PCB structure capable of preventing liquid leakage of large capacitor from damaging substrate of board

By designing a combined structure of capacitor screen printing, prohibited threading area and silk-print copper skin on the PCB board, the corrosion of PCB board substrate and circuit short circuit caused by liquid leakage of large capacitors is solved, and the stability and reliability of the circuit are significantly improved. sex.

CN222464915UActive Publication Date: 2025-02-11CHANGSHA QUANBO ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202421066558.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-15
Publication Date
2025-02-11
Estimated Expiration
2034-05-15

AI Technical Summary

Technical Problem

Large capacitors may leak liquid in harsh environments, causing corrosion of the substrate of the PCB board, circuit short circuit, and even causing fires.

Method used

A PCB structure is designed, including a containment area formed by capacitance screen printing and a prohibited drilling area. Combined with the isolation effect of the silk screen copper skin, it prevents signal lines and signal holes from being directly arranged under the large capacitor to avoid signals caused by liquid leakage. Short circuit.

Benefits of technology

It effectively prevents the damage of large capacitor liquid leakage to PCB board substrate, reduces signal short circuit and fire risks, and improves the stability and reliability of the circuit.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a PCB structure capable of preventing liquid leakage of a large capacitor from damaging a substrate of a board, comprising a PCB body and a capacitor silk screen arranged on the PCB body, the capacitor silk screen is enclosed to form an accommodating area used for installing the capacitor, a wiring forbidding punching area is arranged in the accommodating area, and the wiring forbidding punching area is arranged on the PCB body. The PCB body is provided with a wiring and punching forbidding area, so that a signal line and a signal hole are forbidden to walk below the large capacitor, the situation of signal short circuit in the PCB body caused by liquid leakage of the large capacitor is avoided, meanwhile, the PCB body is provided with a silk-screen copper sheet, and in the orthographic projection direction of the PCB body, the projection of the wiring and punching forbidding area is located in the projection area of the silk-screen copper sheet. The silk-screen copper sheet can play a role in isolation, not only can isolate and prevent liquid from being in direct contact with a base material in the PCB body, but also can prevent leakage liquid from further damaging surrounding elements and circuits.
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Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and more specifically to a PCB structure which can prevent a large capacitor from leaking liquid and damaging a board substrate. Background Art

[0002] Printed Circuit Board (PCB), also known as printed circuit board, is an important part of the physical support and signal transmission of electronic products. As the core physical support and signal transmission component of modern electronic products, the importance of printed circuit boards is self-evident. PCB boards connect various electronic components such as resistors, capacitors, transistors, etc. through pre-designed circuit patterns to form a complete circuit system, providing electronic products with a stable physical structure and efficient signal transmission capabilities.

[0003] With the continuous evolution of electronic technology, capacitors, as components for storing charge, are increasingly widely used in key areas such as power modules. Large capacitors occupy an important position in circuit design due to their large capacity and strong charge storage capacity. However, as the use time of circuit boards increases, especially under harsh environmental conditions such as high temperature and high humidity, the large capacitors in the board may experience performance degradation. Specifically, the dielectric material of large capacitors will age over time and its performance will gradually decrease. At the same time, in a high temperature environment, the temperature resistance of capacitors is challenged. Once the limit temperature is exceeded, leakage may occur. If the leaked electrolyte is not removed in time, it will directly threaten the safety and stability of the PCB board. On the one hand, the electrolyte will corrode the substrate on the surface of the board and destroy its original physical structure; on the other hand, the electrolyte may invade the wiring on the surface of the substrate, causing circuit short circuits and even fires. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the utility model provides a PCB structure that can prevent large capacitors from leaking and damaging the board substrate, so as to solve the problem that capacitor leakage easily causes the circuit board surface to be damaged.

[0005] The technical solution of the utility model is as follows: A PCB structure that can prevent a large capacitor from leaking and damaging a board substrate, comprising a PCB board body, and a capacitor silk screen arranged on the PCB board body, wherein the capacitor silk screen is arranged to form a housing area for installing the capacitor, a prohibited wiring punching area is arranged in the housing area, and a silk screen copper sheet is arranged on the PCB board body, and in the orthographic projection direction of the PCB board body, the projection of the prohibited wiring punching area is located within the projection area of ​​the silk screen copper sheet.

[0006] Furthermore, a first solder pad and a second solder pad are arranged on the PCB board body, and the first solder pad and the second solder pad are arranged along the width direction of the capacitor silk screen. In the orthographic projection direction of the PCB board body, the projection of the first solder pad and the projection of the second solder pad do not overlap with the silk screen copper skin.

[0007] Furthermore, the first pad and the second pad are of the same shape and size.

[0008] Further, the length of the first solder pad and the length of the second solder pad are both 4.25 mm, and the width of the first solder pad and the width of the second solder pad are both 2.7 mm.

[0009] Furthermore, the area of ​​the prohibited routing perforation region is less than or equal to the area of ​​the silk-screen copper foil.

[0010] Furthermore, the distance between the edge of the silk-screen copper sheet and the edge of the prohibited wiring punching area is less than or equal to 1 mm.

[0011] Furthermore, the length of the prohibited routing perforation area is 11.3 mm, and the width of the prohibited routing perforation area is 11.3 mm.

[0012] The utility model according to the above scheme has the beneficial effect that: the utility model provides a PCB structure that can prevent a large capacitor from leaking and damaging a board substrate, including a PCB board body and a capacitor silk screen arranged on the PCB board body, the capacitor silk screen is surrounded to form a accommodating area for installing the capacitor, and a prohibited routing punching area is arranged in the accommodating area, so as to prohibit the signal line and the signal hole from running under the large capacitor, thereby preventing the large capacitor from leaking and causing a signal short circuit in the PCB board body. At the same time, a silk screen copper sheet is arranged on the PCB board body, and in the positive projection direction of the PCB board body, the projection of the prohibited routing punching area is located in the projection area of ​​the silk screen copper sheet. When the large capacitor leaks, the silk screen copper sheet can play an isolation role, which can not only isolate and prevent the liquid from directly contacting the substrate in the PCB board body, but also prevent the leakage from causing further damage to surrounding components and circuits. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0014] Figure 1This is one of the structural schematic diagrams of a PCB structure that can prevent a large capacitor from leaking and damaging a board substrate in an embodiment of the utility model;

[0015] Figure 2 This is a second structural schematic diagram of a PCB structure that can prevent a large capacitor from leaking and damaging a board substrate in an embodiment of the utility model.

[0016] In the figure, 1. PCB board body; 2. Capacitor silk screen; 3. Prohibited routing and punching area; 4. Silk screen copper foil; 5. First solder pad; 6. Second solder pad;

[0017] W, the width direction of the capacitor silk screen; D, the distance between the edge of the silk screen copper and the edge of the prohibited routing punching area. DETAILED DESCRIPTION

[0018] The following detailed description and drawings of the embodiments of the present invention are used to illustrate the principle of the present invention, but cannot be used to limit the scope of the present invention, that is, the present invention is not limited to the embodiments described.

[0019] In order to better understand the present invention, the present invention is further described below in conjunction with the accompanying drawings and embodiments:

[0020] Signal short circuit refers to the occurrence of a low-impedance path between two or more signal lines in a circuit that should not be connected, resulting in the signal not being transmitted as expected. When a signal short circuit occurs, the normal transmission of the signal line is blocked, which may cause various faults in electronic equipment, such as communication interruption, functional failure, misoperation, etc. Due to the aging and damage of the internal materials of large capacitors or external environmental factors (such as high temperature, vibration, etc.), large capacitors are prone to leakage risks. When large capacitors leak, the electrolyte may overflow and contaminate the surrounding circuit boards and components. This contamination may not only damage the substrate on the surface of the circuit board, but may also cause changes in the resistance value of the local area of ​​the circuit board, thereby changing the path and characteristics of the signal transmission. In addition, leakage may also cause chemical corrosion and electrochemical reactions, further damaging the insulation layer and metal lines of the circuit board, increasing the risk of short circuits.

[0021] Based on this, the present invention provides a PCB structure that can prevent large capacitors from leaking and damaging the board substrate, see Figure 1 and Figure 2As shown, a PCB structure that can prevent a large capacitor from leaking and damaging a board substrate includes a PCB body 1, and a capacitor silk screen 2 arranged on the PCB body 1, the capacitor silk screen 2 is surrounded by a receiving area for installing the capacitor, and a prohibited routing punching area 3 is arranged in the receiving area, and a silk screen copper sheet 4 is arranged on the PCB body 1, and in the orthographic projection direction of the PCB body 1, the projection of the prohibited routing punching area 3 is located in the projection area of ​​the silk screen copper sheet 4.

[0022] Specifically, by providing a capacitor silk screen 2 on the PCB board body 1 and enclosing a housing area for installing the capacitor, and providing a prohibited wiring punching area 3 in the housing area, this design effectively reduces the risk of damage to the PCB board substrate due to leakage of the large capacitor. Due to the existence of the prohibited wiring punching area 3, the signal line and the signal hole will not be arranged directly under the large capacitor, fundamentally avoiding the signal short circuit problem caused by leakage of the large capacitor.

[0023] In this embodiment, a silk-screen copper sheet 4 is provided on the PCB body 1, and its projection area covers the prohibited routing punching area 3, providing an additional isolation layer for the PCB board. When a large capacitor leaks, the silk-screen copper sheet 4 can quickly play an isolation role to prevent the leaked liquid from directly contacting the substrate in the PCB body 1, thereby not only protecting the integrity of the substrate, but also preventing the leakage from causing further damage to surrounding components and circuits.

[0024] Specifically, the embodiment of the utility model provides a PCB structure that can prevent large capacitors from leaking and damaging the board substrate. By combining the prohibited routing perforation area 3 and the silk-screen copper sheet 4, the structural design and layout of the PCB board are optimized, the stability and reliability of the circuit are significantly improved, and the impact of large capacitor leakage on circuit performance is effectively reduced, ensuring the stable operation of the circuit in complex environments. Secondly, the maintenance and replacement costs are also reduced. Since the structure can significantly reduce the risk of equipment damage caused by large capacitor leakage, the maintenance and replacement costs of the equipment are reduced.

[0025] Preferably, the PCB body 1 is provided with a first pad 5 and a second pad 6, which are arranged along the width direction of the capacitor screen 2, and in the orthographic projection direction of the PCB body 1, the projection of the first pad 5 and the projection of the second pad 6 do not overlap with the screen-printed copper skin 4. This design avoids direct coupling or cross-interference of electrical signals, and the physical isolation between the pad and the screen-printed copper skin 4 reduces the electrical interaction between them, thereby improving the stability and reliability of the circuit.

[0026] Preferably, the first pad 5 and the second pad 6 have the same shape and size. Specifically, the length of the first pad 5 and the length of the second pad 6 are both 4.25 mm, and the width of the first pad 5 and the width of the second pad 6 are both 2.7 mm.

[0027] Preferably, the area of ​​the prohibited routing perforation region 3 is smaller than or equal to the area of ​​the silk-screen copper sheet 4 .

[0028] Preferably, the distance between the edge of the silk-screen copper sheet 4 and the edge of the prohibited routing perforation area 3 is less than or equal to 1 mm.

[0029] In this embodiment, if the area of ​​the prohibited routing perforation area 3 is too large, it will affect the space for signal routing when the surface space of the PCB board body 1 is tight. If the area of ​​the prohibited routing perforation area 3 is too small, it will cause some signal lines / signal holes to be laid under the large capacitor, which is easy to cause the risk of signal short circuit or open circuit. Based on this, the length of the prohibited routing perforation area 3 is 11.3mm, and the width of the prohibited routing perforation area 3 is 11.3mm. Specifically, the size of the prohibited routing perforation area 3 is consistent with the size of the large capacitor. Those skilled in the art can also adjust the size of the prohibited routing perforation area 3 according to the size of the physical installation area of ​​other types of large capacitors. The length of the prohibited routing perforation area 3 and the width of the prohibited routing perforation area 3 are not limited to the above-mentioned dimensions. This design can prevent signal lines / signal holes, etc. from entering under the large capacitor, and prevent the signal lines / signal holes from corroding when the large capacitor leaks, causing signal short circuit or open circuit.

[0030] The indicated orientation or position relationship is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the product of the application is usually placed when used, or the orientation or position relationship commonly understood by technical personnel in this field, or the orientation or position relationship in which the product of the application is usually placed when used. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0031] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

[0032] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A PCB structure that can prevent large capacitors from leaking and damaging the board substrate, characterized in that: The invention comprises a PCB body (1), and a capacitor screen (2) arranged on the PCB body (1), wherein the capacitor screen (2) surrounds a receiving area for installing a capacitor, wherein a prohibited wiring punching area (3) is arranged in the receiving area, and a screen-printed copper sheet (4) is arranged on the PCB body (1), and in the orthographic projection direction of the PCB body (1), the projection of the prohibited wiring punching area (3) is located within the projection area of ​​the screen-printed copper sheet (4).

2. A PCB structure capable of preventing a large capacitor from leaking and damaging a board substrate as claimed in claim 1, characterized in that: A first solder pad (5) and a second solder pad (6) are provided on the PCB body (1); the first solder pad (5) and the second solder pad (6) are provided along the width direction of the capacitor screen printing (2); in the orthographic projection direction of the PCB body (1), the projection of the first solder pad (5) and the projection of the second solder pad (6) do not overlap with the screen printing copper sheet (4).

3. A PCB structure capable of preventing a large capacitor from leaking and damaging a board substrate as claimed in claim 2, characterized in that: The first soldering pad (5) and the second soldering pad (6) are of the same shape and size.

4. A PCB structure capable of preventing a large capacitor from leaking and damaging a board substrate as claimed in claim 2, characterized in that: The length of the first solder pad (5) and the length of the second solder pad (6) are both 4.25 mm, and the width of the first solder pad (5) and the width of the second solder pad (6) are both 2.7 mm.

5. A PCB structure capable of preventing a large capacitor from leaking and damaging a board substrate as claimed in claim 1, characterized in that: The area of ​​the prohibited routing perforation area (3) is less than or equal to the area of ​​the silk-screen copper sheet (4).

6. A PCB structure capable of preventing a large capacitor from leaking and damaging a board substrate as claimed in claim 1, characterized in that: The distance between the edge of the silk-screen copper sheet (4) and the edge of the prohibited wiring perforation area (3) is less than or equal to 1 mm.

7. A PCB structure capable of preventing a large capacitor from leaking and damaging a board substrate as claimed in claim 1, characterized in that: The length of the prohibited wiring perforation area (3) is 11.3 mm, and the width of the prohibited wiring perforation area (3) is 11.3 mm.