High-power aluminum thermal circuit board air cooling radiator

Abstract

The utility model relates to a high-power aluminum thermal circuit board air-cooled radiator, which belongs to the technical field of thermal management, the radiator is matched with an aluminum thermal circuit board, a micro-channel structure taking a self-organizing thermodynamic system (SOTS) as a theoretical basis is arranged in the radiator, the aluminum thermal circuit board is manufactured into a U shape through a bending process, and the aluminum thermal circuit board and radiating fins are welded into a whole through low-temperature tin soldering. A traditional heat pipe structure is replaced, and therefore the heat exchange area can be increased, and wind resistance can be effectively reduced. The aluminum thermal circuit board is formed through a brazing process and is internally filled with a working medium, heat generated by an electronic element is quickly transferred to the radiating fin end, the heat is effectively taken away through a flow field of a fan, and then the electronic element is effectively cooled.

Description

Technical Field

[0001] The utility model relates to a high-power aluminum thermal circuit board air-cooled radiator, in particular to a high-power consumption, low-wind resistance air-cooled radiator equipped with a bent aluminum thermal circuit board, belonging to the technical field of thermal management. Background Art

[0002] As the power consumption of electronic product chips is getting higher and higher, some consumer electronics also have higher requirements for the quietness of air-cooled radiators (such as photography lighting equipment, etc.). Although water-cooled radiators can effectively solve such problems, air-cooled radiators still have a place in the field of thermal management due to cost and safety considerations.

[0003] Traditional air-cooled heat sinks have to take into account high power consumption and low fan air volume at the same time, and the heat dissipation challenge is becoming increasingly high. If the overheating problem caused by limited heat dissipation conditions cannot be handled, the life of the electronic hardware will be reduced or even damaged.

[0004] Due to the special working environment requirements (such as the photography lighting industry), high-power electronic components require silent cooling fans, low fan speed and small air volume. At the same time, the power consumption of electronic components in photography lights is high. Traditional heat pipe radiators generally improve thermal conductivity by stacking a large number of heat pipes. However, a large number of heat pipes run through the heat dissipation module, which will increase the flow field resistance in the heat dissipation module and make the weight of the entire radiator too large.

[0005] Today, traditional vapor chamber and heat pipe technology and production have become mature, but there are still many deficiencies and difficulties in using them in special scenarios. Due to this special heat dissipation requirement, the pressure on traditional heat dissipation and structure is increasing day by day. Utility Model Content

[0006] The purpose of the utility model is to use a heat circuit plate to replace the traditional heat pipe structure in a bent form, effectively reduce the flow field resistance without losing the thermal conductivity efficiency, achieve higher heat dissipation efficiency and easily meet the effect of special working environment; the all-aluminum heat circuit plate replaces a large number of heat pipes, making the module lightweight.

[0007] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0008] Technical Solution 1

[0009] A high-power aluminum thermal path plate air-cooled radiator, characterized in that it comprises: a heat dissipation fin group, a U-shaped aluminum thermal path plate, a lower base plate, a fan, and a fan bracket; the heat dissipation fin group is connected to the U-shaped aluminum thermal path plate, the lower base plate is connected to the U-shaped aluminum thermal path plate, the fan bracket is connected to the heat dissipation fin group, and the fan is connected to the fan bracket.

[0010] Technical Solution 2

[0011] A high-power aluminum thermal path plate air-cooled radiator, characterized in that it comprises: a heat dissipation fin group, a U-shaped aluminum thermal path plate, a lower base plate, a fan, and a fan bracket; the heat dissipation fin group is connected to the U-shaped aluminum thermal path plate, the lower base plate is connected to the U-shaped aluminum thermal path plate, the fan bracket is connected to the heat dissipation fin group, and the fan is connected to the fan bracket.

[0012] Preferably, the U-shaped aluminum heating circuit plate includes a first U-shaped aluminum heating circuit plate and a second U-shaped aluminum heating circuit plate.

[0013] Preferably, there are two fans and two fan brackets, which are a blowing fan and a suction fan respectively.

[0014] Preferably, there are two fan brackets, namely a first fan bracket and a second fan bracket.

[0015] Preferably, the heat dissipation fin group consists of five heat dissipation fins, namely a first heat dissipation fin, a second heat dissipation fin, a third heat dissipation fin, a fourth heat dissipation fin, and a fifth heat dissipation fin.

[0016] Preferably, the first heat sink fin is soldered to the second U-shaped aluminum thermal circuit board with solder paste; the second heat sink fin is soldered to the second U-shaped aluminum thermal circuit board and the first U-shaped aluminum thermal circuit board with solder paste; the third heat sink fin is soldered to the first U-shaped aluminum thermal circuit board with solder paste; the fourth heat sink fin is soldered to the second U-shaped aluminum thermal circuit board and the first U-shaped aluminum thermal circuit board with solder paste; the fifth heat sink fin is soldered to the second U-shaped aluminum thermal circuit board with solder paste; the lower base plate is soldered to the second U-shaped aluminum thermal circuit board with solder paste; the first fan bracket is soldered to the first heat sink fin, the second heat sink fin, the third heat sink fin, the fourth heat sink fin and the fifth heat sink fin with solder paste; the second fan bracket is soldered to the first heat sink fin, the second heat sink fin, the third heat sink fin, the fourth heat sink and the fifth heat sink fin with solder paste.

[0017] Preferably, it also includes an upper base plate, a third U-shaped aluminum heating circuit plate and a fourth U-shaped aluminum heating circuit plate.

[0018] Preferably, the first heat sink fin is soldered to the third U-shaped aluminum thermal circuit board and the second U-shaped aluminum thermal circuit board with solder paste; the second heat sink fin is soldered to the second U-shaped aluminum thermal circuit board and the first U-shaped aluminum thermal circuit board with solder paste; the third heat sink fin is soldered to the first U-shaped aluminum thermal circuit board with solder paste; the fourth heat sink fin is soldered to the second U-shaped aluminum thermal circuit board and the first U-shaped aluminum thermal circuit board with solder paste; the fifth heat sink fin is soldered to the second U-shaped aluminum thermal circuit board and the fourth U-shaped aluminum thermal circuit board with solder paste; the upper base plate is soldered to the third U-shaped aluminum thermal circuit board and the fourth U-shaped aluminum thermal circuit board with solder paste; the lower base plate is soldered to the second U-shaped aluminum thermal circuit board, the third U-shaped aluminum thermal circuit board and the fourth U-shaped aluminum thermal circuit board with solder paste; the second fan bracket is soldered to the first heat sink fin, the second heat sink fin, the third heat sink fin, the fourth heat sink fin and the fifth heat sink fin.

[0019] Preferably, the blowing fan is locked to the first fan bracket via fan screws and threaded holes; the suction fan is locked to the second fan bracket via fan screws and threaded holes.

[0020] Preferably, the first fan bracket and the second fan bracket are provided with mounting holes for fixing to the housing of the photographic equipment.

[0021] Preferably, the U-shaped aluminum heat dissipation plate is embedded with a self-organized thermodynamic system (SOTS) microchannel.

[0022] Beneficial effects:

[0023] The high-power aluminum heat sink air-cooled radiator of the utility model has higher heat conduction efficiency and is lighter overall. The aluminum heat sink bending forming process is simple, and production and assembly are convenient.

[0024] The present invention is further described below through the accompanying drawings and specific embodiments, but it does not mean to limit the protection scope of the present invention. Unless otherwise specified, the implementation conditions and devices in the embodiments are conventional implementation conditions in the art and conventional devices available on the market. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a three-dimensional structural schematic diagram of the high-power aluminum heat path plate air-cooled radiator in Example 1 of the utility model.

[0026] Figure 2 It is a three-dimensional structural schematic diagram of the high-power aluminum heat plate air-cooled radiator in Example 1 of the utility model from another perspective.

[0027] Figure 3 It is a front structural schematic diagram of the high-power aluminum heat plate air-cooled radiator in Example 1 of the utility model.

[0028] Figure 4 It is a schematic diagram of the assembly structure of the upper base plate and the first fan bracket in the high-power aluminum heat path plate air-cooled radiator in Example 1 of the utility model.

[0029] Figure 5 It is a schematic diagram of the installation structure of the high-power aluminum heat plate air-cooled radiator and the fan in Example 1 of the utility model.

[0030] Figure 6 It is a structural schematic diagram of the first U-shaped aluminum heat sink in the high-power aluminum heat sink air-cooled radiator in Example 1 of the utility model.

[0031] Figure 7 It is a structural schematic diagram of the second U-shaped aluminum heat sink in the high-power aluminum heat sink air-cooled radiator in Example 1 of the utility model.

[0032] Figure 8It is a structural schematic diagram of the third U-shaped aluminum heat sink in the high-power aluminum heat sink air-cooled radiator in Example 1 of the utility model.

[0033] Figure 9-1 It is a structural schematic diagram of a first U-shaped aluminum heat sink with a micro-groove structure (SOTS) in a high-power aluminum heat sink air-cooled radiator in Example 1 of the utility model.

[0034] Figure 9-2 It is a structural schematic diagram of the AA section of the first U-shaped aluminum heat sink with a micro-groove structure (SOTS) in the high-power aluminum heat sink air-cooled radiator in Example 1 of the utility model.

[0035] Fig.10 It is a side structural schematic diagram of the high-power aluminum heat circuit plate air-cooled radiator in Example 2 of the utility model.

[0036] Fig.11 It is a front structural schematic diagram of the high-power aluminum heat circuit plate air-cooled radiator in Example 2 of the utility model.

[0037] Fig.12 It is a schematic diagram of the installation structure of the fan in the high-power aluminum heat circuit plate air-cooled radiator in Example 2 of the utility model.

[0038] Main parts name:

[0039] 10 upper substrate 101 first through hole in upper substrate

[0040] 102 The second through hole of the upper substrate 103 The third through hole of the upper substrate

[0041] 104 first threaded hole on the upper substrate 105 second threaded hole on the upper substrate

[0042] 106 The third threaded hole on the upper substrate 107 The fourth threaded hole on the upper substrate

[0043] 20M4×15mm screws 30 first fan bracket

[0044] 301 first fan bracket first threaded hole 302 first fan bracket second threaded hole

[0045] 303 The third threaded hole of the first fan bracket 304 The fourth threaded hole of the first fan bracket

[0046] 305 fifth threaded hole of the first fan bracket 306 sixth threaded hole of the first fan bracket

[0047] 307 seventh threaded hole of the first fan bracket 308 eighth threaded hole of the first fan bracket

[0048] 309 the ninth threaded hole of the first fan bracket 3010 the tenth threaded hole of the first fan bracket

[0049] 3011 Eleventh threaded hole of the first fan bracket 3012 Twelfth threaded hole of the first fan bracket

[0050] 3013 First fan bracket first stud 3014 First fan bracket second stud

[0051] 3015 First fan bracket Third stud 40 Second fan bracket

[0052] 401 second fan bracket first threaded hole 402 second fan bracket second threaded hole

[0053] 403 The third threaded hole of the second fan bracket 404 The fourth threaded hole of the second fan bracket

[0054] 405 fifth threaded hole of the second fan bracket 406 sixth threaded hole of the second fan bracket

[0055] 407 seventh threaded hole of the second fan bracket 408 eighth threaded hole of the second fan bracket

[0056] 409 the ninth threaded hole of the second fan bracket 4010 the tenth threaded hole of the second fan bracket

[0057] 4011 Eleventh threaded hole of the second fan bracket 4012 Twelfth threaded hole of the second fan bracket

[0058] 501 first heat dissipation fin 502 second heat dissipation fin

[0059] 503 third heat dissipation fin 504 fourth heat dissipation fin

[0060] 505 fifth heat sink fin 601 third U-shaped aluminum heat plate

[0061] 602 Fourth U-shaped aluminum heat dissipation plate 70 Second U-shaped aluminum heat dissipation plate

[0062] 80 first U-shaped aluminum heat circuit board 90 lower base plate

[0063] 901 first threaded hole of lower substrate 902 second threaded hole of lower substrate

[0064] 903 The third threaded hole of the lower substrate 904 The fourth threaded hole of the lower substrate

[0065] 1101 Fan screw 1201 Blowing fan

[0066] 1202 suction fan 130 third fan bracket

[0067] 1301 first threaded hole of the third fan bracket 1302 second threaded hole of the third fan bracket

[0068] 1303 third fan bracket third threaded hole 1304 third fan bracket third threaded hole

[0069] 1305 The fifth threaded hole of the third fan bracket 1306 The sixth threaded hole of the third fan bracket

[0070] 1307 seventh threaded hole of the third fan bracket 1308 eighth threaded hole of the third fan bracket

[0071] 140 Fourth fan bracket

[0072] 1401 the first threaded hole of the fourth fan bracket 1402 the second threaded hole of the fourth fan bracket

[0073] 1403 The third threaded hole of the fourth fan bracket 1404 The third threaded hole of the fourth fan bracket

[0074] 1405 The fifth threaded hole of the fourth fan bracket 1406 The sixth threaded hole of the fourth fan bracket

[0075] 1407 seventh threaded hole of the fourth fan bracket 1408 eighth threaded hole of the fourth fan bracket DETAILED DESCRIPTION

[0076] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0077] Unless otherwise specified, in the embodiments of the present invention, the components used are all conventional components available on the market in the technical field, and the connections between the components are all conventional connections.

[0078] Example 1

[0079] like Figure 1 As shown, it is a three-dimensional structural schematic diagram of the high-power aluminum heat plate air-cooled radiator in Example 1 of the utility model; Figure 2 As shown, it is a three-dimensional structural schematic diagram of another perspective of the high-power aluminum heat plate air-cooled radiator in Example 1 of the utility model; Figure 3 As shown, it is a schematic diagram of the front structure of the high-power aluminum heat plate air-cooled radiator in Example 1 of the utility model; Figure 4 As shown, it is a schematic diagram of the assembly structure of the upper base plate and the first fan bracket in the high-power aluminum heat path plate air-cooled radiator in Example 1 of the utility model; Figure 5 As shown, it is a schematic diagram of the installation structure of the high-power aluminum heat plate air-cooled radiator and the fan in Example 1 of the utility model; Figure 6 As shown, it is a schematic diagram of the structure of the first U-shaped aluminum heat plate in the high-power aluminum heat plate air-cooled radiator in Example 1 of the utility model; Figure 7 As shown, it is a schematic diagram of the structure of the second U-shaped aluminum heat plate in the high-power aluminum heat plate air-cooled radiator in Example 1 of the utility model; Figure 8 As shown, it is a schematic diagram of the structure of the third U-shaped aluminum heat plate in the high-power aluminum heat plate air-cooled radiator in the embodiment of the utility model; Figure 9-1 As shown, it is a structural schematic diagram of the first U-shaped aluminum heat sink with a micro-groove structure (SOTS) in the high-power aluminum heat sink air-cooled heat sink in Example 1 of the utility model; Figure 9-2 , which is a schematic structural diagram of the AA section in the first U-shaped aluminum heat sink with a micro-groove structure (SOTS) in the high-power aluminum heat sink air-cooled heat sink in Example 1 of the utility model;

[0080] The high-power aluminum thermal path plate air-cooled radiator in Example 1 of the utility model is a radiator used in photographic light equipment, and its parts include: an upper base plate 10, an M4×15mm screw 20, a first fan bracket 30, a second fan bracket 40, a first heat dissipation fin 501, a second heat dissipation fin 502, a third heat dissipation fin 503, a fourth heat dissipation fin 504, a fifth heat dissipation fin 505, a third U-shaped aluminum thermal path plate 601 (embedded with a self-organized thermal dynamics system (SOTS) microchannel), a fourth U-shaped aluminum thermal path plate 602 (embedded with a self-organized thermal dynamics system (SOTS) microchannel), a second U-shaped aluminum thermal path plate 70 (embedded with a self-organized thermal dynamics system (SOTS) microchannel), a first U-shaped aluminum thermal path plate 80 (embedded with a self-organized thermal dynamics system (SOTS) microchannel), a lower base plate 90, a fan screw 1101, a blowing fan 1201, and an air suction fan 1202;

[0081] The high-power aluminum heat plate air-cooled radiator in Example 1 of the utility model is assembled by solder paste welding, wherein the first heat dissipation fin 501 is soldered with the third U-shaped aluminum heat plate 601 and the second U-shaped aluminum heat plate 70; the second heat dissipation fin 502 is soldered with the second U-shaped aluminum heat plate 70 and the first U-shaped aluminum heat plate 80; the third heat dissipation fin 503 is soldered with the first U-shaped aluminum heat plate 80; the fourth heat dissipation fin 504 is soldered with the second U-shaped aluminum heat plate 70 and the first U-shaped aluminum heat plate 80; the fifth heat dissipation fin 506 is soldered with the second U-shaped aluminum heat plate 70 and the first U-shaped aluminum heat plate 80; The heat dissipation fin 505 is soldered with the second U-shaped aluminum heat dissipation circuit board 70 and the fourth U-shaped aluminum heat dissipation circuit board 602; the upper substrate 10 is soldered with the third U-shaped aluminum heat dissipation circuit board 601 and the fourth U-shaped aluminum heat dissipation circuit board 602; the lower substrate 90 is soldered with the second U-shaped aluminum heat dissipation circuit board 70, the third U-shaped aluminum heat dissipation circuit board 601 and the fourth U-shaped aluminum heat dissipation circuit board 602; the second fan bracket 40 is soldered with the first heat dissipation fin 501, the second heat dissipation fin 502, the third heat dissipation fin 503, the fourth heat dissipation fin 504 and the fifth heat dissipation fin 505;

[0082] Further, such as Figure 4 , which is a schematic diagram of the assembly structure of the upper base plate and the first fan bracket in the high-power aluminum heat path plate air-cooled radiator in Example 1 of the utility model; the upper base plate 10 is locked together with the first fan bracket 30 by three M4×15mm screws 20 passing through the first through hole 101, the second through hole 102, the third through hole 103 of the upper base plate and the first stud 3013, the second stud 3014, the third stud 3015 of the first fan bracket through the first through hole 101, the second through hole 102, the third through hole 103 of the upper base plate, to ensure the installation accuracy of the fan hole;

[0083] like Figure 5 As shown, it is a schematic diagram of the installation structure of the high-power aluminum thermal circuit board air-cooled radiator and the fan in Example 1 of the utility model, which illustrates the assembly method of the blowing fan 1201 and the suction fan 1202. The blowing fan 1201 is locked to the high-power aluminum thermal circuit board air-cooled radiator in Example 1 of the utility model by using four fan screws 1101 and the first threaded hole 301 of the first fan bracket, the second threaded hole 302 of the first fan bracket, the first threaded hole 401 of the second fan bracket, and the second threaded hole 402 of the second fan bracket in a locking manner; the same operation is performed by using four fan screws 1101 and the seventh threaded hole 307 of the first fan bracket, the eighth threaded hole 308 of the first fan bracket, the eleventh threaded hole 4011 of the second fan bracket, and the twelfth threaded hole 4012 of the second fan bracket in a locking manner to lock the suction fan 1202 to the high-power aluminum thermal circuit board air-cooled radiator in Example 1 of the utility model;

[0084] In the high-power aluminum heat plate air-cooled radiator of embodiment 1 of the utility model, Figures 1 to 4Some of the holes are used for mounting holes of the main board, LED lamp bead component module, power supply module and light control electronic component module in the photographic light device, which are: the first threaded hole 104 of the upper substrate, the second threaded hole 105 of the upper substrate, the third threaded hole 106 of the upper substrate and the fourth threaded hole 107 of the upper substrate, which are mounting holes of the power supply module in the photographic light device; the first threaded hole 901 of the lower substrate, the second threaded hole 902 of the lower substrate, the third threaded hole 903 of the lower substrate and the fourth threaded hole 904 of the lower substrate, which are mounting holes of the LED lamp bead component module in the photographic light device; the fifth threaded hole 305 of the first fan bracket, the sixth threaded hole 306 of the first fan bracket, the fifth threaded hole 405 of the second fan bracket and the sixth threaded hole 406 of the second fan bracket are mounting holes of the main board in the photographic light device; the eleventh threaded hole 3011 of the first fan bracket, the twelfth threaded hole 3012 of the first fan bracket, the seventh threaded hole 407 of the second fan bracket and the eighth threaded hole 408 of the second fan bracket are mounting holes of the light control electronic component module in the photographic light device;

[0085] In the high-power aluminum heat plate air-cooled radiator of embodiment 1 of the utility model, Figure 2 , Figure 3 The holes shown are the installation and fixing holes of the high-power aluminum thermal circuit board air-cooling radiator and the housing of the photography light in Example 1 of the utility model, which are: the third threaded hole 303 of the first fan bracket, the fourth threaded hole 304 of the first fan bracket, the third threaded hole 403 of the second fan bracket, the fourth threaded hole 404 of the second fan bracket, the ninth threaded hole 309 of the first fan bracket, the tenth threaded hole 3010 of the first fan bracket, the ninth threaded hole 409 of the second fan bracket, and the tenth threaded hole 4010 of the second fan bracket. The high-power aluminum thermal circuit board air-cooling radiator and the housing of the photography light device in Example 1 of the utility model are locked as a whole by screw connection and locking;

[0086] In the high-power aluminum heat path plate air-cooled radiator of Example 1 of the utility model, there are four surfaces as heat source contact surfaces, the lower substrate 90 is the main heat source surface, which is used for the heat conduction generated by the LED lamp beads of the LED lamp bead component module of the photography light equipment, and the power of the LED lamp beads is 1000W; the upper substrate 10 is used for the heat conduction generated by the power module in the photography light equipment, and the power of the power module is 100W; the third U-shaped aluminum heat path plate 601 is used for the heat conduction generated by the main board in the photography light equipment, and the power of the main board is 100W; the fourth U-shaped aluminum heat path plate 602 is used for the heat conduction generated by the light control electronic component module in the photography light equipment, and the power of the light control electronic component module is 100W. The total power of the high-power aluminum heat path plate air-cooled radiator in Example 1 is 1300W;

[0087] like Figure 9-1As shown, it is a structural schematic diagram of the first U-shaped aluminum heat sink with a micro-groove structure (SOTS) in the high-power aluminum heat sink air-cooled heat sink in Example 1 of the utility model; Figure 9-2 The figure shows a schematic diagram of the AA section of the first U-shaped aluminum heat sink with a micro-groove structure (SOTS) in the high-power aluminum heat sink air-cooled heat sink in Example 1 of the utility model. The self-organized thermodynamic system (SOTS) micro-groove structure is a method of using discontinuous gas-liquid distribution plug flow in microchannels to construct a three-dimensional network channel between cold and heat sources to form a self-organized two-phase heat transfer system. The principle is that through a special physical structure (embedded in a microchannel solid substrate), the gas-liquid two-phase in the structure quickly presents a self-organized state under the drive of the heat source, thereby achieving the purpose of excellent heat transfer performance; because the network structure of SOTS can drive the working fluid to move quickly, it can well overcome the influence of gravity on the aluminum heat sink, thereby connecting the upper substrate 10, the lower substrate 90, and the third U-shaped aluminum heat sink 60 1. The heat generated by the fourth U-shaped heat circuit board 602 contacting the electronic components is quickly brought to the far end and dissipated through the first heat dissipation fin 501, the second heat dissipation fin 502, the third heat dissipation fin 503, the fourth heat dissipation fin 504, and the fifth heat dissipation fin 505, so as to achieve the purpose of rapid heat dissipation; compared with the traditional temperature plate, the aluminum heat circuit board with SOTS micro-grooves embedded in it has good deformation ability and does not have much heat transfer capacity loss; compared with the traditional heat pipe, the aluminum heat circuit board with SOTS micro-grooves embedded in it has the effect of reducing the wind resistance of the air-cooled radiator, so as to have higher heat dissipation efficiency; Figure 9-1 As shown in Figure 2, due to the relatively small SOTS micro-grooves ( Figure 9-2 The middle section AA shows a schematic diagram of its micro-groove structure). The working fluid has a certain capillary force in the micro-groove. In conjunction with the gas-liquid changes of the working fluid, the aluminum heat sink has a good anti-gravity performance. The height of the radiator shown in this embodiment can be adjusted accordingly according to the actual product height, and it also has high flexibility for the design end.

[0088] Example 2

[0089] In some photography light modules, only the LED lamp beads in the photography equipment will generate a lot of heat, and the heat of other electronic components is too low. The high-power aluminum heat path plate air-cooled radiator of the utility model can only be equipped with the first U-shaped aluminum heat path plate 80 and the second U-shaped aluminum heat path plate 70 as the main structural form;

[0090] The installation method of the LED lamp beads is the same as that in Example 1. The following describes Example 2:

[0091] like Fig.10 As shown, it is a schematic diagram of the side structure of the high-power aluminum heat plate air-cooled radiator in Example 2 of the utility model; Fig.11As shown, it is a schematic diagram of the front structure of the high-power aluminum heat plate air-cooled radiator in Example 2 of the utility model; Fig.12 , which is a schematic diagram of the installation structure of the fan in the high-power aluminum heat plate air-cooled radiator in Embodiment 2 of the present utility model;

[0092] The parts include: a first heat dissipation fin 501, a second heat dissipation fin 502, a third heat dissipation fin 503, a fourth heat dissipation fin 504, a fifth heat dissipation fin 505, a second U-shaped aluminum heat dissipation circuit board 70 (with a self-organized thermodynamic system (SOTS) microchannel embedded therein), a first U-shaped aluminum heat dissipation circuit board 80 (with a self-organized thermodynamic system (SOTS) microchannel embedded therein), a lower base plate 90, a fan screw 1101, a blowing fan 1201, an air suction fan 1202, a third fan bracket 130, and a fourth fan bracket 140;

[0093] The high-power aluminum heat plate air-cooled radiator of Example 2 of the utility model is assembled by solder paste welding, wherein the first heat dissipation fin 501 is soldered with the second U-shaped aluminum heat plate 70; the second heat dissipation fin 502 is soldered with the second U-shaped aluminum heat plate 70 and the first U-shaped aluminum heat plate 80; the third heat dissipation fin 503 is soldered with the first U-shaped aluminum heat plate 80; the fourth heat dissipation fin 504 is soldered with the second U-shaped aluminum heat plate 70 and the first U-shaped aluminum heat plate 80; the fifth heat dissipation fin 501 is soldered with the second U-shaped aluminum heat plate 70 and the first U-shaped aluminum heat plate 80; 505 is soldered with the second U-shaped aluminum heat circuit board 70; the lower base plate 90 is soldered with the second U-shaped aluminum heat circuit board 70; the third fan bracket 130 is soldered with the first heat dissipation fin 501, the second heat dissipation fin 502, the third heat dissipation fin 503, the fourth heat dissipation fin 504, and the fifth heat dissipation fin 505; the fourth fan bracket 140 is soldered with the first heat dissipation fin 501, the second heat dissipation fin 502, the third heat dissipation fin 503, the fourth heat dissipation fin 504, and the fifth heat dissipation fin 505;

[0094] like Fig.12 As shown, the assembly method of the blowing fan 1201 and the suction fan 1202 is illustrated. The blowing fan 1201 is locked to the high-power aluminum thermal circuit board air-cooling radiator of the second embodiment by using four fan screws 1101 and the third threaded hole 1303 of the third fan bracket, the fourth threaded hole 1304 of the third fan bracket, the fifth threaded hole 1305 of the third fan bracket, and the sixth threaded hole 1306 of the third fan bracket in a locking manner; the suction fan 1202 is locked to the high-power aluminum thermal circuit board air-cooling radiator of the second embodiment by using four fan screws 1101 and the third threaded hole 1403 of the fourth fan bracket, the fourth threaded hole 1404 of the fourth fan bracket, the fifth threaded hole 1405 of the fourth fan bracket, and the sixth threaded hole 1406 of the fourth fan bracket in a locking manner;

[0095] Fig.10 , Fig.11 The diagram illustrates the installation and fixing holes of the high-power aluminum thermal circuit board air-cooled radiator and the housing of the photographic equipment (photographic light) of this embodiment 2, which are: the first threaded hole 1301 of the third fan bracket, the second threaded hole 1302 of the third fan bracket, the seventh threaded hole 1307 of the third fan bracket, the eighth threaded hole 1308 of the third fan bracket, the first threaded hole 1401 of the fourth fan bracket, the second threaded hole 1402 of the fourth fan bracket, the seventh threaded hole 1407 of the fourth fan bracket, and the eighth threaded hole 1408 of the fourth fan bracket. The high-power aluminum thermal circuit board air-cooled radiator and the housing of the equipment (photographic light) of this embodiment 2 are locked as a whole by screw locking.

[0096] The utility model discloses a high-power aluminum heat sink air-cooled heat sink, comprising a U-shaped bent aluminum heat sink with a self-organized thermal dynamics system (SOTS) (bent aluminum heat sink), a bottom plate and heat sink fins. The U-shaped bent aluminum heat sink with a self-organized thermal dynamics system (SOTS) is integrated with the bottom plate and the heat sink fins.

[0097] The tower heat sink is equipped with a bent aluminum thermal circuit board, which uses the aluminum thermal circuit board to transfer the heat generated by the electronic components to the heat dissipation fins to absorb the heat generated by the electronic components and dissipate the heat through the fan;

[0098] The interior of the aluminum heat dissipation plate is a micro-groove structure (SOTS), which is welded by aluminum material through a vacuum brazing process. After vacuuming and pouring working fluid (such as acetone, R134A, R1233ZD, etc.), the required shape structure is achieved through a bending process;

[0099] The micro-groove structure of the aluminum heat dissipation plate is formed by machining, chemical etching, forging, etc., and then becomes the internal structure by vacuum brazing;

[0100] The aluminum heat dissipation plate can realize various structural forms through post-processing of sheet metal bending;

[0101] The micro-groove structure (SOTS) is composed of multiple layers connected in series to form a three-dimensional space form;

[0102] The aluminum heat dissipation plate is formed by pouring working fluid into the microchannel, and the working fluid transfers heat through the gas-liquid change of condensation after heating.

[0103] The high-power aluminum heat sink air-cooled radiator of the utility model has the function of increasing the heat exchange area and reducing wind resistance in special scenarios with high power consumption and low air volume. The air-cooled heat dissipation mode of traditional heat pipes and traditional temperature equalizing plates has great difficulties in such application environments. The high-power aluminum heat sink air-cooled radiator of the utility model is installed by a combined process of soldering, which is simple, practical and conducive to mass production.

[0104] The above description is only a preferred specific implementation manner of the present utility model, but the protection scope of the present utility model is not limited thereto. Any technician familiar with the technical field within the technical scope disclosed in the present utility model, according to the technical scheme and utility model concept or equivalent substitution or change, should be covered within the protection scope of the present utility model.

Claims

1. A high-power aluminum heat plate air-cooled radiator, characterized in that: It includes a heat dissipation fin group, a U-shaped aluminum heat dissipation circuit board, a lower base plate, a fan, and a fan bracket; the heat dissipation fin group is connected to the U-shaped aluminum heat dissipation circuit board, the lower base plate is connected to the U-shaped aluminum heat dissipation circuit board, the fan bracket is connected to the heat dissipation fin group, and the fan is connected to the fan bracket.

2. According to claim 1, the high-power aluminum heat plate air-cooled radiator is characterized by: The U-shaped aluminum heating circuit plate includes a first U-shaped aluminum heating circuit plate and a second U-shaped aluminum heating circuit plate.

3. The high-power aluminum heat plate air-cooled radiator according to claim 2 is characterized in that: The number of the fans and fan brackets is two, namely a blower fan and a suction fan.

4. The high-power aluminum heat plate air-cooled radiator according to claim 3 is characterized in that: There are two fan brackets, namely a first fan bracket and a second fan bracket.

5. The high-power aluminum heat plate air-cooled radiator according to claim 4 is characterized in that: The heat dissipation fin group consists of five heat dissipation fins, namely a first heat dissipation fin, a second heat dissipation fin, a third heat dissipation fin, a fourth heat dissipation fin, and a fifth heat dissipation fin.

6. The high-power aluminum heat plate air-cooled radiator according to claim 5 is characterized in that: The first heat sink fin is soldered to the second U-shaped aluminum thermal circuit board with solder paste; the second heat sink fin is soldered to the second U-shaped aluminum thermal circuit board and the first U-shaped aluminum thermal circuit board with solder paste; the third heat sink fin is soldered to the first U-shaped aluminum thermal circuit board with solder paste; the fourth heat sink fin is soldered to the second U-shaped aluminum thermal circuit board and the first U-shaped aluminum thermal circuit board with solder paste; the fifth heat sink fin is soldered to the second U-shaped aluminum thermal circuit board with solder paste; the lower base plate is soldered to the second U-shaped aluminum thermal circuit board with solder paste; the first fan bracket is soldered to the first heat sink fin, the second heat sink fin, the third heat sink fin, the fourth heat sink fin, and the fifth heat sink fin with solder paste; the second fan bracket is soldered to the first heat sink fin, the second heat sink fin, the third heat sink fin, the fourth heat sink, and the fifth heat sink fin.

7. The high-power aluminum heat plate air-cooled radiator according to claim 6 is characterized in that: It also includes an upper base plate, a third U-shaped aluminum heat sink plate and a fourth U-shaped aluminum heat sink plate.

8. The high-power aluminum heat plate air-cooled radiator according to claim 7 is characterized in that: The first heat sink fin is soldered to the third U-shaped aluminum thermal circuit board and the second U-shaped aluminum thermal circuit board with solder paste; the second heat sink fin is soldered to the second U-shaped aluminum thermal circuit board and the first U-shaped aluminum thermal circuit board with solder paste; the third heat sink fin is soldered to the first U-shaped aluminum thermal circuit board with solder paste; the fourth heat sink fin is soldered to the second U-shaped aluminum thermal circuit board and the first U-shaped aluminum thermal circuit board with solder paste; the fifth heat sink fin is soldered to the second U-shaped aluminum thermal circuit board and the fourth U-shaped aluminum thermal circuit board with solder paste; the upper base plate is soldered to the third U-shaped aluminum thermal circuit board and the fourth U-shaped aluminum thermal circuit board with solder paste; the lower base plate is soldered to the second U-shaped aluminum thermal circuit board, the third U-shaped aluminum thermal circuit board and the fourth U-shaped aluminum thermal circuit board with solder paste; the second fan bracket is soldered to the first heat sink fin, the second heat sink fin, the third heat sink fin, the fourth heat sink fin and the fifth heat sink fin.

9. The high-power aluminum heat plate air-cooled radiator according to claim 8, characterized in that: The air blowing fan is locked with the first fan bracket through fan screws and threaded holes; the air suction fan is locked with the second fan bracket through fan screws and threaded holes.

10. The high-power aluminum heat plate air-cooled radiator according to claim 9, characterized in that: The first fan bracket and the second fan bracket are provided with mounting holes for fixing to the outer shell of the photographic equipment; the U-shaped aluminum thermal circuit plate is embedded with a microchannel of a self-organized thermodynamic system.

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