Frequency hopping filter

Abstract

The utility model discloses a frequency hopping filter, which belongs to the technical field of frequency hopping filters and comprises a base, a box cover and a PCB (printed circuit board), components are arranged on the upper side of the PCB and comprise a diode module and a resistor module, the bottom of the PCB is fixedly connected onto the base, the box cover covers the base and covers the PCB, a plurality of leading-out terminals are arranged on two sides of the PCB, and the leading-out terminals are connected with the diode module and the resistor module. And the plurality of leading-out terminals penetrate out of the through holes in the box cover. According to the utility model, the diode module and the resistor module are independently welded on the PCB in a modularized manner, so that the mounting is convenient, pseudo soldering is avoided, the product reliability is higher, the mounting efficiency is improved, the box cover is used for sealing after the PCB is fixed by the base, the dustproof effect and the protection effect are achieved, the leading-out terminal is used for lateral leading-out, and the mounting is convenient.

Description

Technical Field

[0001] The utility model relates to a frequency hopping filter, belonging to the technical field of frequency hopping filters. Background Art

[0002] The welding process of the existing frequency hopping filter design is: Figure 1 As shown, the diode and the resistor are connected in parallel and stacked with their backs soldered, which is prone to cold soldering and device failure, affecting reliability. Summary of the invention

[0003] The technical problem to be solved by the utility model is to provide a frequency hopping filter to solve the problems existing in the above-mentioned prior art.

[0004] The technical solution adopted by the utility model is: a frequency hopping filter, including a base, a box cover and a PCB board, components are arranged on the upper side of the PCB board, the components include a diode module and a resistor module, the bottom of the PCB board is fixedly connected to the base, the box cover is closed on the base and covers the PCB board, a plurality of lead terminals are arranged on both sides of the PCB board, and the plurality of lead terminals pass through through holes on the box cover.

[0005] Furthermore, the magnetic ring inductor arranged on the above-mentioned PCB board is fixed by gluing.

[0006] Furthermore, a groove is provided on the upper end surface of the base, and the groove is filled with potting glue.

[0007] Furthermore, the through hole is provided with an elastic rubber ring.

[0008] The beneficial effects of the utility model are as follows: compared with the prior art, the utility model adopts modularization to independently weld the diode module and the resistor module to the PCB board, which is easy to install and avoids cold soldering. The product reliability is higher and the mounting efficiency is improved. The PCB board is fixed with a base and then sealed with a box cover to play a dust-proof and protective role. The lead-out terminal is led out laterally, which is easy to install. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram of the stack welding structure of the existing frequency hopping filter;

[0010] Figure 2 This is a schematic diagram of the welding structure of the independent module of the frequency hopping filter;

[0011] Figure 3 This is the circuit diagram of the diode and resistor module;

[0012] Figure 4 is a schematic diagram of the three-dimensional structure of the frequency hopping filter;

[0013] Figure 5 is a schematic diagram of the cross-sectional structure of a frequency hopping filter;

[0014] Figure 6 Schematic diagram of the structure of the frequency hopping filter from top view. DETAILED DESCRIPTION

[0015] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0016] Example 1: Figure 4-6 As shown, a frequency hopping filter comprises a base 1, a box cover 2 and a PCB board 3. Components 4 are arranged on the upper side of the PCB board 3. The components include a diode module and a resistor module. The bottom of the PCB board 3 is fixedly connected to the base 1. The box cover 2 is covered on the base 1 and covers the PCB board 3. A plurality of lead terminals 5 are arranged on both sides of the PCB board 3. The plurality of lead terminals 5 pass through through holes 6 on the box cover 2. The through holes 6 are inverted U-shaped notch structures, which are convenient for manufacturing. The diode module and the resistor module are designed as independent modules and welded on the PCB board, which is convenient for installation and avoids cold soldering. The product reliability is higher and the mounting efficiency is improved.

[0017] The magnetic ring inductor arranged on the PCB board 3 is fixed by glue, and the glue is a potting glue, which is arranged around the magnetic ring, which can stabilize the magnetic ring and achieve elastic buffer protection.

[0018] In order to improve the shock absorption effect of the PCB board, a groove 7 is provided on the upper end surface of the base 1, and the groove 7 is filled with potting glue. The potting glue contacts the PCB board, which can elastically buffer the PCB board. In addition, a plastic elastic gasket is provided at the contact point between the PCB board and the base 1, which cooperates with the potting glue to form an overall elastic buffer protection effect.

[0019] When the lead terminal passes through the box cover, the rigidity is weak due to the cantilever of the lead terminal. Under long-term vibration or shaking, the welding joint may become desoldered or loose. Therefore, an elastic rubber ring 8 is provided at the through hole 6. The elastic rubber ring elastically fastens the lead terminal so that the lead terminal has a certain elastic buffering and vibration reduction. An auxiliary fulcrum is added to avoid loosening and desoldering of the lead terminal due to the excessive cantilever, thereby improving the connection reliability.

[0020] Embodiment 2: A frequency hopping filter, the frequency hopping filter is as follows Figure 2-3 As shown, the diode 1 and the resistor 1 are independently soldered on the circuit board 3 of the frequency hopping filter. The method comprises the following steps:

[0021] 1) Design: The diode and resistor are designed in parallel as a separate module with back soldering;

[0022] 2) Mounting: Mount the diode and the resistor on separate modules to obtain a diode module and a resistor module, and mount the diode module and the resistor module on two PCB boards adapted to the frequency hopping filter by reflow soldering;

[0023] 3) Assembly: After the reflow soldering in step 2) is completed, the diode module and resistor module are assembled into the frequency hopping filter using the SMT process, and the resonant capacitor and magnetic ring inductor of the frequency hopping filter are assembled, and then cleaned and assembled for quality inspection;

[0024] 4) Final assembly: Assemble the frequency hopping filter that has completed quality inspection in step 3) into the corresponding product structure and conduct final assembly quality inspection (quality inspection includes appearance inspection process compliance, visual inspection of component solder joints under a microscope at 40 times magnification, and the quality inspection equipment is a microscope);

[0025] 5) Debugging: Complete parameter performance debugging of the frequency hopping filter that has completed quality inspection in step 4), and conduct quality inspection of the debugging process (quality inspection includes appearance inspection for process compliance, visual inspection of component solder joints, excess residue, device integrity, and the fixing effect of magnetic ring inductors under a microscope at 40 times magnification, and the quality inspection equipment is a microscope).

[0026] The modular design is easy to install, avoids cold soldering, improves product reliability, and improves mounting efficiency (time can be increased by 60%). It can realize SMT automated mounting, reduce the use of manual work, and improve product reliability.

[0027] The SMT process steps are as follows:

[0028] (1) Solder paste printing: Place the solder paste in the solder paste mixer of the fully automatic solder paste printer and stir for 5 minutes; adjust the track width of the solder paste printer to adapt to the current carrier, install the PCB board on the carrier, and send it into the solder paste printer; pre-install the steel mesh on the solder paste printer, adjust the solder paste printing platform to rise and contact the steel mesh; adjust the steel mesh hole to be aligned with the PCB board pad, click the cylinder switch to fix the steel mesh; use a scraper to add solder paste to the steel mesh; set the MARK point, move the placement machine lens to find the carrier and steel mesh MARK position, and create the carrier and steel mesh MARK templates in turn; click to start production, and after the solder paste brush machine automatically recognizes the MARK point, confirm the steel mesh hole and PCB pad again. If there is any misalignment, make fine adjustments, and start production after fine-tuning and alignment;

[0029] (2) SPI detection: Open the SPI software of the 3D solder paste detection system and call the corresponding detection program; adjust the track width to adapt to the current carrier; click start and place the PCB with printed solder paste into the SPI detection equipment for solder paste detection;

[0030] (3) Placement: Call the corresponding placement program of the placement machine and adjust the track width to adapt to the current carrier; click to edit the production program, confirm that the material information is correct, and then load the material; insert the material belt into the feeder to load the material, and then install the feeder to the position corresponding to the placement program; adjust the placement position, measure the placement height, measure the device size and optimize the nozzle head in turn; confirm the placement position and make fine adjustments; click to start production, and start production after the placement machine completes the automatic optimization of the program;

[0031] (4) Reflow: Call the corresponding reflow temperature (temperature zone 1 130, temperature zone 2 140, temperature zone 3 150, temperature zone 4 170, temperature zone 5 185, temperature zone 6 215, temperature zone 7 255, temperature zone 8 250, the temperature of the upper and lower temperature zones is the same); put the reflow temperature measuring instrument into the reflow equipment to measure the temperature. After the measurement, connect the temperature measuring instrument to the computer, read the temperature data, and confirm that the temperature meets the requirements (1. Reflow time above 183℃: time 30~165 seconds; 2. Above 200℃: time 20~40 seconds; 3. Preheating heating rate: 1~4℃ / second; 4. Peak temperature: 210~245℃; 5. Cooling zone temperature cooling rate: cooling rate <4℃; 6. Time in heating zone 130~170: 60~140 seconds, heating rate <2℃ / second); adjust the track width to adapt to the current carrier, and put the mounted products into the reflow equipment for reflow.

[0032] The quality inspection in step 3) includes appearance inspection for process compliance and visual inspection of component solder joints at 40 times magnification under a microscope. The quality inspection equipment is a microscope.

[0033] The parameter performance debugging method is: adjust the magnetic ring inductance parameters to make it resonate in the best state, that is, to meet the set performance parameter range.

[0034] The above description is only a specific implementation method of the present utility model, but the protection scope of the present utility model is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present utility model, which should be included in the protection scope of the present utility model. Therefore, the protection scope of the present utility model should be based on the protection scope of the claims.

Claims

1. A frequency hopping filter, characterized in that: The invention comprises a base (1), a box cover (2) and a PCB board (3), wherein components (4) are arranged on the upper side of the PCB board (3), and the components include a diode module and a resistor module, the bottom of the PCB board (3) is fixedly connected to the base (1), the box cover (2) is covered on the base (1) and covers the PCB board (3), and a plurality of lead terminals (5) are arranged on both sides of the PCB board (3), and the plurality of lead terminals (5) pass through through holes (6) on the box cover (2).

2. A frequency hopping filter according to claim 1, characterized in that: The magnetic ring inductor arranged on the PCB board (3) is fixed by gluing.

3. A frequency hopping filter according to claim 1, characterized in that: The upper end surface of the base (1) is provided with a groove (7), and the groove (7) is filled with potting glue.

4. A frequency hopping filter according to claim 1, characterized in that: An elastic rubber ring (8) is disposed at the through hole (6).

Images