Inductance device, power module and battery system

Abstract

The utility model provides an inductance device, a power module and a battery system. The inductance device comprises a shell and at least one inductance piece, the shell comprises a first sub-shell and a second sub-shell which are oppositely arranged and connected, a flow guide space is defined by the first sub-shell and the second sub-shell, the flow guide space is used for containing cooling liquid, and the first sub-shell is provided with a liquid inlet and a liquid outlet which are communicated with the flow guide space; cooling liquid flows into the diversion space through the liquid inlet and then flows out through the liquid outlet, a containing groove is formed in the surface, deviating from the first sub-shell, of the second sub-shell in a concave mode, at least one inductance piece is arranged in the containing groove, and the diversion space is arranged around the inductance piece. According to the inductance device, the diversion space surrounding the inductance piece is arranged in the shell, liquid cooling heat dissipation on the periphery of the inductance piece is achieved, the heat dissipation efficiency of the inductance device can be improved, heat radiation of the inductance piece can be prevented, and the stability of the power module is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of inductor devices, and specifically relates to inductor devices, power modules and battery systems. Background Art

[0002] At present, the high-power technology route of fuel cells is being applied in more and more scenarios, such as ships, rail transit, distributed power generation, energy storage and other fields. In order to meet the application scenarios of high-power output, the high-current and high-power technology route of its output poses increasing challenges and reliability to the power module in the fuel cell. As the core component of the power module, the inductor device usually adopts a water-cooled radiator installed at the bottom of the inductor device, but the heat dissipation effect of such a setting is poor. The inductive heat radiation of the inductor device will also affect other electronic components inside the power module, increase the ambient temperature inside the power module, reduce the stability of the power module and shorten the service life of the power module. Utility Model Content

[0003] In view of this, the first aspect of the present application provides an inductor device, which includes a shell and at least one inductor component. The shell includes a first sub-shell and a second sub-shell that are arranged opposite to each other and connected. The first sub-shell and the second sub-shell are arranged to form a guide space, and the guide space is used to accommodate a coolant. The first sub-shell has a liquid inlet and a liquid outlet connected to the guide space. The coolant flows into the guide space through the liquid inlet and then flows out through the liquid outlet. A accommodating groove is recessed on the surface of the second sub-shell facing away from the first sub-shell. The at least one inductor component is arranged in the accommodating groove, and the guide space is arranged around the inductor component.

[0004] The inductor device provided in the first aspect of the present application includes a housing and an inductor. The housing is composed of a first sub-housing and a second sub-housing, and the inductors are all arranged in the receiving groove of the second sub-housing. The first sub-housing and the second sub-housing form a guide space for receiving cooling liquid, and the guide space surrounds the inductor, and can perform liquid cooling and heat dissipation on the inductor around, thereby improving the heat dissipation efficiency of the inductor device. The guide space can also prevent the heat radiation of the inductor and improve the stability of the power module.

[0005] In addition, the coolant flows in through the liquid inlet and flows out through the liquid outlet, which can reduce the sealing area of ​​the shell and further improve the reliability of the inductor device. In addition, the liquid inlet and the liquid outlet can make the coolant circulate in the shell, so that the heat in the coolant can be taken away from the inductor device in time, thereby further improving the heat dissipation efficiency.

[0006] Therefore, the present application achieves liquid cooling around the inductor by setting up a flow guide space around the inductor in the shell, which not only improves the heat dissipation efficiency of the inductor device, but also prevents heat radiation of the inductor and improves the stability of the power module.

[0007] The first subshell includes a first peripheral side wall and a first bottom wall bent and connected to the first peripheral side wall, and the second subshell includes a second peripheral side wall opposite to the first peripheral side wall and a second bottom wall bent and connected to the second peripheral side wall and opposite to the first bottom wall;

[0008] The flow guide space includes a first flow guide cavity and a second flow guide cavity that are connected to each other. The first flow guide cavity is formed between the first peripheral side wall and the second peripheral side wall. The second flow guide cavity is formed between the first bottom wall and the second bottom wall. The first bottom wall has the liquid inlet and the liquid outlet.

[0009] Wherein, the shell also includes at least one partition, and the at least one partition is arranged on the cavity wall of the second guide cavity, and the partition is used to divide the second guide cavity into a plurality of guide channels connected in sequence, so that the coolant flows along a preset direction.

[0010] Among them, the multiple guide channels include a first guide channel, a second guide channel, and a third guide channel which are connected in sequence, the first guide channel also connects the liquid inlet and a part of the first guide cavity, the second guide channel corresponds to the second bottom wall, and the third guide channel also connects the liquid outlet and another part of the first guide cavity.

[0011] Wherein, the shell further includes at least one flow detent, and the at least one flow detent is arranged on the cavity wall of the second flow guide cavity, and the flow detent is used to change the flow parameters of the coolant.

[0012] Wherein, the inductor device also includes a circuit board electrically connected to the inductor, the circuit board has an inductor input terminal and an inductor output terminal, and the circuit board is arranged on the side of the inductor away from the bottom of the accommodating groove; at least one conductive member is arranged on the side of the circuit board away from the inductor, and the conductive member is used to conduct current on the circuit board.

[0013] The second aspect of the present application provides a power module, which includes a shell and an inductor device as provided in the first aspect of the present application, wherein the shell has a receiving space, and the inductor device is arranged in the receiving space, and the shell also has a first heat dissipation space connected to the liquid inlet, and a second heat dissipation space connected to the liquid outlet; the coolant located in the first heat dissipation space flows to the guide space through the liquid inlet, and then flows to the second heat dissipation space through the liquid outlet.

[0014] The power module provided in the second aspect of the present application adopts the inductor device provided in the first aspect of the present application, and sets a flow guide space around the inductor in the shell of the inductor device to achieve liquid cooling on all sides of the inductor. This not only improves the heat dissipation efficiency of the inductor device, but also prevents heat radiation from the inductor, thereby improving the stability of the power module.

[0015] Wherein, the power module further includes two sealing rings, one of which is arranged at the connection between the liquid inlet and the shell, and the other of which is arranged at the connection between the liquid outlet and the shell.

[0016] The first subshell has a mounting hole, and the mounting hole is used to accommodate a screw connecting the inductive device and the housing.

[0017] A third aspect of the present application provides a battery system, which includes a battery stack and a power module as provided in the second aspect of the present application, wherein the battery stack is electrically connected to the power module.

[0018] The battery system provided in the third aspect of the present application, by adopting the power module provided in the second aspect of the present application, sets a flow guide space around the inductor in the shell of the inductor device to achieve liquid cooling on all sides of the inductor, which not only improves the heat dissipation efficiency of the inductor device, but also prevents heat radiation of the inductor, thereby improving the stability of the power module. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the implementation modes of the present application, the drawings required for use in the implementation modes of the present application will be described below.

[0020] Figure 1 A schematic diagram of the structure of an inductor device provided in one embodiment of the present application.

[0021] Figure 2 A schematic structural diagram of an inductor device provided in one embodiment of the present application from another perspective.

[0022] Figure 3 An exploded diagram of the structure of an inductor device provided in one embodiment of the present application.

[0023] Figure 4 This is a structural explosion diagram of the inductor device provided in one embodiment of the present application from another perspective.

[0024] Figure 5 A schematic diagram of the structure of an inductive device with a portion of the shell removed provided in one embodiment of the present application.

[0025] Figure 6 A cross-sectional schematic diagram of an inductor device provided in one embodiment of the present application.

[0026] Figure 7 A schematic diagram of the structure of a power module provided in one embodiment of the present application.

[0027] Figure 8 A schematic structural diagram of a housing provided in one embodiment of the present application.

[0028] Fig. 9 A schematic structural diagram of a power module from another perspective provided in one embodiment of the present application.

[0029] Fig.10 A schematic structural diagram of a housing from another perspective provided in one embodiment of the present application.

[0030] Description of reference numerals: inductor device 1, housing 11, first sub-shell 111, first peripheral side wall 1111, first bottom wall 1112, annular groove 1113, mounting hole 1114, second sub-shell 112, second peripheral side wall 1121, second bottom wall 1122, liquid inlet 113, liquid outlet 114, accommodating groove 115, inductor 12, flow guiding space 13, first flow guiding cavity 131, second flow guiding cavity 132, first flow guiding channel 1321, second flow guiding channel 13 22, first sub-guiding channel-1322a, second sub-guiding channel-1322b, third guiding channel-1323, partition-14, flow bypass member-15, circuit board-16, inductor input terminal-161, inductor output terminal-162, conductive member-163, sealing ring-17, power module-2, housing-21, accommodating space-211, protrusion-212, first heat dissipation space-221, second heat dissipation space-222, liquid inlet pipe-223, liquid outlet pipe-224, guiding member-225. DETAILED DESCRIPTION

[0031] The following are preferred implementations of the present application. It should be noted that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application, and these improvements and modifications are also considered to be within the scope of protection of the present application.

[0032] Unless otherwise specified or there is a contradiction, the terms and phrases used in this application have the following meanings:

[0033] In this application, "first", "second", etc. are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0034] In this application, "one or several" refers to any one, any two or more of the listed items. Among them, "several" refers to any two or more of the listed items.

[0035] In the present application, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0036] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated. It can be mechanically connected or electrically connected. It can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0037] Please refer to Figure 1-Figure 6 , Figure 1 A schematic diagram of the structure of an inductor device provided in one embodiment of the present application. Figure 2 A schematic structural diagram of an inductor device provided in one embodiment of the present application from another perspective. Figure 3 An exploded diagram of the structure of an inductor device provided in one embodiment of the present application. Figure 4 This is a structural explosion diagram of the inductor device provided in one embodiment of the present application from another perspective. Figure 5 A schematic diagram of the structure of an inductive device with a portion of the shell removed provided in one embodiment of the present application. Figure 6 A cross-sectional schematic diagram of an inductor device provided in one embodiment of the present application.

[0038] The present embodiment provides an inductor device 1, which includes a housing 11 and at least one inductor 12. The housing 11 includes a first sub-housing 111 and a second sub-housing 112 that are arranged opposite to each other and connected to each other. The first sub-housing 111 and the second sub-housing 112 are arranged to form a guide space 13. The guide space 13 is used to accommodate a cooling liquid. The first sub-housing 111 has a liquid inlet 113 and a liquid outlet 114 that are connected to the guide space 13. The cooling liquid flows into the guide space 13 through the liquid inlet 113 and then flows out through the liquid outlet 114. A receiving groove 115 is concavely provided on a surface of the second sub-housing 112 that is away from the first sub-housing 111. The at least one inductor 12 is arranged in the receiving groove 115. The guide space 13 is arranged around the inductor 12.

[0039] The inductor device 1 provided in this embodiment includes a housing 11 for heat dissipation and carrying an inductor 12. The housing 11 includes a first sub-shell 111 and a second sub-shell 112. The surface of the first sub-shell 111 facing away from the second sub-shell 112 forms the outer surface of the housing 11. The surface of the second sub-shell 112 facing away from the first sub-shell 111 is provided with a receiving groove 115, and a gap is provided between part of the first sub-shell 111 and part of the second sub-shell 112, so that a flow guiding space 13 is formed between the first sub-shell 111 and the second sub-shell 112. The first sub-shell 111 is also provided with a liquid inlet 113 and a liquid outlet 114 connected to the liquid guiding space. Optionally, the liquid inlet 113 and the liquid outlet 114 are provided on the bottom wall of the first sub-shell 111. Optionally, the liquid inlet 113 and the liquid outlet 114 are provided on the side wall of the first sub-shell 111. Optionally, the coolant can be water, liquid nitrogen, ethylene glycol, etc.

[0040] The inductor device 1 provided in this embodiment also includes an inductor 12. Optionally, the number of the inductors 12 can be 1-15, and further optionally, the number of the inductors 12 is 8. A plurality of inductors 12 are interconnected to form an inductor assembly. The inductors 12 are all arranged in the accommodating groove 115. The flow guide space 13 is arranged around the inductor 12. Optionally, the flow guide space 13 surrounds the peripheral side surface of the inductor 12. Optionally, the flow guide space 13 surrounds the peripheral side surface and the bottom surface of the inductor 12. Optionally, the flow guide space 13 surrounds the peripheral side surface, the bottom surface, and the top surface of the inductor 12.

[0041] Specifically, the first sub-shell 111 and the second sub-shell 112 form a guide space 13 for accommodating cooling liquid. The guide space 13 surrounds the inductor 12 and can perform liquid cooling on the inductor 12 to improve the heat dissipation efficiency of the inductor device 1. The guide space 13 can also prevent heat radiation from the inductor 12 to improve the stability of the power module 2.

[0042] Furthermore, the coolant flows in through the liquid inlet 113 and flows out through the liquid outlet 114, which can reduce the sealing area of ​​the housing 11 and further improve the reliability of the inductor device 1. Furthermore, the liquid inlet 113 and the liquid outlet 114 can allow the coolant to circulate in the housing 11, so that the heat in the coolant can be taken away from the inductor device 1 in time, thereby further improving the heat dissipation efficiency.

[0043] Therefore, in this embodiment, a flow guide space 13 surrounding the inductor 12 is provided in the shell 11 to achieve liquid cooling around the inductor 12, which not only improves the heat dissipation efficiency of the inductor device 1, but also prevents heat radiation of the inductor 12 and improves the stability of the power module 2.

[0044] The inductor device 1 provided in this embodiment, when the inductor 12 and the liquid cooling radiator meet the installation specifications, the liquid cooling radiator is designed to be enveloping according to the shape of the inductor. In other words, a flow guide space 13 is provided in the housing 11 to achieve liquid cooling and heat dissipation around the inductor 12, prevent heat radiation of the inductor 12, improve the stability of the power module 2, and extend the service life of the power module 2. In addition, the inductor device 1 can be used as a standard part for multiple times.

[0045] Please refer to Figure 1-Figure 6 In one embodiment, the first sub-shell 111 includes a first circumferential side wall 1111 and a first bottom wall 1112 bent and connected to the first circumferential side wall 1111, and the second sub-shell 112 includes a second circumferential side wall 1121 opposite to the first circumferential side wall 1111 and a second bottom wall 1122 bent and connected to the second circumferential side wall 1121 and opposite to the first bottom wall 1112.

[0046] The guide space 13 includes a first guide cavity 131 and a second guide cavity 132 that are connected to each other. The first guide cavity 131 is formed between the first circumferential side wall 1111 and the second circumferential side wall 1121. The second guide cavity 132 is formed between the first bottom wall 1112 and the second bottom wall 1122. The first bottom wall 1112 has the liquid inlet 113 and the liquid outlet 114.

[0047] The first sub-shell 111 is sleeved in the second sub-shell 112. The first sub-shell 111 includes a first circumferential side wall 1111 and a first bottom wall 1112, and the first circumferential side wall 1111 and the first bottom wall 1112 form the outer surface of the housing 11. The second sub-shell 112 includes a second circumferential side wall 1121 and a second bottom wall 1122, and the second circumferential side wall 1121 and the second bottom wall 1122 are arranged to form a receiving groove 115. The first circumferential side wall 1111 surrounds the second circumferential side wall 1121, and the first bottom wall 1112 and the inductor 12 are arranged on opposite sides of the second bottom wall 1122. The end of the first circumferential side wall 1111 away from the first bottom wall 1112 is connected to the end of the second circumferential side wall 1121 away from the second bottom wall 1122.

[0048] A first flow guide cavity 131 is formed between the first circumferential side wall 1111 and the second circumferential side wall 1121, and the first flow guide cavity 131 surrounds the circumferential side surface of the inductor 12. A second flow guide cavity 132 is formed between the first bottom wall 1112 and the second bottom wall 1122, and the second flow guide cavity 132 is arranged on the bottom surface of the inductor 12, so the flow guide space 13 surrounds the circumferential side surface and the bottom surface of the inductor 12. Specifically, the coolant flows into the first flow guide cavity 131 and the second flow guide cavity 132 through the liquid inlet 113, and then flows out through the liquid outlet 114. In addition, the first flow guide cavity 131 is connected to the second flow guide cavity 132, and the coolant in the first flow guide cavity 131 and the coolant in the second flow guide cavity 132 can circulate with each other.

[0049] Therefore, in this embodiment, by setting a first guide cavity 131 and a second guide cavity 132 around the inductor 12, the guide space 13 surrounds the peripheral side surface and the bottom surface of the inductor 12, thereby further realizing liquid cooling of the inductor 12 on all sides. This can not only further improve the heat dissipation efficiency of the inductor device 1, but also further prevent the heat radiation of the inductor 12, thereby improving the stability of the power module 2.

[0050] Please refer to Figure 1-Figure 6 In one embodiment, the shell 11 also includes at least one partition 14, and the at least one partition 14 is arranged on the cavity wall of the second guide cavity 132. The partition 14 is used to divide the second guide cavity 132 into a plurality of guide channels connected in sequence, so that the coolant flows along a preset direction.

[0051] The shell 11 provided in this embodiment also includes a partition 14, which is used to divide the second guide cavity 132 into multiple guide channels. The partition 14 can also be understood as a partition plate. Optionally, the partition 14 is arranged on at least one of the first bottom wall 1112 and the second bottom wall 1122. Optionally, one end of the partition 14 is connected to the first bottom wall 1112, and the other end is connected to the second bottom wall 1122. Multiple partitions 14 are arranged at intervals from each other. For example, a guide channel is formed between two adjacent partitions 14. For another example, a guide channel is formed between the partition 14 and the first peripheral side wall 1111. Optionally, the partition 14 and the second subshell 112 are an integrated structure. Optionally, one guide channel is bent to connect to another guide channel.

[0052] In this embodiment, the second flow guiding cavity 132 is divided into a plurality of flow guiding channels by providing a partition 14 , thereby extending the flow path of the coolant in the housing 11 , increasing the contact area between the housing 11 and the coolant, and further improving the heat dissipation efficiency of the inductor device 1 .

[0053] Please refer to Figure 1-Figure 6In one embodiment, the multiple guide channels include a first guide channel 1321, a second guide channel 1322, and a third guide channel 1323 which are connected in sequence, the first guide channel 1321 also connects the liquid inlet 113 and a part of the first guide cavity 131, the second guide channel 1322 corresponds to the second bottom wall 1122, and the third guide channel 1323 also connects the liquid outlet 114 and another part of the first guide cavity 131.

[0054] The plurality of guide channels provided in this embodiment include a first guide channel 1321, a second guide channel 1322, and a third guide channel 1323. The first guide channel 1321 is formed by the first bottom wall 1112, the second bottom wall 1122, the first peripheral side wall 1111, and the partition 14. The second guide channel 1322 is formed by the first bottom wall 1112, the second bottom wall 1122, and the partition 14. The third guide channel 1323 is formed by the first bottom wall 1112, the second bottom wall 1122, the first peripheral side wall 1111, and the partition 14. The first guide channel 1321 and the third guide channel 1323 are arranged around the second guide channel 1322.

[0055] Optionally, the second guide channel 1322 includes a first sub-guide channel 1322a and a second sub-guide channel 1322b that are bent and connected, the first sub-guide channel 1322a connects the first guide channel 1321 and the second sub-guide channel 1322b, and the second sub-guide channel 1322b connects the first sub-guide channel 1322a and the third guide channel 1323. Further optionally, the separator 14 is also provided at the cavity wall of the first sub-guide channel 1322a close to the first guide channel 1321, for diverting the cooling liquid from the first guide channel 1321. Further optionally, the separator 14 is also provided at the cavity wall of the second sub-guide channel 1322b close to the third guide channel 1323, for diverting the cooling liquid flowing to the third guide channel 1323.

[0056] Specifically, the coolant flows into the first guide channel 1321 from the liquid inlet 113, and the coolant in the first guide channel 1321 flows to part of the first guide cavity 131 and the second guide channel 1322, and the coolant in part of the first guide cavity 131 can flow to the second guide channel 1322. The coolant in the second guide channel 1322 flows to another part of the first guide cavity 131 and the third guide channel 1323. The coolant in the third guide channel 1323 and another part of the first guide cavity 131 then flows out from the liquid outlet 114. The flow direction of the coolant is as shown in FIG. Figure 5 As shown in the direction D1.

[0057] In this embodiment, the partition 14 cooperates with the first sub-shell 111 to set the first guide channel 1321, the second guide channel 1322, and the third guide channel 1323, so that the first guide cavity 131 and the third guide cavity are also connected to the first guide channel 1321, thereby strengthening the connection between the first guide channel 1321 and the second guide channel 1322, further extending the flow path of the coolant in the shell 11, and further increasing the contact area between the shell 11 and the coolant, thereby further improving the heat dissipation efficiency of the inductor device 1.

[0058] Please refer to Figure 1-Figure 6 In one embodiment, the shell 11 further includes at least one flow detent 15, and the at least one flow detent 15 is disposed on the cavity wall of the second flow guide cavity 132, and the flow detent 15 is used to change the flow parameters of the coolant.

[0059] The present embodiment provides a flow deflector 15. The flow deflector 15 is used to change the flow parameters of the coolant, such as the flow direction, flow speed, etc., so that the coolant forms a vortex. Optionally, the flow deflector 15 is arranged on the first bottom wall 1112 and / or the second bottom wall 1122. Optionally, the flow deflector 15 and the first sub-shell 111 are an integral structural member; or, the flow deflector 15 and the second sub-shell 112 are an integral structural member. Optionally, a plurality of flow deflectors 15 are staggered. Optionally, the flow deflector 15 is a protrusion.

[0060] In this embodiment, by providing a flow-around member 15 on the cavity wall of the second flow-guiding cavity 132, the coolant can be caused to flow around, thereby improving the fluidity of the coolant and allowing the coolant to take away more heat, thereby further improving the heat dissipation effect of the inductor device 1. In addition, the flow-around member 15 can also increase the contact area between the housing 11 and the coolant, thereby further improving the heat dissipation effect of the inductor device 1.

[0061] Please refer to Figure 1-Figure 6 In one embodiment, the inductor device 1 further includes a circuit board 16 electrically connected to the inductor 12, the circuit board 16 having an inductor input terminal 161 and an inductor output terminal 162, and the circuit board 16 is disposed on a side of the inductor 12 away from the bottom of the accommodating groove 115; at least one conductive member 163 is disposed on a side of the circuit board 16 away from the inductor 12, and the conductive member 163 is used to conduct current of the circuit board 16.

[0062] The inductor device 1 provided in this embodiment further includes a circuit board 16. The circuit board 16 is electrically connected to the inductor 12 and has an inductor input terminal 161 and an inductor output terminal 162. Other components can be electrically connected to the inductor 12 by electrically connecting to the inductor input terminal 161 or the inductor output terminal 162. The number of the inductor output terminals 162 and the inductor output terminals 162 is equal to the number of the inductor 12. For example, the number of the inductor output terminals 162 and the inductor output terminals 162 is 8.

[0063] The circuit board 16 provided in this embodiment is further provided with a conductive member 163. Optionally, the number of the conductive members 163 is 1-30. The plurality of conductive members 163 are arranged at intervals. Optionally, the plurality of conductive members 163 are arranged along the arrangement direction of the plurality of inductors 12. Optionally, one inductor 12 corresponds to at least one conductive member 163. Optionally, the conductive member 163 can be a welded copper bar.

[0064] In this embodiment, a conductive member 163 is provided on the circuit board 16 to improve the overcurrent capability of the circuit board 16 and reduce the heating of the circuit board 16 , thereby improving the heat dissipation efficiency of the inductor device 1 .

[0065] Please refer to Figure 1-Figure 10 , Figure 7 A schematic diagram of the structure of a power module provided in one embodiment of the present application. Figure 8 A schematic structural diagram of a housing provided in one embodiment of the present application. Fig. 9 A schematic structural diagram of a power module from another perspective provided in one embodiment of the present application. Fig.10 A schematic structural diagram of a housing from another perspective provided in one embodiment of the present application.

[0066] The present application also provides a power module 2, which includes a shell 21 and an inductor device 1 as provided above in the present application, wherein the shell 21 has a receiving space 211, and the inductor device 1 is arranged in the receiving space 211, and the shell 21 also has a first heat dissipation space 221 connected to the liquid inlet 113, and a second heat dissipation space 222 connected to the liquid outlet 114; the coolant located in the first heat dissipation space 221 flows to the guide space 13 through the liquid inlet 113, and then flows to the second heat dissipation space 222 through the liquid outlet 114.

[0067] The power module 2 provided in this embodiment adopts the inductor device 1 provided in the above application, and sets a flow guide space 13 around the inductor 12 in the shell 11 of the inductor device 1 to achieve liquid cooling of the inductor 12 all around. This not only improves the heat dissipation efficiency of the inductor device 1, but also prevents heat radiation of the inductor 12, thereby improving the stability of the power module 2.

[0068] Moreover, the flow guide space 13 of the inductor device 1 is also connected to the first heat dissipation space 221 and the second heat dissipation space 222 of the housing 21, thereby further improving the heat dissipation efficiency of the inductor device 1, improving the heat dissipation efficiency of the power module 2, improving the reliability of the power module 2, and extending the service life of the power module 2.

[0069] Optionally, the housing 11 further has a liquid inlet pipe 223 connected to the first heat dissipation space 221, and a liquid outlet pipe 224 connected to the second heat dissipation space 222. The coolant flows from the liquid inlet pipe 223 into the first heat dissipation space 221, then flows into the guide space 13 through the liquid inlet 113, then flows to the second heat dissipation space 222 through the liquid outlet 114, and then flows out through the liquid outlet pipe 224. The flow direction of the coolant is as follows: Figure 8 As shown in the direction D2.

[0070] Optionally, the housing 21 further includes at least one flow guide 225 , and the at least one flow guide 225 is disposed on the cavity wall of the second heat dissipation space 222 , and the flow guide 225 is used to make the coolant flow along a preset direction.

[0071] In this embodiment, by providing the liquid inlet pipe 113 and the liquid outlet pipe 224 , the coolant can circulate in the housing 21 and the shell 11 , so that the heat in the coolant can be promptly removed from the power module 2 , thereby further improving the heat dissipation efficiency.

[0072] Please refer to Figure 1-Figure 10 In one embodiment, the power module 2 further includes two sealing rings 17 , one sealing ring 17 is disposed at a connection between the liquid inlet 113 and the housing 21 , and the other sealing ring 17 is disposed at a connection between the liquid outlet 114 and the housing 21 .

[0073] The power module 2 provided in this embodiment further includes a sealing ring 17, which is used to seal the liquid inlet 113 and the first heat dissipation space 221, and is also used to seal the liquid outlet 114 and the second heat dissipation space 222. One sealing ring 17 is arranged around the liquid inlet 113, and another sealing ring 17 is arranged around the liquid outlet 114. Optionally, the first bottom wall 1112 is recessed with an annular groove 1113 for accommodating at least part of the sealing ring 17. Optionally, a protrusion 212 is provided on the surface of the housing 21 facing the inductor device 1, and the protrusion 212 is arranged corresponding to the annular groove 1113, and is used to abut the sealing ring 17.

[0074] In this embodiment, the sealing ring 17 is provided so that the liquid guide channel of the housing 11 and the heat dissipation channel of the shell 21 can be tightly connected to avoid leakage of the coolant, thereby improving the reliability of the power module 2.

[0075] Please refer to Figure 1-Figure 10In one embodiment, the first sub-shell 111 has a mounting hole 1114 , and the mounting hole 1114 is used to accommodate a screw connecting the inductive device 1 and the housing 21 .

[0076] Optionally, the number of mounting holes 1114 is 1-10. Multiple mounting holes 1114 are arranged around the circumference of the inductor 12. Optionally, a boss is arranged on the circumference of the first sub-shell 111, and the boss is provided with a mounting hole 1114 that passes through the bottom wall of the first sub-shell 111. Screws penetrate the mounting holes 1114 and connect the housing 21, thereby fixing the inductor device 1 on the housing 21.

[0077] In this embodiment, by setting a mounting hole 1114 on the first sub-shell 111, the inductor device 1 can be fixed to the shell 21 by screws, so as to press the sealing ring 17, so that the liquid guide channel of the shell 11 and the heat dissipation channel of the shell 21 form a sealed water path, further avoiding leakage of coolant, thereby further improving the reliability of the power module 2.

[0078] The present application also provides a battery system, which includes a battery stack and a power module as provided above in the present application, wherein the battery stack is electrically connected to the power module.

[0079] The battery system provided in this embodiment adopts the power module provided in the present application, and sets a flow guide space around the inductor in the shell of the inductor device to achieve liquid cooling on all sides of the inductor. This not only improves the heat dissipation efficiency of the inductor device, but also prevents heat radiation from the inductor, thereby improving the stability of the power module.

[0080] The above is a detailed introduction to the contents provided in the implementation mode of the present application. This article explains and illustrates the principles and implementation modes of the present application. The above explanation is only used to help understand the method and core idea of ​​the present application. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation mode and application scope. In summary, the contents of this specification should not be understood as limiting the present application.

Claims

1. An inductor device, characterized in that: The inductor device includes a shell and at least one inductor. The shell includes a first subshell and a second subshell that are arranged opposite to each other and connected. The first subshell and the second subshell are arranged to form a guide space. The guide space is used to accommodate a coolant. The first subshell has a liquid inlet and a liquid outlet that are connected to the guide space. The coolant flows into the guide space through the liquid inlet and then flows out through the liquid outlet. A accommodating groove is recessed on the surface of the second subshell that is away from the first subshell. The at least one inductor is arranged in the accommodating groove. The guide space is arranged around the inductor.

2. The inductive device according to claim 1, wherein: The first subshell includes a first peripheral side wall and a first bottom wall bent and connected to the first peripheral side wall, and the second subshell includes a second peripheral side wall opposite to the first peripheral side wall and a second bottom wall bent and connected to the second peripheral side wall and opposite to the first bottom wall; The flow guide space includes a first flow guide cavity and a second flow guide cavity that are connected to each other. The first flow guide cavity is formed between the first peripheral side wall and the second peripheral side wall. The second flow guide cavity is formed between the first bottom wall and the second bottom wall. The first bottom wall has the liquid inlet and the liquid outlet.

3. The inductive device according to claim 2, characterized in that The shell further includes at least one partition, which is disposed on a cavity wall of the second flow guide cavity. The partition is used to divide the second flow guide cavity into a plurality of flow guide channels that are connected in sequence, so that the coolant flows in a preset direction.

4. The inductive device according to claim 3, characterized in that The multiple guide channels include a first guide channel, a second guide channel, and a third guide channel that are connected in sequence. The first guide channel also connects the liquid inlet and a part of the first guide cavity. The second guide channel corresponds to the second bottom wall. The third guide channel also connects the liquid outlet and another part of the first guide cavity.

5. The inductive device according to claim 2, wherein: The shell further includes at least one flow detent, which is disposed on a cavity wall of the second flow guide cavity and is used to change flow parameters of the coolant.

6. The inductive device according to claim 1, wherein: The inductor device also includes a circuit board electrically connected to the inductor, the circuit board has an inductor input terminal and an inductor output terminal, and the circuit board is arranged on a side of the inductor away from the bottom of the accommodating groove; at least one conductive member is arranged on a side of the circuit board away from the inductor, and the conductive member is used to conduct current on the circuit board.

7. A power module, characterized in that: The power module includes a shell, and the inductor device according to any one of claims 1 to 6, the shell having a receiving space, the inductor device being arranged in the receiving space, the shell also having a first heat dissipation space connected to the liquid inlet, and a second heat dissipation space connected to the liquid outlet; the coolant located in the first heat dissipation space flows to the guide space through the liquid inlet, and then flows to the second heat dissipation space through the liquid outlet.

8. The power module according to claim 7, characterized in that: The power module further comprises two sealing rings, one of which is arranged at the connection between the liquid inlet and the shell, and the other of which is arranged at the connection between the liquid outlet and the shell.

9. The power module according to claim 8, characterized in that: The first sub-shell has a mounting hole, and the mounting hole is used to accommodate a screw connecting the inductive device and the housing.

10. A battery system, characterized in that: The battery system includes a battery stack and a power module as described in any one of claims 7 to 9, and the battery stack is electrically connected to the power module.

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