Diamond fretsaw

By twisting the tungsten wire with alloy steel in the matrix layer of the diamond wire saw and covering the surface with carbon fiber powder, it enhances its strength and wear resistance, and fixes the diamond particles through the resin layer and electroplating layer, the diamond wire saw is solved at a high level. The problem of easy breaking during load cutting achieves higher cutting force and durability.

CN222470943UActive Publication Date: 2025-02-14HENAN CHENFA SURFACE TREATMENT CO LTD
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Patent Information

Application Number
CN202420856352.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-23
Publication Date
2025-02-14
Estimated Expiration
2034-04-23

AI Technical Summary

Technical Problem

During the high-speed rotation and high-load cutting process of existing diamond wire saws, the wire rope is prone to tiny cracks and gradually expands, which eventually leads to fatigue and fracture.

Method used

The strength and wear resistance of the substrate layer are enhanced by twisting the tungsten wire with alloy steel and covering the surface with carbon fiber powder. At the same time, the diamond particles are fixed by using resin layer, electroplating layer and electroplating layer to prevent them from falling off.

Benefits of technology

Improves cutting power and durability of the wire saw, avoids breakage of the wire saw, and reduces the risk of falling off of diamond particles.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a diamond fretsaw, which belongs to the technical field of diamond fretsaws and comprises a substrate layer, the substrate layer comprises alloy steel and tungsten filaments, the tungsten filaments and the alloy steel are twisted, an electroplated layer I is arranged on the outer surface of the substrate layer, a resin layer is arranged on the outer surface of the electroplated layer I, and diamond particles are uniformly laid on the resin layer. The outer surfaces of the diamond particles are provided with second electroplated layers, and the protruding ends of the diamond particles are located on the outer surfaces of the second electroplated layers. According to the utility model, the fretsaw can bear larger cutting force, so that the condition that the fretsaw is broken is avoided, and meanwhile, the falling of diamond particles is reduced.
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Description

Technical Field

[0001] The utility model relates to the technical field of diamond wire saws, in particular to a diamond wire saw. Background Art

[0002] A diamond wire saw is a cutting tool that uses diamond particles as the cutting edge and is fixed to a metal wire (usually a high-strength steel wire) through an electroplating process or resin bonding.

[0003] The existing diamond wire saw uses steel wire as the base layer. However, during the high-speed rotation and high-load cutting process of the steel wire, the steel wire is repeatedly subjected to tensile, bending and torsional stresses, which can easily generate tiny cracks that gradually expand and eventually lead to fatigue fracture. Utility Model Content

[0004] In view of this, the utility model provides a diamond wire saw, which can enable the wire saw to withstand a greater cutting force, avoid the wire saw from breaking, and reduce the shedding of diamond particles.

[0005] In order to solve the above technical problems, the utility model provides a diamond wire saw, including a base layer, the base layer includes alloy steel and tungsten wire, the tungsten wire and the alloy steel are twisted, an electroplating layer 1 is provided on the outer surface of the base layer, a resin layer is provided on the outer surface of the electroplating layer 1, diamond particles are evenly laid on the resin layer, an electroplating layer 2 is provided on the outer surface of the diamond particles, and the protruding ends of the diamond particles are located on the outer surface of the electroplating layer 2; that is, by uniformly twisting the alloy steel and the tungsten wire, the strength and wear resistance between the alloy steel and the tungsten wire are enhanced, so that the wire saw can withstand a greater cutting force and avoid fatigue fracture, and then the electroplating layer 2 and the resin layer can well wrap the diamond particles to prevent them from falling during cutting.

[0006] The base layer includes carbon fiber powder, and the outer surfaces of the tungsten wire and the alloy steel are covered with the carbon fiber powder; that is, the wear resistance of the base layer is enhanced.

[0007] The diameter of the base layer is 0.1 mm to 0.15 mm, that is, the flexibility and cutting performance of the wire saw are maintained.

[0008] The thickness of the second electroplating layer is greater than that of the first electroplating layer, which can ensure that the diamond particles are better fixed and protected, thereby improving the overall performance and life of the diamond wire saw.

[0009] The particle size of the diamond particle layer is 10 microns to 18 microns; that is, the particle size of the diamond particle layer can be better laid on the base layer.

[0010] The materials of the first and second electroplating layers are nickel or chromium, which improves the cutting effect, durability and stability of the diamond wire saw.

[0011] In summary, compared with the prior art, the present application includes at least one of the following beneficial technical effects:

[0012] 1. Twist the tungsten wire and alloy steel evenly, then evenly coat the tungsten wire and alloy steel with carbon fiber powder, and then heat press or sinter them. This can enhance the bonding force between the carbon fiber powder and the matrix layer, making them more closely combined, indirectly improving the strength and wear resistance, allowing the wire saw to withstand greater cutting force, and avoiding wire saw breakage.

[0013] 2. The diamond particles can be effectively fixed by the resin layer, the first electroplating layer and the second electroplating layer, thereby reducing the shedding of the diamond particles. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the structure of a diamond wire saw of the utility model.

[0015] Figure 2 It is a structural schematic diagram of the base layer of the utility model.

[0016] Description of reference numerals:

[0017] 100, substrate layer; 101, alloy steel; 102, tungsten wire; 103, carbon fiber powder;

[0018] 200, electroplating layer 1; 201, resin layer; 202, electroplating layer 2; 203, diamond particles; DETAILED DESCRIPTION

[0019] In order to make the purpose, technical scheme and advantages of the embodiment of the utility model clearer, the following will be combined with the appended drawings of the embodiment of the utility model. Figure 1-2 , the technical scheme of the embodiment of the utility model is clearly and completely described. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the described embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the utility model.

[0020] like Figure 1-2As shown: This embodiment provides a diamond wire saw, including a base layer 100, the base layer 100 includes an alloy steel 101 and a tungsten wire 102, the tungsten wire 102 and the alloy steel 101 are twisted, and multiple tungsten wires 102 and the alloy steel 101 are evenly wound. The alloy steel provides good rigidity and strength to ensure the stability of the wire saw during the cutting process. The twisted arrangement of the tungsten wire 102 and the alloy steel further enhances the strength and wear resistance of the base layer 100, so that the wire saw can withstand greater cutting force and avoid the wire saw from breaking. The electroplating layer 200 on the outer surface of the base layer 100 protects the base layer 100 from corrosion and wear. The outer surface of the electroplating layer 200 is provided with a resin layer 201, and the resin layer 201 is evenly laid with diamond particles 203. The outer surface of the electroplating layer 200 is coated with the resin layer 201, and the resin layer 201 has good adhesion and can well adhere the diamond particles 203, thereby improving the wear resistance and impact resistance of the wire saw. The outer surface of the diamond particles 203 is provided with an electroplating layer 202, and the protruding end of the diamond particles 203 is located on the outer surface of the electroplating layer 202. The electroplating layer 202 can reduce the shedding of the diamond particles 203.

[0021] like Figure 2 As shown,

[0022] The base layer 100 includes carbon fiber powder 103. The outer surfaces of the tungsten wire 102 and the alloy steel 101 are covered with the carbon fiber powder 103. The carbon fiber powder 103 is evenly coated on the tungsten wire 102 and the alloy steel 101, and is processed by hot pressing or sintering. The bonding force between the carbon fiber powder 103 and the base layer 100 can be enhanced, so that they are more closely combined. The fiber powder provides an additional reinforcement effect for the base layer 100 with its light weight and high strength characteristics;

[0023] The diameter of the base layer 100 is 0.1 mm to 0.15 mm, which can ensure that the diamond particles 203 are evenly distributed on the wire saw, and can take into account both manufacturing costs and cutting performance while ensuring strength and rigidity;

[0024] The thickness of the second electroplating layer 202 is greater than the thickness of the first electroplating layer 200, thereby reducing the shedding of the diamond particles 203;

[0025] The particle size of the diamond particle 203 layer is 10 microns to 18 microns, and the diamond particles 203 can provide sufficient hardness and wear resistance;

[0026] The materials of the electroplating layer 1 200 and the electroplating layer 202 are nickel or chromium, which improves the bonding force, strength and wear resistance of the diamond wire saw;

[0027] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0028] The above is a preferred embodiment of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A diamond wire saw, characterized in that: The invention comprises a base layer (100), wherein the base layer (100) comprises alloy steel (101) and tungsten wire (102), wherein the tungsten wire (102) and the alloy steel (101) are twisted and arranged, and an electroplating layer (200) is arranged on the outer surface of the base layer (100), wherein the outer surface of the electroplating layer (200) is provided with a resin layer (201), wherein diamond particles (203) are evenly spread on the resin layer (201), and an electroplating layer (202) is arranged on the outer surface of the diamond particles (203), and the protruding ends of the diamond particles (203) are located on the outer surface of the electroplating layer (202).

2. A diamond wire saw according to claim 1, characterized in that: The base layer (100) comprises carbon fiber powder (103), and the outer surfaces of the tungsten wire (102) and the alloy steel (101) are covered with the carbon fiber powder (103).

3. A diamond wire saw as claimed in claim 2, characterized in that: The base layer (100) has a diameter of 0.1 mm to 0.15 mm.

4. A diamond wire saw as claimed in claim 3, characterized in that: The thickness of the second electroplating layer (202) is greater than the thickness of the first electroplating layer (200).

5. A diamond wire saw as claimed in claim 4, characterized in that: The particle size of the diamond particle (203) layer is 10 microns to 18 microns.

6. A diamond wire saw as claimed in claim 5, characterized in that: The materials of the electroplating layer 1 (200) and the electroplating layer 2 (202) are nickel or chromium.