type thermal switch.

2. The gas filling device of the air gap type thermal switch according to claim 1, characterized in that: The first valve comprises a fine-tuning valve; And / or, the second valve comprises a ball valve or an angle valve; And / or, the sealing device comprises one of a manual cold welding clamp, a hydraulic sealing clamp, and an ultrasonic sealing machine; And / or, the pressure monitoring device includes a pressure transmitter.

3. The gas filling device of the air gap type thermal switch according to claim 1, characterized in that: A pressure reducing valve is provided on the communication path between the gas tank and the first valve.

4. The gas filling device of the air gap type thermal switch according to claim 1, characterized in that: The heat transfer gas includes helium.

5. The gas filling device of the air gap type thermal switch according to claim 1, characterized in that: A cooling device is also included for cooling the adsorption pump.

6. The gas filling device of the air gap type thermal switch according to claim 5, characterized in that: The cooling device is a tank filled with liquid nitrogen.

7. The gas filling device of the air gap type thermal switch according to claim 1, characterized in that: It also includes a controller for determining the closing time of the first valve during inflation according to the second pressure value monitored by the pressure monitoring device during inflation, and for determining the closing time of the second valve during vacuuming according to the first pressure value monitored by the pressure monitoring device during vacuuming.

8. The gas filling device of the air gap type thermal switch according to claim 7, characterized in that: The controller comprises: A collection module, used for collecting a first pressure value monitored by the pressure monitoring device during vacuuming and a second pressure value monitored by the pressure monitoring device during inflation; A judging module, used for judging whether the first pressure value is equal to a preset first threshold value and whether the second pressure value is equal to a preset second threshold value; And a control module is used to receive the judgment result of the judgment module and control the closing time of the first valve during inflation and the closing time of the second valve during vacuuming according to the judgment result.

9. An air gap thermal switch, characterized in that: It includes a thermal switch body, an adsorption pump connected to the thermal switch body, and a heater installed on the adsorption pump, the adsorption pump is filled with an adsorbent, and a gap filled with a heat-conducting gas is provided inside the thermal switch body. The heat-conducting gas is filled into the adsorption pump through the inflation device described in any one of claims 1 to 8.

10. A dilution refrigerator, characterized in that: It comprises a plurality of cold plates, and a plurality of air gap type heat switches as claimed in claim 9 are arranged between adjacent cold plates.

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