Abrasive paper compound machine

By designing the moving mechanism and fine-tuning components in the sandpaper composite machine, the problem of insufficient adjustment of glue thickness in the prior art is solved, and the precise control of glue thickness on sandpaper is achieved.

CN222521021UActive Publication Date: 2025-02-25SICHUAN BAIDI TECH CO LTD
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Patent Information

Application Number
CN202421308065.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-07
Publication Date
2025-02-25
Estimated Expiration
2034-06-07

AI Technical Summary

Technical Problem

When using existing sandpaper composite machines, the distance between the glue tank, press roller and glue roller needs to be manually adjusted to control the thickness of the glue on the sandpaper, and the adjustment is not accurate enough.

Method used

A sandpaper composite machine is designed, using a moving mechanism to adjust the distance between the press roller and the rubber roller, and to achieve precise adjustment of the glue groove and the rubber roller spacing through the first and second fine-tuning components.

Benefits of technology

Through the cooperation of the moving mechanism and the fine-tuning assembly, the thickness of the glue on the sandpaper can be precisely controlled, improving the accuracy and efficiency of glue application.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an abrasive paper compounding machine, and relates to the technical field of abrasive paper production and manufacturing, the abrasive paper compounding machine comprises a rack and a rubber roller, the rack is rotatably connected with the rubber roller, the rack is provided with a glue groove and a press roller, the press roller is located on one side of the rubber roller, the glue groove is located on one side of the rubber roller, and the press roller is provided with a press head. The rack is provided with a moving mechanism used for adjusting the distance between the pressing roller and the glue roller and the distance between the glue groove and the glue roller. The base paper gluing device has the effect of adjusting the base paper gluing thickness.
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Description

Technical Field

[0001] The present application relates to the technical field of sandpaper production and manufacturing, and in particular to a sandpaper compound machine. Background Art

[0002] Sandpaper, commonly known as sandpaper, is a material for grinding. It is used to grind the surfaces of metals, wood, etc. to make them smooth and clean. It is usually made by gluing various abrasive particles on base paper. Depending on the different abrasive materials, there are various types of emery paper, artificial emery paper, glass sandpaper, etc. Dry sandpaper (wood sandpaper) is used to polish the surface of wood and bamboo. Water-resistant sandpaper (water sandpaper) is used to polish the surface of metal or non-metallic workpieces in water or oil. The base paper is strong, wear-resistant and fold-resistant, and has good water resistance. Abrasive materials such as glass sand are glued to the base paper with adhesives such as gum and dried. It is suitable for deep processing of sandpaper grinding discs and many other industries.

[0003] When the existing sandpaper compound machine is in use, the sandpaper is glued through the glue groove, and the glue and sandpaper are pressed down between the pressure roller and the rubber roller so that the glue adheres to the sandpaper. However, since the relative distances between the glue groove, the pressure roller and the rubber roller are fixed, the glue thickness required on different types of sandpaper is different, and the glue groove and the pressure roller need to be manually adjusted. Utility Model Content

[0004] In order to solve the problem of controlling the thickness of glue on sandpaper, the present application provides a sandpaper compound machine.

[0005] The present application provides a sandpaper compound machine, which adopts the following technical solution:

[0006] A sandpaper compound machine comprises a frame and a rubber roller, wherein the frame is rotatably connected to the rubber roller, the frame is provided with a glue tank, the frame is provided with a pressure roller, the pressure roller is located on one side of the rubber roller, the glue tank is located on one side of the rubber roller, and the frame is provided with a moving mechanism for adjusting the pressure roller and the distance between the glue tank and the rubber roller.

[0007] By adopting the above technical scheme, in the process of gluing sandpaper, the glue roller and the glue tank are used for gluing, and the thickness of the glue on the sandpaper is controlled by adjusting the distance between the glue tank and the rubber roller and between the pressure roller and the rubber roller. To a certain extent, the thickness of the glue on the sandpaper can be effectively controlled.

[0008] Furthermore, the moving mechanism includes a motor and a rotating plate, the motor is arranged on a frame, the pressure roller is rotatably arranged on the frame, one end of the rotating plate is fixedly connected to one end of the pressure roller, the output end of the motor is fixedly connected to the other end of the rotating plate, and the frame is provided with a first fine-tuning component for manually moving the rotating plate.

[0009] By adopting the above technical solution, when gluing the base paper, the motor drives the pressure roller to move forward, so as to adjust the distance between the pressure roller and the glue roller. Then, the staff uses the first fine-tuning component to adjust the pressure roller, which can achieve more precise distance adjustment, so as to further adjust the glue thickness.

[0010] Furthermore, the first fine-tuning component includes a first handle rod and a moving rod, the first handle is provided with a gear at one end close to the motor, the gear is meshed with the moving rod, the moving rod is slidably connected to the frame, and the moving rod is fixedly connected to the motor.

[0011] By adopting the above technical solution, when adjusting the pressure roller, the staff rotates the first handle bar, and the gear at one end of the first handle bar drives the moving rod to move, and the moving rod drives the motor to move, so as to adjust the distance between the pressure roller and the rubber roller.

[0012] Furthermore, the moving mechanism also includes a cylinder and a slider, the cylinder is fixedly arranged on the frame, the output end of the cylinder is fixedly connected to the slider, the slider is slidably connected to the frame, the slider is fixedly connected to one end of the glue groove, and the frame is provided with a second fine-tuning component for manually moving the slider.

[0013] By adopting the listed technical solution, when adjusting the glue tank, the cylinder adjusts the glue tank, the output end of the cylinder drives the slide, and the slide drives the glue tank to adjust the position of the glue tank.

[0014] Furthermore, the second fine-tuning assembly includes a second handle and a limit block, the second handle is slidably connected to the slider, one end of the limit block is fixedly connected to the frame, the second handle is threadedly connected to the limit rod at one end close to the slider, and the second handle is provided with a fixed block abutting the slider.

[0015] By adopting the above technical solution, when adjusting the position of the glue groove, the second handle is rotated to drive the slider to move, and the slider drives the glue groove to move, so as to adjust the distance between the glue groove and the rubber roller.

[0016] Furthermore, the frame is provided with a cleaning plate for cleaning the glue groove, and the frame is provided with a driving member for driving the cleaning plate to move along the length direction of the glue groove.

[0017] By adopting the above technical solution, when cleaning the glue groove, the driving member drives the cleaning plate to move along the length direction of the glue groove, thereby cleaning the groove surface of the glue groove.

[0018] Furthermore, a mounting plate is provided on the bottom wall of the cleaning plate along the length direction, a friction plate is provided at the bottom of the mounting plate, and the friction plate abuts against the glue groove.

[0019] By adopting the above technical solution, a mounting plate is provided on the cleaning plate, and a friction plate is provided on the mounting plate to abut against the glue groove, so that the solidified glue on the glue groove can be cleaned to a certain extent.

[0020] Furthermore, a bolt is provided on the top of the cleaning plate, and one end of the bolt passes through the cleaning plate and is fixedly connected to the mounting plate.

[0021] By adopting the above technical solution, the bolt can drive the mounting plate to abut against the glue groove, and the friction force of the friction plate on the groove surface of the glue groove can be controlled.

[0022] In summary, the present application includes at least one of the following beneficial technical effects:

[0023] 1. The present application is provided with a moving mechanism, by which the distance between the pressure roller and the rubber roller and the distance between the glue tank and the rubber roller are adjusted, so as to adjust the gluing thickness of the base paper.

[0024] 2. The present application is provided with a first fine-tuning component to fine-tune the distance between the pressure roller and the rubber roller, thereby being able to adjust the glue on the base paper.

[0025] 3. The present application is provided with a cleaning plate, which cleans the glue tank and prevents the solidified glue on the glue tank from hindering the gluing to a certain extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application;

[0027] Figure 2 It is a schematic diagram of the structure of the frame and the pressure roller of the embodiment of the present application;

[0028] Figure 3 It is a structural schematic diagram of a frame and a glue tank in an embodiment of the present application;

[0029] Figure 4 is a schematic diagram of the structure of the first fine-tuning component of an embodiment of the present application;

[0030] Figure 5 is a schematic diagram of the structure of the second fine-tuning component of an embodiment of the present application;

[0031] Figure 6 It is a schematic diagram of the structure of the cleaning plate of the embodiment of the present application.

[0032] Explanation of the reference numerals in the accompanying drawings: 1. Frame; 2. Rubber roller; 3. Glue tank; 4. Pressure roller; 5. Moving mechanism; 51. Motor; 52. Rotating plate; 6. First fine-tuning assembly; 61. First handle; 62. Moving rod; 63. Cylinder; 64. Slider; 65. Gear; 7. Second fine-tuning assembly; 71. Second handle; 72. Limit block; 73. Fixed block; 8. Cleaning plate; 81. Hydraulic cylinder; 82. Mounting plate; 83. Friction plate; 84. Bolt. DETAILED DESCRIPTION

[0033] The following is combined with Figure 1-6 This application is described in further detail.

[0034] The embodiment of the present application discloses a sandpaper compound machine.

[0035] Reference Figure 1 , Figure 2 as well as Figure 3 A sandpaper compound machine includes a frame and a rubber roller, the frame is rotatably connected to the rubber roller, the frame is provided with a glue tank, the frame is provided with a pressure roller, the pressure roller is located on one side of the rubber roller, the glue tank is located on one side of the rubber roller, and the frame is provided with a moving mechanism for adjusting the pressure roller and the distance between the glue tank and the rubber roller. In this embodiment, the glue tank is arranged obliquely, so that glue is poured onto the rubber roller when in use, the pressure roller is located obliquely above the rubber roller, the glue tank is arranged along the length direction of the rubber cylinder, the rubber roller, the pressure roller and the glue tank are connected to the frame at both ends, and the rubber roller is rotatably connected to the frame at both ends.

[0036] refer to Figure 3 as well as Figure 4 The moving mechanism includes a motor and a rotating plate. The motor is arranged on a frame. The pressure roller is rotatably arranged on the frame. One end of the rotating plate is fixedly connected to one end of the pressure roller. The output end of the motor is fixedly connected to the other end of the rotating plate. The frame is provided with a first fine-tuning component for manually moving the rotating plate. The first fine-tuning component includes a first handle bar and a moving rod. A gear is arranged at one end of the first handle near the motor. The gear is meshed with the moving rod. The moving rod is slidably connected to the frame. The moving rod is fixedly connected to the motor.

[0037] refer to Figure 3 , Figure 4 as well as Figure 5 The moving mechanism also includes a cylinder and a slider. The cylinder is fixedly arranged on the frame. The output end of the cylinder is fixedly connected to the slider. The slider is slidably connected to the frame. The slider is fixedly connected to one end of the glue groove. The frame is provided with a second fine-tuning component for manually moving the slider. The second fine-tuning component includes a second handle and a limit block. The second handle is slidably connected to the slider. One end of the limit block is fixedly connected to the frame. The second handle is threadedly connected to the limit rod near one end of the slider. The second handle is provided with a fixed block abutting against the slider.

[0038] refer to Figure 3as well as Figure 6 The frame is provided with a cleaning plate for cleaning the glue groove, and the frame is provided with a driving member for driving the cleaning plate to move along the length direction of the glue groove. In this embodiment, the driving member is configured as a hydraulic cylinder, and the output end of the hydraulic cylinder is connected to one end of the slider. When the glue groove needs to be cleaned, the cleaning plate can be driven by the hydraulic cylinder to move along the groove surface of the glue groove.

[0039] refer to Figure 3 as well as Figure 6 , a mounting plate is provided on the bottom wall of the cleaning plate along the length direction, a friction plate is provided at the bottom of the mounting plate, and the friction plate abuts against the glue groove. A bolt is provided on the top of the cleaning plate, and one end of the bolt is passed through the cleaning plate and fixedly connected with the mounting plate. In this embodiment, two bolts are provided, the bolts are located at both ends of the cleaning plate, the bolts are passed through the cleaning plate, the bolts are threadedly connected with the cleaning plate, and the bolts are fixedly connected with the mounting plate. In this embodiment, the friction plate and the mounting plate are slidably connected along the length direction, so that the friction plate can be detached, and when the friction plate is damaged, it can be replaced in time.

[0040] The implementation principle of a sandpaper compound machine in an embodiment of the present application is: when gluing the base paper, the motor drives the rotating plate to rotate, and the rotating plate drives the pressure roller to rotate, so as to adjust the distance between the pressure roller and the glue roller. At this time, the staff rotates the first handle, and the first handle drives the moving rod to move, and the movement drives the motor and the pressure roller to move, so as to realize manual fine-tuning of the position of the pressure roller.

[0041] The cylinder drives the slider to move, and the slider drives the glue tank to move, so as to adjust the distance between the glue tank and the rubber roller. After the cylinder is adjusted, the staff drives the slider through the second handle, and the slider moves to drive the glue tank to achieve fine adjustment of the glue. The glue tank and the pressure roller are driven by the motor and the cylinder to achieve the distance between the pressure roller and the rubber roller and between the glue tank and the rubber roller. Then, the glue tank and the rubber roller are finely adjusted through the first handle and the second handle to more accurately adjust the distance between the glue tank and the pressure roller relative to the rubber roller, so as to achieve the adjustment of the glue thickness of the base paper.

[0042] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A sandpaper compound machine, comprising a frame (1) and a rubber roller (2), characterized in that: The frame (1) is rotatably connected to the rubber roller (2), the frame (1) is provided with a glue groove (3), the frame (1) is provided with a pressure roller (4), the pressure roller (4) is located on one side of the rubber roller (2), the glue groove (3) is located on one side of the rubber roller (2), and the frame (1) is provided with a moving mechanism (5) for adjusting the distance between the pressure roller (4) and the glue groove (3) and the rubber roller (2).

2. The sandpaper compound machine according to claim 1, characterized in that: The moving mechanism (5) comprises a motor (51) and a rotating plate (52), wherein the motor (51) is arranged on a frame (1), the pressure roller (4) is rotatably arranged on the frame (1), one end of the rotating plate (52) is fixedly connected to one end of the pressure roller (4), the output end of the motor (51) is fixedly connected to the other end of the rotating plate (52), and the frame (1) is provided with a first fine-tuning component (6) for manually moving the rotating plate (52).

3. A sandpaper compound machine according to claim 2, characterized in that: The first fine-tuning component (6) comprises a first handle (61) rod and a moving rod (62); a gear (65) is provided at one end of the first handle (61) close to the motor (51); the gear (65) is meshed with the moving rod (62); the moving rod (62) is slidably connected to the frame (1); and the moving rod (62) is fixedly connected to the motor (51).

4. A sandpaper compound machine according to claim 3, characterized in that: The moving mechanism (5) further comprises a cylinder (63) and a slider (64); the cylinder (63) is fixedly arranged on the frame (1); the output end of the cylinder (63) is fixedly connected to the slider (64); the slider (64) is slidably connected to the frame (1); the slider (64) is fixedly connected to one end of the glue groove (3); and the frame (1) is provided with a second fine-tuning component (7) for manually moving the slider (64).

5. The sandpaper compound machine according to claim 4, characterized in that: The second fine-tuning assembly (7) comprises a second handle (71) and a limit block (72); the second handle (71) is slidably connected to the slider (64); one end of the limit block (72) is fixedly connected to the frame (1); one end of the second handle (71) close to the slider (64) is threadedly connected to the limit rod; the second handle (71) is provided with a fixed block (73) abutting against the slider (64).

6. The sandpaper compound machine according to claim 1, characterized in that: The frame (1) is provided with a cleaning plate (8) for cleaning the glue groove (3), and the frame (1) is provided with a driving member for driving the cleaning plate (8) to move along the length direction of the glue groove (3).

7. A sandpaper compound machine according to claim 6, characterized in that: A mounting plate (82) is arranged on the bottom wall of the cleaning plate (8) along the length direction, and a friction plate (83) is arranged at the bottom of the mounting plate (82), and the friction plate (83) abuts against the glue groove (3).

8. The sandpaper compound machine according to claim 7, characterized in that: A bolt (84) is provided on the top of the cleaning plate (8), and one end of the bolt (84) is passed through the cleaning plate (8) and fixedly connected to the mounting plate (82).