Electrical module and motor vehicle
By connecting the fin set heat conduction to the copper clad layer in the electrical module and extending out of the shell, the problem of difficulty in heat dissipation of existing electrical modules is solved, and efficient heat dissipation and cost reduction effects are achieved.
Patent Information
- Application Number
- CN202323421599.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-14
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2033-12-14
AI Technical Summary
Existing electrical modules have difficulties in heat dissipation. High-cost metal shells have good heat dissipation but high cost, while low-cost plastic shells have poor heat dissipation. At the same time, heat dissipation glue is required for bonding, which increases production cost and complexity.
An electrical module is designed in which the fin set is connected to the copper clad layer by heat conduction and extends out of the shell to directly dissipate heat from the back of the power element, avoiding the need for heat dissipation glue.
It effectively improves heat dissipation efficiency, reduces production costs, and simplifies production processes.
Smart Images
Figure CN222485123U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of vehicle parts, in particular to an electrical module which can be used as a zone controller in a motor vehicle and a motor vehicle comprising the electrical module. Background Art
[0002] It is known that most electrical modules with electronic components such as integrated circuits have PCBs (printed circuit boards) for electrical interconnection between various electronic components. As electrical modules become more and more complex, more and more electronic components are required, and more and more heat is generated on the surface of the PCB, which leads to more and more prominent problems such as heat dissipation and heat resistance of electrical modules.
[0003] In the prior art electrical modules with PCB boards, a metal or plastic shell is usually used to cover the periphery of the PCB board and heat dissipation fins are arranged on the surface of the shell to dissipate heat. A common configuration is that electronic components are arranged on one side of the PCB board, and the other side is bonded to the shell by heat dissipation adhesive such as thermal conductive silicone grease so that heat is dissipated through the shell. Such a structure has the following defects: if the shell is made of a metal material with good heat dissipation, the cost is high; if the shell is made of a low-cost plastic material, the heat dissipation is poor; and it is often necessary to use heat dissipation adhesive to bond the PCB board to the shell, which is disadvantageous in terms of production cost and production efficiency. Utility Model Content
[0004] The purpose of the present invention is to solve at least one of the above problems and / or other problems existing in the prior art.
[0005] To achieve the above object, according to one aspect of the utility model, an electrical module is provided, the electrical module comprising a PCB board, a fin group and a housing portion. The PCB board has a first surface and a second surface opposite to each other, the first surface is provided with at least one power element, and the second surface is provided with a copper clad layer; the fin group is connected to the copper clad layer corresponding to the power element; the housing portion is configured to accommodate the PCB board; wherein the fin group extends from the copper clad layer toward a direction away from the second surface of the PCB board and extends out of the housing portion, so as to conduct the heat generated by the power element to the outside of the housing portion.
[0006] According to an embodiment of the present invention, the copper clad layer includes a plurality of copper clad areas arranged in a matrix, and each copper clad area corresponds to one or more power components.
[0007] According to one embodiment of the utility model, the fin group includes a plurality of heat dissipating fins arranged in parallel, each of the heat dissipating fins includes a fin body and a heat conducting portion extending perpendicular to the fin body, and the heat conducting portion is connected to at least one copper clad area in a heat conduction manner.
[0008] According to an embodiment of the present invention, the heat conducting part includes a plurality of first heat conducting plates arranged in rows on a side surface of the fin body, and the plurality of first heat conducting plates are connected one-to-one with each copper clad area in a row or a column.
[0009] According to one embodiment of the present invention, the heat conducting part also includes a plurality of second heat conducting plates arranged in rows at intervals and extending in a direction opposite to the extension direction of the first heat conducting plate, and the plurality of second heat conducting plates are connected one-to-one with each copper clad area of another adjacent row or column.
[0010] According to an embodiment of the present invention, the heat conducting portion is connected to the copper clad area by surface mounting.
[0011] According to an embodiment of the present invention, the electrical module further includes a copper gasket disposed between the heat conducting portion and the copper clad area.
[0012] According to an embodiment of the present invention, the heat conducting portion is connected to the copper gasket by welding, and the copper gasket is connected to the copper clad area by surface mounting.
[0013] According to an embodiment of the present invention, the shell portion is made of plastic material and has a through slot for the fin group to pass through.
[0014] According to another aspect of the present invention, a motor vehicle is provided, the motor vehicle comprising the electrical module as described above.
[0015] The electrical module of the utility model is characterized in that the fin group is connected to the copper cladding layer in a heat conduction manner and the fin group is extended out of the shell, thereby directly dissipating heat from the back of the power element as a heat source through the fin group without using heat dissipation glue, thereby effectively improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The features and advantages of the present invention will be clearly understood through the detailed description provided below with reference to the accompanying drawings. It should be understood that the following drawings are only schematic and not necessarily drawn to scale, and thus cannot be regarded as limiting the present invention. In the accompanying drawings:
[0017] Figure 1 A cross section of an electrical module according to a first exemplary embodiment of the present invention is shown in a perspective view, wherein only parts relevant to the present invention are shown;
[0018] Figure 2 for Figure 1 An exploded view of the electrical module shown;
[0019] Figure 3 With Figure 1 A cross section of an electrical module according to a second exemplary embodiment of the present invention is shown in a similar manner; and
[0020] Figure 4 for Figure 3 Exploded view of the electrical module shown.
[0021] Description of reference numerals:
[0022] 1. PCB board; 11. first surface; 111. power element; 12. second surface; 121. copper clad layer; 1211. copper clad area; 2. fin group; 21. heat dissipation fin; 211. fin body; 212. heat conducting part; 2121. first heat conducting sheet; 2122. second heat conducting sheet; 3. shell part; 31. through groove; 4. copper gasket. DETAILED DESCRIPTION
[0023] Embodiments of the present invention are described below with reference to the accompanying drawings. In the following description, many specific details are set forth so that those skilled in the art can more fully understand and implement the present invention. However, it is obvious to those skilled in the art that the implementation of the present invention may not have some of these specific details. In addition, it should be understood that the present invention is not limited to the specific embodiments described. On the contrary, any combination of the features and elements described below may be considered to implement the present invention, regardless of whether they relate to different embodiments. Therefore, the following aspects, features, embodiments and advantages are for illustrative purposes only and should not be regarded as elements or limitations of the claims unless clearly stated in the claims.
[0024] In the following, terms such as "first", "second", etc. are used to describe the elements of the present application. These terms are only used to distinguish the various elements, and are not used to limit the nature, order or number of these elements. The terms "including" and "having" are used to express an open-ended inclusive meaning, and mean that there may be additional elements / components in addition to the listed elements / components.
[0025] The electrical module of the utility model can be used in a motor vehicle and, for example, as a zone control unit (ZCU). Such an electrical module generally comprises a PCB board, on which at least one power element is arranged and the PCB board is generally encapsulated in a housing. The power element generates heat during operation and thus forms a heating element. In order to ensure its function and normal operation, the electrical module needs to be cooled in time, that is, the heat generated by its power element needs to be dissipated in time. Of course, the application occasions of the electrical module of the utility model are not limited thereto.
[0026] Figure 1 and Figure 2 FIG. 2 shows a partial cross-sectional view of an electrical module according to a first embodiment of the present utility model. Figure 1 and Figure 2 As shown, the electrical module according to this embodiment may include a PCB board 1, a fin group 2 and a housing portion 3. The PCB board 1 has two opposite surfaces, namely a first surface 11 and a second surface 12. The first surface 11 is Figure 1 The lower surface of the PCB board 1 shown in the figure has at least one (especially multiple) power components 111 arranged thereon. The second surface 12 is Figure 1 The upper surface of the PCB board 1 shown in the figure is provided with a copper clad layer 121. The copper clad layer 121 can be provided only at a position corresponding to the power element 111 or, as is generally known, on the entire second surface 12 and at least partially covered by a green oil layer. Such a copper clad layer 121 can be used to guide the heat generated by the power element 111 to the second surface 12. The housing portion 3 is surrounded to form a cavity structure to accommodate the PCB board 1 provided with the copper clad layer 121 and the power element 111.
[0027] According to the utility model, the lower end of the fin group 2 is connected to the copper clad layer 121 of the PCB board 1 at a position corresponding to the power element 111, and is especially connected to the copper clad layer 121 in a manner that is conducive to heat conduction, such as face-to-face contact. The upper end of the fin group 2 is directed from the copper clad layer 121 toward a direction away from the second surface 12 of the PCB board 1 ( Figure 1 The fin group 2 is connected to the copper clad layer 121, which means that the copper clad layer 121 is exposed at least at the part connected to the fin group 2 and is not covered by the green oil layer.
[0028] Compared with the prior art, the electrical module of the utility model includes a copper clad layer 121 which is arranged on a PCB board 1 and is at least partially exposed, and a fin group 2 which is connected thereto in a heat conduction manner and extends out of a housing portion 3 from the PCB board 1. Thus, the heat generated by the power element 111 can be directly conducted to the outside of the housing portion 3 from the back through the fin group 2 without using heat dissipation glue, thereby effectively improving the heat dissipation efficiency.
[0029] According to an exemplary embodiment of the copper clad layer 121, Figure 1 and Figure 2 As shown, the copper clad layer 121 can be divided or separated into a plurality of copper clad areas 1211 arranged in a matrix, and each copper clad area 1211 corresponds to one or more power elements 111. In this way, the heat generated by each power element 111 can be respectively guided to the side where the second surface 12 of the PCB board 1 is located through the plurality of copper clad areas 1211, thereby avoiding the accumulation of heat due to the concentrated heat transfer of too many power elements 111 to one or some parts of the copper clad layer 121 at the same time, thereby further improving the heat dissipation efficiency. It should be noted here that the plurality of copper clad areas 1211 can be formed, in particular, by removing the green oil layer at a specific part of the PCB board 1 to expose the corresponding part of the copper clad layer 121 covered by it.
[0030] In order to more specifically describe the corresponding structure of the copper-clad area 1211 and the fin group 2, in the following specific description, Figure 2 The copper-clad areas 1211 shown arranged perpendicular to the paper surface are called "rows" of copper-clad areas, and the rows along the Figure 2 The copper-clad areas arranged in the left-right direction are called "columns" of copper-clad areas.
[0031] According to an exemplary embodiment of the fin set 2, continue to refer to Figure 1 and Figure 2 The fin group 2 includes a plurality of heat dissipation fins 21 arranged in parallel. Each heat dissipation fin 21 may include Figure 1 and Figure 2 The fin body 211 extends in the vertical direction and the heat conducting portion 212 extends perpendicular to the fin body 211. The heat conducting portion 212 extends along Figure 1 and Figure 2 The heat dissipation fins 21 extend in the left-right direction as shown, so that when connected to at least one copper-clad area 1211 in a heat conduction manner, the contact area between the heat dissipation fins 21 and the copper-clad area 1211 can be greatly increased, thereby increasing the heat dissipation efficiency.
[0032] According to an exemplary embodiment of the heat conducting portion 212, refer to Figure 2The heat conducting portion 212 of the two heat dissipating fins 21 on the right side of the middle fin group 2 may include a plurality of first heat conducting fins 2121 extending perpendicularly from one side surface of the fin body 211 and outward (from the right side surface of the fin body 211 to the right). The plurality of first heat conducting fins 2121 are arranged in an interval arrangement and are connected to each copper clad area 1211 in a row or a column in a one-to-one correspondence. It can be understood that when each fin body 211 is arranged along Figure 2 When extending in the direction of the "row" shown in FIG. 1 , a plurality of first heat conducting sheets 2121 are connected to a row of copper clad areas 1211 in a one-to-one correspondence. Figure 2 When extending in the direction of the “row” shown, the plurality of first heat conducting sheets 2121 are connected to a row of copper clad areas 1211 in a one-to-one correspondence.
[0033] According to another exemplary embodiment of the heat conducting portion 212, refer to Figure 2 The heat-dissipating fin 21 on the leftmost side of the middle fin group 2, the heat-conducting portion 212 may also include a plurality of second heat-conducting fins 2122 extending vertically outward from the other side surface of the fin body 211 (the left side surface of the fin body 211 is to the left). The second heat-conducting fins 2122 are arranged in an interval and the extending direction is opposite to the extending direction of the first heat-conducting fins 2121. Therefore, when the space corresponding to the copper-clad areas 1211 of two adjacent rows (or two columns) is small, the fin body 211 can be arranged between the copper-clad areas of two adjacent rows (or two columns), and the fin body 211 is connected one by one with the multiple copper-clad areas 1211 of one row (or one column) through the multiple first heat-conducting fins 2121, and the multiple copper-clad areas 1211 of the adjacent row (or adjacent column) are connected one by one through the multiple second heat-conducting fins 2122.
[0034] In the above embodiment, the heat conducting portion 212 and the copper clad area 1211 are connected by surface mounting (SMT), especially by bonding them together with solder paste, thereby increasing the connection speed of the heat conducting portion 212 and the copper clad area 1211 and reducing the deformation of both, thereby improving production efficiency and reducing the rework rate.
[0035] Now refer to Figure 3 and Figure 4 , which shows a second embodiment of the electrical module according to the utility model. The difference from the first embodiment is that the electrical module of the second embodiment may also include a copper gasket 4 arranged between the heat-conducting part 212 and the copper-clad area 1211. By connecting the heat-conducting part 212 and the copper-clad area 1211 through the copper gasket 4, the connection strength between the copper-clad area 1211 and the heat-conducting part 212 can be increased, and the heat transfer efficiency between the two can be improved. Specifically, the heat-conducting part 212 is connected to the copper gasket 4 by welding, preferably laser welding. The copper gasket 4 is connected to the copper-clad area 1211 by surface mounting. Advantageously, the number and arrangement of the copper gaskets 4 are the same as those of the copper-clad area 1211.
[0036] In the aforementioned first and second embodiments, the housing portion 3 has a through slot 31 for the fin group 2 to pass through. It can be understood that the present embodiment does not limit the number of through slots 31. When the fin group 2 includes a plurality of heat dissipating fins 21, the through slot 31 may be a single through slot having a relatively wide width so that the plurality of heat dissipating fins 21 can pass through at the same time; or, the through slot 31 may also have a width slightly larger than the width of the fin body 211, and the number of the through slots 31 is consistent with the number of the heat dissipating fins 21, so that the plurality of heat dissipating fins 21 can pass through in a one-to-one correspondence.
[0037] Preferably, the housing 3 can be made of plastic material, preferably common industrial plastics such as PBT+GF30 / PA66, etc. Also preferably, the fin assembly 2 can be made of metal material, such as aluminum alloy or copper, which is good for heat dissipation.
[0038] The utility model also provides a motor vehicle comprising the electrical module.
[0039] For those skilled in the art, various modifications and variations may be made to the embodiments disclosed above without departing from the scope or spirit of the utility model. Other embodiments of the utility model will be apparent to those skilled in the art from the practice of the utility model disclosed in this specification. This specification and the examples disclosed therein should be considered to be illustrative only, and the true scope of the utility model is specified by the appended claims and their equivalents.
Claims
1. An electrical module, characterized in that: The electrical module comprises: A PCB board (1), the PCB board (1) having a first surface (11) and a second surface (12) which are opposite to each other, the first surface (11) being provided with at least one power element (111), and the second surface (12) being provided with a copper cladding layer (121); A fin group (2), the fin group (2) being connected to the copper clad layer (121) corresponding to the power element (111); and A housing portion (3), the housing portion (3) being configured to accommodate the PCB board (1); The fin group (2) extends from the copper cladding layer (121) in a direction away from the second surface (12) and extends out of the housing portion (3) so as to conduct heat generated by the power element (111) to the outside of the housing portion (3).
2. The electrical module according to claim 1, characterized in that: The copper-clad layer (121) comprises a plurality of copper-clad regions (1211) arranged in a matrix, and each copper-clad region (1211) corresponds to one or more power components (111).
3. The electrical module according to claim 2, characterized in that: The fin group (2) comprises a plurality of heat dissipation fins (21) arranged in parallel, each of the heat dissipation fins (21) comprising a fin body (211) and a heat conduction portion (212) extending perpendicularly to the fin body (211), and the heat conduction portion (212) is connected to at least one copper-clad area (1211) in a heat conduction manner.
4. The electrical module according to claim 3, characterized in that: The heat conducting part (212) comprises a plurality of first heat conducting plates (2121) extending from a side surface of the fin body (211) and arranged in rows at intervals, and the plurality of first heat conducting plates (2121) are connected one-to-one with each copper clad area (1211) in a row or a column.
5. The electrical module according to claim 4, characterized in that: The heat conducting portion (212) further comprises a plurality of second heat conducting sheets (2122) which are arranged in rows at intervals and extend in a direction opposite to the extension direction of the first heat conducting sheet (2121), and the plurality of second heat conducting sheets (2122) are connected one-to-one with each copper clad area (1211) of another row or another column.
6. The electrical module according to any one of claims 3 to 5, characterized in that: The heat conducting portion (212) is connected to the copper clad area (1211) by surface mounting.
7. The electrical module according to any one of claims 3 to 5, characterized in that: The electrical module further comprises a copper gasket (4) arranged between the heat conducting portion (212) and the copper clad area (1211).
8. The electrical module according to claim 7, characterized in that: The heat conducting portion (212) is connected to the copper gasket (4) by welding, and the copper gasket (4) is connected to the copper clad area (1211) by surface mounting.
9. The electrical module according to any one of claims 1 to 5, characterized in that: The housing portion (3) is made of plastic material and has a through slot (31) for the fin group (2) to pass through.
10. A motor vehicle, characterized in that: The motor vehicle comprises an electrical module according to any one of claims 1 to 9.