POP packaging structure of millimeter wave transmission device

Abstract

The utility model discloses a POP packaging structure of a millimeter wave transmission device, which comprises a top substrate, a top packaging body, a top welding piece, a bottom substrate, a bottom packaging body and a bottom welding piece, and the top packaging body and the bottom packaging body are chip packaging bodies capable of transmitting millimeter wave signals. Each of the top packaging body and the bottom packaging body comprises a first surface and a second surface which are oppositely arranged and a side surface connected with the first surface and the second surface, each of the top substrate and the bottom substrate comprises a first surface and a second surface which are oppositely arranged and a side surface connected with the first surface and the second surface, the first surface of the top packaging body is arranged on the first surface of the top substrate, and the second surface of the bottom packaging body is arranged on the second surface of the bottom substrate. The top welding piece is arranged on the second surface of the top substrate, the first surface of the bottom packaging body is arranged on the first surface of the bottom substrate, and the bottom welding piece is arranged on the second surface of the bottom substrate; the packaging structure further comprises insulating glue and packaging pieces, the second face of the top packaging body and the second face of the bottom packaging body are oppositely arranged and bonded through the insulating glue, and the packaging pieces are arranged on the side face of the top substrate, the side face of the bottom substrate, the side face of the top packaging body and the side face of the bottom packaging body.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a POP packaging structure of a millimeter wave transmission device. Background Art

[0002] POP is a package stacking technology that can reintegrate packages with the same appearance of logic and memory chips without causing other problems. The existing POP packaging structure usually adopts Figure 1 In the structure shown, the bottom package and the upper package are both composed of a substrate and a package body arranged on the substrate. The bottom package body is provided with a copper column. A solder ball is arranged between the bottom package and the upper package. The bottom package and the upper package are interconnected through the solder ball and the copper column. A welding pin is arranged on the substrate of the bottom package for connecting with a motherboard.

[0003] The above-mentioned POP packaging structure uses physical connections such as solder balls and copper pillars between the two layers of packaging, which has the risk of stress failure. The copper pillar connection also requires a customized frame, which is complex in process. On the other hand, the signal transmission rate is affected by the physical link and has a large loss, so high-speed transmission cannot be achieved. In addition, the upper layer signal will still pass through the bottom package, and it cannot be completely isolated. The isolation strength is limited, and it is not suitable for the packaging of millimeter wave transmission devices. Utility Model Content

[0004] In view of the above-mentioned deficiencies in the prior art, the utility model proposes a POP packaging structure of a millimeter wave transmission device.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0006] A POP packaging structure of a millimeter wave transmission device includes a top substrate, a top packaging body, a top welding piece, a bottom substrate, a bottom packaging body and a bottom welding piece, wherein the top packaging body and the bottom packaging body are chip packaging bodies capable of transmitting millimeter wave signals, the top packaging body and the bottom packaging body each include a first surface and a second surface arranged opposite to each other, and a side surface connecting the first surface and the second surface, the top substrate and the bottom substrate each include a first surface and a second surface arranged opposite to each other, and a side surface connecting the first surface and the second surface, the first surface of the top packaging body is arranged on the first surface of the top substrate, the top welding piece is arranged on the second surface of the top substrate, the first surface of the bottom packaging body is arranged on the first surface of the bottom substrate, and the bottom welding piece is arranged on the second surface of the bottom substrate; further comprising insulating glue and a packaging piece, the second surface of the top packaging body is arranged opposite to the second surface of the bottom packaging body and is bonded by the insulating glue, and the packaging piece is arranged on the side surface of the top substrate, the side surface of the bottom substrate, the side surface of the top packaging body and the side surface of the bottom packaging body.

[0007] Optionally, the packaging component is also provided in an area of ​​the second surface of the top substrate where no top welding component is provided, and in an area of ​​the second surface of the bottom substrate where no bottom welding component is provided.

[0008] Optionally, the top package body includes a top millimeter wave transmission chip, a top millimeter wave antenna and a top package, the top millimeter wave transmission chip and the top millimeter wave antenna are arranged on the first side of the top substrate, the top package is arranged on the first side of the top substrate and wraps the top millimeter wave transmission chip and the top millimeter wave antenna, the bottom package body includes a bottom millimeter wave transmission chip, a bottom millimeter wave antenna and a bottom package, the bottom millimeter wave transmission chip and the bottom millimeter wave antenna are arranged on the first side of the bottom substrate, the bottom package is arranged on the first side of the bottom substrate and wraps the bottom millimeter wave transmission chip and the bottom millimeter wave antenna.

[0009] Optionally, the top millimeter wave transmission chip is a millimeter wave sending chip, and the bottom millimeter wave transmission chip is a millimeter wave receiving chip.

[0010] Optionally, the top millimeter wave transmission chip is electrically connected to the top millimeter wave antenna, and the bottom millimeter wave transmission chip is electrically connected to the bottom millimeter wave antenna.

[0011] Optionally, a quartz plate is further included, which is arranged between the second surface of the top package body and the second surface of the bottom package body, and the second surface of the top package body and the quartz plate, and the second surface of the bottom package body and the quartz plate branches are bonded by insulating glue.

[0012] The beneficial effect of the utility model is that: combining the advantages of millimeter wave transmission that does not require physical connection and the POP packaging structure, the top package body and the bottom package body are arranged opposite to each other on the side away from the substrate, and are bonded with insulating glue. Compared with the existing POP packaging structure, no physical connection is required, the risk of stress failure is completely avoided, and no customized connection jig is required, which reduces the process flow and cost. In addition, the upper and lower layer signals can be completely isolated, millimeter wave transmission is not affected by the physical link, the rate can reach the Gbps level, and the transmission reliability is effectively guaranteed. By setting the packaging parts on the side of the top substrate, the side of the bottom substrate, the side of the top package body, and the side of the bottom package body, the entire structure forms an integrated package, the application end can be more flexible, performance consistency is guaranteed, and the difficulty of assembly is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 Shown is a schematic diagram of a POP packaging structure of the prior art;

[0014] Figure 2 The figure shows the POP packaging structure of the millimeter wave transmission device of the embodiment of the utility model;

[0015] Figure 3 The figure shows a POP packaging structure of a millimeter wave transmission device according to another embodiment of the present utility model;

[0016] Figure 4 It is a schematic diagram showing the connection application of the POP packaging structure of the millimeter wave transmission device according to an embodiment of the utility model;

[0017] Figure 5 Shown is another connection application schematic diagram of the POP packaging structure of the millimeter wave transmission device according to an embodiment of the utility model. DETAILED DESCRIPTION

[0018] In order to more clearly understand the technical content, achieved purposes and effects of the utility model, the utility model is described in detail below in combination with specific implementation methods and in conjunction with the accompanying drawings. It should be noted that the implementation methods of the utility model and the features in the implementation methods can be combined with each other without conflict. In the following description, many specific details are set forth in order to fully understand the utility model. The implementation methods described are only part of the implementation methods of the utility model, not all of the implementation methods. Based on the implementation methods in the utility model, all other implementation methods obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0019] Please refer to Figure 2 and 3 As shown, the technical solution provided by the utility model is:

[0020] A POP packaging structure of a millimeter wave transmission device includes a top substrate, a top packaging body, a top welding piece, a bottom substrate, a bottom packaging body and a bottom welding piece, wherein the top packaging body and the bottom packaging body are chip packaging bodies capable of transmitting millimeter wave signals, the top packaging body and the bottom packaging body each include a first surface and a second surface arranged opposite to each other, and a side surface connecting the first surface and the second surface, the top substrate and the bottom substrate each include a first surface and a second surface arranged opposite to each other, and a side surface connecting the first surface and the second surface, the first surface of the top packaging body is arranged on the first surface of the top substrate, the top welding piece is arranged on the second surface of the top substrate, the first surface of the bottom packaging body is arranged on the first surface of the bottom substrate, and the bottom welding piece is arranged on the second surface of the bottom substrate; further comprising insulating glue and a packaging piece, the second surface of the top packaging body is arranged opposite to the second surface of the bottom packaging body and is bonded by the insulating glue, and the packaging piece is arranged on the side surface of the top substrate, the side surface of the bottom substrate, the side surface of the top packaging body and the side surface of the bottom packaging body.

[0021] From the above description, it can be seen that the POP packaging structure of the millimeter wave transmission device of the utility model utilizes the wireless transmission characteristics of millimeter waves, eliminates the welding method of the middle solder ball plus copper column, has a higher transmission rate, and enhances reliability, and does not cause the problem of poor connection due to warping of the physical connection. By adopting the form of reverse stacking, the lead-out of the welding parts also becomes an up-down method. Compared with the traditional POP packaging structure, the signals of the upper and lower layers are completely isolated, and the isolation and voltage resistance level can be increased by adding other insulating materials between the upper and lower layers.

[0022] It should be noted that the top package and the bottom package may adopt an existing chip package structure capable of transmitting millimeter wave signals.

[0023] Optionally, the packaging component is also provided in an area of ​​the second surface of the top substrate where no top welding component is provided, and in an area of ​​the second surface of the bottom substrate where no bottom welding component is provided.

[0024] From the above description, it can be seen that the packaging parts can be arranged only on the sides of the upper and lower packaging layers, or on the entire outer surface of the upper and lower packaging layers except the welding parts. The utility model prefers the latter, which can achieve a better overall packaging effect.

[0025] Optionally, the top package body includes a top millimeter wave transmission chip, a top millimeter wave antenna and a top package, the top millimeter wave transmission chip and the top millimeter wave antenna are arranged on the first side of the top substrate, the top package is arranged on the first side of the top substrate and wraps the top millimeter wave transmission chip and the top millimeter wave antenna, the bottom package body includes a bottom millimeter wave transmission chip, a bottom millimeter wave antenna and a bottom package, the bottom millimeter wave transmission chip and the bottom millimeter wave antenna are arranged on the first side of the bottom substrate, the bottom package is arranged on the first side of the bottom substrate and wraps the bottom millimeter wave transmission chip and the bottom millimeter wave antenna.

[0026] Optionally, the top millimeter wave transmission chip is a millimeter wave sending chip, and the bottom millimeter wave transmission chip is a millimeter wave receiving chip.

[0027] Optionally, the top millimeter wave transmission chip is electrically connected to the top millimeter wave antenna, and the bottom millimeter wave transmission chip is electrically connected to the bottom millimeter wave antenna.

[0028] Optionally, a quartz plate is further included, and the quartz plate is arranged between the second surface of the top package body and the second surface of the bottom package body, and the second surface of the top package body and the quartz plate, and the second surface of the bottom package body and the quartz plate branches are bonded by insulating glue. By adding a quartz plate between the second surface of the top package body and the second surface of the bottom package body, the withstand voltage level is improved.

[0029] Please refer to Figure 2, Embodiment 1 of the present utility model is:

[0030] A POP packaging structure of a millimeter wave transmission device includes a top substrate 11, a top packaging body, a top welding piece 15, a bottom substrate 21, a bottom packaging body, a bottom welding piece 25, an insulating glue 3 and a packaging piece 4, wherein the top packaging body and the bottom packaging body both include a first surface and a second surface that are arranged opposite to each other, and a side surface connecting the first surface and the second surface, the top substrate 11 and the bottom substrate 21 both include a first surface and a second surface that are arranged opposite to each other, and a side surface connecting the first surface and the second surface, the first surface of the top packaging body is arranged on the first surface of the top substrate 11, the top welding piece 15 is arranged on the second surface of the top substrate 11, the first surface of the bottom packaging body is arranged on the first surface of the bottom substrate 21, and the bottom welding piece 25 is arranged on the second surface of the bottom substrate 21.

[0031] Specifically, the top package body includes a top millimeter wave transmission chip 12, a top millimeter wave antenna 13 and a top package 14. The top millimeter wave transmission chip 12 is a millimeter wave transmitting chip, and any existing chip that can realize millimeter wave signal transmission can be used. The top millimeter wave transmission chip 12 and the top millimeter wave antenna 13 are matched and electrically connected. The top millimeter wave transmission chip 12 and the top millimeter wave antenna 13 are arranged on the first surface of the top substrate 11, and the top package 14 is arranged on the first surface of the top substrate 11 and wraps the top millimeter wave transmission chip 12 and the top millimeter wave antenna 13. The bottom package body includes a bottom millimeter wave transmission chip 22, a bottom millimeter wave antenna 23 and a bottom package 24. The bottom millimeter wave transmission chip 22 is a millimeter wave receiving chip, and any existing chip that can realize millimeter wave signal reception can be used. The bottom millimeter wave transmission chip 22 and the bottom millimeter wave antenna 23 are matched and electrically connected. The bottom millimeter wave transmission chip 22 and the bottom millimeter wave antenna 23 are disposed on the first surface of the bottom substrate 21 , and the bottom package 24 is disposed on the first surface of the bottom substrate 21 and wraps the bottom millimeter wave transmission chip 22 and the bottom millimeter wave antenna 23 .

[0032] The second side of the top package body is arranged opposite to the second side of the bottom package body and is bonded by an insulating glue 3, and the package 4 wraps the side of the top substrate 11, the side of the bottom substrate 21, the side of the top package body, the side of the bottom package body, the area on the second side of the top substrate 11 where the top welding part 15 is not provided, and the area on the second side of the bottom substrate 21 where the bottom welding part 25 is not provided.

[0033] The POP packaging structure of the millimeter wave transmission device of this embodiment is that the top packaging body is arranged on one side of the top substrate, and the welding piece is arranged on the other side to form the top packaging; the bottom packaging body is arranged on one side of the bottom substrate, and the welding piece is arranged on the other side to form the bottom packaging; the top packaging and the bottom packaging are stacked in reverse and bonded with insulating glue to form the upper and lower packaging bodies; the entire outer surface of the upper and lower packaging bodies except the welding piece is covered with the packaging piece to form an integrated packaging structure with high integration. Compared with the traditional millimeter wave packaging structure, the assembly difficulty is greatly reduced and the size is also greatly reduced.

[0034] Please refer to Figure 3 , Embodiment 2 of the present utility model is:

[0035] A POP packaging structure of a millimeter wave transmission device, which differs from the first embodiment in that it also includes a quartz plate 5, wherein the quartz plate 5 is arranged between the second surface of the top packaging body and the second surface of the bottom packaging body, and the second surface of the top packaging body and the quartz plate 5 are bonded together as well as the second surface of the bottom packaging body and the quartz plate 5 by means of insulating glue 3.

[0036] The POP packaging structure of the millimeter wave transmission device of the present utility model can be used for but not limited to the following two connection applications:

[0037] 1. The welding parts of the bottom substrate are mounted on the PCB board, and the welding parts on the top are used for wire bonding connection, metal belt connection or magnetic adsorption connection. The metal base for heat dissipation is set at the POP packaging structure of the PCB board corresponding to the millimeter wave transmission device. Figure 4 shown.

[0038] Second, the welding parts of the bottom substrate and the welding parts of the top substrate are connected to the laser-printed pads on the PCB. A metal base for heat dissipation is set at the POP packaging structure of the PCB corresponding to the millimeter wave transmission device. Figure 5 shown.

[0039] In summary, the POP packaging structure of the millimeter wave transmission chip of the present invention has the advantages of high transmission rate, high isolation, high reliability, high integration, etc.

[0040] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, any modification, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A POP packaging structure of a millimeter wave transmission device, comprising a top substrate, a top packaging body, a top welding piece, a bottom substrate, a bottom packaging body and a bottom welding piece, wherein the top packaging body and the bottom packaging body are chip packaging bodies capable of transmitting millimeter wave signals, the top packaging body and the bottom packaging body both comprise a first surface and a second surface arranged oppositely, and a side surface connecting the first surface and the second surface, the top substrate and the bottom substrate both comprise a first surface and a second surface arranged oppositely, and a side surface connecting the first surface and the second surface, the first surface of the top packaging body is arranged on the first surface of the top substrate, the top welding piece is arranged on the second surface of the top substrate, the first surface of the bottom packaging body is arranged on the first surface of the bottom substrate, and the bottom welding piece is arranged on the second surface of the bottom substrate; characterized in that It also includes insulating glue and a packaging component. The second side of the top packaging body is arranged opposite to the second side of the bottom packaging body and is bonded by the insulating glue. The packaging component is arranged on the side of the top substrate, the side of the bottom substrate, the side of the top packaging body and the side of the bottom packaging body.

2. The POP packaging structure of the millimeter wave transmission device according to claim 1, characterized in that: The packaging component is also arranged in an area of ​​the second surface of the top substrate where no top welding component is arranged, and in an area of ​​the second surface of the bottom substrate where no bottom welding component is arranged.

3. The POP packaging structure of the millimeter wave transmission device according to claim 1, characterized in that: The top package body includes a top millimeter-wave transmission chip, a top millimeter-wave antenna and a top package, the top millimeter-wave transmission chip and the top millimeter-wave antenna are arranged on the first side of the top substrate, the top package is arranged on the first side of the top substrate and wraps the top millimeter-wave transmission chip and the top millimeter-wave antenna, the bottom package body includes a bottom millimeter-wave transmission chip, a bottom millimeter-wave antenna and a bottom package, the bottom millimeter-wave transmission chip and the bottom millimeter-wave antenna are arranged on the first side of the bottom substrate, the bottom package is arranged on the first side of the bottom substrate and wraps the bottom millimeter-wave transmission chip and the bottom millimeter-wave antenna.

4. The POP packaging structure of the millimeter wave transmission device according to claim 3, characterized in that: The top millimeter wave transmission chip is a millimeter wave sending chip, and the bottom millimeter wave transmission chip is a millimeter wave receiving chip.

5. The POP packaging structure of the millimeter wave transmission device according to claim 3, characterized in that: The top millimeter wave transmission chip is electrically connected to the top millimeter wave antenna, and the bottom millimeter wave transmission chip is electrically connected to the bottom millimeter wave antenna.

6. The POP packaging structure of the millimeter wave transmission device according to any one of claims 1 to 5, characterized in that: It also includes a quartz plate, which is arranged between the second surface of the top package and the second surface of the bottom package. The second surface of the top package and the quartz plate, and the second surface of the bottom package and the quartz plate branches are bonded by insulating glue.

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