Semiconductor side pump condensation cavity

Abstract

The utility model discloses a semiconductor side pump light condensation cavity, a glass tube is embedded in a reflection cavity, two ends of the reflection cavity are respectively provided with a cavity end, semiconductor heat sink assemblies are arranged around the outer side of the reflection cavity at equal intervals in an array mode, and the front cavity end and the rear cavity end of the reflection cavity are fixedly connected through a supporting connecting rod. The two cavity ends are connected with the upper surface of a water passing bottom plate in an attached mode, a through hole is formed in the middle of the water passing bottom plate, the lower surface of the water passing bottom plate is fixed to the cavity bottom plate, and an electrode body is installed on the side wall, provided with the through hole, of the water passing bottom plate; a water passing pagoda is installed on the cavity bottom plate and communicated with a water passing opening formed in the water passing bottom plate. Due to the characteristics of high efficiency and low consumption of semiconductor pumping, the device is an optimal method for a high-frequency and high-energy laser, and the device can be compatible with one-way, two-way, three-way, five-way and other pumping structures by changing the shape of a cavity end; the structure is compact, and working media of various sizes can be compatible.

Description

Technical Field

[0001] The utility model relates to the technical field of laser accessories, in particular to a semiconductor side-pump focusing cavity. Background Art

[0002] Laser is a special kind of light with the characteristics of monochromaticity, coherence and high brightness, and has been widely used in scientific research, medical treatment, industrial processing and other fields. The three elements of laser are working medium, pump source and resonant cavity, and the interaction of these three elements can produce laser.

[0003] The focusing cavity is a combination of the working medium and the pump source, and is the core component of the laser. The focusing cavity has two functions: one is to effectively couple the pump source with the working medium; the other is to determine the distribution of the pump light density on the working medium, thereby affecting the uniformity, divergence and optical distortion of the output beam. Both the working medium and the pump source are installed in the focusing cavity, so the quality of the focusing cavity directly affects the efficiency and working performance of the pump.

[0004] The semiconductor side-pump focusing cavity is the optimal method for high-frequency and high-energy lasers due to the high efficiency and low consumption of semiconductor pumping. The rationality of its structure is very important. Utility Model Content

[0005] To this end, the utility model provides a semiconductor side pump focusing cavity to solve the above problems in the prior art. In order to achieve the above purpose, the utility model provides the following technical solutions: According to the first aspect of the utility model, a semiconductor side pump focusing cavity includes a semiconductor heat sink component, a supporting connecting rod, a cavity end, a water-passing pagoda, a cavity bottom plate, an electrode body, a reflective cavity, a glass tube and a water-passing bottom plate;

[0006] The glass tube is embedded in the reflection cavity, and cavity ends are respectively arranged at both ends of the reflection cavity. The semiconductor heat sink components are arranged in an array at equal intervals around the outside of the reflection cavity, and the front and rear cavity ends of the reflection cavity are fixedly connected by a supporting connecting rod.

[0007] The two cavity ends are attached and connected to the upper surface of the water-through bottom plate, a through hole is opened in the middle of the water-through bottom plate, the lower surface of the water-through bottom plate is fixed on the cavity bottom plate, and the electrode body is installed on the side wall of the water-through bottom plate with the through hole;

[0008] The cavity bottom plate is provided with a water-passing pagoda, which is communicated with a water-passing port provided in the water-passing bottom plate.

[0009] Furthermore, the cavity end head comprises an inner end cover, a pressure plate and an outer end cover, the inner end covers are respectively provided at both ends of the reflection cavity, and the pressure plate presses the outer end cover onto the outer surface of the inner end cover.

[0010] Furthermore, it also includes a connecting screw A, and the supporting connecting rod is installed on the inner end cover through the connecting screw A.

[0011] Furthermore, it also includes connecting screws B, and the pressure plate is installed on the outer surface of the outer end cover through a plurality of connecting screws B.

[0012] Furthermore, it also includes a working substance sealing ring, which is arranged at the end of the glass tube and is used to surround the laser working substance.

[0013] Furthermore, it also includes cavity fixing screws, and the cavity fixing screws are arranged at the four top corners of the cavity bottom plate.

[0014] Furthermore, it also includes an electrode fixing plate, and the electrode body is installed on the outer side wall of the water-permeable bottom plate through the electrode fixing plate.

[0015] Furthermore, it also includes an electrode insulating sleeve, and the electrode insulating sleeve is provided at the connection between the electrode body and the electrode fixing plate.

[0016] Furthermore, it also includes an electrode fixing screw, and the outer end of the electrode body is provided with the electrode fixing screw.

[0017] Furthermore, it also includes an upper cover, which encapsulates and wraps a plurality of semiconductor heat sink components above the water-permeable bottom plate.

[0018] Furthermore, a polygonal boss is protruding from the inner surface of the cavity end, and each side surface of the polygonal boss is provided with a heat sink water outlet connected to the semiconductor heat sink component. Multiple semiconductor heat sink components are arranged in an equidistant array around the center line of the glass tube.

[0019] The utility model has the following advantages: through a semiconductor side-pump focusing cavity of the utility model, due to the high efficiency and low consumption characteristics of semiconductor pumping, it is the optimal method for high-frequency and high-energy lasers. By changing the shape of the cavity end, the device can be compatible with unidirectional, bidirectional, tridirectional, five-directional and other pumping structures; this structure is compact and can be compatible with working media of various sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 An expanded structural diagram of a semiconductor side-pump focusing cavity provided for some embodiments of the utility model.

[0021] Figure 2 A three-dimensional structural diagram of a semiconductor side-pump focusing cavity provided in some embodiments of the utility model.

[0022] Figure 3A front view of a semiconductor side-pump focusing cavity provided in some embodiments of the utility model.

[0023] Figure 4 A side view of a semiconductor side-pump focusing cavity provided in some embodiments of the present invention.

[0024] Figure 5 AA cross-sectional view of a semiconductor side-pump focusing cavity provided in some embodiments of the present utility model.

[0025] Figure 6 A BB cross-sectional view of a semiconductor side-pump focusing cavity provided in some embodiments of the utility model.

[0026] In the figure, 1. upper cover, 2. semiconductor heat sink assembly, 3. supporting connecting rod, 4. working material sealing ring, 5. laser working material, 6. connecting screw A, 7. inner end cover, 8. connecting screw B, 9. pressure plate, 10. outer end cover, 11. water outlet, 12. cavity fixing screw, 13. water tower, 14. electrode fixing plate, 15. cavity bottom plate, 16. electrode fixing screw, 17. electrode body, 18. electrode insulating sleeve, 19. heat sink water outlet, 20. reflection cavity, 21. through hole, 22. water bottom plate, 23. glass tube. DETAILED DESCRIPTION

[0027] The following is a specific embodiment of the present invention. People familiar with the technology can easily understand the other advantages and functions of the present invention from the contents disclosed in this specification. Obviously, the described embodiment is a part of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] Example 1

[0029] like Figures 1 to 6As shown, a semiconductor side pump focusing cavity in the embodiment of the first aspect of the utility model comprises a semiconductor heat sink assembly 2, a supporting connecting rod 3, a cavity end, a water-passing pagoda 13, a cavity bottom plate 15, an electrode body 17, a reflecting cavity 20, a glass tube 23 and a water-passing bottom plate 22; the glass tube 23 is embedded in the reflecting cavity 20, and cavity ends are respectively arranged at both ends of the reflecting cavity 20, the semiconductor heat sink assembly 2 is arranged in an array at equal intervals around the outer side of the reflecting cavity 20, and the front and rear cavity ends of the reflecting cavity 20 are fixedly connected by the supporting connecting rod 3; the two cavity ends are attached and linked to the upper surface of the water-passing bottom plate 22, a through hole 21 is opened in the middle of the water-passing bottom plate 22, the lower surface of the water-passing bottom plate 22 is fixed on the cavity bottom plate 15, and the side wall of the water-passing bottom plate 22 with the through hole 21 is provided with an electrode body 17; the cavity bottom plate 15 is equipped with a water-passing pagoda 13, and the water-passing pagoda 13 is connected to the water port 11 opened in the water-passing bottom plate 22.

[0030] In the above embodiment, it should be noted that, when in use, the semiconductor heat sink assembly 2 includes a semiconductor heat sink, heat dissipation fins, a conductive copper clad laminate A, a conductive copper clad laminate B, a connecting electrode A, a connecting electrode B and a semiconductor stack; the assembly of heat dissipation fins is embedded in the semiconductor heat sink, the semiconductor stack is attached to the assembly of heat dissipation fins, and the two vertical sides of the semiconductor heat sink are respectively attached to the conductive copper clad laminate A and the conductive copper clad laminate B; the upper ends of the connecting electrodes A and B are pressed against the side edges of the semiconductor stack, and the lower edges of the connecting electrodes A and B are pressed against the outer surfaces of the conductive copper clad laminates A and B; the top surface of the semiconductor heat sink is recessed to form a strip groove, and water holes are respectively opened at both ends of the length direction of the semiconductor heat sink, the strip groove is connected to the two water holes to form a water channel, and the heat dissipation fins are embedded in the water channel; it also includes fixed hole positions, the bottom planes of the two ends of the length direction of the semiconductor heat sink are recessed upward to form fixed hole positions, and the fixed hole positions at both ends are symmetrically arranged.

[0031] For example, Figure 1 As shown, the reflection cavity 20 is a structure with a regular pentagonal cross section. A strip groove is provided on each outer surface of the reflection cavity 20 , and a semiconductor heat sink assembly 2 is provided above each strip groove.

[0032] The technical effect achieved by the above embodiment is: through a semiconductor side-pump focusing cavity of this embodiment, due to the high efficiency and low consumption characteristics of semiconductor pumping, it is the optimal method for high-frequency and high-energy lasers. By changing the shape of the cavity end, this device can be compatible with unidirectional, bidirectional, tridirectional, and five-directional pumping structures; this structure is compact and can be compatible with working media of various sizes.

[0033] Example 2

[0034] like Figures 1 to 6As shown, a semiconductor side-pump focusing cavity includes all the contents of Example 1. In addition, the cavity end includes an inner end cover 7, a pressure plate 9 and an outer end cover 10. The inner end covers 7 are respectively provided at both ends of the reflection cavity 20, and the pressure plate 9 presses the outer end cover 10 onto the outer surface of the inner end cover 7.

[0035] Optionally, it also includes a connecting screw A6, and the supporting connecting rod 3 is installed on the inner end cover 7 through the connecting screw A6.

[0036] Optionally, it also includes connecting screws B8, and the pressure plate 9 is installed on the outer surface of the outer end cover 10 through a plurality of connecting screws B8.

[0037] The technical effects achieved by the above embodiment are as follows: by using the connecting screw A6 to install the support link 3, the support link 3 can be quickly disassembled; by using the connecting screw B8 to install the pressure plate 9, the pressure plate 9 can be quickly disassembled and replaced.

[0038] Example 3

[0039] like Figures 1 to 6 As shown, a semiconductor side pump focusing cavity includes all the contents of Example 2, and in addition, also includes a working material sealing ring 4, which is arranged at the end of the glass tube 23, and the working material sealing ring 4 is used to surround the laser working material 5.

[0040] The technical effect achieved by the above embodiment is: by providing the working material sealing ring 4, the sealing performance of the device is significantly improved.

[0041] Example 4

[0042] like Figures 1 to 6 As shown, a semiconductor side pump focusing cavity includes all the contents of Example 3, and in addition, also includes cavity fixing screws 12. Cavity fixing screws 12 are arranged at the four top corners of the cavity bottom plate 15.

[0043] The technical effect achieved by the above embodiment is: by providing the cavity fixing screws 12, rapid installation of the entire device is achieved.

[0044] Example 5

[0045] like Figures 1 to 6 As shown, a semiconductor side pump focusing cavity includes all the contents of Example 4, and in addition, it also includes an electrode fixing plate 14, and the electrode body 17 is installed on the outer wall of the water-permeable bottom plate 22 through the electrode fixing plate 14.

[0046] Optionally, it also includes an electrode insulating sleeve 18 and an electrode fixing screw 16 . The electrode insulating sleeve 18 is provided at the connection between the electrode body 17 and the electrode fixing plate 14 , and the electrode fixing screw 16 is provided at the outer end of the electrode body 17 .

[0047] The technical effects achieved by the above embodiments are as follows: by setting the electrode fixing plate 14, effective positioning of the electrode body 17 is achieved, ensuring the installation accuracy of the electrode body 17; by setting the electrode insulating sleeve 18, the insulation of the electrode body 17 during installation is improved; by setting the electrode fixing screw 16, efficient connection between the electrode body 17 and other components is facilitated.

[0048] Example 6

[0049] like Figures 1 to 6 As shown, a semiconductor side pump focusing cavity includes all the contents of Example 5, and in addition, also includes an upper cover 1, which encapsulates and wraps multiple semiconductor heat sink components 2 above the water-permeable bottom plate 22.

[0050] Optionally, a polygonal boss is protruding from the inner surface of the cavity end, and each side surface of the polygonal boss is provided with a heat sink water port 19 connected to the semiconductor heat sink component 2, and multiple semiconductor heat sink components 2 are arranged in an equidistant array around the center line of the glass tube 23.

[0051] The technical effects achieved by the above embodiment are as follows: by providing the upper cover 1, the semiconductor heat sink assembly 2 and other components are effectively protected; by providing the polygonal boss, the accuracy of the installation positions of the multiple semiconductor heat sink assemblies 2 is ensured.

[0052] In the description of the present invention, it should be understood that the terms "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0053] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0054] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0055] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0056] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

[0057] In the description of this specification, the description with reference to the terms "embodiment one", "embodiment two", "example", "specific example", or "some examples" means that the specific method, device or feature described in conjunction with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, methods, devices or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0058] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor side pump focusing cavity, characterized in that: It comprises a semiconductor heat sink component (2), a supporting connecting rod (3), a cavity end, a water-passing pagoda (13), a cavity bottom plate (15), an electrode body (17), a reflection cavity (20), a glass tube (23) and a water-passing bottom plate (22); The glass tube (23) is embedded in the reflection cavity (20), and cavity ends are respectively arranged at both ends of the reflection cavity (20). The semiconductor heat sink components (2) are arranged in an array at equal intervals around the outside of the reflection cavity (20), and the front and rear cavity ends of the reflection cavity (20) are fixedly connected via a supporting connecting rod (3); The two cavity ends are attached and connected to the upper surface of a water-passing bottom plate (22); a through hole (21) is provided in the middle of the water-passing bottom plate (22); the lower surface of the water-passing bottom plate (22) is fixed on the cavity bottom plate (15); and an electrode body (17) is installed on the side wall of the water-passing bottom plate (22) where the through hole (21) is provided; The cavity bottom plate (15) is provided with a water-passing pagoda (13), and the water-passing pagoda (13) is connected to a water-passing port (11) provided in the water-passing bottom plate (22).

2. The semiconductor side pump focusing cavity according to claim 1, characterized in that: The cavity end comprises an inner end cover (7), a pressure plate (9) and an outer end cover (10); the inner end covers (7) are respectively arranged at both ends of the reflection cavity (20); and the pressure plate (9) presses the outer end cover (10) onto the outer surface of the inner end cover (7).

3. The semiconductor side pump focusing cavity according to claim 2, characterized in that: It also includes a connecting screw A (6), and the supporting connecting rod (3) is installed on the inner end cover (7) through the connecting screw A (6).

4. The semiconductor side pump focusing cavity according to claim 3, characterized in that: It also includes connecting screws B (8), and the pressing plate (9) is installed on the outer surface of the outer end cover (10) through a plurality of connecting screws B (8).

5. The semiconductor side pump focusing cavity according to claim 1, characterized in that: It also comprises a working substance sealing ring (4), which is arranged at the end of the glass tube (23) and is used to surround the laser working substance (5).

6. The semiconductor side pump focusing cavity according to claim 1, characterized in that: It also includes cavity fixing screws (12), and the cavity fixing screws (12) are arranged at the four top corners of the cavity bottom plate (15).

7. The semiconductor side pump focusing cavity according to claim 1, characterized in that: It also includes an electrode fixing plate (14), and the electrode body (17) is installed on the outer side wall of the water-passing bottom plate (22) through the electrode fixing plate (14).

8. The semiconductor side pump focusing cavity according to claim 7, characterized in that: It also includes an electrode insulating sleeve (18) and an electrode fixing screw (16); the electrode insulating sleeve (18) is provided at the connection between the electrode body (17) and the electrode fixing plate (14); and the electrode fixing screw (16) is provided at the outer end of the electrode body (17).

9. The semiconductor side pump focusing cavity according to claim 1, characterized in that: It also comprises an upper cover (1), wherein the upper cover (1) encapsulates and wraps a plurality of semiconductor heat sink components (2) above the water-permeable bottom plate (22).

10. The semiconductor side-pump focusing cavity according to claim 1, characterized in that: A polygonal boss is protruding from the inner surface of the cavity end, and each side surface of the polygonal boss is provided with a heat sink water outlet (19) connected to the semiconductor heat sink component (2). A plurality of semiconductor heat sink components (2) are arranged in an equidistant array in a circular direction around the center line of the glass tube (23).

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