Heating device

Abstract

The utility model discloses a heating device. The heating device is used for heating a wire rod. The heating device comprises a device body, a heating mechanism and a heat conduction mechanism, the heating mechanism is used for generating heat, and the heating mechanism is arranged in the device body; the heat conduction mechanism is arranged in the device body, the heat conduction mechanism is arranged close to the heating mechanism, or the heat conduction mechanism makes contact with the heating mechanism, a heating space for heating the wire is defined by the heat conduction mechanism, and the wire penetrates through the heating space. Through the arrangement, the uniformity of the mechanical property of the wire can be improved, and the machining efficiency of the wire can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of post-heating treatment of electroplating products, and in particular to a heating device for heating wires. Background Art

[0002] In order to enhance the mechanical properties of the coating of electroplated wires, heating post-treatment technology is a commonly used solution. For the coating and the wire: As the heat treatment proceeds, the diffusion of the coating elements and the wire elements continues to intensify, and another bonding method, namely chemical bonding, is formed between the coating and the wire. The higher the heat treatment temperature, the more intense the element diffusion between the coating and the wire. Therefore, as the heat treatment temperature increases, the bonding force between the coating and the wire increases. For the coating itself: Taking the nickel layer as an example, the hydrogen generated during the electroplating of the nickel layer can easily enter the coating. When the hydrogen is enriched to a certain extent, it will cause hydrogen embrittlement of the coating. Heat treatment can cause hydrogen precipitation and crystallization of the coating, so that the treated nickel layer can be strengthened and toughened.

[0003] Existing heat treatment technology often heats the finished electroplated wire into a coil, but this will result in differences in mechanical properties between the inner and outer sides of the coiled wire. Taking electroplated diamond wire as an example, if there is a difference in mechanical properties between the inner and outer sides of the diamond wire, it will easily lead to instability in the cutting process of the diamond wire.

[0004] In addition, the existing heat treatment of wires requires manual transportation of finished wires to an oven for unified treatment. This treatment method increases the processing steps of the wires, thereby increasing the production cost of the wires and reducing the production efficiency of the wires. Utility Model Content

[0005] In order to solve the deficiencies of the prior art, the purpose of the present application is to provide a heating device, which can make the mechanical properties of the wire more uniform and improve the production efficiency of the wire.

[0006] To achieve the above objectives, this application adopts the following technical solutions:

[0007] A heating device is used for heating a wire. The heating device comprises a device body, a heating mechanism and a heat conducting mechanism. The heating mechanism is used to generate heat and is installed in the device body. The heat conducting mechanism is installed in the device body and is arranged close to the heating mechanism or in contact with the heating mechanism. The heat conducting mechanism surrounds a heating space for heating the wire and the wire passes through the heating space.

[0008] Furthermore, the heating device comprises a temperature measuring mechanism, which is installed in the device body and is also arranged close to the heating mechanism and / or the heat conducting mechanism.

[0009] Furthermore, the heat conducting mechanism includes a first heat conducting member and a second heat conducting member, the first heat conducting member is located above the second heat conducting member, the first heat conducting member and the second heat conducting member are both close to or in contact with the heating mechanism, and a heating space is formed between the first heat conducting member and the second heat conducting member.

[0010] Furthermore, the device body includes a receiving groove and two heat insulation plates respectively located at two ends of the receiving groove, and the heat insulation plates are fixedly connected to the receiving groove.

[0011] Furthermore, the receiving groove has an opening, the heating mechanism is arranged near the groove bottom of the receiving groove, and the first heat conducting member and the second heat conducting member are near the opening of the receiving groove.

[0012] Furthermore, both heat insulation plates are provided with a first fixed structure and a second fixed structure, the first fixed structure is arranged close to the bottom of the accommodating groove, the second fixed structure is located on the side of the first fixed structure away from the bottom of the accommodating groove, the heating mechanism is fixedly connected to the first fixed structure, and the first heat conductor and the second heat conductor are both fixedly connected to the second fixed structure.

[0013] Furthermore, two second fixing structures are provided, and the two second fixing structures are respectively connected to the first heat conducting member and the second heat conducting member;

[0014] The first fixing structure and the heating mechanism are bolted, welded or plugged together;

[0015] The second fixing structure and the first heat conducting member are connected by bolts, welding or plugging;

[0016] The second fixing structure and the second heat conducting member are connected by bolts, welding or plugging.

[0017] Furthermore, both heat insulation plates are provided with U-shaped grooves for the wires to pass through, away from the receiving grooves;

[0018] The wire is passed through one of the U-shaped grooves, the heating space and the other U-shaped groove;

[0019] The heating device further includes a connection structure for connecting an external device, the connection structure being connected to the outside of the device body.

[0020] A heating device is used for heating a wire, and comprises a device body and a heating mechanism. The heating mechanism is used for generating heat, and is installed in the device body. The heating mechanism heats the device body so that a heating space is formed inside the device body, and the wire is passed through the heating space.

[0021] Furthermore, the heating device also includes a heat-conducting mechanism, which is installed in the device body, arranged close to the heating mechanism, or in contact with the heating mechanism, and a heating space is formed around the heat-conducting mechanism.

[0022] The above-mentioned heating device can evenly transfer the heat transferred by the heating mechanism to the heating space through the heat conducting mechanism, so that the wire is heated evenly and the mechanical properties of the wire are relatively uniform, so as to avoid the need for later processing of the wire due to uneven mechanical properties of the wire, thereby reducing the processing cost of the wire and improving the production efficiency of the wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the structure of a heating device provided in an embodiment of the present application.

[0024] Figure 2 This is a schematic structural diagram of the heating device provided in an embodiment of the present application from another angle.

[0025] Figure 3 A schematic structural diagram of the device body of the heating device provided in an embodiment of the present application.

[0026] Figure 4 For the embodiment of this application Figure 3 A partial enlarged view of point A in the middle. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the specific implementation manner of the present application will be clearly and completely described below in conjunction with the drawings in the implementation manner of the present application.

[0028] It should be noted that the words "first", "second" and similar words used in the specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "a" do not indicate a quantitative limitation, but indicate the existence of at least one. "Multiple" or "several" means at least two. Unless otherwise specified, words such as "front", "back", "left", "right", "bottom" and / or "top" are only for the convenience of description and are not limited to one position or one spatial orientation. Words such as "include" or "comprise" mean that the elements or objects appearing before "include" or "comprise" include the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, and may include electrical connections, whether direct or indirect.

[0029] The singular forms "a", "said" and "the" used in this specification and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0030] like Figure 1 As shown, the present application provides a heating device 100, which is used for heating a wire. Specifically, the heating device 100 can be used to heat the wire after electroplating, so that a chemical bond is formed between the wire and the coating. Exemplarily, the electroplated diamond wire is used as an example for explanation. The heating device 100 of the present application can heat the electroplated diamond wire, so that the bonding ability between the coating and the diamond wire is enhanced, and other impurities generated during the electroplating process (such as hydrogen in the electroplated nickel layer) are precipitated, thereby improving the toughness of the coating.

[0031] In order to clearly illustrate the technical solution of this application, the following is also defined: Figure 1 Front, back, left, right, up and down as shown.

[0032] As an implementation method, the heating device 100 includes a device body 11, a heating mechanism 12 and a heat conducting mechanism 13. Among them, the device body 11 is the basic frame of the heating device 100, which is used to support the heating mechanism 12 and the heat conducting mechanism 13, so as to improve the working stability of the heating mechanism 12 and the heat conducting mechanism 13. The heat pipe heating mechanism 12 is installed in the device body 11, and the heating mechanism 12 is used to generate heat. Specifically, the heating mechanism 12 can convert electrical energy into thermal energy. For example, the heating device 100 can be an electric heating pipe, etc. The heat conducting mechanism 13 is installed in the device body 11, and the heat conducting mechanism 13 is arranged close to the heating mechanism 12, or the heat conducting mechanism 13 is in contact with the heating mechanism 12, so that the heat generated by the heating mechanism 12 can be transferred to the heat conducting mechanism 13. The heat conducting mechanism 13 surrounds the heating space 101 formed with the heating wire, and the wire is passed through the heating space 101, so that the heat conducting mechanism 13 can transfer the heat generated by the heating mechanism 12 to the wire. The heat conducting mechanism 13 of the present application can evenly transfer the heat transferred by the heating mechanism 12 to the heating space 101, so that the wire is heated evenly and the mechanical properties of the wire are relatively uniform, so as to avoid the need for later processing of the wire due to uneven mechanical properties of the wire, thereby reducing the processing cost of the wire and improving the production efficiency of the wire.

[0033] Exemplarily, the heat conducting mechanism 13 may be a metal material having heat conducting properties, such as copper, iron, etc., which is not limited in the present application.

[0034] like Figure 2 As shown, as an optional implementation, the heating device 100 includes a temperature measuring mechanism 14, which can detect the heating temperature of the heating device 100, so that the temperature of the heating device 100 can be controlled to improve the heating accuracy of the heating device 100 on the wire, avoid damage to the wire due to overheating, or avoid poor mechanical properties of the wire due to the temperature failing to meet the requirements.

[0035] Specifically, the temperature measuring mechanism 14 is installed in the device body 11, and the temperature measuring mechanism 14 is also arranged near the heating mechanism 12 and / or the heat conducting mechanism 13. More specifically, the temperature measuring mechanism 14 can be fixed to the side of the heating mechanism 12 away from the heat conducting mechanism 13, so that the temperature measuring mechanism 14 can detect the temperature generated by the heating mechanism 12 and avoid interference between the temperature measuring mechanism 14 and the wire. Optionally, the temperature measuring mechanism 14 can be fixed to one side of the heat conducting mechanism 13, so that the temperature measuring mechanism 14 can detect the temperature of the heat conducting mechanism 13, that is, the temperature measuring mechanism 14 can directly detect the temperature in the heating space 101, thereby improving the detection accuracy of the temperature measuring mechanism 14.

[0036] It should be noted that the installation position of the temperature measuring mechanism 14 can be anywhere in the device body 11, and the temperature measuring mechanism 14 only needs to be able to detect the heating temperature in the heating device 100, and this application does not limit it; the temperature measuring mechanism 14 can be a resistor, a thermometer, etc., and this application does not limit it.

[0037] It should be noted that the temperature measuring mechanism 14 can be electrically connected to an external display device, so that the temperature detected by the temperature measuring mechanism 14 is transmitted to the external display device, which is beneficial for the operator to observe the heating temperature of the heating device 100 and adjust the temperature of the heating device 100 in real time.

[0038] Alternatively, the temperature measuring mechanism 14 may be a structure with a built-in display window, so that the temperature measuring mechanism 14 can directly display the temperature detected by the temperature measuring mechanism 14 .

[0039] Alternatively, the temperature measuring mechanism 14 can be electrically connected to a control module (such as a chip, etc.), and the control module is also electrically connected to the heating mechanism 12, so that the heating amount of the heating mechanism 12 can be adjusted in real time through the control module according to the heating requirements of the wire and the temperature detected by the temperature measuring mechanism 14, thereby improving the heating accuracy of the heating device 100.

[0040] As an implementation, the heat-conducting mechanism 13 includes a first heat-conducting member 131 and a second heat-conducting member 132. The first heat-conducting member 131 and the second heat-conducting member 132 are both close to or in contact with the heating mechanism 12, so that the heat generated by the heating mechanism 12 can be transferred to the first heat-conducting member 131 and the second heat-conducting member 132. Specifically, the first heat-conducting member 131 is located above the second heat-conducting member 132, and a heating space 101 is formed between the first heat-conducting member 131 and the second heat-conducting member 132. Through the above arrangement, the wire can be surrounded by the first heat-conducting member 131 and the second heat-conducting member 132, so that the wire is heated more evenly, so that the mechanical properties of the wire are more uniform, so as to avoid post-processing of the wire.

[0041] In this embodiment, the lengths of the first heat conductor 131 and the second heat conductor 132 along the direction of the wire are adjustable, so that the heating time of the wire can be adjusted by the lengths of the first heat conductor 131 and the second heat conductor 132 to meet the processing requirements of different wires. It should be noted that when the lengths of the first heat conductor 131 and the second heat conductor 132 change, the heating range of the heating mechanism 12 also changes accordingly, and it is only necessary that the heating mechanism 12 can evenly heat the first heat conductor 131 and the second heat conductor 132, and this application does not limit this.

[0042] like Figure 3 As shown, as an implementation method, the device body 11 includes a receiving groove 111 and two heat insulation boards 112, the two heat insulation boards 112 are respectively located at both ends of the receiving groove 111, and the heat insulation boards 112 are fixedly connected to the receiving groove 111. The heat insulation boards 112 are used to isolate the heat in the device body 11 to prevent the heat in the device body 11 from being transferred to the outside, thereby affecting the ambient temperature of the outside. The material of the heat insulation board 112 can be glass fiber, asbestos, rock wool, etc. The heat insulation board 112 can also achieve a heat insulation effect by covering the heat insulation board 112 with a heat insulation layer, which is not limited in this application.

[0043] Specifically, the containing groove 111 and the two heat insulation plates 112 are connected to form a containing space 102 , and the heating mechanism 12 , the heat conducting mechanism 13 and the temperature measuring mechanism 14 are all located in the containing space 102 .

[0044] In this embodiment, the receiving groove 111 has an opening, the heating mechanism 12 is arranged near the bottom of the receiving groove 111, and the first heat conductor 131 and the second heat conductor 132 are close to the opening of the receiving groove 111 to avoid the heat generated by the heating mechanism 12 from being transferred to the outside, so that the heat generated by the heating mechanism 12 can be transferred more to the first heat conductor 131 and the second heat conductor 132, thereby improving the thermal conductivity efficiency of the first heat conductor 131 and the second heat conductor 132, and improving the heating efficiency of the first heat conductor 131 and the second heat conductor 132.

[0045] like Figure 4 As shown, as an implementation, both heat insulation plates 112 are provided with a first fixing structure 1121 and a second fixing structure 1122, and the first fixing structure 1121 is arranged close to the bottom of the receiving groove 111, so that the heating mechanism 12 is arranged close to the bottom of the receiving groove 111. The second fixing structure 1122 is located on the side of the first fixing structure 1121 away from the bottom of the receiving groove 111, the heating mechanism 12 is fixedly connected to the first fixing structure 1121, and the first heat conductive member 131 and the second heat conductive member 132 are both fixedly connected to the second fixing structure 1122, so that the first heat conductive member 131 and the second heat conductive member 132 are arranged close to the opening of the receiving groove 111.

[0046] Specifically, two second fixing structures 1122 are provided, and the two second fixing structures 1122 are respectively connected to the first heat conducting member 131 and the second heat conducting member 132. It should be noted that at least one heat insulating board 112 is provided with two second fixing structures 1122, that is, each heat insulating board 112 is provided with two second fixing structures 1122, or only one heat insulating board 112 is provided with two second fixing structures 1122, and this application does not limit this, that is, the number and setting position of the second fixing structures 1122 can be adjusted according to actual needs.

[0047] In this embodiment, the first fixing structure 1121 and the heating mechanism 12 are bolted, welded or plugged in; the second fixing structure 1122 and the first heat conductor 131 are bolted, welded or plugged in; the second fixing structure 1122 and the second heat conductor 132 are bolted, welded or plugged in.

[0048] Exemplarily, the first fixing structure 1121 and the second fixing structure 1122 may be connecting holes, so that the bolts can pass through the first fixing structure 1121 to be fixedly connected to the heating mechanism 12, and the bolts can pass through the second fixing mechanism to be fixedly connected to the first heat conductor 131 and the second heat conductor 132. It should be noted that the heating mechanism 12 can be indirectly connected to the bolts through an adapter bracket, and the heating mechanism 12 can also be directly connected to the bolts; the connection method between the first heat conductor 131 and the bolts, and the connection method between the second heat conductor 132 and the bolts are consistent with the connection method between the heating mechanism 12 and the bolts, and will not be repeated here. Among them, the connecting hole can be a through hole or a threaded hole.

[0049] Exemplarily, when the first fixing structure 1121 and the second fixing structure 1122 are provided on both heat insulating plates 112, the first fixing structure 1121 and the second fixing structure 1122 on one heat insulating plate 112 may be plug holes, so that the heating mechanism 12 can be plugged into the first fixing structure 1121, and the first heat conductive member 131 and the second heat conductive member 132 can be plugged into the second fixing structure 1122. The first fixing structure 1121 on the other heat insulating plate 112 may be connected to the heating mechanism 12 by bolts or welding, and the second fixing structure 1122 on the other heat insulating plate 112 may be connected to the first heat conductive member 131 and the second heat conductive member 132 by bolts or welding, respectively.

[0050] It should be noted that the first fixing structure 1121 and the second fixing structure 1122 are not limited in the present application, and it is only necessary that the heating mechanism 12 , the first heat conducting member 131 and the second heat conducting member 132 can be fixed to the device body 11 .

[0051] As an implementation method, both heat insulation plates 112 are provided with U-shaped grooves 1123 for the wire to pass through, away from the receiving groove 111, and the wire is passed through one of the U-shaped grooves 1123, the heating space 101 and the other U-shaped groove 1123. Through the above arrangement, there is no need to pass one end of the wire through the heating device 100 first, that is, the wire can be heated by the heating device 100 during the winding process of the wire, which is beneficial to improve the heating efficiency of the wire. It should be noted that the wire is wound by the winding wheels located at both ends of the heating device 100. Therefore, if the U-shaped groove 1123 is not provided, the wire needs to pass through the heating device 100 before being wound on a winding wheel, thereby reducing the processing efficiency of the wire.

[0052] like Figure 1 As shown, as an optional implementation, the heating device 100 further includes a connection structure 15 for connecting an external device, and the connection structure 15 is connected to the outside of the device body 11, so that the heating device 100 can be fixed to the external device. Exemplarily, through the above arrangement, the heating device 100 can be fixed on a wire production line, so that the heating of the wire can be achieved during the processing of the wire, thereby improving the processing efficiency of the wire.

[0053] Optionally, the connection structure 15 may be an “L”-shaped sheet metal part, one end of the sheet metal part is fixed to the outside of the connection device body 11 , and the other end of the sheet metal part is used to be fixed to an external device.

[0054] Optionally, the connection structure 15 can be a combination of a hinge and a bolt, and the hinge is fixed to the external device and the device body 11 respectively by bolts, so that a rotational connection can be achieved between the device body 11 and the external device, thereby enabling the heating device 100 to meet different heating requirements.

[0055] It should be noted that the connection structure 15 may also be other structures, as long as the heating device 100 can be connected to external equipment, and this application does not limit this.

[0056] As another implementation, the heating device 100 may include a device body 11 and a heating mechanism 12, that is, the heating device 100 does not include a heat conducting mechanism 13. The heating mechanism 12 is installed in the device body 11, and the heating mechanism 12 heats the device 100 body, so that a heating space 101 is formed inside the device body 11, and the wire is passed through the heating space 101. Through the above arrangement, the heating mechanism 12 can directly heat the wire, thereby simplifying the structure of the heating device 100 while meeting the heating requirements of the wire. Specifically, a plurality of heating mechanisms 12 can be provided, and the plurality of heating mechanisms 12 are evenly distributed in the device body 11, so that the heating mechanism 12 can achieve uniform heating of the wire, so that the wire is evenly heated, and the mechanical properties of the wire are relatively uniform, so as to avoid the wire still needing post-processing due to the uneven mechanical properties of the wire, thereby reducing the processing cost of the wire and improving the production efficiency of the wire.

[0057] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A heating device for heating a wire, characterized in that: The heating device comprises: Device body; A heating mechanism, used to generate heat, the heating mechanism being installed in the device body; A heat-conducting mechanism is installed in the device body, the heat-conducting mechanism is arranged close to the heating mechanism, or the heat-conducting mechanism is in contact with the heating mechanism, the heat-conducting mechanism surrounds a heating space for heating the wire, and the wire is passed through the heating space.

2. The heating device according to claim 1, characterized in that The heating device comprises a temperature measuring mechanism, which is installed in the device body and is also arranged close to the heating mechanism and / or the heat conducting mechanism.

3. The heating device according to claim 1, characterized in that: The heat-conducting mechanism includes a first heat-conducting member and a second heat-conducting member, the first heat-conducting member is located above the second heat-conducting member, the first heat-conducting member and the second heat-conducting member are both close to or in contact with the heating mechanism, and the heating space is formed between the first heat-conducting member and the second heat-conducting member.

4. The heating device according to claim 3, characterized in that: The device body comprises a containing groove and two heat insulation plates respectively located at two ends of the containing groove, and the heat insulation plates are fixedly connected to the containing groove.

5. The heating device according to claim 4, characterized in that: The receiving groove has an opening, the heating mechanism is arranged close to the groove bottom of the receiving groove, and the first heat conducting member and the second heat conducting member are close to the opening of the receiving groove.

6. The heating device according to claim 4, characterized in that: The two heat insulation plates are both provided with a first fixed structure and a second fixed structure, the first fixed structure is arranged close to the bottom of the accommodating groove, the second fixed structure is located on the side of the first fixed structure away from the bottom of the accommodating groove, the heating mechanism is fixedly connected to the first fixed structure, and the first heat conductor and the second heat conductor are both fixedly connected to the second fixed structure.

7. The heating device according to claim 6, characterized in that Two second fixing structures are provided, and the two second fixing structures are respectively connected to the first heat conducting member and the second heat conducting member; The first fixing structure and the heating mechanism are bolted, welded or plugged together; The second fixing structure and the first heat conducting member are connected by bolts, welding or plugging; The second fixing structure and the second heat conducting member are connected by bolts, welding or plugging.

8. The heating device according to claim 4, characterized in that: The two heat insulation plates are provided with U-shaped grooves for the wires to pass through at locations away from the receiving grooves; The wire is passed through one of the U-shaped grooves, the heating space and the other U-shaped groove; The heating device further includes a connection structure for connecting to an external device, wherein the connection structure is connected to the outside of the device body.

9. A heating device for heating a wire, characterized in that: The heating device comprises: Device body; The heating mechanism is used to generate heat. The heating mechanism is installed in the device body. The heating mechanism heats the device body so that a heating space is formed inside the device body. The wire is passed through the heating space.

10. The heating device according to claim 9, characterized in that The heating device further comprises a heat conducting mechanism, which is installed in the device body, arranged close to the heating mechanism, or in contact with the heating mechanism, and the heating space is formed around the heat conducting mechanism.

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