Charging module and charging device

Abstract

The embodiment of the utility model provides a charging module and charging equipment. The charging module comprises at least one power converter, and each power converter comprises a circuit board, a power device and at least one radiator, wherein the power device and the radiator are located on the same side of the circuit board. Each radiator comprises two radiating substrates and a plurality of first radiating fins, the two radiating substrates are oppositely arranged in the direction parallel to the circuit board, the plurality of first radiating fins are connected to the opposite surfaces of the two radiating substrates, and the power device is located between the two radiating substrates and is in heat conduction connection with the two radiating substrates. And the power device is positioned between the circuit board and the plurality of first radiating fins. According to the embodiment of the invention, the heat dissipation efficiency of the radiator in the charging module on the power device can be improved, so that the heat dissipation effect of the charging module is improved, and the service life of the charging equipment is prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of charging equipment, and more specifically, to a charging module and a charging equipment. Background Art

[0002] With the rapid popularization of electric vehicles, the application of charging equipment as supporting facilities is becoming more and more extensive. Due to the rapid growth of the demand for charging power of electric vehicles, the charging modules in the charging equipment are developing towards high power. However, as the charging power increases, the heat generated by the power devices set in the charging module also increases.

[0003] Currently, most charging modules are equipped with a heat sink, which cools the power device by air cooling. However, as the heat generated by the power device continues to increase, the heat dissipation capacity of the existing heat sink can no longer meet the heat dissipation requirements of the power device. Utility Model Content

[0004] The present application provides a charging module and a charging device, which can improve the heat dissipation efficiency of the heat sink in the charging module for power devices, thereby improving the heat dissipation effect of the charging module and extending the service life of the charging device.

[0005] In a first aspect, the present application provides a charging module, which includes at least one power converter, each power converter includes a circuit board, a power device and at least one heat sink, and the power device and at least one heat sink are located on the same side of the circuit board. Each heat sink includes two heat sinks and a plurality of first heat sink fins, the two heat sinks are arranged relative to each other in a direction parallel to the circuit board, and the plurality of first heat sink fins are connected to the opposite surfaces of the two heat sinks. The power device is located between the two heat sinks and is thermally connected to the two heat sinks, and the power device is located between the circuit board and the plurality of first heat sink fins.

[0006] In the charging module provided in the embodiment of the present application, by arranging the power device between the two heat dissipation substrates of the radiator, the heat generated by the power device can be transferred to the two heat dissipation substrates at the same time, that is, the power device can perform double-sided heat dissipation through the two heat dissipation substrates, thereby accelerating the heat dissipation process of the radiator to the power device. In addition, by fixedly arranging a plurality of first heat dissipation fins on the relative surfaces of the two heat dissipation substrates, the radiator can have a higher heat dissipation area. In this way, the two heat dissipation substrates can dissipate the heat transferred by the power device through the plurality of first heat dissipation fins more quickly, so as to improve the heat dissipation efficiency of the radiator to the power device. In addition, the heat dissipation effect of the charging module is improved, and the service life of the charging device is extended.

[0007] In one implementation, the charging module includes an air inlet and an air outlet, the air inlet and the air outlet are arranged opposite to each other in a direction perpendicular to the arrangement of the two heat dissipation substrates, and the arrangement direction of the air inlet and the air outlet is parallel to the circuit board. In a direction perpendicular to the arrangement of the air inlet and the air outlet, a plurality of first heat dissipation fins are arranged at intervals on opposite surfaces of the two heat dissipation substrates.

[0008] In the charging module provided in the embodiment of the present application, an air duct connecting the air inlet and the air outlet is formed along the direction in which the air inlet and the air outlet are set. By arranging a plurality of first heat dissipation fins at intervals perpendicular to the direction in which the air inlet and the air outlet are set, the gap between two adjacent first heat dissipation fins can extend along the direction in which the air inlet and the air outlet are set, that is, along the air flow duct in the charging module. In this way, the gap between two adjacent first heat dissipation fins can be used as part of the air flow duct in the charging module, thereby reducing the resistance encountered when the air flow passes through the gap between two adjacent first heat dissipation fins. In the process of flowing from the air inlet to the air outlet, the air flow in the charging module can pass through the gap between two adjacent first heat dissipation fins to take away the heat of the first heat dissipation fins, and dissipate the heat out of the charging module through the air outlet. Furthermore, the heat dissipation process of the radiator to the power device is accelerated, thereby improving the heat dissipation effect of the charging module.

[0009] In one implementation, the heat sink further includes a plurality of second heat dissipation fins, which are arranged at intervals on the opposite surfaces of the two heat dissipation substrates in a direction perpendicular to the arrangement of the air inlet and the air outlet. In the direction in which the two heat dissipation substrates are arranged, the projections of the plurality of second heat dissipation fins overlap with the projection of the power device.

[0010] In the charging module provided in the embodiment of the present application, by fixing and arranging a plurality of second heat sink fins on the opposite surfaces of two heat sinks, the heat sink's heat dissipation area can be further increased, thereby accelerating the heat dissipation process of the heat sink for power devices. In addition, by arranging a plurality of second heat sink fins at intervals in a direction perpendicular to the air inlet and the air outlet, the gap between two adjacent second heat sink fins can extend along the air flow duct in the charging module. In this way, the gap between two adjacent second heat sink fins arranged on the surface of the same heat sink can also serve as part of the air flow duct in the charging module, thereby reducing the resistance encountered by the air flow when passing through the gap between two adjacent first heat sink fins. In addition, the heat dissipation process of the heat sink for power devices is accelerated, and the heat dissipation effect of the charging module is improved.

[0011] In one implementation, the heat sink further includes a plurality of third heat sink fins, which are arranged at intervals on the end surfaces of the two heat sinks away from the circuit board along the direction in which the two heat sinks are arranged. Along the direction in which the plurality of first heat sink fins are arranged, the projections of the third heat sink fins arranged on each heat sink overlap with the projections of the first heat sink fins arranged on each heat sink and the projections of the second heat sink fins arranged on each heat sink.

[0012] In the charging module provided in the embodiment of the present application, by fixing and arranging a plurality of third heat sink fins on the end surfaces of the two heat sinks away from the circuit board, the heat sink's heat dissipation area can be further increased, thereby accelerating the heat dissipation process of the heat sink for the power device. In addition, by arranging a plurality of third heat sink fins at intervals along the direction in which the two heat sinks are set, that is, arranging them at intervals along the direction perpendicular to the setting of the air inlet and the air outlet, the gap between two adjacent third heat sink fins can extend along the air flow duct in the charging module. In this way, the gap between two adjacent third heat sink fins arranged on the surface of the same heat sink can also serve as part of the air flow duct in the charging module, thereby reducing the resistance encountered by the air flow when passing through the gap between two adjacent first heat sink fins. In addition, the heat dissipation process of the radiator for the power device is accelerated, and the heat dissipation effect of the charging module is improved.

[0013] In one implementation, a plurality of first heat sink fins are divided into two groups, each group of first heat sink fins is connected to a heat sink base, one end of each first heat sink fin is used to connect to the heat sink base, and the other end of each first heat sink fin is located on the side of one end of each first heat sink fin away from the connected heat sink base. The dimension of one end of each first heat sink fin along the arrangement direction of the plurality of first heat sink fins is greater than the dimension of the other end of each first heat sink fin along the arrangement direction of the plurality of first heat sink fins. The dimension of one end of each first heat sink fin along the arrangement direction of the plurality of first heat sink fins is greater than or equal to 0.6 mm and less than or equal to 1.2 mm. The dimension of the other end of each first heat sink fin along the arrangement direction of the plurality of first heat sink fins is greater than or equal to 0.2 mm and less than 1.2 mm.

[0014] It should be understood that one end of the first heat sink fin may refer to the fin root of the first heat sink fin, and the other end of the first heat sink fin may refer to the fin top of the first heat sink fin. The dimension of the first heat sink fin along the arrangement direction of the plurality of first heat sink fins may be referred to as the thickness of the first heat sink fin.

[0015] In the charging module provided in the embodiment of the present application, by setting the thickness of the root of the first heat dissipation fin to be greater than the thickness of the top of the fin, and setting the above two thicknesses within an appropriate range, it is possible to reduce the weight and cost of the radiator and increase the temperature difference between the first heat dissipation fin and the airflow in the charging module, which is beneficial to improving the heat exchange efficiency between the first heat dissipation fin and the airflow, further accelerating the heat dissipation process of the radiator to the power device, and improving the heat dissipation effect of the charging module.

[0016] In one implementation, along the arrangement direction of the plurality of first heat dissipation fins, the spacing distance between two adjacent first heat dissipation fins connected to the same heat dissipation substrate is greater than or equal to 1 mm and less than or equal to 2 mm.

[0017] In the charging module provided by the embodiment of the present application, by setting the interval between two adjacent first heat dissipation fins arranged on the surface of the same heat dissipation substrate within a suitable range, on the one hand, it is helpful to ensure that there is enough gap between the two adjacent first heat dissipation fins for air flow, so that the air flow in the charging module can flow through the gap between the two adjacent first heat dissipation fins in the process of flowing from the air inlet to the air outlet, so as to take away the heat of the first heat dissipation fins and speed up the heat dissipation process of the radiator to the power device. On the other hand, it is helpful to arrange the multiple first heat dissipation fins connected to the same heat dissipation substrate surface relatively compactly, so that more first heat dissipation fins can be arranged on the same heat dissipation substrate surface, thereby better increasing the heat dissipation area of ​​the radiator, speeding up the heat dissipation process of the radiator to the power device, and improving the heat dissipation effect of the charging module.

[0018] In one implementation, the plurality of first heat sink fins further include a glue filling hole, and the glue filling hole penetrates the plurality of first heat sink fins along the arrangement direction of the plurality of first heat sink fins. Along the arrangement direction of the plurality of first heat sink fins, the projection of the glue filling hole is located within the projection of the plurality of first heat sink fins. In this way, the power device located between the two heat sink substrates can be filled with glue through the provided glue filling hole, so that the power device is buried in the colloid, thereby preventing the power device from being corroded by the harsh environment. Furthermore, it is beneficial to increase the life of the power device and the service life of the charging module.

[0019] In one implementation, along the direction in which the air inlet and the air outlet are arranged, the distance between each heat sink and the air inlet is smaller than the distance between each heat sink and the air outlet; and the multiple heat sinks in each power converter are arranged at intervals along the direction in which the two heat dissipation substrates are arranged. That is, compared with the air outlet, each heat sink in the power converter is arranged closer to the air inlet.

[0020] In the charging module provided in the embodiment of the present application, when the power converter includes multiple radiators, by arranging each radiator close to the air inlet, the airflow flowing into the charging module from the air inlet can flow to each radiator faster, thereby accelerating the heat dissipation process of each radiator for the power device and improving the heat dissipation effect of the charging module. In addition, by arranging multiple radiators at intervals along the direction in which the two heat dissipation substrates are set, that is, arranging them at intervals along the direction perpendicular to the setting of the air inlet and the air outlet, the gap between two adjacent radiators can extend along the direction in which the air inlet and the air outlet are set, that is, extend along the air flow duct in the charging module. Furthermore, the airflow in the charging module can flow between two adjacent radiators, thereby accelerating the heat dissipation process of the radiator for the power device and improving the heat dissipation effect of the charging module.

[0021] In one implementation, at least one power converter includes an AC-DC converter and a DC-DC converter, the AC-DC converter is used to convert AC power into DC power, and the DC-DC converter is used to convert the voltage of the DC power. The AC-DC converter and the DC-DC converter are arranged at intervals along a direction perpendicular to the air inlet and the air outlet, and the interval between the AC-DC converter and the DC-DC converter connects the air inlet and the air outlet. In this way, the airflow flowing into the charging module from the air inlet can flow in the interval space between the AC-DC converter and the DC-DC converter, and the airflow encounters less resistance when flowing, which is conducive to improving the effect of air cooling and heat dissipation of the AC-DC converter and the DC-DC converter.

[0022] In the second aspect, the present application provides a charging device, which includes a charging module and a charging gun. The charging module is electrically connected to the charging gun. The charging module is used to convert AC power into DC power and output it to the charging gun. The charging gun is used to provide DC power to the electric vehicle. The charging device includes at least one power converter, each power converter includes a circuit board, a power device and at least one heat sink, and the power device and the at least one heat sink are located on the same side of the circuit board. Each heat sink includes two heat sinks and a plurality of first heat sink fins. The two heat sinks are arranged relative to each other in a direction parallel to the circuit board, and the plurality of first heat sinks are connected to the opposite surfaces of the two heat sinks. The power device is located between the two heat sinks and is thermally connected to the two heat sinks, and the power device is located between the circuit board and the plurality of first heat sinks.

[0023] For the beneficial effects of the second aspect that are not detailed, please refer to the beneficial effects of the first aspect mentioned above, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of a charging system provided in an embodiment of the present application.

[0025] Figure 2 It is a structural schematic diagram of a charging system provided in an embodiment of the present application.

[0026] Figure 3 It is a schematic diagram of the exploded structure of a charging module provided in an embodiment of the present application.

[0027] Figure 4 It is a schematic diagram of the structure of a power converter provided in an embodiment of the present application.

[0028] Figure 5 It is a schematic diagram of the three-dimensional structure of a radiator provided in an embodiment of the present application.

[0029] Figure 6 yes Figure 5 Schematic diagram of the two-dimensional structure of the heat sink shown.

[0030] Figure 7 It is a schematic diagram of the three-dimensional structure of another radiator provided in an embodiment of the present application.

[0031] Figure 8 It is a schematic diagram of the three-dimensional structure of another radiator provided in an embodiment of the present application.

[0032] Fig. 9 It is a schematic diagram of the three-dimensional structure of another radiator provided in an embodiment of the present application. DETAILED DESCRIPTION

[0033] To facilitate understanding of the embodiments of the present application, the following points are explained before introducing the embodiments of the present application.

[0034] In the embodiments of the present application, the terms "first" and "second" are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may include one or more features either explicitly or implicitly. In addition, in the description of the embodiments of the present application, "plurality" refers to two or more than two.

[0035] The directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside" and "outside" in the embodiments of the present application are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on the present application.

[0036] The "perpendicular" mentioned in this application is not perpendicular in the strict sense, but within the allowable error range. The "parallel" is not parallel in the strict sense, but within the allowable error range.

[0037] In the embodiments of the present application, the same reference numerals represent the same component or the same part. In the embodiments of the present application, for multiple identical parts, only one of the parts may be marked with a reference numeral in the drawings as an example. For other identical parts or components, the reference numerals are also applicable. In addition, the sizes and dimensions of the parts shown in the drawings are only exemplary.

[0038] An embodiment of the present application provides a charging module, which includes at least one power converter, each power converter includes a circuit board, a power device and at least one heat sink, and the power device and the at least one heat sink are located on the same side of the circuit board. Each heat sink includes two heat sinks and a plurality of first heat sink fins, the two heat sinks are arranged relative to each other in a direction parallel to the circuit board, and the plurality of first heat sink fins are connected to the opposite surfaces of the two heat sinks. The power device is located between the two heat sinks and is thermally connected to the two heat sinks, and the power device is located between the circuit board and the plurality of first heat sink fins.

[0039] In the charging module provided in the embodiment of the present application, by arranging the power device between the two heat dissipation substrates of the radiator, the heat generated by the power device can be transferred to the two heat dissipation substrates at the same time, that is, the power device can perform double-sided heat dissipation through the two heat dissipation substrates, thereby accelerating the heat dissipation process of the radiator to the power device. In addition, by fixedly arranging a plurality of first heat dissipation fins on the relative surfaces of the two heat dissipation substrates, the radiator can have a higher heat dissipation area. In this way, the two heat dissipation substrates can dissipate the heat transferred by the power device through the plurality of first heat dissipation fins more quickly, so as to improve the heat dissipation efficiency of the radiator to the power device. In addition, the heat dissipation effect of the charging module is improved, and the service life of the charging device is extended.

[0040] The embodiment of the present application also provides a charging device, which includes the charging module and the charging gun described above. The charging module and the charging gun are electrically connected, and the charging module is used to convert AC power into DC power and output it to the charging gun, and the charging gun is used to provide the DC power to the electric vehicle. As described above, the heat dissipation effect of the charging module is good, which is conducive to extending the service life of the charging device.

[0041] The charging device provided in the embodiment of the present application can be applied to a charging system including an electric vehicle. In the charging system, the charging device can use the electric energy from the power grid to charge the electric vehicle. Figure 1 to Figure 2 The charging device provided in the embodiment of the present application is first described in detail.

[0042] Figure 1 It is a scenario schematic diagram of a charging system 10 provided in an embodiment of the present application. Figure 2 yes Figure 1The connection structure diagram of the charging system 10 is shown.

[0043] Combination Figure 1 and Figure 2 The charging system 10 includes a charging device 11 and an electric vehicle 12. The charging device 11 includes a charging host 111, at least one charging terminal 112 and at least one charging gun 113, that is, the charging device 11 can be a split charging pile. Among them, the charging host 111 includes at least one charging module 1111, and each charging module 1111 is electrically connected between the power grid 20 and at least one charging terminal 112. At least one charging terminal 112 is electrically connected to at least one charging gun 113, and each charging gun 113 is used to electrically connect the electric vehicle 12. Exemplarily, one charging terminal 112 can be electrically connected to one or more charging guns 113.

[0044] Each charging module 1111 is used to convert the AC power from the power grid 20 into DC power suitable for the electric vehicle 12 and then output it to the charging terminal 112. In one example, the charging host 111 also includes a power distribution device 1112, and at least one charging module 1111 is electrically connected to each charging terminal 112 through the power distribution device 1112. The power distribution device 1112 is used to dynamically distribute the DC power output by at least one charging module 1111 to each charging terminal 112.

[0045] The charging terminal 112 transmits the received DC power to the electric vehicle 12 through the electrically connected charging gun 113 to charge the electric vehicle 12. Exemplarily, the charging terminal 112 may include a housing, a human-machine interaction interface, a charging control unit, and a metering and billing unit, and is used to perform information exchange, energy transmission, metering and billing, etc. with the electric vehicle 12.

[0046] It should be understood that the embodiment of the present application is described by taking the charging device 11 as a split-type charging pile as an example. In some other embodiments, the charging device 11 may also be an integrated charging pile. Specifically, the charging device 11 may directly set the human-machine interaction interface, the charging control unit, and the metering and billing unit in the charging host 111, so that the charging device 11 may only include the charging host 111 and at least one charging gun 113 connected to the charging host 111, but not the charging terminal 112.

[0047] The electric vehicle 12 may be a vehicle driven by electric energy, such as a pure electric vehicle / battery electric vehicle (pure EV / battery EV), a hybrid electric vehicle (HEV), a range extended electric vehicle (REEV), or a plug-in hybrid electric vehicle (PHEV).

[0048] As mentioned above, the charging module 1111 in the charging device 11 can convert the AC power from the power grid 20 into DC power for output. Figures 3 to 9 The specific structure of the charging module provided in the embodiment of the present application is described in detail.

[0049] Figure 3 It is a structural schematic diagram of a charging module 30 provided in an embodiment of the present application. Figure 4 yes Figure 3 The partial structural diagram of the charging module 30 is shown in FIG. It should be understood that in the embodiment of the present application, the charging module 30 may be Figure 2 The charging module 1111 is shown.

[0050] See also Figure 3 The charging module 30 includes a housing 310 and at least one power converter 320. The housing 310 includes an upper housing 311 and a lower housing 312, and the upper housing 311 and the lower housing 312 are buckled and connected to each other to form a receiving space, and the at least one power converter 320 is received in the receiving space.

[0051] In some embodiments, the shell 310 also includes an air inlet M1 and an air outlet M2 that are relatively arranged. The external air flows into the shell 310 through the air inlet M1 and flows out of the shell 310 through the air outlet M2, thereby forming an air duct connecting the air inlet M1 and the air outlet M2 in the shell 310 along the direction in which the air inlet M1 and the air outlet M2 are arranged, so as to perform air cooling and heat dissipation on the devices in the shell 310, for example, to perform air cooling and heat dissipation on at least one power converter 320 in the shell 310.

[0052] In one example, the housing 310 further includes a front panel 313 and a rear panel 314 that are arranged opposite to each other, and the front panel 313 and the rear panel 314 are respectively fixedly connected to the upper housing 311 and the lower housing 312 to form a storage space for placing at least one power converter 320. The air inlet M1 is arranged on the rear panel 314, and the air outlet M2 is arranged on the front panel 313.

[0053] It should be understood that the specific positions of the air inlet M1 and the air outlet M2 are only for illustration. In another example, the air inlet M1 can be set on the front panel 313, and the air outlet M2 can be set on the rear panel 314. For ease of description and understanding, the embodiment of the present application is described by taking the air inlet M1 being set on the rear panel 314 and the air outlet M2 being set on the front panel 313 as an example.

[0054] In some embodiments, the charging module 30 further includes a fan (not shown in the figure), which is housed in the housing 310 and disposed near the air inlet M1. On the one hand, the fan can cool the components in the housing 310. On the other hand, the fan is disposed near the air inlet M1, and under the action of the fan, the airflow in the housing 310 will flow from the air inlet M1 to the air outlet M2. When the airflow in the housing 310 flows from the air inlet M1 to the air outlet M2, it will take away the heat in the housing 310. In this way, the heat dissipation process of the charging module 30 is accelerated.

[0055] Next, continue to combine Figure 3 and Figure 4 The at least one power converter 320 housed in the housing 310 is described in detail.

[0056] Combination Figure 3 and Figure 4 In some embodiments, at least one power converter 320 in the charging module 30 may include an alternating current-direct current (AC-DC) converter 320a and a direct current-direct current (DC-DC) converter 320b. Each of the AC-DC converter 320a and the DC-DC converter 320b includes a circuit board 321, a power device 322 and at least one heat sink 323, and the power device 322 and the at least one heat sink 323 are located on the same side of the circuit board 321. The circuit board 321 is used to fix the power device 322 and is electrically connected to the power device 322, and the at least one heat sink 323 is used to dissipate heat for the power device 322. The AC-DC converter 320a is used to convert the alternating current from the power grid 20 into direct current, and the DC-DC converter 320b is used to convert the voltage of the direct current, for example, to perform step-up and / or step-down conversion on the direct current.

[0057] It should be understood that there may be a plurality of power devices 322 , and each heat sink 323 may dissipate heat for at least one power device 322 .

[0058] Exemplarily, the power device 322 may refer to one or more of various types of switch tubes such as a metal oxide semiconductor field effect transistor (MOSFET), a bipolar junction transistor (BJT), an insulated gate bipolar transistor (IGBT), and a silicon carbide (SiC) transistor. The packaging form of each switch tube may be a single tube package or a multi-tube package.

[0059] In some embodiments, the AC-DC converter 320a and the DC-DC converter 320b are arranged at intervals along a direction perpendicular to the arrangement of the air inlet M1 and the air outlet M2, and the interval between the AC-DC converter 320a and the DC-DC converter 320b connects the air inlet M1 and the air outlet M2. In this way, the airflow flowing into the housing 310 from the air inlet M1 can flow through the interval space between the AC-DC converter 320a and the DC-DC converter 320b, and flow out through the air outlet M2. The airflow encounters less resistance when flowing, which is conducive to improving the effect of air cooling and heat dissipation of the AC-DC converter 320a and the DC-DC converter 320b.

[0060] For example, in one example, the circuit board 321 in the AC-DC converter 320a and the circuit board 321 in the DC-DC converter 320b are arranged relative to each other in a direction perpendicular to the air inlet M1 and the air outlet M2, that is, the direction in which the air inlet M1 and the air outlet M2 are arranged is parallel to the circuit board 321 in the AC-DC converter 320a and the circuit board 321 in the DC-DC converter 320b. Wherein, the circuit board 321 in the AC-DC converter 320a and the circuit board 321 in the DC-DC converter 320b both include a first circuit board surface 3211 and a second circuit board surface 3212 arranged relative to each other in a direction perpendicular to the air inlet M1 and the air outlet M2. The first circuit board surface 3211 in the AC-DC converter 320a is fixedly connected to the lower housing 312, and the second circuit board surface 3212 is fixedly connected to the power device 322 in the AC-DC converter 320a. The first circuit board surface 3211 of the DC-DC converter 320 b is fixedly connected to the upper housing 311 , and the second circuit board surface 3212 is fixedly connected to the power device 322 of the DC-DC converter 320 b .

[0061] In some other embodiments, the charging module 30 may include only one power converter 320, for example, only an AC-DC converter 320a, but not a DC-DC converter 320b. The first circuit board surface 3211 in the AC-DC converter 320a may be fixedly connected to the upper housing 311 or the lower housing 312.

[0062] It should be understood that, for ease of description and understanding, the embodiment of the present application is described by taking the example that the charging module 30 includes two power converters 320, namely, an AC-DC converter 320a and a DC-DC converter 320b.

[0063] The following takes the AC-DC converter 320a as an example, and describes in detail the specific structure of the heat sink 323 in the power converter 320 provided in the embodiment of the present application in combination with the accompanying drawings. It should be understood that the following description of the heat sink 323 is applicable to any power converter 320 in the above-mentioned charging module 30, for example, applicable to the DC-DC converter 320b.

[0064] Figure 5 It is a schematic diagram of the three-dimensional structure of a heat sink 323 provided in an embodiment of the present application. Figure 6 yes Figure 5 A front view of the heat sink 323 is shown.

[0065] Combination Figures 3 to 6 In some embodiments, each heat sink 323 in the AC-DC converter 320a includes two heat dissipation bases, namely, a heat dissipation base 3231a and a heat dissipation base 3231b, and a plurality of first heat dissipation fins 3232. The heat dissipation base 3231a and the heat dissipation base 3231b are arranged relative to each other in a direction parallel to the circuit board 321, and the arrangement direction of the heat dissipation base 3231a and the heat dissipation base 3231b is perpendicular to the arrangement direction of the air inlet M1 and the air outlet M2. The plurality of first heat dissipation fins 3232 are connected to the opposite surfaces of the heat dissipation base 3231a and the heat dissipation base 3231b. The power device 322 is located between the heat dissipation base 3231a and the heat dissipation base 3231b and is thermally connected to the heat dissipation base 3231a and the heat dissipation base 3231b, and the power device 322 is located between the circuit board 321 and the plurality of first heat dissipation fins 3232.

[0066] Specifically, if Figure 5As shown, along the setting direction of the heat dissipation base 3231a and the heat dissipation base 3231b, the heat dissipation base 3231a includes a first side surface S1 and a second side surface S2 that are arranged oppositely, and the heat dissipation base 3231b includes a third side surface S3 and a fourth side surface S4 that are arranged oppositely. The first side surface S1 of the heat dissipation base 3231a and the third side surface S3 of the heat dissipation base 3231b are arranged oppositely, and the second side surface S2 of the heat dissipation base 3231a and the fourth side surface S4 of the heat dissipation base 3231b are arranged oppositely. Among them, the interval between the first side surface S1 and the third side surface S3 close to the circuit board 321 forms a receiving cavity R, and the power device 322 is accommodated in the receiving cavity R and is thermally connected to the first side surface S1 and the third side surface S3. Exemplarily, the number of the power devices 322 in the receiving cavity R can be one or more.

[0067] In this way, the heat generated by the power device 322 located in the accommodating cavity R can be simultaneously transferred to the heat dissipation base 3231a and the heat dissipation base 3231b that are thermally connected, that is, the power device 322 can be cooled on both sides through the heat dissipation base 3231a and the heat dissipation base 3231b of the radiator 323, which is beneficial to accelerate the heat dissipation process of the radiator 323 for the power device 322.

[0068] In addition, a plurality of first heat dissipation fins 3232 are fixedly connected to the first side surface S1 and the third side surface S3 away from the circuit board 321. A large number of first heat dissipation fins 3232 enable the heat sink 323 to have a higher heat dissipation area. In this way, the heat transferred from the power device 322 to the heat dissipation base 3231a and the heat dissipation base 3231b can be dissipated more quickly through the plurality of first heat dissipation fins 3232 connected to the first side surface S1 and the second side surface S2, so as to improve the heat dissipation efficiency of the heat sink 323 to the power device 322. In addition, the heat dissipation effect of the charging module 30 is improved.

[0069] Furthermore, in some embodiments, the heat sink 323 further includes a heat conducting layer (not shown in the figure), and the power device 322 can be thermally connected to the first side surface S1 of the heat dissipation substrate 3231a and the third side surface S3 of the heat dissipation substrate 3231b respectively through the heat conducting layer. The heat conducting layer can play the role of insulation and heat conduction, and further, the efficiency of heat generated by the power device 322 being transferred to the two heat dissipation substrates can be improved through the heat conducting layer, thereby accelerating the heat dissipation process of the power device 322 by the heat sink 323.

[0070] Exemplarily, the material used for the heat-conducting layer is a thermal interface material, which is also called thermal interface material, or TIM for short. Specifically, TIM includes but is not limited to silicone grease, thermal conductive gel, graphite film, phase change material, etc.

[0071] In some embodiments, in combination Figures 3 to 6 , along the direction perpendicular to the air inlet M1 and the air outlet M2, a plurality of first heat dissipation fins 3232 are arranged at intervals on the surfaces opposite to the heat dissipation base 3231a and the heat dissipation base 3231b, that is, arranged at intervals on the first side surface S1 of the heat dissipation base 3231a and the third side surface S3 of the heat dissipation base 3231a. In this way, the gap between two adjacent first heat dissipation fins 3232 arranged on the same heat dissipation base, for example, arranged on the heat dissipation base 3231a, extends along the direction in which the air inlet M1 and the air outlet M2 are arranged, that is, extends along the air flow path in the housing 310.

[0072] Furthermore, in actual application, the gap between two adjacent first heat dissipation fins 3232 can be used as part of the airflow duct in the housing 310, thereby reducing the resistance encountered by the airflow when passing through the gap between two adjacent first heat dissipation fins 3232. In the process of the airflow in the housing 310 flowing from the air inlet M1 to the air outlet M2, it can pass through the gap between two adjacent first heat dissipation fins 3232 to take away the heat of the first heat dissipation fins 3232, and dissipate the heat out of the housing 310 through the air outlet M2. Furthermore, the heat dissipation process of the radiator 323 to the power device 322 is accelerated, thereby improving the heat dissipation effect of the charging module 30.

[0073] In some embodiments, such as Figure 6 As shown, the plurality of first heat dissipation fins 3232 can be divided into two groups, one group of first heat dissipation fins 3232 is connected to the first side surface S1 of the heat dissipation base 3231a, and the other group of first heat dissipation fins 3232 is connected to the third side surface S3 of the heat dissipation base 3231b. Among them, one end 32321 of each first heat dissipation fin 3232 is used to connect to the heat dissipation base, for example, to connect to the heat dissipation base 3231a or 3231b. The other end 32322 of each first heat dissipation fin 3232 is located on the side of the one end 32321 of each first heat dissipation fin 3232 away from the connected heat dissipation base. Along the arrangement direction of the plurality of first heat dissipation fins 3232, the size d of the one end 32321 of each first heat dissipation fin 3232 is 1 is larger than the dimension d of the other end 32322 of each first heat dissipating fin 3232 2 .

[0074] It should be understood that one end 32321 of the first heat dissipation fin 3232 may refer to the fin root of the first heat dissipation fin 3232, and the other end 32322 of the first heat dissipation fin 3232 may refer to the fin top of the first heat dissipation fin 3232. The dimension of the first heat dissipation fin 3232 along the arrangement direction of the plurality of first heat dissipation fins 3232 may refer to the thickness of the first heat dissipation fin 3232.

[0075] In the embodiment of the present application, by setting the thickness of the root of the first heat dissipating fin 3232 to be greater than the thickness of the top of the fin, that is, the first heat dissipating fin 3232 gradually narrows from the root to the top, on the one hand, it is beneficial to reduce the weight and cost of the radiator 323; on the other hand, increasing the thickness of the root of the first heat dissipating fin 3232 is beneficial to increase the temperature difference between the first heat dissipating fin 3232 and the airflow in the shell 310, thereby improving the heat exchange efficiency between the first heat dissipating fin 3232 and the airflow, further accelerating the heat dissipation process of the radiator 323 to the power device 322, and improving the heat dissipation effect of the charging module 30.

[0076] Furthermore, in some embodiments, along the arrangement direction of the plurality of first heat dissipation fins 3232, the dimension d of one end 32321 of each first heat dissipation fin 3232 is 1 The dimension d of the other end 32322 of each first heat dissipating fin 3232 is greater than or equal to 0.6 mm and less than or equal to 1.2 mm. 2 Greater than or equal to 0.2mm and less than 1.2mm.

[0077] For example, in one example, the size d of one end 32321 of the first heat dissipation fin 3232 is 1 The dimension d of the other end 32322 of the first heat dissipation fin 3232 is 0.6 mm. 2 Or, in another example, the dimension d of one end 32321 of the first heat dissipation fin 3232 is 1 The dimension d of the other end 32322 of the first heat dissipation fin 3232 is 0.9 mm. 2 Alternatively, the dimension d of one end 32321 of the first heat dissipation fin 3232 is 1 The dimension d of the other end 32322 of the first heat dissipation fin 3232 is 1.2 mm. 2 is 1.0mm.

[0078] In the embodiment of the present application, by setting the thickness of the root of the first heat sink 3232 and the thickness of the top of the fin within a suitable range, not only can the first heat sink 3232 gradually become narrower from the root to the top, which is beneficial to reducing the weight and cost of the radiator 323 and speeding up the heat dissipation process of the radiator 323 for the power device 322, but also the processing and production of the first heat sink 3232 is facilitated.

[0079] In some embodiments, continue to refer to Figure 6 , along the arrangement direction of the plurality of first heat dissipation fins 3232, the spacing distance d between two adjacent first heat dissipation fins 3232 connected to the same heat dissipation substrate 3For example, along the arrangement direction of the plurality of first heat dissipation fins 3232, the spacing distance d between two adjacent first heat dissipation fins 3232 arranged on the heat dissipation base 3232b is 3 d is greater than or equal to 1 mm and less than or equal to 2 mm. For example, the spacing distance d between two adjacent first heat dissipation fins 3232 arranged on the heat dissipation substrate 3232b is 3 It can be 1mm, 1.2mm, 1.4mm, 1.5mm, 1.6mm, 1.8mm or 2mm.

[0080] In the embodiment of the present application, by setting the interval between two adjacent first heat dissipation fins 3232 arranged on the same heat dissipation substrate within a suitable range, on the one hand, it is helpful to ensure that there is a sufficient gap between the two adjacent first heat dissipation fins 3232 for air flow, so that the air flow in the housing 310 can flow through the gap between the two adjacent first heat dissipation fins 3232 in the process of flowing from the air inlet M1 to the air outlet M2, so as to take away the heat of the first heat dissipation fins 3232 and accelerate the heat dissipation process of the radiator 323 to the power device 322. On the other hand, it is helpful to arrange the multiple first heat dissipation fins 3232 connected to the surface of the same heat dissipation substrate relatively compactly, so that more first heat dissipation fins 3232 can be arranged on the same heat dissipation substrate surface, thereby better improving the heat dissipation area of ​​the radiator 323, accelerating the heat dissipation process of the radiator 323 to the power device 322, and improving the heat dissipation effect of the charging module 30.

[0081] In some embodiments, each first heat dissipation fin 3232 in the heat sink 323 and the heat dissipation base connected thereto may be integrally formed, for example, integrally formed with the heat dissipation base 3231a or the heat dissipation base 3231b. In this way, the thermal conductivity resistance between the two heat dissipation bases in the heat sink 323 and the first heat dissipation fins 3232 connected thereto can be reduced, the heat dissipation process of the heat sink 323 to the power device 322 can be accelerated, and the heat dissipation effect of the charging module 30 can be improved.

[0082] In some embodiments, the combination Figures 3 to 6 The heat sink 323 further includes a plurality of second heat dissipation fins 3233. In a direction perpendicular to the air inlet M1 and the air outlet M2, the plurality of second heat dissipation fins 3233 are arranged at intervals on the opposite surfaces of the heat dissipation base 3231a and the heat dissipation base 3231b, that is, arranged at intervals on the second side surface S2 of the heat dissipation base 3231a and the fourth side surface S4 of the heat dissipation base 3231b. In other words, the arrangement direction of the plurality of second heat dissipation fins 3233 is the same as that of the plurality of first heat dissipation fins 3232.

[0083] In this way, on the basis of the heat dissipation base 3231a and the heat dissipation base 3231b being fixedly connected to a plurality of first heat dissipation fins 3232, by making the heat dissipation base 3231a and the heat dissipation base 3231b also fixedly connected to a plurality of second heat dissipation fins 3233, the heat dissipation area of ​​the heat sink 323 can be further increased, thereby better accelerating the heat dissipation process of the heat sink 323 to the power device 322. In addition, the gap between two adjacent second heat dissipation fins 3233 arranged on the same heat dissipation base, for example, arranged on the heat dissipation base 3231a, extends along the direction in which the air inlet M1 and the air outlet M2 are set, that is, extends along the air flow duct in the housing 310. In actual application, the gap between two adjacent first heat dissipation fins 3232 can be used as a part of the air flow duct in the housing 310, thereby reducing the resistance encountered by the air flow when passing through the gap between two adjacent first heat dissipation fins 3232. Furthermore, it is beneficial to accelerate the heat dissipation process of the heat sink 323 to the power device 322 and improve the heat dissipation effect of the charging module 30.

[0084] Further, in some embodiments, in combination Figure 5 and Figure 6 In the heat dissipation base 3231a, along the arrangement direction of the plurality of first heat dissipation fins 3232, the end surface of each first heat dissipation fin 3232 away from the first side surface S1 is flush, and the end surface of each second heat dissipation fin 3233 away from the second side surface S2 is flush along the first direction. Similarly, in the heat dissipation base 3231b, along the arrangement direction of the plurality of first heat dissipation fins 3232, the end surface of each first heat dissipation fin 3232 away from the third side surface S3 is flush, and the end surface of each second heat dissipation fin 3233 away from the fourth side surface S4 is flush. In this way, the heat sink 323 can meet the requirements of regularized design and reduce the processing difficulty of the heat sink 323.

[0085] In some embodiments, Figure 6 As shown, one end of each second heat dissipation fin 3233 in the heat sink 323 is used to connect to a heat dissipation base, for example, to connect to the heat dissipation base 3231a or the heat dissipation base 3231b. The other end of each second heat dissipation fin 3233 is located at a side of the heat dissipation base that is away from the one end of each second heat dissipation fin 3233. Along the arrangement direction of the plurality of second heat dissipation fins 3233, the size of one end of each second heat dissipation fin 3233 is larger than the size of the other end of each second heat dissipation fin 3233.

[0086] It should be understood that the above description about the size of the first heat sink fin 3232 is also applicable to the second heat sink fin 3233. Therefore, the description about the size of the second heat sink fin 3233 can refer to the above description about the first heat sink fin 3232, which will not be repeated here.

[0087] Figure 73 is a schematic diagram of another three-dimensional structure of a heat sink 323 provided in an embodiment of the present application. It should be understood that Figure 7 The illustrated embodiment includes Figure 5 and Figure 6 To avoid redundancy in most of the technical features of the illustrated embodiment, the following mainly describes the differences between the two.

[0088] In some embodiments, such as Figure 7 As shown, the heat sink 323 further includes a glue injection hole 3234 , which penetrates the plurality of first heat dissipation fins 3232 along the arrangement direction of the plurality of first heat dissipation fins 3232 to communicate with the accommodating cavity R. In this way, the power device 322 in the accommodating cavity R can be injected with glue through the glue injection hole 3234 .

[0089] During the assembly process of the heat sink 323 and the power device 322, the power device 322 can be first fixed on the circuit board 321 and placed in the receiving cavity R of the heat sink 323, and then the fluid glue is poured into the receiving cavity R through the glue injection hole 3234, so that the fluid glue submerges the power device 322 in the receiving cavity R. After that, it is placed at room temperature or placed in a thermostat for heating, so that the power device 322 in the receiving cavity R is buried in the glue. In this way, dust and the like can be prevented from accumulating on the power device 322, and the power device 322 can also be prevented from being corroded by the harsh environment, which is conducive to improving the life of the power device 322, and then improving the service life of the charging module 30.

[0090] Furthermore, in some embodiments, along the arrangement direction of the plurality of first heat dissipation fins 3232, the projection of the glue injection hole 3234 is located within the projection of the plurality of first heat dissipation fins 3232. In this way, it can be ensured that the glue is more accurately injected into the accommodation cavity R through the glue injection hole 3234 during glue injection.

[0091] In some embodiments, in combination Figure 4 and Figure 7 The power device 322 includes a fixedly connected power device body (not shown in the figure) and a power pin 3221. The power device body is buried in the colloid, and the power pin 3221 extends toward a side close to the circuit board 321 along the arrangement direction of the plurality of first heat dissipation fins 3232, and at least a portion of the power pin 3221 is exposed from the colloid, so as to be electrically connected to the circuit board 321.

[0092] In some embodiments, continue to refer to Figure 7 The heat sink 323 may further include a sealing layer 3235. The sealing layer 3235 is used to seal and fit with the heat dissipation base 3231a and the portion of the heat dissipation base 3231b close to the circuit board 321, so as to seal the accommodation cavity R. In this way, the fluid glue poured into the accommodation cavity R through the glue pouring hole 3234 can be prevented from flowing out of the accommodation cavity.

[0093] Figure 8 and Fig. 9 They are three-dimensional structural schematic diagrams of another heat sink 323 provided in the embodiment of the present application. It should be understood that Figure 8 and Fig. 9 The illustrated embodiment includes Figures 5 to 7 To avoid redundancy in most of the technical features of the illustrated embodiment, the following mainly describes the differences between the two.

[0094] In some embodiments, in combination Figure 3 , Figure 4 , Figure 8 and Fig. 9 The heat sink 323 further includes a plurality of third heat dissipation fins 3236. The plurality of third heat dissipation fins 3236 are arranged at intervals on the end surface S5 of the heat dissipation base 3231a away from the circuit board 321 and the end surface S6 of the heat dissipation base 3231b away from the circuit board 321 along the arrangement direction of the heat dissipation base 3231a and the heat dissipation base 3231b.

[0095] In this way, on the basis of the plurality of first heat dissipation fins 3232 being fixedly connected to the heat dissipation base 3231a and the heat dissipation base 3231b, by further fixing the plurality of third heat dissipation fins 3236 to the heat dissipation base 3231a and the heat dissipation base 3231b, the heat dissipation area of ​​the heat sink 323 can be further increased, thereby better accelerating the heat dissipation process of the heat sink 323 to the power device 322. In addition, the gap between two adjacent third heat dissipation fins 3236 arranged on the same heat dissipation base, for example, arranged on the heat dissipation base 3231a, extends along the direction in which the air inlet M1 and the air outlet M2 are set, that is, extends along the air flow channel in the housing 310. In actual application, the gap between two adjacent third heat dissipation fins 3236 can be used as a part of the air flow channel in the housing 310, thereby reducing the resistance of the air flow when passing through the gap between two adjacent third heat dissipation fins 3236. Furthermore, it is beneficial to accelerate the heat dissipation process of the heat sink 323 to the power device 322 and improve the heat dissipation effect of the charging module 30.

[0096] Furthermore, in some embodiments, along the arrangement direction of the plurality of first heat dissipation fins 3232, the projection of the third heat dissipation fins 3236 arranged on each heat dissipation substrate, for example, arranged on the heat dissipation substrate 3231a, overlaps with the projection of the first heat dissipation fins 3232 arranged on the heat dissipation substrate 3231a and the projection of the second heat dissipation fins 3233 arranged on the heat dissipation substrate 3231a. Specifically, the end surface S5 of the heat dissipation substrate 3231a extends in a direction away from the heat dissipation substrate 3231a on both sides along the arrangement direction of the heat dissipation substrate 3231a and the heat dissipation substrate 3231b, respectively, so that the end surface S5 has a larger area to arrange more third heat dissipation fins 3236, thereby being able to better increase the heat dissipation area of ​​the radiator 323, and further improve the heat dissipation effect of the charging module 30.

[0097] It should be understood that the above description about the size of the first heat sink fin 3232 is also applicable to the third heat sink fin 3236. Therefore, the description about the size of the third heat sink fin 3236 can refer to the above description about the first heat sink fin 3232 and will not be repeated here.

[0098] In some embodiments, Fig. 9 As shown, the glue injection hole 3234 simultaneously penetrates the plurality of first heat dissipation fins 3232 and the plurality of third heat dissipation fins 3236 along the arrangement direction of the plurality of first heat dissipation fins 3232 to connect the accommodating cavity R. In this way, the power device 322 in the accommodating cavity R can be injected with glue through the glue injection hole 3234 .

[0099] The specific structure of each heat sink 323 in the power converter 320 provided in the embodiment of the present application is introduced above in combination with the drawings. The specific arrangement of multiple heat sinks 323 in the power converter 320 is introduced below in combination with the drawings.

[0100] In some embodiments, in combination Figure 3 and Figure 4 , taking the AC-DC converter 320a as an example, when the AC-DC converter 320a includes a plurality of heat sinks 323, along the arrangement direction of the air inlet M1 and the air outlet M2, the distance between each heat sink 323 and the air inlet M1 is smaller than the distance between each heat sink 323 and the air outlet M2. That is, compared with the air outlet M2, each heat sink 323 in the AC-DC converter 320a is arranged closer to the air inlet M1.

[0101] For example, in an example, Figure 4As shown, the circuit board 321 of the AC-DC converter 320a includes a first circuit board end 3213 and a second circuit board end 3214 that are arranged opposite to each other along the arrangement direction of the air inlet M1 and the air outlet M2. The first circuit board end 3213 is arranged adjacent to the air outlet M2, and the second circuit board end 3214 is arranged adjacent to the air inlet M1. Each heat sink 323 in the AC-DC converter 320a is arranged at the second circuit board end 3214.

[0102] In this way, the airflow flowing into the shell 310 through the air inlet M1 can flow to each radiator 323 faster to take away the heat of each cooling fin in each radiator 323, thereby accelerating the heat dissipation process of each radiator 323 for the power device 322 and improving the heat dissipation effect of the charging module 30.

[0103] Furthermore, in some embodiments, the plurality of heat sinks 323 in the AC-DC converter 320a are arranged at intervals along the setting direction of the heat sink base 3231a and the heat sink base 3231b. Thus, the gap between two adjacent heat sinks 323 extends along the setting direction of the air inlet M1 and the air outlet M2, that is, extends along the air flow duct in the housing 310, so that the air flow can flow between the two adjacent heat sinks 323.

[0104] For example, in an example, Figure 4 As shown, the multiple heat sinks 323 in the AC-DC converter 320a include a heat sink 323a, a heat sink 323b, and a heat sink 323c. The heat sinks 323a, 323b, and 323c are sequentially arranged in a spaced relationship along the arrangement direction of the heat sink base 3231a and the heat sink base 3231b, and the spacing distance between the heat sink 323a and the heat sink 323b is greater than the spacing distance between the heat sink 323b and the heat sink 323c.

[0105] In actual application, the gap between two adjacent heat sinks 323 can be used as part of the air flow duct in the housing 310. In the process of the air flow in the housing 310 flowing from the air inlet M1 to the air outlet M2, the air flow can flow in the gap between two adjacent heat sinks 323 to take away the heat of each heat dissipation fin in the two adjacent heat sinks 323, and dissipate the heat out of the housing 310 through the air outlet M2. In addition, the heat dissipation process of the power device 322 by the heat sink 323 is accelerated, and the heat dissipation effect of the charging module 30 is improved.

[0106] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A charging module, characterized in that: The charging module includes at least one power converter, each of which includes a circuit board, a power device and at least one heat sink, wherein the power device and the at least one heat sink are located on the same side of the circuit board, wherein: Each of the radiators includes two heat dissipation substrates and a plurality of first heat dissipation fins, the two heat dissipation substrates are arranged opposite to each other in a direction parallel to the circuit board, the plurality of first heat dissipation fins are connected to the opposite surfaces of the two heat dissipation substrates, the power device is located between the two heat dissipation substrates and is thermally connected to the two heat dissipation substrates, and the power device is located between the circuit board and the plurality of first heat dissipation fins.

2. The charging module according to claim 1, characterized in that: The charging module comprises an air inlet and an air outlet, the air inlet and the air outlet are arranged opposite to each other in a direction perpendicular to the arrangement of the two heat dissipation substrates, and the arrangement direction of the air inlet and the air outlet is parallel to the circuit board; Along a direction perpendicular to the arrangement of the air inlet and the air outlet, the plurality of first heat dissipation fins are arranged at intervals on the opposite surfaces of the two heat dissipation substrates.

3. The charging module according to claim 2, characterized in that: The heat sink also includes a plurality of second heat dissipation fins, Along a direction perpendicular to the arrangement of the air inlet and the air outlet, the plurality of second heat dissipation fins are arranged at intervals on the opposite surfaces of the two heat dissipation substrates; Along the direction in which the two heat dissipation substrates are arranged, the projections of the plurality of second heat dissipation fins overlap with the projection of the power device.

4. The charging module according to claim 2, characterized in that: The heat sink further comprises a plurality of third heat dissipation fins, Along the direction in which the two heat dissipation substrates are arranged, the plurality of third heat dissipation fins are arranged at intervals on the end surfaces of the two heat dissipation substrates away from the circuit board; Along the arrangement direction of the plurality of first heat dissipation fins, the projection of the third heat dissipation fins arranged on each heat dissipation substrate overlaps with the projection of the first heat dissipation fins arranged on each heat dissipation substrate and the projection of the second heat dissipation fins arranged on each heat dissipation substrate.

5. The charging module according to claim 2, characterized in that: The plurality of first heat dissipation fins are divided into two groups, each group of first heat dissipation fins is connected to one of the heat dissipation bases, one end of each of the first heat dissipation fins is used to connect to the heat dissipation base, and the other end of each of the first heat dissipation fins is located on a side of one end of each of the first heat dissipation fins away from the connected heat dissipation base, wherein: A dimension of one end of each of the first heat dissipation fins along the arrangement direction of the plurality of first heat dissipation fins is greater than a dimension of the other end of each of the first heat dissipation fins along the arrangement direction of the plurality of first heat dissipation fins; A dimension of one end of each of the first heat dissipation fins along the arrangement direction of the plurality of first heat dissipation fins is greater than or equal to 0.6 mm and less than or equal to 1.2 mm; A dimension of the other end of each of the first heat dissipation fins along the arrangement direction of the plurality of first heat dissipation fins is greater than or equal to 0.2 mm and less than 1.2 mm.

6. The charging module according to claim 5, characterized in that: Along the arrangement direction of the plurality of first heat dissipation fins, a spacing distance between two adjacent first heat dissipation fins connected to the same heat dissipation substrate is greater than or equal to 1 mm and less than or equal to 2 mm.

7. The charging module according to any one of claims 2 to 6, characterized in that: The plurality of first heat dissipation fins further include a glue injection hole, and the glue injection hole penetrates the plurality of first heat dissipation fins along the arrangement direction of the plurality of first heat dissipation fins; Along the arrangement direction of the plurality of first heat dissipation fins, the projection of the glue injection hole is located within the projection of the plurality of first heat dissipation fins.

8. The charging module according to any one of claims 2 to 6, characterized in that: Along the direction in which the air inlet and the air outlet are arranged, the distance between each of the radiators and the air inlet is smaller than the distance between each of the radiators and the air outlet; The plurality of heat sinks in each of the power converters are arranged at intervals along the direction in which the two heat dissipation substrates are arranged.

9. The charging module according to any one of claims 2 to 6, characterized in that: The at least one power converter includes an AC-DC converter and a DC-DC converter, wherein the AC-DC converter is used to convert AC power into DC power, and the DC-DC converter is used to convert the voltage of the DC power; The AC-DC converter and the DC-DC converter are arranged at intervals along a direction perpendicular to the arrangement of the air inlet and the air outlet, and the interval between the AC-DC converter and the DC-DC converter connects the air inlet and the air outlet.

10. A charging device, characterized in that: The charging device includes a charging module and a charging gun; The charging module is electrically connected to the charging gun, the charging module is used to convert AC power into DC power and output it to the charging gun, and the charging gun is used to provide the DC power to the electric vehicle; The charging module includes at least one power converter, each of which includes a circuit board, a power device and at least one heat sink, wherein the power device and the at least one heat sink are located on the same side of the circuit board, wherein: Each of the radiators includes two heat dissipation substrates and a plurality of first heat dissipation fins, the two heat dissipation substrates are arranged opposite to each other in a direction parallel to the circuit board, the plurality of first heat dissipation fins are connected to the opposite surfaces of the two heat dissipation substrates, the power device is located between the two heat dissipation substrates and is thermally connected to the two heat dissipation substrates, and the power device is located between the circuit board and the plurality of first heat dissipation fins.

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