Miniaturized high-voltage ground network short-circuit packaging structure
By designing a miniaturized high-voltage network short-circuit packaging structure, using through-hole PIN and slotted design, the problems of inconvenient debugging, easy damage, easy breakdown and excessive space occupied by the short-circuit packaging design of short-circuit device in the prior art are solved. , realizes more efficient debugging and maintenance, improves lightning protection capabilities, and saves the layout and wiring space of PCB boards.
Patent Information
- Application Number
- CN202420908584.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-28
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-04-28
AI Technical Summary
The packaging design of existing short-connected devices has problems such as inconvenient debugging, easy damage during disassembly, easy breakdown and excessive space consumption.
A miniaturized high-voltage ground network short-connection packaging structure was designed, using through-hole PIN (high-voltage ground network through-hole and earth network through-hole) instead of patch PIN, setting slot and solder-resistant window opening areas, simplifying the debugging process and reducing the Material loss and improve lightning protection capability.
It realizes convenient plug-in and removal of short-connected devices, reduces debugging and maintenance costs, reduces material losses, improves lightning protection capabilities, and makes the short-connected packaging structure smaller, saving the layout and wiring space of PCB boards .
Smart Images
Figure CN222464907U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to a miniaturized high-voltage network short-circuit packaging structure. Background Art
[0002] Printed Circuit Board (PCB), also known as printed circuit board, is an important component of the physical support and signal transmission of electronic products. It not only carries the physical support function of electronic components, but also is responsible for the efficient transmission of signals. Its importance is self-evident.
[0003] In the circuit board high-voltage power supply project, when the voltage in the circuit is too high, some devices in the circuit will be broken down by the voltage, which will burn these devices. In order to avoid this problem, a short-circuit device is usually connected between the ground network of the high-voltage power supply and the earth (PGND) during design. This short-circuit device can be used to lead the high-voltage power supply to the earth better and faster, thereby avoiding burning out the devices in the circuit and reducing economic losses.
[0004] Figure 1 The present invention shows a conventional packaging structure of a short-circuit device. The packaging structure consists of two solder joints. When the circuit voltage is too high, a short-circuit device (such as a 0 ohm resistor, whose size is consistent with the size of the entire packaging structure) is soldered between the two solder joints, so that the high-voltage ground network copper foil (such as -110V) on the PCB board and the earth network copper foil (such as PGND) on the PCB board can be short-circuited together, so that the voltage or current can be discharged to the ground more quickly.
[0005] However, the existing packaging design of short-circuit devices has the following disadvantages:
[0006] 1. Short-circuited components need to be repeatedly welded and disassembled during debugging. Frequent welding and disassembly not only affect the debugging progress, but also may cause unnecessary damage to the circuit board, further reducing the debugging efficiency;
[0007] 2. During the disassembly process, the short-circuited device may be damaged and cannot be used again, thereby increasing material loss. The increase in material loss directly leads to an increase in production costs;
[0008] 3. If the voltage in the circuit is high or affected by external lightning, the short-circuited device is prone to breakdown, causing damage to the device;
[0009] 4. The short-circuit device is too large (at least 20mm*7mm), taking up too much layout and wiring space, which may make the layout and wiring of other components difficult. Utility Model Content
[0010] In order to overcome the problems in the prior art of short-circuit device packaging such as inconvenient operation during debugging, easy material loss during disassembly, easy breakdown and occupying too much layout and wiring space, the utility model provides a miniaturized high-voltage network short-circuit packaging structure.
[0011] The technical solution of the utility model is as follows:
[0012] A miniaturized high-voltage ground network short-circuit packaging structure is applied on a PCB board, comprising a short-circuit packaging body, wherein the short-circuit packaging body comprises a high-voltage ground network through hole arranged on the PCB board for connecting to the high-voltage ground network copper foil and a ground network through hole arranged on the PCB board for connecting to the ground network copper foil, a first solder resist window area is arranged around the high-voltage ground network through hole, a second solder resist window area is arranged around the ground network through hole, and a slot is arranged between the high-voltage ground network through hole and the ground network through hole.
[0013] As a preferred solution of the utility model, the length of the short-circuit package body is 16 mm and the width is 7 mm.
[0014] As a preferred solution of the utility model, the apertures of the high-voltage ground network through holes and the earth network through holes are not less than 3 mm.
[0015] As a preferred solution of the utility model, the apertures of the high-voltage ground network through holes and the earth network through holes are both no larger than 4.2 mm.
[0016] As a preferred solution of the utility model, the center distance between the high-voltage ground network through hole and the earth network through hole is 9.0 mm.
[0017] As a preferred solution of the present invention, the width of the groove is not less than 0.5 mm.
[0018] As a preferred solution of the present invention, the width of the groove is no more than 1 mm.
[0019] As a preferred solution of the present invention, the length of the slot is consistent with the width of the short-circuit package body.
[0020] As a preferred solution of the utility model, the edge of the short-circuit package body, the edge of the high-voltage ground network through hole and the edge of the slot form the first solder resist window area.
[0021] As a preferred solution of the utility model, the edge of the short-circuit package body, the edge of the earth network through hole and the edge of the slot form the second solder resist window area.
[0022] Compared with the prior art, the beneficial effects of the utility model are:
[0023] 1. By changing the solder joints of the short-circuit package structure from the original patch PIN (high-voltage ground network patch solder joints and earth network patch solder joints) to through-hole PIN (high-voltage ground network through-hole and earth network through-hole), the short-circuit device can be plugged and unplugged at will during debugging, and can be taken out in time when not in use, which is very convenient to operate and avoids the problem of material damage caused by repeated welding;
[0024] 2. By making a slot between the two solder joints of the high-voltage ground network through hole and the earth network through hole, the creepage distance between the high-voltage ground at the two solder joints can be met, the distance between the two solder joints can be shortened, and lightning strike protection can be better achieved;
[0025] 3. By setting a first solder resist window area around the high-voltage ground network through hole and a second solder resist window area around the earth network through hole, the copper foil of the two solder joints can be leaked out. When the short-circuit device is installed on the short-circuit package body, it can ensure that the short-circuit device and the copper foil of the two solder joints are in full contact, so as to achieve the purpose of discharging high voltage better and faster, and also facilitate the heat dissipation at the two solder joints;
[0026] 4. The size of the short-circuit package body has been reduced from the original at least 20mm*7mm to 16mm*7mm, which reduces the area and makes the short-circuit package structure more compact, saving space for PCB design layout and wiring. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0028] Figure 1 A schematic diagram of a conventional short-circuit device packaging structure applied to a PCB board;
[0029] Figure 2 This is a schematic diagram of the structure of the utility model applied on a PCB board;
[0030] Figure 3 It is a structural schematic diagram of the utility model.
[0031] In the figure,
[0032] 1. PCB board; 2. High-voltage ground network patch solder joint; 3. Earth network patch solder joint; 4. High-voltage ground network copper foil; 5. Earth network copper foil; 6. Short-circuit package body; 7. High-voltage ground network through hole; 8. Earth network through hole; 9. First solder resist window area; 10. Second solder resist window area; 11. Grooving. DETAILED DESCRIPTION
[0033] In order to make the technical problems, technical solutions and beneficial effects to be solved by the utility model more clearly understood, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. At the same time, it is stated that the embodiments described below are only used to explain the utility model and are not used to limit the utility model.
[0034] It should be noted that the terms "install", "set", "connect", "fix" and the like should be understood in a broad sense. For example, they can be fixedly connected, detachably connected, or integrated; they can be mechanically connected or electrically connected; they can be directly connected or indirectly connected through an intermediate medium; they can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. The indicated orientation or position relationship is based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the application product is usually placed when in use, or the orientation or position relationship commonly understood by those skilled in the art, or the orientation or position relationship in which the application product is usually placed when in use. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. The terms "first" and "second" are only used for the purpose of convenience of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features.
[0035] Figure 1 The present invention shows a conventional package structure of a short-circuit device, which is composed of a high-voltage ground network patch solder joint 2 and a ground network patch solder joint 3. When the circuit voltage is too high, a short-circuit device (such as a 0 ohm resistor, whose size is consistent with the size of the package structure as a whole) is welded between the two solder joints, so that the high-voltage ground network copper foil 4 (such as -110V) on the PCB board 1 and the ground network copper foil 5 (such as PGND) on the PCB board 1 can be short-circuited together, so that the voltage or current can be discharged to the ground more quickly. The length of the package structure is greater than or equal to 20mm, the width is greater than or equal to 7mm, and the distance between the two solder joints is greater than or equal to 7mm.
[0036] However, the packaging design of the above-mentioned short-circuit device has the following problems: 1. The short-circuit device needs to be repeatedly welded and disassembled during debugging. Frequent welding and disassembly not only affects the debugging progress, but also may cause unnecessary damage to the circuit board, further reducing the debugging efficiency; 2. During the disassembly process, the short-circuit device may be damaged, resulting in inability to be used again, thereby increasing material loss, and the increase in material loss directly leads to an increase in production costs; 3. When the voltage in the circuit is high, or affected by external lightning strikes, the short-circuit device is easily broken down, resulting in device damage; 4. The short-circuit device is too large (at least 20mm*7mm), taking up too much layout and wiring space, which may make the layout and wiring of other components difficult.
[0037] In order to solve the above problems, an embodiment of the utility model provides a miniaturized high-voltage ground network short-circuit packaging structure, which is applied on a PCB board 1 .
[0038] See also Figure 1 , Figure 2 The miniaturized high-voltage ground network short-circuit packaging structure includes a short-circuit packaging body 6, which includes a high-voltage ground network through hole 7 arranged on a PCB board 1 for connecting with a high-voltage ground network copper foil 4 and a ground network through hole 8 for connecting with a ground network copper foil 5. A first solder resist window area 9 is arranged around the high-voltage ground network through hole 7, a second solder resist window area 10 is arranged around the ground network through hole 8, and a slot 11 is arranged between the high-voltage ground network through hole 7 and the ground network through hole 8.
[0039] The utility model modifies the soldering points of the short-circuit package structure from the original patch PIN (high-voltage ground network patch soldering point 2 and earth network patch soldering point 3) to through-hole PIN (high-voltage ground network through-hole 7 and earth network through-hole 8), so that the short-circuit device can be plugged and unplugged at will during debugging, and can be taken out in time when not in use, which greatly simplifies the debugging process and improves work efficiency. It also avoids the problem of repeated welding causing material damage and reduces maintenance costs. By making a slot 11 between the two soldering points of the high-voltage ground network through-hole 7 and the earth network through-hole 8, it can not only meet the creepage distance between the high-voltage ground at the two soldering points, but also reduce the distance between the two soldering points, and at the same time better prevent lightning strikes. By setting a first solder resist window area 9 around the high-voltage ground network through hole 7, and setting a second solder resist window area 10 around the ground network through hole 8, the copper foil of the two solder joints can be leaked out. When the short-circuit device is installed on the short-circuit package body 6, it can ensure that the short-circuit device and the copper foil of the two solder joints are fully in contact, and the purpose of discharging high voltage is achieved better and faster, and it can also be beneficial to the heat dissipation at the two solder joints. In addition, such a setting can make the size of the short-circuit package body 6 from the original at least 20mm*7mm to 16mm*7mm (that is, the length of the short-circuit package body 6 is 16mm and the width is 7mm), reducing the area, making the short-circuit package structure more miniaturized, and saving space for PCB design layout and wiring.
[0040] In one embodiment, the apertures of the high-voltage ground network through hole 7 and the earth network through hole 8 are not less than 3mm, and the apertures of the high-voltage ground network through hole 7 and the earth network through hole 8 are not greater than 4.2mm. In addition, the center spacing of the high-voltage ground network through hole 7 and the earth network through hole 8 is 9.0mm. The high-voltage ground network through hole 7 and the earth network through hole 8 set above can not only ensure the stability of the short-circuit device installed on the short-circuit package body 6, but also can further reduce the size of the short-circuit package structure, and realize a more miniaturized design. This is very beneficial for the layout and wiring of the PCB design, can save valuable space resources, and improve the integration and functional density of the PCB board 1.
[0041] In one embodiment, the width of the slot 11 is not less than 0.5 mm, the width of the slot 11 is not greater than 1 mm, and the length of the slot 11 is consistent with the width of the short-circuit package body 6. The slot 11 is provided to meet the high-voltage ground creepage spacing requirements between the high-voltage ground network through hole 7 and the earth network through hole 8. Creepage spacing is an important parameter in electrical design, which determines the minimum distance between two conductors without breakdown at a specific voltage. By controlling the width of the slot 11 between 0.5 mm and 1 mm, the compliance of the creepage spacing can be effectively guaranteed to prevent electrical breakdown under high voltage conditions. At the same time, the design of the slot 11 length being consistent with the width of the short-circuit package body 6 can ensure a more uniform electric field distribution and further improve the stability and reliability of electrical performance.
[0042] See also Figure 3 In one embodiment, the edge of the short-circuit package body 6, the edge of the high-voltage ground network through hole 7 and the edge of the slot 11 form a first solder resist window area 9. The first solder resist window area 9 has the largest area, so that when the short-circuit device is installed on the short-circuit package body 6, the copper foil around the short-circuit device and the high-voltage ground network through hole 7 is fully in contact, so as to achieve the purpose of discharging high voltage better and faster, and also facilitate the heat dissipation at the high-voltage ground network through hole 7.
[0043] See also Figure 3 In one embodiment, the edge of the short-circuit package body 6, the edge of the earth network through hole 8 and the edge of the slot 11 form a second solder resist window area 10. The second solder resist window area 10 has the largest area, so that when the short-circuit device is installed on the short-circuit package body 6, the copper foil around the earth network through hole 8 is fully in contact with the short-circuit device, so as to achieve the purpose of discharging high voltage better and faster, and also facilitate the heat dissipation at the earth network through hole 8.
[0044] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.
[0045] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.
Claims
1. A miniaturized high-voltage network short-circuit packaging structure, applied on a PCB board, characterized in that: It includes a short-circuit package body, which includes a high-voltage ground network through hole arranged on the PCB board for connecting to the high-voltage ground network copper foil and a ground network through hole arranged on the PCB board for connecting to the ground network copper foil, a first solder resist window area is arranged around the high-voltage ground network through hole, a second solder resist window area is arranged around the ground network through hole, and a groove is arranged between the high-voltage ground network through hole and the ground network through hole.
2. The miniaturized high-voltage ground network short circuit packaging structure according to claim 1 is characterized in that: The length of the short-circuit package body is 16 mm and the width is 7 mm.
3. The miniaturized high-voltage ground network short circuit packaging structure according to claim 1 is characterized in that: The apertures of the high-voltage ground network through holes and the earth network through holes are not less than 3 mm.
4. The miniaturized high-voltage ground network short circuit packaging structure according to claim 3 is characterized in that: The apertures of the high-voltage ground network through holes and the earth network through holes are both no larger than 4.2 mm.
5. The miniaturized high-voltage ground network short circuit packaging structure according to claim 1, characterized in that: The center distance between the high-voltage ground network through holes and the earth network through holes is 9.0 mm.
6. The miniaturized high-voltage ground network short circuit packaging structure according to claim 1, characterized in that: The width of the slot is not less than 0.5 mm.
7. The miniaturized high-voltage ground network short circuit packaging structure according to claim 6, characterized in that: The width of the slot is no greater than 1 mm.
8. The miniaturized high-voltage ground network short circuit packaging structure according to claim 1, characterized in that: The length of the slot is consistent with the width of the short-circuit package body.
9. The miniaturized high-voltage ground network short circuit packaging structure according to claim 1, characterized in that: The edge of the short-circuit package body, the edge of the high-voltage ground network through hole and the edge of the slot form the first solder resist window area.
10. The miniaturized high-voltage ground network short circuit packaging structure according to claim 1, characterized in that: The edge of the short-circuit package body, the edge of the ground network through hole and the edge of the slot form the second solder resist window area.