High-power chip resistor
By using a combination of a lateral ceramic heat dissipation substrate and a heat dissipation unit in a high-power chip resistor, the problem of poor heat dissipation inside the chip resistor is solved, and the effect of efficient heat dissipation and extended service life is achieved.
Patent Information
- Application Number
- CN202323151050.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-22
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2033-11-22
AI Technical Summary
The existing high-power chip resistors cannot spread rapidly due to the inability to spread internal heat, resulting in a low service life, especially the high-power type.
The combination of lateral ceramic heat dissipation substrate and heat dissipation unit is adopted, including a frame made of metal thermally conductive material, a ceramic heat insulation film and thermal strips, to achieve efficient heat dissipation through these components.
Maintain the efficient heat dissipation of the chip resistor to the greatest extent, thereby extending its service life and maintaining performance.
Smart Images
Figure CN222483040U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of electronic components, in particular to a high-power chip resistor. Background Art
[0002] Chip resistors, also known as chip fixed resistors, are a type of metal glass glaze resistors. They are made by mixing metal powder and glass glaze powder and printing them on a substrate using a screen printing method. They have the advantages of moisture resistance and a small temperature coefficient, and can greatly save circuit space costs. However, during the use of most existing chip resistors, since the inside of the chip resistor is in a sealed state, the heat generated inside the chip resistor during operation cannot be quickly diffused, which can easily cause damage to the inside of the chip resistor, resulting in a short service life of the chip resistor, especially for high-power chip resistors. Therefore, the utility model proposes a high-power chip resistor, which adopts a combination of a lateral ceramic heat dissipation substrate + a heat dissipation unit to maximize the chip resistor's efficient heat dissipation, thereby maintaining its performance. Utility Model Content
[0003] The purpose of the utility model is to provide a high-power chip resistor to solve the problems raised in the above background technology.
[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high-power chip resistor, the resistor unit has a resistor body and a ceramic heat dissipation substrate, the ceramic heat dissipation substrate is connected to both sides of the resistor body, and a heat dissipation unit is arranged outside the ceramic heat dissipation substrate; the heat dissipation unit has a frame, a spacer and a heat dissipation fin, wherein a plurality of frames are provided and connected front to back, a plurality of frames are fixedly connected to the side of the ceramic heat dissipation substrate, a notch is opened in the middle of each frame, and a heat dissipation fin is arranged inside each frame.
[0005] Preferably, the frame is made of a metal thermally conductive material, and a graphene thermally conductive coating is provided on a connecting surface between the frame and the ceramic heat dissipation substrate.
[0006] Preferably, the spacer is arranged between two adjacent frames, and the spacer is a ceramic thermal insulation film.
[0007] Preferably, the heat sink comprises a heat sink seat, heat sink blocks and heat conducting strips, wherein a plurality of heat sink blocks are arranged in an array on the upper end surface of the heat sink seat, and a plurality of heat conducting strips are connected to the outer side of the heat sink seat.
[0008] Preferably, the thermally conductive strip is in an S shape, and the end of the thermally conductive strip away from the heat sink is attached to the inner side of the frame through a thermally conductive sheet.
[0009] Compared with the prior art, the beneficial effects of the utility model are:
[0010] The utility model adopts a combination of a lateral ceramic heat dissipation substrate and a heat dissipation unit, which can maximize the efficient heat dissipation of the chip resistor, thereby maintaining the performance of the chip resistor. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 The structure of the utility model is shown in FIG. Figure 1 ;
[0012] Figure 2 The structure of the utility model is shown in FIG. Figure 2 ;
[0013] Figure 3 It is a structural schematic diagram of the heat dissipation unit of the utility model.
[0014] In the figure: 1. resistor body; 2. ceramic heat dissipation substrate; 3. frame; 4. spacer; 5. heat sink; 501. heat sink; 502. heat sink block; 503. thermal conductive strip. DETAILED DESCRIPTION
[0015] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0016] In the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0017] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0018] See also Figure 1-3The utility model provides a technical solution: a high-power chip resistor, including a resistor unit and a heat dissipation unit, wherein the resistor unit has a resistor body 1 and a ceramic heat dissipation substrate 2, the ceramic heat dissipation substrate 2 is connected to both sides of the resistor body 1, and the heat dissipation unit is arranged outside the ceramic heat dissipation substrate 2; the heat dissipation unit has a frame 3, a spacer 4 and a heat dissipation sheet 5, wherein a plurality of frames 3 are provided and connected front to back, and a plurality of frames 3 are fixedly connected to the side of the ceramic heat dissipation substrate 2, a notch 301 is opened in the middle of each frame 3, and a heat dissipation sheet 5 is arranged inside each frame 3.
[0019] In this embodiment, the frame 3 is made of a metal heat-conducting material, and a graphene heat-conducting coating is provided on the connection surface between the frame 3 and the ceramic heat-dissipating substrate 2 .
[0020] In this embodiment, the spacer 4 is disposed between two adjacent frames 3 , and the spacer 4 is a ceramic heat insulation film.
[0021] In this embodiment, the heat sink 5 includes a heat sink 501 , a heat sink block 502 and a thermally conductive strip 503 , wherein a plurality of heat sink blocks 502 are arranged in an array on the upper end surface of the heat sink 501 , and a plurality of thermally conductive strips 503 are connected to the outer side of the heat sink 501 .
[0022] In this embodiment, the heat conducting bar 503 is in an S shape, and the end of the heat conducting bar 503 away from the heat sink 501 is attached to the inner side of the frame 3 through a heat conducting sheet.
[0023] In this embodiment, a combination of a lateral ceramic heat dissipation substrate 1 and a heat dissipation unit is used to maximize the efficient heat dissipation of the chip resistor, thereby maintaining the performance of the chip resistor.
[0024] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A high-power chip resistor, characterized in that: The invention comprises a resistor unit and a heat dissipation unit, wherein the resistor unit comprises a resistor body (1) and a ceramic heat dissipation substrate (2), wherein the ceramic heat dissipation substrate (2) is connected to both sides of the resistor body (1), and the heat dissipation unit is arranged outside the ceramic heat dissipation substrate (2); the heat dissipation unit comprises a frame (3), a spacer (4) and a heat dissipation sheet (5), wherein a plurality of frames (3) are provided and connected front to back, the plurality of frames (3) are fixedly connected to the side of the ceramic heat dissipation substrate (2), a notch (301) is opened in the middle of each frame (3), and a heat dissipation sheet (5) is arranged inside each frame (3).
2. A high-power chip resistor according to claim 1, characterized in that: The frame (3) is made of a metal heat-conducting material, and a graphene heat-conducting coating is provided on the connection surface between the frame (3) and the ceramic heat-dissipating substrate (2).
3. A high-power chip resistor according to claim 1, characterized in that: The spacer (4) is arranged between two adjacent frames (3), and the spacer (4) is a ceramic heat insulation film.
4. A high-power chip resistor according to claim 1, characterized in that: The heat sink (5) comprises a heat sink (501), a heat sink block (502) and a heat conducting strip (503), wherein a plurality of heat sink blocks (502) are arranged in an array on the upper end surface of the heat sink (501), and a plurality of heat conducting strips (503) are connected to the outer side of the heat sink (501).
5. A high-power chip resistor according to claim 4, characterized in that: The heat conducting strip (503) is in an S shape, and the end of the heat conducting strip (503) away from the heat sink (501) is attached to the inner side of the frame (3) via a heat conducting sheet.