Double-fan CPU radiator

Abstract

The utility model provides a double-fan CPU (central processing unit) radiator which comprises a first radiating fin group, a second radiating fin group, a base and a plurality of heat conduction pipes, wherein the first radiating fin group and the second radiating fin group are arranged left and right; the heat conduction pipe comprises a mounting end, a heat dissipation end and a connecting part; the mounting end is in contact with the base; the heat dissipation end is in contact with the first heat dissipation fin group and the second heat dissipation fin group; the connecting part is connected with the mounting end and the heat dissipation end; a first heat dissipation fan and a second heat dissipation fan are arranged on the outer side of the first heat dissipation fin set and the outer side of the second heat dissipation fin set respectively. The two cooling fans arranged on the outer side of the cooling fin set can remarkably increase the cooling area and the cooling efficiency of the radiator, and the cooling efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a dual-fan CPU radiator. Background Art

[0002] With the rapid development of science and technology, modern electronic devices such as computers and servers have an increasing demand for heat dissipation. Especially in the heat dissipation of high-power CPUs, traditional heat sinks often face problems such as low heat dissipation efficiency, poor stability, and large space occupation. In order to solve these problems, heat dissipation technology continues to advance, but there are still some technical challenges.

[0003] In the existing heat sink design, a single fan heat dissipation method is usually used. This method has a relatively low heat dissipation efficiency, especially when dealing with high-power CPUs, and it is difficult to meet the needs of fast heat dissipation. The single fan design is also prone to uneven heat dissipation, which may cause one-side overheating and damage the equipment. In addition, the existing heat sink structure is relatively complex, occupies a large space, and is not suitable for application environments with limited space.

[0004] Therefore, in view of the defects of the single-fan cooling method in the existing technology, such as low efficiency, uneven heat dissipation, and large space occupation, an innovative dual-fan CPU cooler is urgently needed to meet the modern electronic equipment's demand for efficient, stable, and compact heat dissipation. Utility Model Content

[0005] The utility model provides a dual-fan CPU radiator, aiming to solve the problems of low heat dissipation efficiency, uneven heat dissipation and large space occupation in the prior art.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a dual-fan CPU radiator, comprising a first heat dissipation fin group and a second heat dissipation fin group arranged on the left and right, a base with a mounting groove, and a plurality of heat conduction pipes passing through the mounting groove, the heat conduction pipe comprising a mounting end of the heat conduction pipe in contact with the base, a heat dissipation end of the heat conduction pipe in contact with the first heat dissipation fin group and the second heat dissipation fin group, and a connecting portion connecting the mounting end with the heat dissipation end, a first heat dissipation fan and a second heat dissipation fan are respectively arranged on one side of the first heat dissipation fin group and the second heat dissipation fin group, the first heat dissipation fin group and the second heat dissipation fin group are provided with through holes for assembling and accommodating the heat conduction pipe, and the through holes and the heat dissipation ends of the heat conduction pipes are oblate bodies for corresponding assembly and accommodation.

[0007] Furthermore, the mounting ends of the heat conducting pipes contacting the base are arranged side by side along the width direction of the cross section of the base.

[0008] Furthermore, the mounting end of the heat conducting pipe in contact with the base is flat and forms a heat conducting plane.

[0009] Furthermore, both ends of the heat conducting pipe outside the mounting groove are bent and extended upward.

[0010] Furthermore, the first heat dissipation fin group and the second heat dissipation fin group are both stacked with a plurality of heat dissipation fins having exactly the same shape and structure.

[0011] Furthermore, the first heat dissipation fin group and the second heat dissipation fin group are in a rectangular parallelepiped shape.

[0012] Furthermore, a copper bar or a heat spreader is arranged at the bottom of the heat conducting plane.

[0013] Furthermore, the first heat dissipation fan and the second heat dissipation fan are arranged on the same side of the first heat dissipation fin group and the second heat dissipation fin group.

[0014] Furthermore, the first cooling fan and the second cooling fan are respectively provided with a slide groove, and the first cooling fin group and the second cooling fin group are provided with a slide rod movably adapted to the slide groove, and the sliding connection between the cooling fan and the cooling fin group is realized by the cooperation between the slide groove and the slide rod, a positioning protrusion is provided on the slide rod, and a plurality of concave points adapted to the shape of the positioning protrusion are provided in the slide groove, and an elastic member is provided inside the positioning protrusion.

[0015] Furthermore, the radiator also includes a cover plate arranged on the top of the first cooling fin group and the second cooling fin group, and an expansion sleeve and expansion pins for fixedly connecting the cover plate and the cooling fin group, the expansion pins are provided with limiting protrusions to prevent them from falling off, the limiting protrusions include a guide portion and a stop portion, and a stop surface corresponding to the stop portion is provided in the expansion sleeve.

[0016] The benefits of the present invention are as follows: first, the two cooling fans arranged on the outside of the heat sink fin group can more quickly take away the heat generated by the CPU, significantly improving the heat dissipation efficiency. This design is particularly important for modern high-power CPUs and can effectively prevent overheating and performance degradation. The dual-fan design also has higher stability and reduces the risk of equipment damage due to unilateral overheating. Although the present invention adopts a dual-fan design, the overall structure is compact and the modular design structure occupies relatively little space. Secondly, through holes are provided on the heat sink fins and the through holes and the heat dissipation ends of the heat pipes are provided as oblate bodies corresponding to the assembly accommodations and the heat pipes are welded to the heat sink fins or are in close fit and direct contact. This design helps to reduce the wind resistance of the radiator, allowing the wind to pass through the radiator more smoothly, thereby improving the heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 This is a schematic structural diagram of the third embodiment of the utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the heat conducting pipe of the utility model;

[0020] Figure 3 It is a three-dimensional structural schematic diagram of the third embodiment of the utility model.

[0021] In the figure: 1. first heat dissipation fin group; 2. second heat dissipation fin group; 3. heat pipe; 31. mounting end; 32. heat dissipation end; 33. connection part; 34. heat conduction plane; 4. base; 41. mounting slot; 5. first heat dissipation fan; 6. second heat dissipation fan. DETAILED DESCRIPTION

[0022] In the description of the present utility model, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0023] In the present invention, unless otherwise clearly defined and specified, the terms "installed", "connected", "connected", "fixedly connected" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0025] In an era of rapid technological development, the need for CPU cooling is growing. Traditional radiators can no longer meet the needs of modern high-power CPUs. Existing radiator designs usually use a single fan for heat dissipation, resulting in low heat dissipation efficiency, especially when dealing with high-power CPUs. In addition, the single fan design may also cause uneven heat dissipation, which in turn damages the device. Moreover, the existing radiators have a complex structure and occupy a large space, making them difficult to adapt to space-constrained application environments.

[0026] In order to solve the above problems, the utility model provides a dual-fan CPU radiator. The radiator includes a first heat dissipation fin group and a second heat dissipation fin group arranged on the left and right, a base with a mounting groove, and a plurality of heat conduction pipes passing through the mounting groove. The heat conduction pipe includes a mounting end in contact with the base, a heat dissipation end in contact with the heat dissipation fin group, and a connecting portion connecting the mounting end and the heat dissipation end. The first and second heat dissipation fans are respectively arranged on the outside of the first and second heat dissipation fin groups. This design significantly increases the heat dissipation area and efficiency of the radiator, and is particularly suitable for the heat dissipation requirements of high-power CPUs. The innovation of the utility model lies in that, firstly, a dual-fan design is adopted, and two heat dissipation fans arranged on the outside of the heat dissipation fin group can take away the heat generated by the CPU more quickly, thereby significantly improving the heat dissipation efficiency. This design is particularly important for modern high-power CPUs, and can effectively prevent overheating and performance degradation. The dual-fan design also enhances the stability of the radiator and reduces the risk of equipment damage caused by unilateral overheating. Secondly, the overall structure is compact, and the modular design structure occupies relatively little space. This allows the heat sink to adapt to various space-restricted environments and meet the needs of modern electronic devices for compact heat sinks. Finally, by flattening the mounting end of the heat pipe that contacts the base, a heat conduction plane is formed. This design reduces the wind resistance of the heat sink, allowing the air flow to pass through the heat sink more smoothly, improving the heat dissipation performance. At the same time, the design of the heat conduction plane allows heat to be transferred more quickly and evenly, further enhancing the heat conduction effect.

[0027] The dual-fan CPU radiator of the utility model has significant advantages in improving heat dissipation efficiency, enhancing stability, reducing space occupancy and optimizing thermal conductivity. It solves the problems in the prior art and meets the requirements of modern electronic equipment for efficient, stable and compact heat dissipation. Therefore, it has high practical value and broad application prospects.

[0028] The present invention will be further described and illustrated below in conjunction with specific embodiments and drawings.

[0029] Embodiment 1

[0030] The present embodiment provides a dual-fan CPU radiator, which includes a first heat dissipation fin group 1 and a second heat dissipation fin group 2 arranged side by side, a base 4 with a mounting slot 41, and a plurality of heat conduction pipes 3 passing through the mounting slot 41. The heat conduction pipe 3 includes a mounting end 31 in contact with the base 4, a heat dissipation end 32 in contact with the heat dissipation fin group, and a connecting portion 33 connecting the mounting end 31 and the heat dissipation end 32. A first heat dissipation fan 5 and a second heat dissipation fan 6 are respectively arranged outside the first heat dissipation fin group 1 and the second heat dissipation fin group 2.

[0031] In this embodiment, the first heat sink fin group 1 and the second heat sink fin group 2 are both made of aluminum alloy material and have good thermal conductivity. The first heat sink fan 5 and the second heat sink fan 6 are DC motor fans of the same shape with a diameter of 10-20 cm and a rotation speed of 2000 rpm, which can provide sufficient air volume to take away the heat generated by the CPU. The base 4 is made of heat-resistant material, and the mounting groove 41 is rectangular, and the size can be adjusted according to actual work needs. The base 4 is also provided with a mounting hole matching the mounting end 31 of the heat pipe 3, which is convenient for fixing the heat pipe 3. The heat pipe 3 is made of copper material and has good thermal conductivity. The mounting end 31 of the heat pipe 3 is arranged side by side along the width direction of the cross section of the base 4 by welding, and a heat conduction plane 34 is formed by flattening. The design of the heat conduction plane 34 increases the contact area, which helps to improve the heat dissipation performance. The connection portion 33 of the heat pipe 3 is designed to be bent, and the two ends outside the mounting groove 41 are bent and extended upward to the first heat dissipation fin group 1 and the second heat dissipation fin group 2. The first heat dissipation fin group 1 and the second heat dissipation fin group 2 are formed with an oblate through hole for accommodating the heat pipe 3 by stamping technology, and the heat dissipation end 32 of the heat pipe 3 is stamped into an oblate shape corresponding to the oblate through hole, and is in close contact with the first and second heat dissipation fin groups 2 by welding, ensuring that heat can be quickly transferred to the fins.

[0032] The first cooling fan 5 and the second cooling fan 6 are respectively arranged on the outside of the first cooling fin group 1 and the second cooling fin group 2, and the distance between the first cooling fin group 1 and the second cooling fin group 2 can be adjusted according to actual needs. This design can significantly increase the cooling area and efficiency of the radiator, meeting the cooling requirements of modern high-power CPUs. At the same time, the dual-fan design also enhances the stability of the radiator and reduces the risk of equipment damage caused by unilateral overheating.

[0033] Among them, the first heat sink fin group 1 and the second heat sink fin group 2 are both stacked with a plurality of heat sink fins with exactly the same shape and structure. This design increases the surface area of ​​the radiator, thereby improving the heat dissipation efficiency. At the same time, stacking a plurality of heat sink fins with exactly the same shape and structure together can also enhance the overall stability. In order to better adapt to different space requirements, the first heat sink fin group 1 and the second heat sink fin group 2 are set to be rectangular.

[0034] Embodiment 2

[0035] In order to enhance the heat conduction capacity and structural strength of the radiator, a copper bar or a heat spreader is provided at the bottom of the heat conduction plane 34 on the basis of the first embodiment. According to the size of the heat pipe 3 and the heat dissipation requirements, a copper bar or a heat spreader of corresponding shape and size can be designed to ensure that it can fit closely with the heat conduction plane 34, while taking into account the convenience and maintainability of installation. In terms of manufacturing technology, we use advanced metal processing technology, such as calendering, cutting, surface treatment, etc., to manufacture the copper bar or the heat spreader to ensure that it has a smooth surface to improve the thermal conductivity. The copper bar or the heat spreader is fixed to the bottom of the base 4 by an appropriate installation method and ensured that it does not move.

[0036] Embodiment 3

[0037] The utility model also provides an embodiment, in which two cooling fans are arranged on the same side of the first cooling fin group 1 and the second cooling fin group 2. Such a design can better utilize the wind flow, form a stable air flow path, and make the wind flow pass through the radiator more smoothly, thereby further improving the heat dissipation efficiency. This design is particularly suitable for high-power CPUs that need to quickly take away a large amount of heat. The modular structural design can also save space, making the radiator more compact, and meeting the needs of modern electronic equipment for compact radiators.

[0038] Embodiment 4

[0039] On the basis of the above embodiments, in order to adapt to different heat dissipation environments, a sliding connection structure is set between the heat dissipation fan and the heat dissipation fin group, and a slide groove is set on the outer shell of the first heat dissipation fan 5 and the second heat dissipation fan 6 respectively. The form of the slide groove can be designed according to needs, such as a straight slide groove, an arc-shaped slide groove, etc., and a slide rod that is movably adapted to the corresponding slide groove is set on the first heat dissipation fin group 1 and the second heat dissipation fin group 2 respectively. The sliding connection between the heat dissipation fan and the heat dissipation fin group is realized through the cooperation between the slide rod and the slide groove. A gear adjustment device is also set between the slide rod and the slide groove. The gear adjustment device includes a positioning protrusion fixedly set on the slide rod and a plurality of concave points set in the slide groove that are adapted to the shape of the positioning protrusion. An elastic member, such as a spring, is set inside the positioning protrusion. When the slide rod is inserted into the slide groove, the positioning protrusion will be pushed into the corresponding concave point. Due to the elastic force of the spring, the slide rod can stably remain at a certain position in the slide groove.

[0040] Embodiment 5

[0041] In order to better protect the electronic components inside the radiator, prevent dust, dirt and other impurities from entering the radiator, and maintain the cleanliness and performance of the radiator, this embodiment, on the basis of Embodiments 1 to 3, sets a cover plate on the top of the first heat sink fin group 1 and the second heat sink fin group 2, and uses an expansion sleeve and an expansion pin to fix the cover plate on the top of the heat sink fin group. Furthermore, the expansion pin is provided with two limit protrusions arranged along the axis direction of the expansion pin corresponding to the expansion sleeve to prevent the expansion pin from falling out of the expansion sleeve, wherein the limit protrusion includes a guide portion close to the top of the expansion pin and a stop portion close to the end of the expansion pin, and a stop surface corresponding to the stop portion is provided in the expansion sleeve. Specifically, the function of the guide portion is to guide the expansion pin into the expansion sleeve to ensure that the expansion pin can be smoothly inserted into the expansion sleeve. The function of the stop portion is to prevent the expansion pin from automatically withdrawing after it is inserted into the expansion sleeve.

[0042] The dual-fan CPU radiator provided by the present invention is introduced in detail above. The principle and implementation mode of the present invention are described in detail using specific examples. The description of the above embodiments is only used to help understand the core idea of ​​the present invention. At the same time, for those skilled in the art, according to the idea and method of the present invention, there will be changes in the specific implementation mode and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A dual-fan CPU radiator, characterized in that , including a first heat dissipation fin group and a second heat dissipation fin group arranged on the left and right, a base with a mounting groove and a plurality of heat conduction pipes passing through the mounting groove, the heat conduction pipe including a mounting end of the heat conduction pipe in contact with the base, a heat dissipation end of the heat conduction pipe in contact with the first heat dissipation fin group and the second heat dissipation fin group, and a connecting portion connecting the mounting end with the heat dissipation end, a first heat dissipation fan and a second heat dissipation fan are respectively arranged on one side of the first heat dissipation fin group and the second heat dissipation fin group, the first heat dissipation fin group and the second heat dissipation fin group are provided with through holes for assembling and accommodating the heat conduction pipe, and the through holes and the heat dissipation ends of the heat conduction pipes are correspondingly assembled and accommodated oblate bodies.

2. The dual-fan CPU radiator according to claim 1, characterized in that: The mounting ends of the heat conducting pipes contacting the base are arranged side by side along the width direction of the cross section of the base.

3. The dual-fan CPU radiator according to claim 2, characterized in that: The installation end of the heat-conducting pipe in contact with the base is flat and forms a heat-conducting plane.

4. The dual-fan CPU radiator according to claim 3, characterized in that: Both ends of the heat conducting pipe outside the mounting groove are bent and extended upward.

5. The dual-fan CPU radiator according to claim 4, characterized in that: The first heat dissipation fin group and the second heat dissipation fin group are both stacked with a plurality of heat dissipation fins having exactly the same shape and structure.

6. The dual-fan CPU radiator according to claim 5, characterized in that: The first heat dissipation fin group and the second heat dissipation fin group are in a rectangular parallelepiped shape.

7. The dual-fan CPU radiator according to claim 6, characterized in that: A copper bar or a heat spreader is disposed at the bottom of the heat conducting plane.

8. The dual-fan CPU radiator according to claim 7, characterized in that: The first heat dissipation fan and the second heat dissipation fan are arranged on the same side of the first heat dissipation fin group and the second heat dissipation fin group.

9. The dual-fan CPU radiator according to any one of claims 1 to 8, characterized in that: The first cooling fan and the second cooling fan are respectively provided with a slide groove, and the first cooling fin group and the second cooling fin group are provided with a slide rod movably adapted to the slide groove, and the sliding connection between the cooling fan and the cooling fin group is realized by the cooperation between the slide groove and the slide rod, a positioning protrusion is provided on the slide rod, and a plurality of concave points adapted to the shape of the positioning protrusion are provided in the slide groove, and an elastic member is provided inside the positioning protrusion.

10. The dual-fan CPU radiator according to any one of claims 1 to 8, characterized in that: The radiator also includes a cover plate arranged on the top of the first cooling fin group and the second cooling fin group, and an expansion sleeve and expansion nails for fixing the cover plate and the cooling fin group. The expansion nail is provided with a limiting protrusion to prevent it from falling off. The limiting protrusion includes a guide portion and a stop portion. A stop surface corresponding to the stop portion is provided in the expansion sleeve.

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