Computer board card module

Abstract

The utility model provides a computer board card module. The computer board card module comprises an installation substrate and a heat dissipation assembly, the heat dissipation assembly is arranged on the installation substrate, the heat dissipation assembly comprises a heat dissipation substrate, a fixed substrate, two supporting blocks and heat dissipation fins, the heat dissipation substrate is arranged at the bottom of the installation substrate, the fixed substrate is arranged at the bottom of the heat dissipation substrate, and the two supporting blocks are arranged on the fixed substrate. The two supporting blocks are both installed on the top of the fixed base plate, the tops of the two supporting blocks are both connected with the bottom of the heat dissipation base plate, and the heat dissipation fins are installed at the bottom of the heat dissipation base plate. The computer board card module provided by the utility model has the advantages that the heat generated by the mounting substrate can be dissipated through the heat dissipation substrate and the heat dissipation fins, and the heat dissipation air channel is formed by the heat dissipation substrate, the heat dissipation fins and the fixed substrate by means of the supporting blocks, so that external airflow can conveniently take away the heat on the heat dissipation fins through the heat dissipation air channel, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of boards and cards, and in particular relates to a computer board and card module. Background Art

[0002] COMExpress is defined as an embedded computer module, abbreviated as COME. Currently, most COME boards are 95mm*95mm or larger in size. For small embedded designs, the board size is too large and cannot be used normally.

[0003] A computer board is disclosed in the utility model patent with announcement number CN 216387980 U, including a substrate, a processing module, a programmable logic chip, a hard disk controller, an onboard hard disk, a USB controller, a power module and a connector. The processing module, the programmable logic chip, the hard disk controller, the onboard hard disk, the USB controller, the power module and the connector are all arranged on the substrate; the programmable logic chip, the hard disk controller, the USB controller and the power module are all electrically connected to the processing module; the onboard hard disk is electrically connected to the hard disk controller; the programmable logic chip, the hard disk controller, the USB controller and the power module are all electrically connected to the connector. The computer board of the utility model can meet the functional requirements of the COME board, and integrates the minimum system of a microcomputer in a small size, has rich interfaces, can effectively reduce the bottom board components, and greatly reduce the design difficulty of the matching board.

[0004] Regarding the above-mentioned related technologies, the utility model inventor believes that there are the following defects:

[0005] 1. The above-mentioned substrate will generate a lot of heat when working, and the above-mentioned technology lacks a corresponding heat dissipation structure, so the heat generated by the substrate cannot be effectively dissipated, reducing the service life of the substrate.

[0006] Therefore, it is necessary to provide a new computer board module to solve the above technical problems. Utility Model Content

[0007] The technical problem solved by the utility model is to provide a computer board module which can dissipate the heat generated by a mounting substrate through a heat dissipation substrate and heat dissipation fins, and a heat dissipation duct is formed by the heat dissipation substrate and the heat dissipation fins with a fixed substrate by means of a support block, so that external airflow can pass through the heat dissipation duct to take away the heat on the heat dissipation fins, thereby improving the heat dissipation effect.

[0008] In order to solve the above technical problems, the computer board module provided by the utility model includes: an installation substrate and a heat dissipation component, the heat dissipation component is arranged on the installation substrate, the heat dissipation component includes a heat dissipation substrate, a fixed substrate, two support blocks and heat dissipation fins, the heat dissipation substrate is arranged on the bottom of the installation substrate, the fixed substrate is arranged on the bottom of the heat dissipation substrate, the two support blocks are both installed on the top of the fixed substrate, the tops of the two support blocks are connected to the bottom of the heat dissipation substrate, the heat dissipation fins are installed on the bottom of the heat dissipation substrate, and a through opening is opened on the installation substrate.

[0009] As a further solution of the utility model, two internally threaded mounting tubes are installed on the fixed base plate, and two fastening bolts are provided on the mounting base plate. The bottom ends of the fastening bolts pass through the mounting base plate and the heat dissipation base plate and extend into the fastening bolts. The fastening bolts are threadedly connected to the internally threaded mounting tubes, and the fastening bolts are slidably connected to the mounting base plate and the heat dissipation base plate.

[0010] As a further solution of the utility model, a PC slot, a logic module, a fixed storage module, a processing module, a random storage module and a protocol module are provided on the installation substrate, the PC slot is connected to the logic module, the logic module is connected to the fixed storage module, the processing module and the random storage module, the fixed storage module is connected to the processing module, the random storage module is connected to the processing module, and the processing module is connected to the protocol module.

[0011] As a further solution of the utility model, the logic module is a logic chip, the fixed storage module is a fixed memory, and the model of the fixed memory is AM29F400B.

[0012] As a further solution of the utility model, the processing module is a communication card board processor, the model of the communication card board processor is MCF5206, the random storage module is a random access memory, and the model of the random access memory is CY7C025.

[0013] As a further solution of the utility model, the protocol module adopts an ARINC429 chip composed of two chips: DEI 1016 and BD429.

[0014] Compared with the related art, the computer board module provided by the utility model has the following advantages:

[0015] Beneficial effects:

[0016] 1. The utility model has a simple structure by setting a heat dissipation component. The heat generated by the mounting substrate can be dissipated by attaching the heat dissipation substrate and the heat dissipation fins to the surface of the heating area of ​​the mounting substrate. In addition, since the heat dissipation substrate, the heat dissipation fins and the fixed substrate form a heat dissipation duct with the aid of the support block, it is convenient for the external air flow to pass through the heat dissipation duct to take away the heat on the heat dissipation fins, thereby improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with the accompanying drawings.

[0018] Figure 1 The structure of the utility model is shown in FIG. Figure 1 ;

[0019] Figure 2 The structure of the utility model is shown in FIG. Figure 2 ;

[0020] Figure 3 It is a schematic diagram of the connection framework of the PC slot, logic module, fixed storage module, processing module, random storage module and protocol module in the utility model.

[0021] In the figure: 1. Installation substrate; 2. Heat dissipation substrate; 3. Fixed substrate; 4. Support block; 5. Heat dissipation fins; 6. Internal thread mounting cylinder; 7. Fastening bolts; 8. PC slot; 9. Logic module; 10. Fixed storage module; 11. Processing module; 12. Random storage module; 13. Protocol module. DETAILED DESCRIPTION

[0022] Please refer to Figure 1 , Figure 2 and Figure 3 ,in, Figure 1 The structure of the utility model is shown in FIG. Figure 1 ; Figure 2 The structure of the utility model is shown in FIG. Figure 2 ; Figure 3 The schematic diagram of the connection framework of the PC slot, logic module, fixed storage module, processing module, random storage module and protocol module in the utility model. The computer board module includes: a mounting substrate 1 and a heat dissipation component, the heat dissipation component is arranged on the mounting substrate 1, the heat dissipation component includes a heat dissipation substrate 2, a fixed substrate 3, two support blocks 4 and heat dissipation fins 5, the heat dissipation substrate 2 is arranged on the bottom of the mounting substrate 1, the fixed substrate 3 is arranged on the bottom of the heat dissipation substrate 2, the two support blocks 4 are both mounted on the top of the fixed substrate 3, the tops of the two support blocks 4 are both connected to the bottom of the heat dissipation substrate 2, the heat dissipation fins 5 are mounted on the bottom of the heat dissipation substrate 2, and a through opening is opened on the mounting substrate 1.

[0023] Two internally threaded mounting tubes 6 are installed on the fixed substrate 3, and two fastening bolts 7 are provided on the mounting substrate 1. The bottom ends of the fastening bolts 7 pass through the mounting substrate 1 and the heat dissipation substrate 2 and extend into the fastening bolts 7. The fastening bolts 7 are threadedly connected to the internally threaded mounting tubes 6, and the fastening bolts 7 are slidably connected to the mounting substrate 1 and the heat dissipation substrate 2.

[0024] The mounting substrate 1 is provided with a PC slot 8, a logic module 9, a fixed storage module 10, a processing module 11, a random storage module 12 and a protocol module 13. The PC slot 8 is connected to the logic module 9, the logic module 9 is connected to the fixed storage module 10, the processing module 11 and the random storage module 12, the fixed storage module 10 is connected to the processing module 11, the random storage module 12 is connected to the processing module 11, and the processing module 11 is connected to the protocol module 13.

[0025] The logic module 9 is a logic chip, the fixed storage module 10 is a fixed memory, and the model of the fixed memory is AM29F400B.

[0026] The logic chip and the PC slot use EPF10K to implement the control signals of the PC slot and the communication board. The fixed storage module 10 supports sudden access and supports two access formats: 8-bit byte and 16-bit byte.

[0027] The processing module 11 is a communication card board processor, the model of the communication card board processor is MCF5206, and the random access memory module 12 is a random access memory, the model of the random access memory is CY7C025.

[0028] The random access storage module 12 also supports two access formats: 8-bit byte and 16-bit byte.

[0029] The protocol module 13 uses an ARI NC429 chip composed of two chips: DEI 1016 and BD429.

[0030] By fixing the substrate 3 on the board, the heat generated by the mounting substrate 1 is dissipated by having the heat dissipation substrate 2 and the heat dissipation fins 5 attached to the surface of the heating area of ​​the mounting substrate 1, and since the heat dissipation substrate 2, the heat dissipation fins 5 and the fixed substrate 3 form a heat dissipation duct with the aid of the support block 4, it is convenient for external airflow to pass through the heat dissipation duct to take away the heat on the heat dissipation fins 5, thereby improving the heat dissipation effect.

[0031] The protocol module 13 implements two-way data transmission and four-way data receiving channels of the communication board, and is responsible for format conversion between parallel user data of the processing module 11 and bus serial data of the protocol module 13 .

[0032] The processing module 11 is responsible for saving the protocol data read from the protocol module 13 into the random access memory module 12, and notifying the PC to take the protocol data through the logic module 9. At the same time, the processing module 11 reads the protocol data to be sent saved by the PC, and then loads it into the protocol module 13 for sending.

[0033] The fixed storage module 10 stores the running program of the processing module 11. The non-volatile storage ensures that the processing module 11 can read the code from here to initialize the system each time the communication board is powered on or reset. The random storage module 12 of the communication board is used to buffer and store the received and sent protocol data. In addition, it also provides a mailbox communication mechanism between the processing module 11 and the PC slot 8 for transmitting the communication board status or protocol chip control information.

[0034] The logic module 9 is responsible for generating the control signals required by the communication board and device and realizing the logical conversion of the PC slot 8 interface. The PC slot 8 access signal is converted into a random storage module 12 access signal through the logic module 9, thereby achieving the purpose of accessing protocol data. In addition, the logic module 9 provides auxiliary control signals for the board and other devices, such as the read and write signals of the memory.

[0035] It should be noted that the equipment structure and drawings of the utility model mainly describe the principle of the utility model. In terms of the technology of the design principle, the settings of the power mechanism, power supply system and control system of the device are not fully described. On the premise that the technical personnel in this field understand the principle of the above utility model, the details of the power mechanism, power supply system and control system can be clearly known. The control method of the application document is automatic control through a controller, and the control circuit of the controller can be realized by simple programming by the technical personnel in this field;

[0036] The standard parts used therein can all be purchased from the market and can be customized according to the instructions and drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art, and the structures and principles of the components known to technical personnel in this field can be known by these technical personnel through technical manuals or through conventional experimental methods.

[0037] Although the embodiments of the present invention have been shown and described, it is understood by those skilled in the art that various changes, modifications, substitutions and variations or direct or indirect applications may be made to these embodiments without departing from the principles and spirit of the present invention. In other related technical fields, the scope of the present invention is defined by the attached claims and their equivalents, which are equally included in the scope of patent protection of the present invention.

Claims

1. A computer board module, characterized in that: include: A mounting substrate and a heat dissipation assembly, wherein the heat dissipation assembly is arranged on the mounting substrate, and the heat dissipation assembly includes a heat dissipation substrate, a fixed substrate, two support blocks and heat dissipation fins. The heat dissipation substrate is arranged on the bottom of the mounting substrate, and the fixed substrate is arranged on the bottom of the heat dissipation substrate. Both support blocks are mounted on the top of the fixed substrate, and the tops of the two support blocks are connected to the bottom of the heat dissipation substrate. The heat dissipation fins are mounted on the bottom of the heat dissipation substrate, and a through opening is opened on the mounting substrate.

2. The computer board module according to claim 1, characterized in that: Two internally threaded mounting tubes are installed on the fixed base plate, and two fastening bolts are provided on the mounting base plate. The bottom ends of the fastening bolts pass through the mounting base plate and the heat dissipation base plate and extend into the fastening bolts. The fastening bolts are threadedly connected to the internally threaded mounting tubes, and the fastening bolts are slidably connected to the mounting base plate and the heat dissipation base plate.

3. The computer board module according to claim 1, characterized in that: The installation substrate is provided with a PC slot, a logic module, a fixed storage module, a processing module, a random storage module and a protocol module, the PC slot is connected to the logic module, the logic module is connected to the fixed storage module, the processing module and the random storage module, the fixed storage module is connected to the processing module, the random storage module is connected to the processing module, and the processing module is connected to the protocol module.

4. The computer board module according to claim 3, characterized in that: The logic module is a logic chip, the fixed storage module is a fixed memory, and the model of the fixed memory is AM29F400B.

5. The computer board module according to claim 3, characterized in that: The processing module is a communication card board processor, the model of the communication card board processor is MCF5206, the random access memory module is a random access memory, the model of the random access memory is CY7C025.

6. The computer board module according to claim 3, characterized in that: The protocol module adopts an ARINC429 chip composed of two chips, DEI 1016 and BD429.

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