Heat dissipation device and biochemical platform

Abstract

The heat dissipation device comprises a first air source, a first air channel structure, a second air channel structure and a connecting piece which are connected in sequence, the first air channel structure and the second air channel structure can define a heat dissipation air channel, the first air channel structure is made of rigid materials, the second air channel structure is made of flexible materials, and the connecting piece is made of flexible materials. The connecting piece is used for connecting a to-be-cooled structure. According to the heat dissipation device provided by the invention, the flexible second air channel structure is additionally arranged, so that a multi-degree-of-freedom sealed heat dissipation air channel can be formed between the first air source and the to-be-cooled structure, heat generated when the to-be-cooled structure works is guided out, and meanwhile, vibration generated by the first air source is reduced or prevented from being transmitted to the to-be-cooled structure; the stability of the to-be-cooled structure in the working process is improved.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation equipment, and in particular to a heat dissipation device and a biochemical platform. Background Art

[0002] At present, the second-generation sequencing technology has been widely used in research and clinical practice, including non-invasive prenatal diagnosis, early cancer screening, and personalized medication guidance in cancer treatment. During the sequencing process, the stability of the temperature control system is crucial to the sequencing quality. The temperature control system consists of a heating part and a cooling part. The cooling methods mainly include air cooling and liquid cooling. The air cooling method has the characteristics of low cost and high stability, and is widely used in equipment with low heat generation. The water cooling method is usually used on equipment with high heat dissipation requirements, but because the water cooling method is expensive and has poor stability, its adaptability is limited.

[0003] In the field of molecular diagnosis, such as PCR instruments and gene sequencers, the internal temperature control systems generate less heat and have high requirements for stability, so air cooling is generally used. In this field, during the biochemical reaction process, the heat sink used to increase and decrease the temperature in the temperature control system has very high requirements for air flow and cannot be cooled naturally. Auxiliary cooling is required and it is sensitive to vibration. In addition, efficient and dense cooling effects need to be achieved in a limited space. However, the current air cooling method is difficult to meet the above requirements. Utility Model Content

[0004] In order to solve at least one of the above defects, it is necessary to propose a heat dissipation device, which can reduce the vibration of the structure to be cooled during the heat dissipation process and improve the stability and heat dissipation efficiency of the structure to be cooled.

[0005] In addition, the embodiment of the present application further provides a biochemical platform using the heat dissipation device, and the heat dissipation device is particularly suitable for a biochemical platform with high requirements on stability.

[0006] In a first aspect, an embodiment of the present application provides a heat dissipation device, comprising: a first wind source, a first air duct structure, a second air duct structure and a connecting piece, wherein the first air duct structure is connected to the air outlet end of the first wind source, the first air duct structure has a first cavity, the first cavity is connected to the air outlet end, and the material of the first air duct structure is a rigid material; the second air duct structure is connected to the end of the first air duct structure away from the first wind source, the second air duct structure has a second cavity, the second cavity is connected to the first cavity and constitutes a heat dissipation air duct, and the material of the second air duct structure is a flexible material; the connecting piece is connected to the end of the second air duct structure away from the first air duct structure, and the connecting piece is used to connect the structure to be cooled, so that the heat dissipation air duct is connected to the air inlet of the structure to be cooled.

[0007] In some possible embodiments, the second air duct structure includes a first end and a second end that are relatively arranged, the first end is close to the first air duct structure, the connecting member is connected to the second end, and the size of the second cavity decreases from the first end to the second end along the direction perpendicular to the wind direction.

[0008] In some possible embodiments, the second air duct structure is made of polyester, acrylic, nylon, spandex or acetate.

[0009] In some possible embodiments, a first connecting structure is provided between the first air duct structure and the second air duct structure, the first connecting structure has a third cavity, the third cavity is connected to the first cavity and the second cavity, the material of the first connecting structure is a flexible material, the first connecting structure includes a third end and a fourth end arranged opposite to each other, the third end is connected to the first air duct structure, and the fourth end is connected to the second air duct structure, and along the direction perpendicular to the wind direction, the size of the third cavity increases successively from the third end to the fourth end.

[0010] In some possible embodiments, a second connecting structure is provided between the first air duct structure and the first wind source, the second connecting structure connects the first air duct structure and the first wind source, the material of the second connecting structure is a rigid material, and along the direction perpendicular to the wind direction, the inner diameter of the second connecting structure is smaller than the inner diameter of the first air duct structure.

[0011] In some possible embodiments, the connecting member includes a connecting frame and a support sheet arranged on the periphery of the connecting frame, the connecting frame is arranged at one end of the second air duct structure away from the first air duct structure, and the support sheet is located on the inner side of the second cavity and extends toward one side of the first air duct structure.

[0012] In some possible embodiments, the heat dissipation device further includes a plurality of elastic fixing members, and the elastic fixing members are arranged at a connection between the second air duct structure and the first air duct structure.

[0013] In some possible embodiments, the heat dissipation device further includes an air particle quantity detection module and an air filtration module, and a probe of the air particle quantity detection module extends into the air duct of the heat dissipation device; the air filtration module is at least arranged at the air inlet of the first wind source.

[0014] In some possible embodiments, a second wind source is provided on the inner side of a connection between the second air duct structure and the first air duct structure.

[0015] In a second aspect, an embodiment of the present application provides a biochemical platform, which includes: a structure to be cooled and a heat dissipation device as described above, wherein the connecting piece is connected to the air inlet of the structure to be cooled, and the structure to be cooled has an air outlet connected to the air duct of the heat dissipation device.

[0016] The heat dissipation device and the biochemical platform using the heat dissipation device provided in the embodiment of the present application can form a sealed heat dissipation duct with multiple degrees of freedom between the first wind source and the structure to be dissipated by separately setting the first wind source and the structure to be dissipated, and adding a flexible second air duct structure at the part where the heat dissipation device is connected to the structure to be dissipated. The heat generated by the structure to be dissipated during operation can be extracted while reducing or blocking the vibration generated by the first wind source from being transmitted to the structure to be dissipated, so as to improve the stability of the structure to be dissipated during operation. Moreover, by adding a rigid first air duct structure, it is beneficial to smoothly introduce the wind from the first wind source into the second air duct structure, and it is also convenient for the fixed installation of the flexible second air duct structure. In addition, the heat dissipation device has a simple structure, is easy to install, is ready to use, and is easy to maintain. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A system framework diagram of a biochemical platform provided in one embodiment of the present application.

[0019] Figure 2 A schematic diagram of the structure of a biochemical platform provided in one embodiment of the present application.

[0020] Figure 3 for Figure 2 Top view of the biochemical platform.

[0021] Figure 4 for Figure 2 Exploded view of the heat sink.

[0022] Figure 5 A schematic diagram of the structure of a biochemical platform provided in another embodiment of the present application.

[0023] Figure 6 This is a schematic diagram of the structure of a biochemical platform provided in yet another embodiment of the present application.

[0024] Figure 7 This is a schematic diagram of the structure of a biochemical platform provided in yet another embodiment of the present application.

[0025] Figure 8 A system framework diagram of a biochemical platform provided in another embodiment of the present application.

[0026] Fig. 9 This is a schematic diagram of the structure of a biochemical platform provided in yet another embodiment of the present application.

[0027] Fig.10 This is a schematic diagram of the structure of a biochemical platform provided in yet another embodiment of the present application.

[0028] Fig.11 This is a vibration fluctuation diagram collected when the heat dissipation device according to an embodiment of the present application is used in the X-axis of a sequencing system when the first wind source is turned on and off.

[0029] Fig.12 This is a vibration fluctuation diagram collected when the Y-axis of a sequencing system using the heat dissipation device of an embodiment of the present application is turned on and off and the first wind source is turned on.

[0030] Fig.13 This is a vibration fluctuation diagram collected when the heat dissipation device according to an embodiment of the present application is used for the T-axis of a sequencing system when the first wind source is turned on and off.

[0031] Fig.14 This is a vibration fluctuation diagram collected when the first wind source is turned on and off when the heat dissipation device of an embodiment of the present application is used for the Z-axis of a sequencing system.

[0032] Main component symbols

[0033]

[0034]

[0035] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0037] It should be noted that when a component is referred to as being "fixed to" or "mounted on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a central component at the same time. The term "and / or" as used herein includes all and any combinations of one or more of the relevant listed items.

[0038] See also Figure 1 and Figure 2 , the embodiment of the present application provides a biochemical platform 1000, which can be, for example, a biochemical reaction platform, which can realize the biochemical reaction of biochemical substances, but is not limited thereto. The biochemical platform 1000 includes a heat dissipation device 100 and a structure to be dissipated 200, wherein the heat dissipation device 100 is connected to the air inlet 210 of the structure to be dissipated 200, so that the heat dissipation air duct A of the heat dissipation device 100 is connected to the air inlet 210, and the structure to be dissipated 200 has an air outlet 220 connected to the heat dissipation air duct A of the heat dissipation device 100. The heat dissipation device 100 can be used to dissipate heat for the temperature rise and fall module 200, and the structure to be dissipated 200 can be a carrier that provides the required temperature for the biochemical reaction to occur, or a structure that needs heat dissipation, such as a heat dissipation fin in the biochemical platform 1000. For example, the biochemical platform 1000 can be a sequencer, and the structure to be dissipated 200 can be a sequencing carrier that carries a sequencing chip, which can provide the required temperature for the biochemical substance to perform a biochemical reaction, but is not limited thereto. It can be understood that the heat dissipation device 100 can also be used in other devices or systems that require heat dissipation.

[0039] Please refer to Figures 2 to 4As shown, the heat dissipation device 100 of the embodiment of the present application includes: a first wind source 1, a first wind duct structure 2, a second wind duct structure 3 and a connector 4. The first wind duct structure 2 is connected to the wind outlet end of the first wind source 1, and the first wind duct structure 2 has a first cavity 21, and the first cavity 21 is connected to the wind outlet end. The material of the first wind duct structure 2 is a rigid material, that is, the first wind duct structure 2 has a fixed shape, and will not be significantly deformed under the action of external force, and has almost zero degree of freedom. The second wind duct structure 3 is connected to the end of the first wind duct structure 2 away from the first wind source 1, and the second wind duct structure 3 has a second cavity 31, and the second cavity 31 is connected to the first cavity 21. The material of the second wind duct structure 3 is a flexible material, that is, the second wind duct structure 3 is a flexible wind duct, has multiple degrees of freedom, and can be deformed in multiple directions under the action of external force. The connector 4 is connected to one end of the second air duct structure 3 away from the first air duct structure 2, and is used to connect the structure to be cooled 200. Specifically, the connector 4 is connected to the air inlet 210 of the structure to be cooled 200. The first cavity 21 and the second cavity 31 that are interconnected constitute the cooling air duct A of the heat dissipation device 100. The wind source provided by the first wind source 1 can reach the structure to be cooled 200 through the cooling air duct A to dissipate heat for the structure to be cooled 200. By adding a rigid first air duct structure 2 with a fixed shape to the heat dissipation device 100, it is beneficial to smoothly introduce the wind from the first air source 1 into the second air duct structure 3, and it is also convenient for the fixed installation of the flexible second air duct structure 3. By adding a second air duct structure 3 at the position where the heat dissipation device 100 is connected to the structure to be cooled 200, and since the material of the second air duct structure 3 is flexible, a sealed heat dissipation air duct A with multiple degrees of freedom can be formed between the first air source 1 and the structure to be cooled 200. This can extract the heat generated by the structure to be cooled 200 when it is working, while reducing or blocking the vibration generated by the first air source 1 from being transmitted to the structure to be cooled 200, so as to improve the stability of the structure to be cooled 200 during operation.

[0040] The first air source 1 may be a fan, a blower, or a combination of the two, or may be other mechanisms capable of generating stable and clean air sources.

[0041] One end of the first air duct structure 2 is fixed to the air outlet end of the first air source 1, and the other end is connected to the second air duct structure 3. Specifically, the first air duct structure 2 can be a ventilation duct, which can be made of rigid materials such as metal, hard plastic, etc., and has a certain supporting force, so as to guide the wind and fix the second air duct structure 3.

[0042] In some embodiments, along the direction perpendicular to the wind direction a, the cross-sectional shape of the first cavity 21 may be circular, rectangular or irregular.

[0043] In some embodiments, sealing materials may be provided at the connection between the first air duct structure 2 and the first air source 1 and the second air duct structure 3 to improve the sealing of the heat dissipation air duct A, reduce the interaction between the internal and external air, and ensure the cleanliness of the air entering the heat dissipation structure 200.

[0044] like Figure 3 and Figure 4 As shown, the second air duct structure 3 includes a first end 32 and a second end 33 that are arranged opposite to each other, the first end 32 is close to the first air duct structure 2, and the connecting member 4 is connected to the second end 33. Along the direction perpendicular to the wind direction a, the size of the second cavity 31 decreases from the first end 32 to the second end 33, thereby forming a trumpet-shaped cavity with a large opening at one end and a small opening at the other end, and the end with a small opening is connected to the structure to be cooled 200, so that the wind pressure can be increased, and the cooling capacity and uniformity of the cooling can be improved.

[0045] In some embodiments, the material of the second air duct structure 3 can be a flexible material such as polyester, acrylic, nylon, spandex, acetate, etc. In addition, the material used in the second air duct structure 3 must also have a certain windproof ability.

[0046] In some embodiments, along the direction perpendicular to the wind direction a, the cross-sectional shape of the second cavity 31 may be circular, rectangular, polygonal or irregular.

[0047] Please refer to Figures 3 to 5 The connector 4 includes a connecting frame 41 and a supporting sheet 42 arranged at the periphery of the connecting frame 41. The connecting frame 41 is arranged at one end of the second air duct structure 3 away from the first air duct structure 2. The supporting sheet 42 is located inside the second cavity 31 and extends toward one side of the first air duct structure 2, that is, the supporting sheet 42 is bent toward the extension direction of the second cavity 31, thereby supporting the second air duct structure 3 inside, reducing the risk of the flexible second air duct structure 3 folding or collapsing to block the heat dissipation air duct A, and improving the uniformity of air duct heat dissipation. Specifically, the connector 4 can clamp the end of the flexible second air duct structure 3 by clamping.

[0048] In some embodiments, a circle of the support sheet 42 may be provided around the periphery of the connection frame 41, or one support sheet 42 may be provided on opposite sides of the connection frame 41. Specifically, the support sheet 42 may be designed to have rounded corners to avoid scratching the flexible second air duct structure 3.

[0049] In some embodiments, the connecting member 4 may be made of metal, plastic, or foam.

[0050] When the heat dissipation device 100 is installed with the structure to be dissipated 200, the first connection method is to press and fasten part of the flexible second air duct structure 3 to the air inlet 210 of the structure to be dissipated 200 through a connector 4 (such as a sheet metal part) and then use screws to lock it. The second method is to sew the end of the flexible second air duct structure 3 to the connector 4 (such as a sheet metal part), and use threaded holes at specific positions of the connector 4 to fit on the structure to be dissipated 200 and use screws to lock it. The third connection method is to directly fit the second air duct structure 3 with the structure to be dissipated 200 by bonding.

[0051] Please refer to Figure 3 and Figure 6 A first connecting structure 8 is provided between the first air duct structure 2 and the second air duct structure 3. The first connecting structure 8 has a third cavity 81. The third cavity 81 is connected to the first cavity 21 and the second cavity 31. The material of the first connecting structure 8 can be a flexible material. The first connecting structure 8 includes a third end 82 and a fourth end 83 which are arranged opposite to each other. The third end 82 is connected to the first air duct structure 2, and the fourth end 83 is connected to the second air duct structure 3. Along the direction perpendicular to the wind direction a, the size of the third cavity 81 increases from the third end 82 to the fourth end 83, that is, the end close to the first wind source 1 is small, and the end away from the first wind source 1 is large, forming a bell-mouth structure. By adding a flexible structure with a bell-mouth between the first air duct structure 2 and the second air duct structure 3, the wind pressure in the heat dissipation duct A can be increased to further improve the heat dissipation capacity and the uniformity of heat dissipation.

[0052] In some embodiments, a second connecting structure may be further provided between the first air duct structure 2 and the first wind source 1, wherein the second connecting structure connects the first air duct structure 2 and the first wind source 1, and the material of the second connecting structure is a rigid material. Along the direction perpendicular to the wind direction a, the inner diameter of the second connecting structure is smaller than the inner diameter of the first air duct structure 2, thereby further increasing the wind pressure entering the heat dissipation air duct A.

[0053] It is understandable that the inner diameter of the second cavity 31 of the second air duct structure 3 may also be reduced at the same time to further increase the wind pressure, thereby further improving the heat dissipation capacity and heat dissipation uniformity.

[0054] Please refer to Figure 7 The heat dissipation device 100 may further include a plurality of elastic fixing members 5, which are arranged at opposite ends of the second air duct structure 3, that is, at the connection between the second air duct structure 3 and the first air duct structure 2, or at the connection between the second air duct structure 3 and the structure to be cooled 200. The specific number of the elastic fixing members 5 can be flexibly designed according to actual needs.

[0055] In some embodiments, the elastic fixing member 5 may include two fixing buckles and an elastic member 51 detachably disposed between the two fixing buckles, and the two fixing buckles are respectively fixed on two structures where the elastic fixing member 5 is required to be disposed, for example, a fixing buckle may be respectively installed on the first air duct structure 2 and the second air duct structure 3 at the connection, and the two ends of the elastic member 51 are respectively mounted on the fixing buckles, and an anchor point is provided on the flexible second air duct structure 3 to connect with the elastic member 51, so that the edge of the second air duct structure 3 moves with the elastic member 51, thereby ensuring the three-dimensional structure of the second air duct structure 3. By adding the elastic fixing member 5 at the place where the flexible second air duct structure 3 is connected with other structures, the bending resistance of the second air duct structure 3 can be further improved.

[0056] In some embodiments, the elastic member 51 may be a pull rope or a spring, and the elastic force of the spring may be less than 0.5N.

[0057] Please refer again Figure 1 The heat dissipation device 100 further includes an air particle number detection module 6, the detection probe of the air particle number detection module 6 extends into the heat dissipation duct A of the heat dissipation device 100, and can detect the number of dust particles in the heat dissipation duct A, so as to detect the air cleanliness in the heat dissipation duct A in real time. It can be understood that the air particle number detection module 6 is used for air particle number detection, and the specific location includes but is not limited to the air outlet of the first air source 1 and the air outlet of the heat dissipation duct A. The air particle number detection module 6 has a pipeline for absorbing air, and can extract air and perform detection.

[0058] Please refer again Figure 1 The heat dissipation device 100 further includes an air filter module 7, which is at least arranged at the air inlet of the first wind source 1 to improve the cleanliness of the air entering the heat dissipation duct A, and further improve the cleanliness of the air entering the structure to be dissipated 200. The air filter module 7 can be, for example, a structure with air filtering function such as an air filter or an air filter. In addition, an air filter can be installed at the connection between the first air duct structure 2 and the first wind source 1 to further improve the cleanliness of the air entering the structure to be dissipated 200.

[0059] Please refer again Figure 1 and Figure 2 The biochemical platform 1000 further includes a fixing frame 300 for supporting the structure to be cooled 200 and the heat dissipation device 100. It also includes a plurality of shock-absorbing pads 500, which can be arranged at the bottom of the structure to be cooled 200 or at the bottom of the heat dissipation device 100 to achieve the purpose of shock absorption.

[0060] Please refer again Figure 1 and Figure 2, the biochemical platform 1000 may be a sequencing system, the structure to be cooled 200 may be a chip carrier, used to provide the required temperature for the sequencing chip, wherein the structure to be cooled 200 has a carrier with high flatness, which can be adjusted in height by adjusting screws, and can be controlled in real time by a temperature control system. In some embodiments, the structure to be cooled 200 can achieve forward and backward, left and right, and rotational movement by an adjustment device 400, specifically, the adjustment device 400 includes a first moving mechanism 410 for realizing left and right movement, a second moving mechanism 420 for realizing front and back movement, and a rotation mechanism 430 for realizing rotation.

[0061] Before using the biochemical platform 1000, it is necessary to check whether the pipe of the heat dissipation device 100 has been fixed. After turning on the first air source 1, check whether the flexible second air duct structure 3 is folded. Turn on the adjustment device 400, and observe whether the second air duct structure 3 is pulled or loosened during the forward and backward movement of the adjustment device 400, and then turn on the temperature rise and fall function of the structure to be radiated 200. During use, the first air source 1 (such as a fan) introduces external airflow into the rigid first air duct structure 2, and blows to the structure to be radiated 200 through the shock absorption of the flexible second air duct structure 3, and takes away the heat from the structure to be radiated 200. While dissipating heat, the built-in air particle number detection module 6 synchronously monitors the number of dust particles in the airflow. In this process, the flexible second air duct structure 3 greatly reduces the vibration of the first air source 1, and assists the entire system to complete the temperature rise and fall process without introducing vibration, and no additional vibration will be generated during the follow-up movement.

[0062] The use of the biochemical platform 1000 mainly includes the following steps: confirmation of the biochemical platform 1000, opening of ventilation and detection of the number of air particles, detection and evaluation of shock absorption effects, and detection and evaluation of heat dissipation effects.

[0063] Step 1, the process of confirming the biochemical platform 1000 is as follows: assemble the heat dissipation device 100 and the structure to be dissipated 200, and confirm that there is no folding at any place after installation. This process is mainly suitable for the first use.

[0064] Step 2, ventilate and detect the number of air particles: turn on the first wind source 1 and the air particle number detection module 6, and start detecting the number of particles.

[0065] Step 3, detection and evaluation of the vibration reduction effect: Use an acceleration sensor to attach to the surface of the heat dissipation structure 200, test the vibration when the first air source 1 is turned on and off, and make a comparison.

[0066] Step 4, detection and evaluation of heat dissipation effect: The temperature probe is attached to the surface of the structure to be cooled 200 to detect whether the temperature change of the semiconductor refrigeration chip when heating or cooling meets the requirements.

[0067] The embodiment of the present application provides a heat dissipation device 100 and a biochemical platform 1000 using the heat dissipation device 100, which has the following beneficial effects:

[0068] 1. By separately arranging the first air source 1 and the structure to be cooled 200, and adding a flexible second air duct structure 3 at the position where the heat dissipation device 100 is connected to the structure to be cooled 200, a sealed heat dissipation air duct A with multiple degrees of freedom can be formed between the first air source 1 and the structure to be cooled 200. The heat generated by the structure to be cooled 200 during operation can be extracted while reducing or blocking the vibration generated by the first air source 1 from being transmitted to the structure to be cooled 200, so as to improve the stability of the structure to be cooled 200 during operation.

[0069] 2. By adding a rigid first air duct structure 2 to the heat dissipation device 100, it is beneficial to smoothly introduce the wind from the first wind source 1 into the second air duct structure 3, and it is also convenient for fixing and installing the flexible second air duct structure 3.

[0070] 3. In conjunction with the air filtration module 7 and the air particle number detection module 6, not only can the number of dust particles in the heat dissipation duct A be detected, but also external dust is isolated from entering the heat dissipation duct A, thereby avoiding dust accumulation, and improving the life of the first air source 1 and the cleanliness and heat dissipation efficiency of the heat dissipation structure 200.

[0071] 4. The air volume can be adjusted by adjusting the rotation speed of the first air source 1, and the corresponding heat dissipation air volume requirement can be selected according to different ambient temperatures.

[0072] 5. There is no need to turn off the first air source 1 when the heat dissipation structure 200 performs specific working steps (for example, when the optical detection platform performs the photo taking step), which reduces the frequent switching on and off actions and increases the life of the first air source 1. At the same time, the heat dissipation structure 200 will not be affected due to the inability to dissipate heat in time due to turning off the first air source 1.

[0073] 6. The heat dissipation device 100 is easy to assemble and to install with the structure to be dissipated 200. It is ready for use and easier to maintain.

[0074] See also Figure 8 and Fig. 9 As shown, another embodiment of the present application provides a biochemical platform 2000. The difference between the biochemical platform 2000 of this embodiment and the biochemical platform 1000 of the aforementioned embodiment is that the biochemical platform 2000 includes a structure to be cooled 200a and two aforementioned heat dissipation devices 100. The structure to be cooled 200a has two air inlets 210 arranged opposite to each other, and the two heat dissipation devices 100 are respectively arranged on opposite sides of the structure to be cooled 200a.

[0075] In some embodiments, when two second air duct structures 3 are disposed on opposite sides of the structure to be cooled 200 a , they may share a connecting member 4 for connection.

[0076] In some embodiments, Fig.10 As shown, a second wind source 11 is provided inside the connection between the second wind duct structure 3 and the first wind duct structure 2. By adding a wind source, the wind pressure can be further increased and the heat dissipation efficiency can be improved.

[0077] It is understandable that the number and connection mode of the heat dissipation devices can be flexibly set according to the specific form of the structure to be dissipated, so as to achieve efficient and uniform heat dissipation of the structure to be dissipated.

[0078] Compared with the previous embodiment, this embodiment changes one air inlet 210 of the heat dissipation structure 200a into two air inlets 210, and at the same time forms a bridge structure with the two second air duct structures 3 in the two heat dissipation devices 100, thereby reducing the attenuation of wind pressure, increasing the air volume, improving the heat dissipation efficiency, shortening the inner cavity volume of a single second air duct structure 3, and improving stability.

[0079] The vibration of the biochemical platform is described in detail below through a specific embodiment. Specifically, the biochemical platform can be the structure of the aforementioned biochemical platform 1000. When the biochemical platform is a sequencing system, the heat dissipation structure 200 can include a chip carrier and an optical carrier, wherein the chip carrier is used to perform temperature rise and fall operations on the sequencing chip, and the optical carrier is used to take pictures of the sequencing chip. During use, the vibration of the heat dissipation structure 200 was tested, and the test results are shown in Tables 1 to 3, and Figures 11 to 14 shown.

[0080] Table 1 Comparison of vibration data results

[0081]

[0082] Table 2 Comparison of optical stage surface vibration data results

[0083]

[0084] Table 3 Comparison of temperature control data results

[0085]

[0086] It can be seen from Table 1 that the use of the heat dissipation device 100 can effectively reduce the vibration of the high-precision structure to be cooled in the XY axis direction, and the use of the heat dissipation device has a shock-absorbing effect in the motion section.

[0087] It can be seen from Table 2 that, compared with the method of directly using a fan, the heat dissipation device 100 provided in the embodiment of the present application can effectively reduce the vibration of the optical stage.

[0088] It can be seen from Table 3 that the time of heating and cooling represents the efficiency of heating and cooling, and the variance of heating and cooling represents the uniformity of temperature in different ways. The results show that the efficiency of heating and cooling by using the heat dissipation device 100 is close to that of directly using a fan, but the variance is significantly reduced, so the heat dissipation uniformity can be effectively improved by using the heat dissipation device 100.

[0089] Depend on Figures 11 to 14 It can be seen that when the aforementioned heat dissipation device 100 is used, after the first wind source (i.e., the fan) is turned on and off, the motion errors of the X-axis, Y-axis, T-axis, and Z-axis are close, and after the fan is turned on, the vibration of the structure to be cooled is small and the stability is high. Therefore, there is no need to turn off the fan during optical photography.

[0090] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the preferred embodiments, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A heat dissipation device, characterized in that: include: First wind source; a first air duct structure connected to the air outlet end of the first air source, the first air duct structure having a first cavity, the first cavity being in communication with the air outlet end, and the material of the first air duct structure being a rigid material; A second air duct structure is connected to an end of the first air duct structure away from the first air source, the second air duct structure has a second cavity, the second cavity is connected to the first cavity and forms a heat dissipation air duct, and the material of the second air duct structure is a flexible material; as well as A connecting member is connected to an end of the second air duct structure away from the first air duct structure, and the connecting member is used to connect the structure to be cooled so that the cooling air duct is connected to the air inlet of the structure to be cooled.

2. The heat dissipation device according to claim 1, characterized in that: The second air duct structure includes a first end and a second end that are relatively arranged, the first end is close to the first air duct structure, the connecting member is connected to the second end, and the size of the second cavity decreases from the first end to the second end along the direction perpendicular to the wind direction.

3. The heat dissipation device according to claim 1, characterized in that: The material of the second air duct structure is polyester, acrylic, nylon, spandex or acetate fiber.

4. The heat dissipation device according to claim 1, characterized in that: The connecting member includes a connecting frame and a supporting sheet arranged on the periphery of the connecting frame. The connecting frame is arranged at one end of the second air duct structure away from the first air duct structure. The supporting sheet is located on the inner side of the second cavity and extends toward one side of the first air duct structure.

5. The heat dissipation device according to claim 1, characterized in that: It also includes a plurality of elastic fixing members, and the elastic fixing members are arranged at the connection between the second air duct structure and the first air duct structure.

6. The heat dissipation device according to claim 1, characterized in that: It also includes an air particle quantity detection module and an air filtering module. The probe of the air particle quantity detection module extends into the air duct of the heat dissipation device; the air filtering module is at least arranged at the air inlet of the first wind source.

7. The heat dissipation device according to claim 1, characterized in that: A first connecting structure is provided between the first air duct structure and the second air duct structure, the first connecting structure having a third cavity, the third cavity being connected to the first cavity and the second cavity, the first connecting structure being made of a flexible material, the first connecting structure comprising a third end and a fourth end arranged opposite to each other, the third end being connected to the first air duct structure, the fourth end being connected to the second air duct structure, and the size of the third cavity increasing successively from the third end to the fourth end along the direction perpendicular to the wind direction.

8. The heat dissipation device according to claim 1, characterized in that: A second connecting structure is provided between the first air duct structure and the first wind source, the second connecting structure connects the first air duct structure and the first wind source, the material of the second connecting structure is rigid material, and the inner diameter of the second connecting structure is smaller than the inner diameter of the first air duct structure along the direction perpendicular to the wind direction.

9. The heat dissipation device according to claim 1, characterized in that: A second wind source is provided inside a connection between the second air duct structure and the first air duct structure.

10. A biochemical platform, characterized in that: include: The structure to be cooled and the heat dissipation device as claimed in any one of claims 1 to 9, wherein the connecting member is connected to the air inlet of the structure to be cooled, and the structure to be cooled has an air outlet connected to the air duct of the heat dissipation device.

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