Heat dissipation module and electronic equipment
By designing a heat dissipation module including a fin structure, a heat pipe module and a graphite sheet, the structural problems of fanless industrial control computers in thermal management are solved, and efficient heat dissipation and simplified manufacturing effects are achieved.
Patent Information
- Application Number
- CN202420219497.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-29
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-01-29
AI Technical Summary
The existing fanless industrial control computers have problems such as obvious structural deformation, complex process, high cost and low yield in thermal management, which is difficult to meet the needs of efficient heat dissipation.
A heat dissipation module is designed, including a fin structure, a heat pipe module and a graphite sheet. By setting multiple grooves on the heat dissipation surface of the fin structure and the heat pipe bracket, graphite sheets are clamped to increase the heat transfer surface area. The graphite sheet is also maintained with an elastomer to ensure that it is in close contact with the inner side surface and the inner bottom surface of the groove.
It improves heat dissipation efficiency, avoids structural dimensional instability caused by high-temperature welding, and simplifies the processing and manufacturing process and reduces costs.
Smart Images
Figure CN222506852U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of industrial computers, and in particular to a heat dissipation module and an electronic device. Background Art
[0002] With the development of industrial technology, factories have a higher demand for intelligence, and fanless industrial computers are increasingly used in detection, detection, monitoring, automated operation robots or vehicles, etc. However, although fanless can bring stability and low failure rate to the computing system, it has higher requirements for thermal management of the computing unit.
[0003] In order to design and manufacture a fanless edge computing device that can meet the heat dissipation requirements, the design of the main heat dissipation structure in contact with the CPU is particularly important. This structural module has strict requirements on the selection of materials, structural surface area design, and interface thermal conductive material selection. However, the use of heat pipes is to quickly diffuse heat in order to quickly take away heat. Then the fixation of the heat pipe or heat pipe module in the heat dissipation module structure is related to the heat dissipation function of the entire structure.
[0004] Based on the above situation, the existing structural module processing will encounter the following problems: obvious structural size deformation, complex process, high cost and low yield. Utility Model Content
[0005] The present disclosure provides a heat dissipation module and an electronic device to at least solve the above technical problems existing in the prior art.
[0006] According to a first aspect of the present disclosure, a heat dissipation module is provided, comprising: a fin structure, a heat pipe module and a graphite sheet, wherein the fin structure has a first heat dissipation surface, the first heat dissipation surface has a plurality of first grooves; the heat pipe module comprises a heat pipe bracket and a heat dissipation pipe embedded in the heat pipe bracket; the heat pipe bracket is used to expose a side of the heat dissipation pipe as a second heat dissipation surface, the second heat dissipation surface has a plurality of second grooves, and the heat pipe module is used to receive a heat source and conduct the heat source to the heat dissipation pipe; the graphite sheet is sandwiched between the first heat dissipation surface and the second heat dissipation surface, and under the action of the extrusion force, the graphite sheet is at least partially located in the first groove and in contact with each inner side surface and inner bottom surface of the first groove; the graphite sheet is at least partially located in the second groove and in contact with each inner side surface and inner bottom surface of the second groove.
[0007] In some embodiments, the heat dissipation module also includes a positioning piece, which passes through the heat pipe bracket from top to bottom and is assembled and installed with the fin structure; an elastomer is sandwiched between the positioning piece and the heat pipe bracket, and the elastomer is kept in a compressed state so that the heat pipe bracket and the fin structure always keep the graphite sheet in a squeeze state.
[0008] In some embodiments, the heat dissipation pipe is exposed on one side of the second heat dissipation surface and has a plurality of third grooves, and the opening of each of the third grooves is arranged toward the graphite sheet;
[0009] Under the extrusion of the elastic body, the graphite sheet is attached to each inner side surface and each inner bottom surface of each third groove.
[0010] In some embodiments, the entire surface area of the graphite sheet can simultaneously cover all of the first grooves, each of the second grooves, and each of the third grooves.
[0011] In some embodiments, the graphite sheet is formed by pressing graphite powder.
[0012] In some embodiments, a copper block and thermal grease are embedded and installed on the side of the heat pipe bracket facing away from the second heat dissipation surface. The copper block is in direct contact with the heat pipe, and the thermal grease is connected to the copper block. The thermal grease is used to directly contact the heat source.
[0013] In some embodiments, the heat pipe bracket has a first mounting groove, the first mounting groove is used to install the copper block and the thermal grease, and the copper block at least partially protrudes from the first mounting groove on a side close to the heat source.
[0014] In some embodiments, the heat pipe bracket further comprises a second mounting groove, wherein the second mounting groove is used to mount the heat pipe, and the number of the second mounting grooves matches the number of the heat pipes.
[0015] In some embodiments, the second mounting groove is located on one side of the second heat dissipation surface, the first mounting groove is located on the opposite side of the second heat dissipation surface of the heat pipe bracket, and the first mounting groove is connected to the second mounting groove.
[0016] In some embodiments, the fin structure is provided with a plurality of guide posts on the side where the first heat dissipation surface is located, and each of the guide posts is used to limit the installation position of the graphite sheet.
[0017] According to a second aspect of the present disclosure, an electronic device is provided, comprising the heat dissipation module as described above.
[0018] By using the heat dissipation module and electronic device disclosed in the present invention, the first heat dissipation surface of the fin structure is provided with a first groove, and the second heat dissipation surface of the heat pipe bracket is provided with a second groove, so that the graphite sheet sandwiched between the fin structure and the heat pipe bracket can be attached to each inner side surface and each inner bottom surface of each first groove and each second groove, thereby increasing the heat transfer surface area of the graphite as a whole and improving the heat transfer efficiency. In addition, the assembly structure of each component is adopted to avoid the structural dimensional instability caused by high-temperature welding, and has the advantage of simple processing and manufacturing.
[0019] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, in which:
[0021] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.
[0022] Figure 1 A schematic diagram of the assembly structure of the heat dissipation module according to an embodiment of the present disclosure is shown;
[0023] Figure 2 A schematic diagram of the exploded structure of the heat dissipation module according to an embodiment of the present disclosure is shown;
[0024] Figure 3 A schematic diagram of the axial structure of the heat pipe module according to an embodiment of the present disclosure is shown;
[0025] Figure 4 A schematic diagram of the axial structure of the fin structure of an embodiment of the present disclosure is shown.
[0026] Description of the numbers in the figure:
[0027] 10-heat dissipation module; 11-fin structure; 111-first heat dissipation surface; 1111-first groove; guide column-1112; 12-heat pipe module; 121-heat pipe bracket; 1211-first mounting groove; 1212-second mounting groove; 122-heat dissipation pipe; 1221-third groove; 123-second heat dissipation surface; 1231-second groove; 13-graphite sheet; 14-positioning piece; 15-elastomer; 16-copper block; 17-thermal grease; 18-PCBA board. DETAILED DESCRIPTION
[0028] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.
[0029] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between one or more components or features shown in the figure and other components or features. It should be understood that spatially relative terms include not only the orientation of the components as described in the figure, but also different orientations in use or operation. For example, if the components in the accompanying drawings are inverted as a whole, the components "above other components or features" or "above other components or features" will include the situation where the components are "below other components or structures" or "below other components or structures". Therefore, the exemplary term "above" may include both "above" and "below". In addition, these components or features may also be positioned at other different angles (e.g., rotated 90 degrees or other angles), and this article is intended to include all of these situations.
[0030] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, parts, components and / or combinations thereof.
[0031] It should be noted that the terms "first", "second", etc. in the specification, claims, and drawings of the present disclosure are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present disclosure described herein are used to be implemented in an order other than those illustrated or described herein.
[0032] In the description of the present disclosure, it is necessary to understand that the orientation or positional relationship indicated by the directional words is usually based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description. Unless otherwise stated, these directional words do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present disclosure; the directional words "inside" and "outside" refer to the inside and outside relative to the outline of each component itself.
[0033] At present, fanless industrial computers are increasingly being used for testing, detection, monitoring, automated operation robots or vehicles. However, although fanless can bring stability and low failure rate to the computing system, it places higher requirements on the thermal management of the computing unit. In order to design and manufacture a fanless edge computing device that can meet the heat dissipation requirements, the design of the main heat dissipation structure in contact with the CPU is particularly important. The structural module has strict requirements on the selection of materials, structural surface area design, and interface thermal conductive material selection. However, the use of heat pipes is to quickly diffuse heat in order to achieve the purpose of quickly taking away heat. Then the fixation of the heat pipe or heat pipe module in the heat dissipation module structure is related to the heat dissipation function of the entire structure.
[0034] Based on the above situation, the existing structural module processing will encounter the following problems: obvious structural size deformation, complex process, high cost and low yield.
[0035] To alleviate the above problems, refer to Figure 1-Figure 4 The embodiment of the present disclosure provides a heat dissipation module 10, which is mainly used for heat dissipation of fanless industrial computers. Specifically, the heat dissipation module 10 includes: a fin structure 11, a heat pipe module 12 and a graphite sheet 13. The graphite sheet 13 is sandwiched between the fin structure 11 and the heat pipe module 12, and the graphite sheet 13 can fill the surface between the two for heat transfer.
[0036] The fin structure 11 has a first heat dissipation surface 111, and the first heat dissipation surface 111 has a plurality of first grooves 1111, and the inner concave surface of the first groove 1111 is larger than the area of the corresponding open plane, thereby improving the heat dissipation efficiency. The heat pipe module 12 includes a heat pipe bracket 121 and a heat dissipation pipe 122 embedded in the heat pipe bracket 121; the heat pipe bracket 121 is used to expose the heat dissipation pipe 122 on one side as a second heat dissipation surface 123, and the second heat dissipation surface 123 has a plurality of second grooves 1231, and the inner concave surface of the second groove 1231 is larger than the area of the corresponding open plane, thereby improving the heat dissipation efficiency. In addition, the heat pipe module 12 is used to receive the heat source and conduct the heat source to the heat dissipation pipe 122, and the graphite sheet 13 is sandwiched between the first heat dissipation surface 111 and the second heat dissipation surface 123. Under the action of the extrusion force, the graphite sheet 13 is at least partially located in the first groove 1111 and contacts the inner side surfaces and inner bottom surface of the first groove 1111; and / or, the graphite sheet 13 is at least partially located in the second groove 1231 and contacts the inner side surfaces and inner bottom surface of the second groove 1231. Exemplarily, at least a part of the structure of the graphite sheet 13 can be completely covered on the inner side surfaces and inner bottom surfaces of each first groove 1111 and each second groove 1231.
[0037] Compared with the prior art, the heat dissipation module 10 and the electronic device of the embodiment of the present disclosure are used to set the first heat dissipation surface 111 of the fin structure 11 with the first groove 1111, and the second heat dissipation surface 123 of the heat pipe bracket 121 with the second groove 1231. In this way, the graphite sheet 13 sandwiched between the fin structure 11 and the heat pipe bracket 121 can be directly attached to the inner side surfaces and inner bottom surfaces of each first groove 1111 and each second groove 1231, thereby increasing the heat transfer surface area of the graphite as a whole and improving the heat transfer efficiency. In addition, the assembly structure of each component is adopted to avoid the structural dimensional instability caused by high-temperature welding, and has the advantage of simple processing and manufacturing.
[0038] Exemplarily, a plurality of guide posts 1112 are disposed on the first heat dissipation surface 111 of the fin structure 11 , and each guide post 1112 is used to limit the installation position of the graphite sheet, so that the graphite sheet can be completely covered on the first heat dissipation surface 111 .
[0039] The shapes of the first groove 1111 and the second groove 1231 of the embodiment of the present disclosure include but are not limited to one of a circle, a triangle, a quadrilateral, a pentagon or a hexagon. Alternatively, the shapes of the first groove 1111 and the second groove 1231 can also be irregular shapes as long as they can be realized during the processing and forming process.
[0040] Exemplarily, the first groove 1111 and the second groove 1231 may be micro grooves.
[0041] Graphite is used as the interface heat transfer material between the heat pipe module 12 and the fin structure 11, because graphite has a good thermal conductivity, which is higher than tin. In order to ensure the heat transfer efficiency, a larger contact area is required, and micro grooves are set on the surface of the heat pipe module 12 and the surface of the fin structure 11. Moreover, under the extrusion of the two, it can be ensured that the graphite is always in contact and heat transfer.
[0042] Specifically, the heat dissipation module 10 further includes a positioning member 14, which includes but is not limited to screws or bolts. The positioning member 14 is inserted into the heat pipe bracket 121 from top to bottom and extends out from the bottom of the heat pipe bracket 121, and at least a portion of the positioning member 14 extends out and is assembled and installed with the fin structure 11; an elastic body 15 is sandwiched between the positioning member 14 and the heat pipe bracket 121, and the elastic body 15 includes but is not limited to a spring or a spring.
[0043] By adopting the above solution, the elastic body 15 remains in a compressed state, so that the heat pipe bracket 121 and the fin structure 11 can jointly press the graphite sheet 13, and both always keep pressing the graphite sheet 13. In this way, the elastic body 15 can keep pressurizing the heat pipe module 12, ensuring that the graphite sheet 13 is completely and always in contact with the fin structure 11 and the heat pipe module 12 respectively.
[0044] Specifically, the heat dissipation pipe 122 further has a third groove 1221, and the third groove 1221 is formed with the heat dissipation pipe 122 and exposed on one side of the second heat dissipation surface 123. In order to further increase the heat dissipation surface effect, the opening of each third groove 1221 is arranged toward the graphite sheet 13, so that under the extrusion of the elastic body 15, the graphite sheet 13 is attached to each inner side surface and each inner bottom surface of each third groove 1221, which can increase the heat transfer area that can be covered by graphite for heat dissipation, so as to further improve the heat transfer efficiency.
[0045] The shape of the third groove 1221 in the embodiment of the present disclosure includes but is not limited to one of a circle, a triangle, a quadrilateral, a pentagon or a hexagon. Alternatively, the shape of the third groove 1221 can also be an irregular shape as long as it can be realized during the processing and forming process.
[0046] Specifically, the entire surface area of the graphite sheet 13 can meet the requirements of the heat dissipation surface of the heat dissipation module of the embodiment of the present disclosure, and the graphite sheet 13 includes but is not limited to being able to simultaneously cover each first groove 1111, each second groove 1231, and each third groove 1221. Further, under the action of the extrusion force, the heat dissipation surface of the graphite sheet 13 can directly adhere to, contact, or fill the inner concave surface of each first groove 1111, each second groove 1231, and each third groove 1221. This further satisfies the prerequisite that the graphite can cover each inner side surface and each inner bottom surface of each first groove 1111, each second groove 1231, and each third groove 1221.
[0047] The graphite sheet 13 of the embodiment of the present disclosure includes but is not limited to being constructed by pressing graphite powder. In this way, the graphite sheet 13 can be kept in a certain molding state, the graphite sheet is attached, and has a certain toughness, and can be diffused and filled under the pressure of the elastic member.
[0048] Specifically, the heat dissipation module of the embodiment of the present disclosure further includes a copper block 16 and a thermal grease 17, both of which are embedded and installed on the side of the heat pipe bracket 121 away from the second heat dissipation surface 123, wherein the copper block 16 directly contacts the top of the heat pipe 122, and the thermal grease 17 is connected to the top of the copper block 16, and the thermal grease 17 is used to directly contact the heat source. Exemplarily, the heat source can be a CPU chip on a PCBA board.
[0049] In this way, the temperature of the CPU chip on the PCBA board gradually increases during use and generates heat, which is conducted to the copper block 16 of the heat pipe module 12 through the thermal grease 17. The copper block 16 receives the heat and conducts the heat to the heat pipe 122. The heat pipe 122 receives the heat and quickly diffuses the heat to the left and right. In addition, the heat pipe 122 transfers the heat to the fin structure 11 through the graphite sheet 13. The fin structure 11 receives the heat and realizes heat exchange with the air on its own surface structure.
[0050] Considering the stable transfer of the heat source, the heat pipe bracket 121 has a first mounting groove 1211, and the first mounting groove 1211 is used to install the copper block 16 and the thermal grease 17. The first mounting groove 1211 of the embodiment of the present disclosure includes but is not limited to the shape of the copper block 16 and the thermal grease 17. Exemplarily, the first mounting groove 1211 can be square or rectangular or other regular or irregular shapes. Among them, the copper block 16 at least partially protrudes from the side of the first mounting groove 1211 close to the heat source, so that the heat source can directly transfer heat to the copper block 16. In this way, the copper block 16 and the thermal grease 17 can be stably installed on the heat pipe bracket 121.
[0051] Further considering the stable transfer of the heat source, the heat pipe support 121 also has a second mounting groove 1212, and the second mounting groove 1212 is used to install the heat pipe 122. The second mounting groove 1212 of the embodiment of the present disclosure includes but is not limited to the shape of the heat pipe 122. For example, the second mounting groove 1212 can be concave or other regular shapes or irregular shapes. Among them, the number of the second mounting grooves 1212 matches the number of the heat pipes 122. In this way, the heat pipe 122 can be stably installed on the heat pipe support 121.
[0052] Furthermore, the second mounting groove 1212 is formed on the side where the second heat dissipation surface 123 is located, and the first mounting groove 1211 is formed on the opposite side of the second heat dissipation surface 123 of the heat pipe bracket 121, and the first mounting groove 1211 is connected to the second mounting groove 1212. In this way, the heat on the chip on the PCBA board can be directly transferred to the heat dissipation pipe 122 via the thermal grease 17 and the copper block 16.
[0053] The disclosed embodiment also provides an electronic device. For example, the electronic device can be a fanless industrial computer, including the heat dissipation module 10 as described above. The heat dissipation module 10 is installed at the system end, and the heat dissipation module is mainly used to dissipate heat and cool down the CPU chip on the PCBA board in the system end. In actual application, the heat of the CPU chip on the PCBA board is transferred to the copper block 16 of the heat pipe module 12 through the thermal grease 17, and the copper block 16 is transferred to the heat pipe 122. The heat pipe 122 quickly diffuses the heat to the left and right. Further, the heat pipe 122 transfers the heat to the fin structure 11 through the graphite sheet 13. The surface of the fin structure 11 realizes heat exchange with the air, which can achieve all the technical effects of the above-mentioned heat dissipation module 10.
[0054] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this disclosure can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of this disclosure can be achieved, and this document is not limited here.
[0055] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0056] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.
Claims
1. A heat dissipation module, characterized in that: include: A fin structure, wherein the fin structure has a first heat dissipation surface, and the first heat dissipation surface has a plurality of first grooves; A heat pipe module, the heat pipe module comprising a heat pipe bracket and a heat pipe embedded in the heat pipe bracket; the heat pipe bracket is used to expose a side of the heat pipe as a second heat dissipation surface, the second heat dissipation surface has a plurality of second grooves, and the heat pipe module is used to receive a heat source and conduct the heat from the heat source to the heat pipe; A graphite sheet, wherein the graphite sheet is sandwiched between the first heat dissipation surface and the second heat dissipation surface. Under the action of the extrusion force, the graphite sheet is at least partially located in the first groove and contacts with each inner side surface and inner bottom surface of the first groove; the graphite sheet is at least partially located in the second groove and contacts with each inner side surface and inner bottom surface of the second groove.
2. The heat dissipation module according to claim 1, characterized in that: The heat dissipation module also includes a positioning member, which passes through the heat pipe bracket from top to bottom and is assembled with the fin structure; an elastic body is sandwiched between the positioning member and the heat pipe bracket, and the elastic body is kept in a compressed state so that the heat pipe bracket and the fin structure always keep the graphite sheet in a compressed state.
3. The heat dissipation module according to claim 2, characterized in that: The heat dissipation pipe is exposed on one side of the second heat dissipation surface and has a plurality of third grooves, and the opening of each of the third grooves is arranged toward the graphite sheet; Under the extrusion of the elastic body, the graphite sheet is attached to each inner side surface and each inner bottom surface of each third groove.
4. The heat dissipation module according to claim 3, characterized in that: The entire surface area of the graphite sheet can cover all of the first grooves, the second grooves, and the third grooves at the same time.
5. The heat dissipation module according to claim 1, characterized in that: A copper block and thermal grease are embedded and installed on the side of the heat pipe bracket away from the second heat dissipation surface. The copper block directly contacts the top of the heat dissipation pipe, and the thermal grease is connected to the top of the copper block. The thermal grease is used to directly contact the heat source.
6. The heat dissipation module according to claim 5, characterized in that: The heat pipe bracket has a first mounting groove, and the first mounting groove is used to install the copper block and the thermal grease. The copper block at least partially protrudes from the first mounting groove on a side close to the heat source.
7. The heat dissipation module according to claim 6, characterized in that: The heat pipe bracket also includes a second mounting groove, and the second mounting groove is used for mounting the heat dissipation pipe.
8. The heat dissipation module according to claim 7, characterized in that: The second mounting groove is located on one side of the second heat dissipation surface, the first mounting groove is located on the opposite side of the second heat dissipation surface, and the first mounting groove is communicated with the second mounting groove.
9. The heat dissipation module according to claim 1, characterized in that: The fin structure is provided with a plurality of guide posts on the side where the first heat dissipation surface is located, and each of the guide posts is used to limit the installation position of the graphite sheet.
10. An electronic device, characterized in that: Comprising the heat dissipation module as described in any one of claims 1-9.