Detection device and equipment provided with same

By designing a detection device including a stage, a probe and a control component, the existing chip's low resistivity detection efficiency and high error rate are solved, and automated detection is realized, which improves detection efficiency and accuracy.

CN222482332UActive Publication Date: 2025-02-14TIANJIN HUANBO SCI & TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202323638808.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-29
Publication Date
2025-02-14
Estimated Expiration
2033-12-29

AI Technical Summary

Technical Problem

The existing chip resistivity detection methods are inefficient, have high error rates, and rely on the proficiency of the operator.

Method used

A detection device is designed, including a stage, a probe and a control assembly. The stage is used to place the measured part, and the probe is used to detect the plane of the measured part. The control component automatically adjusts the position of the measured part through the rotating table, the lifting table and the transverse tray to make the probe come into contact with different measured positions and obtain different Test data.

Benefits of technology

Automatic detection is realized, the detection efficiency and accuracy is improved, the error rate is reduced, and personnel interference is not required, ensuring the accuracy of the test position and the reproducibility of the results.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN222482332U_ABST
    Figure CN222482332U_ABST
Patent Text Reader

Abstract

A detection device is provided with a carrying platform used for placing a detected piece; the probe is used for detecting the plane of the measured piece so as to measure data; the control assembly is provided with a lower assembly connected with the carrying table and an upper assembly connected with the probe; and the lower assembly can control the position of the carrying table to drive the tested piece to move when the tested piece is configured on the carrying table, so that the probe is in contact with different tested positions in the tested piece to obtain different test data. The device is simple in structure and easy to operate, manual interference is not needed, and the stress uniformity and stability of the probe can be adjusted by controlling the balance weight piece; the position of the tested piece is adjusted through the multi-axis rotating table, so that the test position is accurate, the test result is accurate, and the reproducibility is good in a detection mode that the tested piece moves and the probe is immobile; meanwhile, a special adsorption structure is arranged to fix the tested piece, so that the placement stability of the tested piece is improved, and the test precision is improved. The utility model further provides equipment provided with the detection device.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present application belongs to the field of wafer detection technology, and in particular, relates to a detection device and equipment equipped with the detection device. Background Art

[0002] The existing wafer resistivity test is generally done manually, first marking the test point on the surface of the silicon wafer, then operating the probe contact by hand, and then recording the data and manually entering the calculation. This method is inefficient, has a high error rate, and depends on the proficiency of the operator. Summary of the invention

[0003] The present application provides a detection device and equipment equipped with the detection device, which solves the technical problems of low detection efficiency and high error rate caused by manual detection in the prior art.

[0004] In order to solve at least one of the above technical problems, the technical solution adopted in this application is:

[0005] A detection device, comprising:

[0006] A stage, used to place the test piece;

[0007] The probe is used to detect the plane of the measured object to measure data;

[0008] A control component, comprising a lower component connected to the carrier, and an upper component connected to the probe;

[0009] When the tested object is arranged on the carrier, the lower component can control the position of the carrier to drive the tested object to move, so that the probe contacts different tested positions in the tested object to obtain different test data.

[0010] Furthermore, the carrier includes an upper surface, on which a plurality of adsorption holes for adsorbing the test piece are configured, and the adsorption holes are arranged at the center of the upper surface and radiate outwards.

[0011] Furthermore, a plurality of placement areas are arranged in the upper table, and all the placement areas are arranged concentrically;

[0012] Preferably, the adsorption holes are arranged in the innermost placement area.

[0013] Furthermore, the carrier is also provided with a lower table surface matched with the upper table surface, and the lower table surface is detachably connected to the upper table surface, and a gap is arranged between the lower table surface and the upper table surface.

[0014] Furthermore, the lower assembly includes a rotating platform and a lifting platform, wherein:

[0015] The rotating platform is connected to the carrier via a rotating shaft and is located below the carrier;

[0016] The rotating platform is arranged on the top of the lifting platform;

[0017] The lifting motor disposed on the side of the lifting platform can drive the lifting platform to drive the rotating platform and the carrier to move up and down to adjust the height of the measured object so that the plane of the measured object contacts the probe.

[0018] Furthermore, it also includes a transverse frame and a transverse slide rail, wherein:

[0019] The transverse moving frame is arranged below the rotating table and connected to the rotating table;

[0020] The transverse movement frame is arranged on a mounting plate placed on the transverse movement slide rail, and the mounting plate is connected to the transverse movement motor;

[0021] The transverse motor drives the transverse frame to move along the transverse slide rail to adjust the position of the carrier so that the tested object is arranged below the probe.

[0022] Furthermore, the upper assembly includes a fixing block, a stand, and an adjustment plate, wherein:

[0023] The probe is fixed on the fixing block and connected to the stand through the adjusting plate;

[0024] The upper section of the probe is connected to the stand;

[0025] Preferably, the fixing block, the probe and the adjustment plate are all arranged on the same side of the stand.

[0026] Furthermore, a plurality of elongated holes and a plurality of circular holes are arranged on the stand. The elongated holes are arranged along the width direction of the stand and are located at the lower section of the stand. The circular holes are arranged at the upper section of the stand and are arranged vertically.

[0027] Furthermore, a counterweight block is provided on the top of the probe, and the counterweight block is connected to the probe through a mounting column;

[0028] Preferably, a temperature detector for monitoring the surface temperature of the measured object is also provided on the lower end surface of the probe.

[0029] A device is provided with the detection device as described above.

[0030] A detection device designed by the present application has a simple structure and is easy to operate without human intervention. The uniformity and stability of the force on the probe can be adjusted by controlling the counterweight. The position of the tested object can be adjusted by a multi-axis rotating table, so that the tested object moves while the probe does not move, ensuring the precise test position, accurate test results and good reproducibility. At the same time, a special adsorption structure is set to fix the tested object to improve its placement stability and improve the test accuracy. The present application also proposes a device equipped with the detection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a structural schematic diagram of a detection device according to an embodiment of the present application;

[0032] Figure 2 is a three-dimensional diagram of the cooperation between the carrier and the lower component in one embodiment of the present application;

[0033] Figure 3 is a top view of the cooperation between the carrier and the lower component in one embodiment of the present application;

[0034] Figure 4 This is a three-dimensional diagram of the cooperation between the probe, the upper assembly and the carrier before testing in one embodiment of the present application;

[0035] Figure 5 This is a three-dimensional diagram of the cooperation between the probe, the upper assembly and the carrier during the test of an embodiment of the present application.

[0036] In the figure:

[0037] 10. Carrier 11. Upper table 12. Lower table

[0038] 13. Adsorption hole 20, probe 30, upper assembly

[0039] 31. Stand 32. Fixing block 33. Counterweight

[0040] 40. Lower assembly 41. Rotating table 42. Lifting table

[0041] 43. Lifting motor 44. Transverse frame 45. Transverse slide rail

[0042] 46. ​​Transverse motor 47. Mounting plate DETAILED DESCRIPTION

[0043] The present application is described in detail below with reference to the accompanying drawings and specific embodiments.

[0044] This embodiment provides a detection device, such as Figure 1As shown, there is a stage 10 for placing a DUT, a probe 20 for detecting the plane of the DUT to measure data, and a control component for controlling the stage 10 and the probe 20 respectively. The control component includes a lower component 40 connected to the stage 10 and an upper component 30 connected to the probe 20. The upper component 30 fixes the position of the probe 20, and the lower component 40 enables the stage 10 to rotate axially, move up and down, and move laterally relative to the position of the probe 20 to adjust the position of the DUT relative to the probe 20. When the DUT is configured on the stage 10, the lower component 40 can control the position of the stage 10 to drive the DUT to move, so that the probe 20 makes point contact with different measured positions in the DUT to obtain different test data. In this embodiment, the DUT can be a round wafer, a square wafer, or a rectangular piece, and its drawings are omitted.

[0045] During the detection process, the probe 20 is fixed and the position of the DUT is adjusted only by the lower component 40, so that the position of the DUT can be automatically adjusted, and the DUT is brought into contact with the probe 20, so as to adjust the position of the DUT according to the preset test track, and perform multi-point contact test on the DUT to obtain the electrical performance parameter data of the DUT, such as resistivity. When testing the resistivity, it is only necessary to control the position of the probe 20 to remain fixed, and by adjusting the position of the wafer to rotate or move along the route of the preset test track, the automatic detection can be completed, or the corresponding data can be obtained.

[0046] like Figure 2 As shown, the carrier 10 includes an upper table 11 and a lower table 12 stacked up and down, and the structures of the upper table 11 and the lower table 12 are adapted to each other, and preferably, both are disc-shaped structures. Among them, the upper table 11 is made of PEEK material with better thermal conductivity, which can better adjust the temperature of the wafer surface to a suitable detection temperature, so that the probe 20 can detect more accurate data.

[0047] The lower table 12 and the upper table 11 are detachably connected by a connecting rod, and there is a gap between the lower table 12 and the upper table 11, so that the vacuum suction tube can pass through the gap between the upper table 11 and the lower table 12 and communicate with the adsorption hole 13. A plurality of adsorption holes 13 for adsorbing the test piece are arranged on the upper table 11. The adsorption holes 13 are arranged at the center of the upper table 11 and radiate outward. The adsorption holes 13 can adsorb the test piece so that its position is fixed during detection. The outer shape structure of the adsorption holes 13 can be a polygonal structure or a concentric ring structure, which is not specifically limited here.

[0048] like Figure 2As shown, several placement areas are also configured in the upper table 11, all of which are configured concentrically, and all adsorption holes 13 are also configured in the innermost placement area. The placement area can be a circular structure, a square structure, or a rectangular structure. Regardless of the structure of the placement area, the center of the circumscribed circle or the inscribed circle is the same, so that the device under test is placed in the placement area and is configured concentrically with the placement area. Furthermore, wafers of different sizes can be placed on the horizontally placed carrier 10, so that it can be compatible with devices under test of different sizes, which can not only improve the detection efficiency, but also improve the accuracy and utilization of the detection.

[0049] Furthermore, the lower component 40 includes a rotating table 41, a lifting platform 42, and a transverse frame 44, wherein the rotating table 41 is connected to the lower end surface of the carrier 10 through a rotating shaft and is located directly below the carrier 10; the rotating table 41 is arranged on the top of the lifting platform 42; the transverse frame 44 is constructed below the rotating table 41 and is connected to the rotating table 41 through the lifting platform 42.

[0050] The rotating table 41 is a structure driven by a built-in motor. The rotating shaft drives the carrier 41 to rotate by controlling the rotation of the rotating shaft, thereby adjusting the position of the measured point on the test piece placed on the carrier 41 and being vacuum-adsorbed. Therefore, under the condition that the position of the probe 20 remains unchanged, the rotation direction of the test piece can be changed to make the probe 20 touch different positions on the same radial circle.

[0051] The top of the lifting platform 42 is fixed on the lower end surface of the rotating platform 41, and a lifting motor 43 is provided on its side for driving the lifting platform 42 to move up and down. When the lifting motor 43 hits the lifting frame in the lifting platform 43, it can drive the lifting frame to move upward; when the lifting motor 43 leaves the lifting frame in the lifting platform 43, the lifting frame moves downward. The lifting motor 43 drives the lifting platform 42 to drive the rotating platform 41 and the carrier 20 to move up and down together to adjust the height of the measured object so that the plane of the measured object is in point contact with the probe 20.

[0052] The lower end surface of the lifting platform 42 is fixed to the upper end surface of the traverse frame 44, a mounting plate 47 for fixing the traverse frame 44 is provided on the traverse slide rail 45, and a traverse motor 46 is provided at the end of the traverse slide rail 45, and the mounting plate 47 is connected to the output end of the traverse motor 46. The traverse motor 46 drives the traverse frame 44 to move along the length direction of the traverse slide rail 45 to adjust the position of the carrier 10 so that the measured object is arranged below the probe 20.

[0053] like Figure 4-5As shown, the upper assembly 30 includes a fixed block 32, a stand 31, and an adjustment plate, wherein the probe 20 is fixed on the fixed block 32 and connected to the stand 31 through the adjustment plate. The stand 31 is vertically arranged and connected to the upper section of the probe 20 through bolts. The adjustment plate can be a sliding plate, which is embedded in the interior of the fixed block 32 (omitted in the drawings), and the fixed block 32 is fixed to the stand 31 through a connecting piece. In order to ensure the convenience of installing the probe 20, the fixed block 32, the probe 20 and the adjustment plate are all arranged on the same side of the stand 31.

[0054] Furthermore, a plurality of elongated holes and a plurality of circular holes are arranged on the stand 31. The elongated holes are arranged along the width direction of the stand 31 and are located at the lower section of the stand 31, and are used to fix the fixing block 32 and the adjustment plate. The circular holes are arranged at the upper section of the stand 31 and are arranged vertically, and are used to fix the stand 31 on the arm beam, that is, to fix the stand 31, so that the probe 20 is suspended and arranged directly above the carrier 10.

[0055] Furthermore, a counterweight block 33 is provided on the top of the probe 20, and the counterweight block 33 is connected to the probe 20 through a mounting column. The counterweight block 33 can ensure that the probe 20 is subjected to uniform and stable force during the detection process, so as to improve the accuracy and consistency of the detection of the probe 20. At the same time, a temperature detector (omitted in the figure) for monitoring the surface temperature of the test piece is also provided on the lower end surface of the probe 20, which can monitor the temperature on the surface of the wafer, and then perform the next step of the probe 20 detection based on the measured temperature value to obtain an accurate electrical performance parameter value, namely resistivity, so as to ensure the accuracy and safety of the measured electrical parameter data.

[0056] Before each test, the automatic calibration function is enabled, and the lens placed above the stage 10 is used to shoot the position of the table 11 on the stage 10, and obtain its center position, and calculate its positioning center based on the algorithm, and then the distance value between the center of the circle of the tested object (or the center of the inscribed circle / circumscribed circle) and the center of the circle on the stage 10 is fed back to the loading robot, and the robot automatically adjusts the position of the tested object on the stage 10, repeating the above actions until the center of the tested object completely coincides with the center of the upper table 11 on the stage 10, and the automatic alignment is completed. Then turn on the vacuum system to allow the tested wafer to be vacuum-adsorbed on the stage 10.

[0057] Then, the position of the carrier 10 is adjusted by controlling the lateral movement frame 44 and the rotating table 41, and the position of the detected point needs to be located directly below the probe 20. Then the lifting motor 43 is notified to control the lifting platform 42 to lift up, so that the upper surface of the wafer of the tested piece is in stable contact with the probe 20, and the point contact detection is started. And by controlling the lifting platform 42 and the rotating table 41, the position of the tested point of the tested piece is adjusted, and the point contact test can be performed multiple times and in multiple positions to obtain the electrical performance parameters of the chip. After the detection is completed, the lateral movement motor 46 is controlled to move the wafer of the tested piece back to the transfer tray. Not only can multi-contact detection be performed repeatedly, but there is no need to manually enter data. It is not only efficient and has a low error rate, but also has high detection accuracy and a high degree of automation. It is also highly adaptable and can be promoted to detect other electrical performance parameters.

[0058] A device is provided with the detection device as described above.

[0059] A detection device designed by the present application has a simple structure and is easy to operate without human intervention. The uniformity and stability of the force on the probe can be adjusted by controlling the counterweight. The position of the tested object can be adjusted by a multi-axis rotating table, so that the tested object moves while the probe does not move, ensuring the precise test position, accurate test results and good reproducibility. At the same time, a special adsorption structure is set to fix the tested object to improve its placement stability and improve the test accuracy. The present application also proposes a device equipped with the detection device.

[0060] The above detailed description of the embodiments of the present application is only a preferred embodiment of the present application and cannot be considered to limit the scope of implementation of the present application. All equivalent changes and improvements made within the scope of the present application should still fall within the scope of the patent coverage of the present application.

Claims

1. A detection device, characterized in that: have: A stage, used to place the test piece; The probe is used to detect the plane of the measured object to measure data; A control component, comprising a lower component connected to the carrier, and an upper component connected to the probe; When the tested object is arranged on the carrier, the lower component can control the position of the carrier to drive the tested object to move, so that the probe contacts different tested positions in the tested object to obtain different test data.

2. A detection device according to claim 1, characterized in that: The carrier comprises an upper surface, on which a plurality of adsorption holes for adsorbing the test piece are arranged. The adsorption holes are arranged at the center of the upper surface and radiate outward.

3. A detection device according to claim 2, characterized in that: A plurality of placement areas are also arranged in the upper table surface, and all the placement areas are arranged concentrically.

4. A detection device according to claim 3, characterized in that: The adsorption holes are arranged in the innermost placement area.

5. A detection device according to any one of claims 2 to 4, characterized in that: The carrier is also provided with a lower table surface matched with the upper table surface. The lower table surface is detachably connected to the upper table surface, and a gap is formed between the lower table surface and the upper table surface.

6. A detection device according to claim 1, characterized in that: The lower assembly includes a rotating platform and a lifting platform, wherein: The rotating platform is connected to the carrier via a rotating shaft and is located below the carrier; The rotating platform is arranged on the top of the lifting platform; The lifting motor disposed on the side of the lifting platform can drive the lifting platform to drive the rotating platform and the carrier to move up and down to adjust the height of the measured object so that the plane of the measured object contacts the probe.

7. A detection device according to claim 6, characterized in that: It also includes a transverse frame and a transverse slide rail, wherein: The transverse moving frame is arranged below the rotating table and connected to the rotating table; The transverse movement frame is arranged on a mounting plate placed on the transverse movement slide rail, and the mounting plate is connected to the transverse movement motor; The transverse motor drives the transverse frame to move along the transverse slide rail to adjust the position of the carrier so that the tested object is arranged below the probe.

8. A detection device according to any one of claims 1-4, 6-7, characterized in that: The upper assembly includes a fixed block, a stand, and an adjustment plate, wherein: The probe is fixed on the fixing block and connected to the stand through the adjusting plate; The upper section of the probe is connected to the stand.

9. A detection device according to claim 8, characterized in that: The fixing block, the probe and the adjusting plate are all arranged on the same side of the stand.

10. A detection device according to claim 9, characterized in that: A plurality of elongated holes and a plurality of circular holes are arranged on the stand. The elongated holes are arranged along the width direction of the stand and are located at the lower section of the stand. The circular holes are arranged at the upper section of the stand and are arranged vertically.

11. A detection device according to any one of claims 1-4, 6-7, 9-10, characterized in that: A counterweight block is also provided on the top of the probe, and the counterweight block is connected to the probe through a mounting column.

12. A detection device according to claim 11, characterized in that: A temperature detector for monitoring the surface temperature of the measured object is also provided on the lower end surface of the probe.

13. A device, characterized in that: The invention is provided with a detection device as described in any one of claims 1 to 12.