Tunable laser and optical module

Abstract

The utility model provides a tunable laser and an optical module, the tunable laser comprises a first shell, an optical assembly is arranged in the first shell, the optical assembly comprises a gain chip, a wavelength selector, a first wave plate, a first reflector, a second wave plate and a photoelectric detector, the gain chip comprises a first cavity surface and a second cavity surface, the first cavity surface is a transmission surface, and the second cavity surface is a second cavity surface. The second cavity surface is a reflecting surface; the first wave plate is used for light reflection and transmission; the first reflecting mirror is horizontally arranged with the bottom surface of the first shell, is positioned below the first wave plate and is used for receiving light reflected by the first wave plate; the first reflecting mirror is provided with a reflecting surface which moves up and down; the second wave plate is used for light reflection and transmission; and the photoelectric detector is positioned below the second wave plate so as to receive the light reflected by the second wave plate. According to the wavelength locking device, the reflecting surface of the first reflecting mirror can move up and down, the cavity length of the resonant cavity can be changed, the cavity length of the resonant cavity can be changed without adjusting a mover, and the wavelength locking precision is improved.

Description

Technical Field

[0001] The present application relates to the field of optical fiber communication technology, and in particular to a tunable laser and an optical module. Background Art

[0002] Laser, as a device that can emit laser, has been applied in various fields. Among them, tunable laser is a laser that can change the laser output wavelength within a certain range. This type of laser has a wider range of uses and can be used in spectroscopy, medicine and other fields.

[0003] The tunable laser includes a gain chip, a wavelength selector, a phase shifter, an end reflector, a wave plate, and a photodetector located below the wave plate. The end reflector is fixed on a piezoelectric ceramic. The piezoelectric ceramic vibrates back and forth under the weak jitter signal. The photodetector detects the feedback signal generated under the weak jitter signal and adjusts the phase shifter in real time according to the feedback signal to lock the wavelength. Thermally adjusting the phase shifter may cause thermal crosstalk to the devices around the phase shifter, resulting in poor wavelength locking accuracy. Utility Model Content

[0004] The present application provides a tunable laser and an optical module to improve the wavelength locking accuracy.

[0005] A tunable laser comprising:

[0006] A first housing, in which an optical component is disposed;

[0007] Wherein, the optical component comprises:

[0008] A gain chip, used to emit a wide spectrum light including multiple wavelengths; the gain chip comprises a first cavity surface and a second cavity surface, the first cavity surface is located behind the second cavity surface, the first cavity surface is a transmission surface, and the second cavity surface is a reflection surface;

[0009] a wavelength selector, located behind the first cavity surface, for selecting light of a specific wavelength from the broad spectrum light;

[0010] A first wave plate, located behind the wavelength selector, for reflection and transmission of light;

[0011] A first reflector is arranged horizontally with the bottom surface of the first housing and is located below the first wave plate to receive light reflected by the first wave plate; the first reflector has a reflective surface, and the reflective surface moves up and down to adjust the distance between the first reflector and the wave plate;

[0012] A second wave plate, located behind the first wave plate, for receiving the light transmitted by the first wave plate and for reflecting and transmitting light;

[0013] The photodetector is located below the second wave plate to receive the light reflected by the second wave plate.

[0014] A tunable laser comprising:

[0015] A first housing, in which an optical component is disposed;

[0016] Wherein, the optical component comprises:

[0017] A gain chip, used for emitting a wide spectrum light including multiple wavelengths; the gain chip comprises a first cavity surface and a second cavity surface, the first cavity surface is located behind the second cavity surface, the first cavity surface is a transmission surface, and the second cavity surface is a transmission surface;

[0018] A first reflector is vertically arranged with the bottom surface of the first shell and is located in front of the second cavity surface; the first reflector has a reflective surface, and the reflective surface moves left and right to adjust the distance between the reflective surface and the second cavity surface;

[0019] a wavelength selector, located behind the first cavity surface, for selecting light of a specific wavelength from the broad spectrum light;

[0020] A second reflector, located behind the wavelength selector;

[0021] a second wave plate, located behind the second reflector, for reflection and transmission of light;

[0022] The photodetector is located below the second wave plate to receive the light reflected by the second wave plate.

[0023] A tunable laser comprising:

[0024] A circuit board having an MCU;

[0025] A first housing, in which an optical component is disposed;

[0026] Wherein, the optical component comprises:

[0027] A gain chip, used to emit a wide spectrum light including multiple wavelengths; the gain chip comprises a first cavity surface and a second cavity surface, the first cavity surface is located behind the second cavity surface, the first cavity surface is a reflection-transmission surface, and the second cavity surface is a transmission surface;

[0028] a wavelength selector, located in front of the second cavity surface, for selecting light of a specific wavelength from the broad spectrum light; a first reflector, vertically arranged with the bottom surface of the first housing, located in front of the wavelength selector; the first reflector has a reflective surface, and the reflective surface moves left and right to adjust the distance between the reflective surface and the wavelength selector;

[0029] A second wave plate, located behind the first cavity surface, for light reflection and transmission;

[0030] The photodetector is located below the second wave plate to receive the light reflected by the second wave plate.

[0031] An optical module, comprising:

[0032] A circuit board having an MCU;

[0033] A tunable laser comprises a first housing, wherein an optical component is arranged in the first housing, and the optical component comprises:

[0034] A gain chip, used to emit a wide spectrum light including multiple wavelengths; the gain chip comprises a first cavity surface and a second cavity surface, the first cavity surface is located behind the second cavity surface, the first cavity surface is a transmission surface, and the second cavity surface is a reflection surface;

[0035] a wavelength selector, located behind the first cavity surface, for selecting light of a specific wavelength from the broad spectrum light;

[0036] A first wave plate, located behind the wavelength selector, for reflection and transmission of light;

[0037] A first reflector is arranged horizontally with the bottom surface of the first housing and is located below the first wave plate to receive light reflected by the first wave plate; the first reflector has a reflective surface;

[0038] A second wave plate, located behind the first wave plate, for receiving the light transmitted by the first wave plate and for reflecting and transmitting light;

[0039] A photodetector is located below the second wave plate to receive the light reflected by the second wave plate to obtain a feedback signal.

[0040] The MCU adjusts the driving signal provided to the first reflector according to the feedback signal, so that the reflecting surface moves left and right under the action of the driving signal;

[0041] The coherent optical component is connected to the tunable laser to realize the conversion of the photoelectric signal.

[0042] An optical module, comprising:

[0043] A circuit board having an MCU;

[0044] A tunable laser comprises a first housing, wherein an optical component is arranged in the first housing, and the optical component comprises:

[0045] A gain chip, used for emitting a wide spectrum light including multiple wavelengths; the gain chip comprises a first cavity surface and a second cavity surface, the first cavity surface is located behind the second cavity surface, the first cavity surface is a transmission surface, and the second cavity surface is a transmission surface;

[0046] A first reflector is vertically arranged with the bottom surface of the first shell and is located in front of the second cavity surface; the first reflector has a reflective surface;

[0047] a wavelength selector, located behind the first cavity surface, for selecting light of a specific wavelength from the broad spectrum light;

[0048] A second reflector, located behind the wavelength selector;

[0049] a second wave plate, located behind the second reflector, for reflection and transmission of light;

[0050] A photodetector is located below the second wave plate to receive the light reflected by the second wave plate to obtain a feedback signal.

[0051] The MCU adjusts the driving signal provided to the first reflector according to the feedback signal, so that the reflecting surface moves left and right under the action of the driving signal;

[0052] The coherent optical component is connected to the tunable laser to realize the conversion of the photoelectric signal.

[0053] An optical module, comprising:

[0054] A circuit board having an MCU;

[0055] A tunable laser comprises a first housing, wherein an optical component is arranged in the first housing, and the optical component comprises:

[0056] A gain chip, used to emit a wide spectrum light including multiple wavelengths; the gain chip comprises a first cavity surface and a second cavity surface, the first cavity surface is located behind the second cavity surface, the first cavity surface is a reflection-transmission surface, and the second cavity surface is a transmission surface;

[0057] a wavelength selector, located in front of the second cavity surface, for selecting light of a specific wavelength from the broad spectrum light; a first reflector, vertically arranged with the bottom surface of the first housing, located in front of the wavelength selector; the first reflector has a reflective surface, and the reflective surface moves left and right;

[0058] A second wave plate, located behind the first cavity surface, for light reflection and transmission;

[0059] A photodetector, located below the second wave plate, to receive light reflected by the second wave plate to obtain a feedback signal;

[0060] The MCU adjusts the driving signal provided to the first reflector according to the feedback signal, so that the reflecting surface moves left and right under the action of the driving signal;

[0061] The coherent optical component is connected to the tunable laser to realize the conversion of the photoelectric signal.

[0062] Beneficial effects: The present application provides a tunable laser, comprising a first housing, an optical component disposed in the first housing, the optical component comprising a gain chip, a wavelength selector, a first wave plate, a first reflector, a second wave plate and a photodetector, the gain chip is used to emit a wide spectrum light containing multiple wavelengths, the wavelength selector is used to select light of a specific wavelength from the wide spectrum light, the wavelength selector is located between the gain chip and the first wave plate, the first wave plate is located between the wavelength selector and the second wave plate, the first reflector is located below the first wave plate to receive the light reflected by the first wave plate, and the photodetector is located below the second wave plate to receive the light reflected by the second wave plate. The first reflector is arranged horizontally with the bottom surface of the first housing, the first reflector has a reflective surface, and the reflective surface moves up and down. The gain chip comprises a first cavity surface and a second cavity surface, the first cavity surface is located behind the second cavity surface, the first cavity surface is a transmission surface, and the second cavity surface is a reflection surface. The gain chip emits a wide spectrum light containing multiple wavelengths, which is collimated by a lens, and the light collimated by the lens is selected by a wavelength selector. The light selected by the wavelength selector is partially reflected and partially transmitted by the second wave plate, and the light reflected by the second wave plate is reflected by the first reflector. The light transmitted by the second wave plate is partially reflected and partially transmitted by the first wave plate. The light reflected by the first wave plate is received by a photodetector to obtain a feedback signal, and the light transmitted by the first wave plate is emitted. The gain chip, the lens, the wavelength selector, the second wave plate and the first reflector can form a resonant cavity, one end of the resonant cavity is the back cavity surface of the gain chip (i.e., the second cavity surface), and the other end of the resonant cavity is the reflection surface of the first reflector. The light of a specific wavelength oscillates back and forth in the resonant cavity, that is, the light of a specific wavelength is reflected and oscillated back and forth between the back cavity surface of the gain chip and the reflection surface of the first reflector. Since the reflection surface of the first reflector can move up and down, the distance between the second wave plate and the reflection surface of the first reflector can be changed, and then the cavity length of the resonant cavity can be changed, so that the cavity mode of the resonant cavity can be changed. Therefore, the height of the reflective surface of the first reflector can be adjusted in real time according to the feedback signal to change the cavity length of the resonant cavity, and then select the appropriate resonant cavity mode for lasing. When the cavity membrane of the resonant cavity is aligned with the wavelength of the light selected by the wavelength selector, the light selected by the wavelength selector oscillates back and forth in the resonant cavity, and is finally transmitted and output from the first wave plate in the form of a laser. In the present application, the reflective surface of the first reflector can be moved up and down, and the cavity length of the resonant cavity can be changed. There is no need to adjust the shifter to change the cavity length of the resonant cavity, which can solve the wavelength locking accuracy problem caused by thermal crosstalk of the phase shifter to improve the wavelength locking accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0064] Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments;

[0065] Figure 2 A partial structural diagram of a host computer provided according to some embodiments;

[0066] Figure 3 A structural diagram of an optical module provided according to some embodiments;

[0067] Figure 4 is an exploded view of an optical module provided according to some embodiments;

[0068] Figure 5 A structural diagram of a tunable laser according to some embodiments;

[0069] Figure 6 is an exploded view of a tunable laser according to some embodiments;

[0070] Figure 7 A structural diagram of a first optical component provided according to some embodiments;

[0071] Figure 8 is a cross-sectional view of a first optical component provided according to some embodiments;

[0072] Fig. 9 A light path diagram of a first optical component provided according to some embodiments;

[0073] Fig.10 Another optical path diagram of the first optical component provided according to some embodiments;

[0074] Fig.11 is a structural diagram of a first reflector provided according to some embodiments;

[0075] Fig.12 is an exploded view of a first reflector provided according to some embodiments;

[0076] Fig.13 is an exploded view of a wave plate assembly according to some embodiments;

[0077] Fig.14is an exploded view of a wave plate assembly provided according to some embodiments at another viewing angle;

[0078] Fig.15 A light path diagram of a wave plate assembly according to some embodiments;

[0079] Fig.16 is a structural diagram of a second optical component provided according to some embodiments;

[0080] Fig.17 A light path diagram of a second optical component provided according to some embodiments;

[0081] Fig.18 is a structural diagram of a third optical component provided according to some embodiments;

[0082] Fig.19 is a structural diagram of a fourth optical component provided according to some embodiments;

[0083] Fig. 20 is a light path diagram of a fourth optical component provided according to some embodiments;

[0084] Fig.21 A structural diagram of a fifth optical component provided according to some embodiments. DETAILED DESCRIPTION

[0085] Some embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0086] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" implies open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "same", "consistent", and "flush" are not limited to absolute mathematical theoretical relationships, but also include an acceptable error range generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0087] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When optical signals are transmitted in information transmission equipment, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment usually includes optical fibers and optical waveguides.

[0088] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0089] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system provided according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0090] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0091] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.

[0092] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0093] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0094] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0095] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0096] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.

[0097] Figure 3 is a structural diagram of an optical module provided according to some embodiments, Figure 4 FIG. 1 is an exploded view of an optical module provided according to some embodiments. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a tunable laser 901 and a coherent optical component 902 .

[0098] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0099] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0100] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0101] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger of the circuit board 300 extends from the electrical port and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, which is configured to access the external optical fiber 101 so that the optical fiber 101 connects the tunable laser 900 and the coherent optical component 902 in the optical module 200.

[0102] The upper housing 201 and the lower housing 202 are combined to facilitate the installation of the circuit board 300, the tunable laser 900, the coherent optical component 902, etc. into the above housing, and the upper housing 201 and the lower housing 202 can encapsulate and protect the above components. In addition, when assembling the circuit board 300, the tunable laser 900, the coherent optical component 902, etc., it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these components, which is conducive to the automated production.

[0103] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0104] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0105] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0106] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), etc. The chips may include microcontroller units (Microcontroller Unit, MCU), laser driver chips, transimpedance amplifiers (Transimpedance Amplifier, TIA), limiting amplifiers (Limiting Amplifier, LIA), clock and data recovery chips (Clock and Data Recovery, CDR), power management chips, and digital signal processing (Digital Signal Processing, DSP) chips.

[0107] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0108] The circuit board 300 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be provided on the surface of only one side of the circuit board 300 (for example, Figure 4 The upper surface shown in the figure) can also be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, so as to adapt to occasions where the number of pins is large. The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0109] The tunable laser 901 is connected to the circuit board 300 and is used for emitting light.

[0110] The optical module further includes a transmitting optical fiber adapter 700 and a receiving optical fiber adapter 701. The transmitting optical fiber adapter 700 is used to transmit high-frequency optical signals, and the receiving optical fiber adapter 701 is used to receive high-frequency optical signals.

[0111] The coherent optical component 902 is placed on the circuit board and is used to realize the conversion of photoelectric signals. Specifically, the coherent optical component 902 includes an optical transmission interface, an optical receiving interface and a local oscillator optical interface. The optical transmission interface extends a first optical fiber, the optical receiving interface extends a second optical fiber, and the local oscillator optical interface extends a third optical fiber. The optical transmission interface is connected to the transmission optical fiber adapter 700, the optical receiving interface is connected to the receiving optical fiber adapter 701, and the local oscillator optical interface is connected to the tunable laser 901. The first optical fiber, the second optical fiber and the third optical fiber form an optical fiber array. The coherent optical component is respectively connected to the transmission optical fiber adapter, the receiving optical fiber adapter and the tunable laser 901 through the optical fiber array. The coherent optical component 902 is also connected to the DSP chip.

[0112] The light emitted by the tunable laser 901 is input into the coherent optical component 902 through the local oscillator optical interface, and the laser is split into beams inside the coherent optical component 902. One beam is used as a transmitting beam and enters the coherent modulation chip inside the coherent optical component. The electro-optical signal conversion is realized under the drive of the high-frequency electrical signal of the DSP chip. The converted high-frequency optical signal is output from the optical transmitting interface of the module; the other beam is used as a local oscillator beam and is coherently demodulated with the high-frequency optical signal input into the coherent optical component 902 from the optical receiving port of the module. The demodulated electrical signal enters the DSP chip for signal processing, thereby completing the optical-electrical signal conversion.

[0113] Figure 5 FIG. 4 is a structural diagram of a tunable laser according to some embodiments. Figure 6 FIG. 1 is an exploded view of a tunable laser according to some embodiments. Figure 5 and Figure 6 As shown, in some embodiments, the tunable laser 901 may include a first housing 911. An optical component 914 may be disposed in the first housing 911.

[0114] like Figure 5 and Figure 6 As shown, in some embodiments, the tunable laser 901 may include an internal fiber adapter 912 . The internal fiber adapter 912 may be connected to the first housing 911 , so that the optical signal emitted in the first housing 911 is incident on the internal fiber adapter 912 .

[0115] like Figure 5 and Figure 6 As shown, in some embodiments, the tunable laser 901 may include a pin 913. One end of the pin 913 may be connected to the optical component 914. The other end of the pin 913 may be connected to the circuit board 300. One end of the pin 913 may be connected to the optical component 914, and the other end of the pin 913 may be connected to the circuit board 300, so that the electrical signal between the circuit board 300 and the optical component 914 is transmitted through the pin 913.

[0116] like Figure 5 and Figure 6 As shown, in some embodiments, the first housing 911 may include a base 9112. A heat sink 9114 may be provided on the base 9112. An optical component 914 may be provided on the heat sink 9114 to control the temperature of the optical component 914. The heat sink 9114 may be a semiconductor cooler.

[0117] like Figure 5 and Figure 6 As shown, in some embodiments, the first housing 911 may include a side panel 9111. The bottom of the side panel 9111 may be connected to the base 9112. A pin 913 may be provided on one side of the side panel 9111. A connection hole 9119 may be provided at one end of the side panel 9111. The internal fiber adapter 912 may be inserted into the connection hole 9119 to connect the internal fiber adapter 912 to the side panel 9111, thereby allowing the light emitted by the optical component 914 to be incident on the internal fiber adapter 912.

[0118] like Figure 5 and Figure 6 As shown, in some embodiments, the first housing 911 may include an upper cover plate 9113. The upper cover plate 9113 may be connected to the top of the side plate 9111. The upper cover plate 9113 may be connected to the top of the side plate 9111, and the bottom of the side plate 9111 may be connected to the base 9112, so that the first housing 911 is surrounded by the first housing 911.

[0119] Figure 7 A structural diagram of a first optical component provided according to some embodiments. Figure 8 FIG. 4 is a cross-sectional view of a first optical component provided according to some embodiments. Figure 7 and Figure 8 As shown, in some implementations, the optical component 914 may include a gain chip 9141. The gain chip 9141 may be fixed to the heat sink 9114 via a first support plate 9115. The gain chip 9141 may emit a broad spectrum of light including multiple wavelengths.

[0120] In some embodiments, the first cavity surface (i.e., the right cavity surface) of the gain chip 9141 can be coated with an anti-reflection film to make the first cavity surface of the gain chip 9141 a transmission surface, thereby allowing light to be emitted through the first cavity surface of the gain chip 9141.

[0121] In some embodiments, the second cavity surface (ie, the working cavity surface) of the gain chip 9141 may be coated with a reflective film to make the second cavity surface of the gain chip 9141 a reflective surface, thereby allowing light to be reflected at the second cavity surface of the gain chip 9141 .

[0122] like Figure 7 and Figure 8 As shown, in some implementations, the optical component 914 may include a lens 9142. The lens 9142 may be fixed to the heat sink 9114 via a first support plate 9115. The lens 9142 may be located behind (i.e., at the right end) the gain chip 9141. The lens 9142 is used to collimate / converge light. For example, the light emitted by the gain chip 9141 is collimated by the lens 9142, and the light is incident on the gain chip 9141 after being converged by the lens 9142.

[0123] In some embodiments, the first support plate 9115 may include a first support surface 9115a on which a gain chip 9141 may be disposed.

[0124] In some embodiments, the first support plate 9115 may include a second support surface 9115b on which a lens 9142 may be disposed.

[0125] In some embodiments, the height of the first supporting surface 9115a is greater than the height of the second supporting surface 9115b, so that the central axis heights of the gain chip 9141 on the first supporting surface 9115a and the lens 9142 on the second supporting surface 9115b are flush.

[0126] like Figure 7 and Figure 8 As shown, in some implementations, the optical component 914 may include a wavelength selector 9143. The wavelength selector 9143 may be directly fixed to the heat sink 9114. The wavelength selector 9143 may be located behind the lens 9142 (i.e., the right end), i.e., the lens 9142 may be located between the gain chip 9141 and the wavelength selector 9143. The wavelength selector 9143 may select light of a specific wavelength from a wide spectrum of light including multiple wavelengths.

[0127] like Figure 7 and Figure 8As shown, in some implementations, the optical component 914 may include a first wave plate 9149. The first wave plate 9149 may be fixed to the heat sink 9114 via a second support plate. The first wave plate 9149 may be located behind (i.e., at the right end of) the wavelength selector 9143, i.e., the wavelength selector 9143 may be located between the lens 9142 and the wavelength selector 9143. The first wave plate 9149 may partially reflect light and partially transmit light.

[0128] In some embodiments, the second support plate may include a first support portion. The first support portion may be located at one side of the first wave plate 9149 .

[0129] In some embodiments, the second support plate may include a second support portion. The second support portion may be located at the other side of the first wave plate 9149.

[0130] The first support portion may be located on one side of the first wave plate 9149 , and the second support portion may be located on the other side of the first wave plate 9149 , so that the middle position of the first wave plate 9149 is suspended, thereby allowing light to be transmitted through the first wave plate 9149 .

[0131] like Figure 7 and Figure 8 As shown, in some implementations, the optical component 914 may include a first reflector 9148. The first reflector 9148 may be a MEMS reflector. The first reflector 9148 may be located below the first wave plate 9149 so that the first reflector 9148 may receive light reflected by the first wave plate 9149.

[0132] In some embodiments, the first reflector 9148 has a reflective surface so that light can be reflected back and forth between the first wave plate 9149 and the first reflector 9148 .

[0133] In some embodiments, the first reflector 9148 can be directly fixed on the heat sink 9114, that is, the first reflector 9148 and the heat sink 9114 are horizontally arranged so that the reflecting surface of the first reflector 9148 can move up and down along the vertical plane, thereby changing the distance between the first wave plate 9149 and the reflecting surface of the first reflector 9148.

[0134] like Figure 7 and Figure 8 As shown, in some implementations, the optical component 914 may include a second wave plate 9144. The second wave plate 9144 may be fixed to the heat sink 9114 via a third support plate. The second wave plate 9144 may not be connected to the first wave plate 9149. The second wave plate 9144 may be connected to the first wave plate 9149. The second wave plate 9144 may partially transmit light and partially reflect light.

[0135] In some embodiments, the third support plate may include a third support portion. The third support portion may be located at one side of the second wave plate 9144 .

[0136] In some embodiments, the third support plate may include a fourth support portion. The fourth support portion may be located at the other side of the second wave plate 9144 .

[0137] The third support portion may be located on one side of the second wave plate 9144 , and the fourth support portion may be located on the other side of the second wave plate 9144 , so that the middle position of the second wave plate 9144 is suspended, thereby allowing light to be transmitted through the second wave plate 9144 .

[0138] When the second wave plate 9144 is not connected to the first wave plate 9149 , the third support plate may be not connected to the second support plate.

[0139] When the second wave plate 9144 is connected to the first wave plate 9149, the third support plate and the second support plate can be connected to form the support member 9117. That is, the first support portion and the third support portion can be connected, and the second support portion and the fourth support portion can be connected.

[0140] like Figure 7 and Figure 8 As shown, in some implementations, the optical component 914 may include a photodetector 9145. The photodetector 9145 may be located below the second wave plate 9144 so that the photodetector 9145 may receive light reflected by the second wave plate 9144. The photodetector 9145 may convert the received light into a feedback signal.

[0141] An electric chip may be disposed on the circuit board. The electric chip may be electrically connected to the first reflector 9148 so that the electric chip can provide a driving signal to the first reflector 9148. The electric chip may be electrically connected to the photodetector 9145 so that the electric chip can read a feedback signal of the photodetector 9145.

[0142] The driving signal includes a DC driving signal and an AC driving signal, and the feedback signal includes an AC feedback signal and a DC feedback signal. The AC feedback signal corresponds to the AC driving signal of the driving signal, and the DC feedback signal corresponds to the DC driving signal of the driving signal.

[0143] The electrical chip can monitor the optical power of the tunable laser according to the DC feedback signal. For example, the electrical chip can be an MCU, and the MCU can monitor the optical power of the tunable laser according to the DC feedback signal.

[0144] The electrical chip can adjust the DC driving signal provided to the first reflector 9148 according to the AC feedback signal to adjust the position of the reflection surface of the first reflector 9148. For example, the electrical chip can be an MCU, and the MCU can adjust the DC driving signal provided to the first reflector 9148 according to the AC feedback signal.

[0145] Fig. 9 FIG. 4 is a light path diagram of a first optical component provided according to some embodiments. Fig. 9 As shown, the second wave plate 9144 and the first wave plate 9149 are connected to form a wave plate group, which is convenient for mounting the wave plate group.

[0146] Fig.10 FIG. 4 is another optical path diagram of the first optical component provided according to some embodiments. Fig.10 As shown, the second wave plate 9144 and the first wave plate 9149 are not connected.

[0147] like Fig. 9 and Fig.10 As shown, the gain chip 9141 emits a wide-spectrum light including multiple wavelengths, the wide-spectrum light including multiple wavelengths is collimated by the lens 9142, the light collimated by the lens 9142 is selected by the wavelength selector 9143, the light selected by the wavelength selector 9143 is partially reflected and partially transmitted by the first wave plate 9149, the light reflected by the first wave plate 9149 is reflected by the first reflector 9148, the light transmitted by the first wave plate 9149 is partially reflected and partially transmitted by the second wave plate 9144, the light reflected by the second wave plate 9144 is received by the photodetector 9145 to obtain a feedback signal, and the light transmitted by the second wave plate 9144 is emitted.

[0148] The gain chip 9141, the lens 9142, the wavelength selector 9143, the first wave plate 9149 and the first reflector 9148 can form a resonant cavity, one end of the resonant cavity is the rear cavity surface (i.e., the left cavity surface) of the gain chip 9141, and the other end of the resonant cavity is the reflective surface of the first reflector 9148. Light of a specific wavelength oscillates back and forth in the resonant cavity, that is, light of a specific wavelength is reflected and oscillated back and forth between the rear cavity surface of the gain chip 941 and the reflective surface of the first reflector 9148.

[0149] Since the reflective surface of the first reflector 9148 can be moved up and down, the distance between the first wave plate 9149 and the reflective surface of the first reflector 9148 can be changed, and the cavity length of the resonant cavity can be changed, thereby changing the cavity mode of the resonant cavity. Therefore, the MCU can adjust the height of the reflective surface of the first reflector 9148 in real time according to the feedback signal to change the cavity length of the resonant cavity, and then select a suitable resonant cavity mode for lasing. When the wavelength corresponding to the cavity membrane of the resonant cavity is aligned with the wavelength of the light selected by the wavelength selector 9143, the light selected by the wavelength selector 9143 oscillates back and forth in the resonant cavity, and is finally transmitted and output from the first wave plate 9149 in the form of laser.

[0150] Fig.11 is a structural diagram of a first reflector provided according to some embodiments. Fig.12 FIG. 4 is an exploded view of a first reflector provided according to some embodiments. Fig.11 and Fig.12 As shown, in some embodiments, the first reflector 9148 may include a base 91481. The base 91481 may be fixed to the surface of the heat sink 9114.

[0151] like Fig.11 and Fig.12 As shown, in some embodiments, the first reflector 9148 may include a first comb-tooth capacitor 91482. Both sides of the first comb-tooth capacitor 91482 may be connected to the base 91481 respectively to keep the first comb-tooth capacitor 91482 stationary.

[0152] like Fig.11 and Fig.12 As shown, in some embodiments, the first reflector 9148 may include a second comb-tooth capacitor 91483. The fixed end of the second comb-tooth capacitor 91483 may be connected to the base 91481 so that the fixed end of the second comb-tooth capacitor 91483 remains stationary. The second comb-tooth capacitor 91483 may be placed between the teeth of the first comb-tooth capacitor 91482. An AC drive signal is provided to the first comb-tooth capacitor 91482 and the second comb-tooth capacitor 91483, respectively, so that the movable end of the second comb-tooth capacitor 91483 can move in and out between the teeth of the first comb-tooth capacitor 91482.

[0153] A first drive signal is provided to the first comb-tooth capacitor 91482 and the second comb-tooth capacitor 91483, and the first comb-tooth capacitor 91482 and the second comb-tooth capacitor 91483 repel each other, so that the active end of the second comb-tooth capacitor 91483 can move outward between the comb teeth of the first comb-tooth capacitor 91482. A second drive signal is provided to the first comb-tooth capacitor 91482 and the second comb-tooth capacitor 91483, and the first comb-tooth capacitor 91482 and the second comb-tooth capacitor 91483 attract each other, so that the active end of the second comb-tooth capacitor 91483 can move inward between the comb teeth of the first comb-tooth capacitor 91482.

[0154] The first reflector 9148 described above can be driven by electromagnetics to realize the movement of the reflective surface. The first reflector 9148 driven by electromagnetics has a fast movement speed, which improves the locking speed of the tunable laser.

[0155] In some embodiments, the first reflector 9148 can also use electrothermal drive to achieve movement of the reflective surface.

[0156] like Fig.11 and Fig.12 As shown, in some embodiments, the first reflector 9148 may include a reflective surface 91484. The periphery of the reflective surface 91484 may be connected to the active end of the second comb capacitor 91483, so that the reflective surface 91484 may move with the movement of the active end of the second comb capacitor 91483.

[0157] In some embodiments, the optical component 914 may include a phase shifter. The phase shifter may be located between the wavelength selector 9143 and the first wave plate 9149.

[0158] When the phase shifter is located between the wavelength selector 9143 and the first wave plate 9149, the electrical chip provides an AC driving signal to the first reflector 9148 and thermally adjusts the phase shifter according to the AC feedback signal to change the cavity length of the resonant cavity.

[0159] Fig.13 is an exploded view of a wave plate assembly according to some embodiments. Fig.14 FIG. 4 is an exploded view of a wave plate assembly provided according to some embodiments at another viewing angle. Fig.15 FIG. 4 is a light path diagram of a wave plate assembly according to some embodiments. Fig.13 , Fig.14 and Fig.15 As shown, in some embodiments, the first wave plate 9149 may include a light incident surface 91492. The light incident surface 91492 may face the wavelength selector 9143. The light incident surface 91492 may allow part of the light to be reflected and part of the light to be transmitted.

[0160] In some embodiments, the light incident surface 91492 can allow light to be split according to a first preset ratio. For example, the first preset ratio is 8%:92%, and the light is split through the light incident surface 91492, 8% of the light is reflected by the light incident surface 91492, and 92% of the light is transmitted through the light incident surface 91492.

[0161] like Fig.13 , Fig.14 and Fig.15 As shown, in some embodiments, the first wave plate 9149 may include a light emitting surface 91491. The light emitting surface 91491 may face away from the wavelength selector 9143, that is, toward the second wave plate 9144. The light emitting surface 91491 and the light incident surface 91492 may be arranged opposite to each other. The light emitting surface 91491 may allow light to be transmitted.

[0162] In some embodiments, the light incident surface 91492 and the light emitting surface 91491 may be arranged in a non-parallel manner.

[0163] like Fig.13 , Fig.14 and Fig.15 As shown, in some embodiments, the second wave plate 9144 may include a light incident surface 91441. The light incident surface 91441 may face the first wave plate 9149. The light incident surface 91441 may be connected to the light emitting surface 91491 so that the first wave plate 9149 is connected to the second wave plate 9144. The light incident surface 91441 may allow part of the light to be reflected and part of the light to be transmitted.

[0164] In some embodiments, the light incident surface 91441 can allow light to be split according to a second preset ratio. For example, the second preset ratio is 1%:99%, and the light is split by the light incident surface 91441, 1% of the light is reflected by the light incident surface 91441, and 99% of the light is transmitted by the light incident surface 91441.

[0165] In some embodiments, the first wave plate 9149 and the second wave plate 9144 are not connected, and the light emitting surface 91491 and the light incident surface 91441 may be arranged non-parallel.

[0166] In some embodiments, the first wave plate 9149 is connected to the second wave plate 9144, and the light emitting surface 91491 and the light incident surface 91441 can be arranged in parallel to increase the contact area between the second wave plate 9144 and the first wave plate 9149, thereby improving the stability of the wave plate group; it is also possible to prevent the presence of other media between the light emitting surface 91491 and the light incident surface 91441, so that the light emitted from the first wave plate 9149 and incident on the second wave plate 9144 will no longer be refracted.

[0167] In some embodiments, the second wave plate 9144 may include a light emitting surface 91442. The light emitting surface 91442 may face away from the first wave plate 9149, that is, the light emitting surface 91442 may be arranged opposite to the light incident surface 91441. The light emitting surface 91442 may allow light to be transmitted.

[0168] In some embodiments, the light incident surface 91441 and the light emitting surface 91442 may be arranged in a non-parallel manner.

[0169] In some embodiments, the first wave plate 9149 is connected to the second wave plate 9144, the light incident surface 91492 and the light emitting surface 91491 can be arranged non-parallel, the light incident surface 91441 and the light emitting surface 91442 can be arranged non-parallel, and the light emitting surface 91491 and the light incident surface 91441 can be arranged parallel, so that the light incident surface 91492 and the light emitting surface 91442 are arranged non-parallel.

[0170] The light incident surface 91492 and the light emitting surface 91442 are arranged non-parallelly, which can prevent the light from oscillating back and forth between the light incident surface 91492 and the light emitting surface 91442, and further prevent the wave plate group from having a filtering effect, thereby reducing the loss of optical power and improving the accuracy of optical power monitoring.

[0171] Fig.16 is a structural diagram of a second optical component provided according to some embodiments. Fig.17 FIG. 4 is a light path diagram of a second optical component provided according to some embodiments. Fig.16 and Fig.17 As shown, in some embodiments, the optical component 914 may include a gain chip 9141. The gain chip 9141 may be fixed to the heat sink 9114 via a first support plate 9115.

[0172] In some embodiments, the first cavity surface (i.e., the right cavity surface) of the gain chip 9141 can be coated with an anti-reflection film to make the first cavity surface of the gain chip 9141 a transmission surface, thereby allowing light to be emitted through the first cavity surface of the gain chip 9141.

[0173] In some embodiments, the second cavity surface (ie, the left cavity surface) of the gain chip 9141 may be coated with an anti-reflection film to make the second cavity surface of the gain chip 9141 a transmission surface, thereby allowing light to be emitted through the second cavity surface of the gain chip 9141.

[0174] like Fig.16 and Fig.17 As shown, in some embodiments, the optical component 914 may include a lens 9142. The lens 9142 may be fixed to the heat sink 9114 via the first support plate 9115. The lens 9142 is used to collimate / converge light. For example, the light emitted by the gain chip 9141 is collimated by the lens 9142, and the light is converged by the lens 9142 and incident on the gain chip 9141.

[0175] In some embodiments, the lens 9142 may include a first lens 91421. The first lens 91421 may be located at the front (ie, the left end) of the gain chip 9141.

[0176] In some embodiments, the lens 9142 may include a second lens 91422. The second lens 91422 may be located behind (ie, behind) the gain chip 9142.

[0177] In some embodiments, the first support plate 9115 may include a first support surface 9115a on which a gain chip 9141 may be disposed.

[0178] In some embodiments, the first support plate 9115 may include a second support surface 9115b on which a lens 9142 may be disposed.

[0179] In some embodiments, the height of the first supporting surface 9115a is greater than the height of the second supporting surface 9115b, so that the central axis heights of the gain chip 9141 on the first supporting surface 9115a and the lens 9142 on the second supporting surface 9115b are flush.

[0180] In some embodiments, the second supporting surface 9115b may include a first sub-supporting surface. A first lens 91421 may be disposed on the first sub-supporting surface.

[0181] In some embodiments, the second support surface may include a second sub-support surface. The second sub-support surface may be provided with a second lens 91422. The first sub-support surface and the second sub-support surface are respectively located at two ends of the first support surface 9115a, so that the first support plate 9115 is in a convex shape.

[0182] like Fig.16 and Fig.17 As shown, in some embodiments, the optical component 914 may include a wavelength selector 9143. The wavelength selector 9143 may be directly fixed on the heat sink 9114. The wavelength selector 9143 may be located behind (i.e., at the right end) the second lens 91422, i.e., the second lens 91422 may be located between the gain chip 9141 and the wavelength selector 9143.

[0183] like Fig.16 and Fig.17As shown, in some embodiments, the optical component 914 may include a second reflector 9147. The second reflector 9147 may be an end reflector. The second reflector 9147 may be located behind (i.e., at the right end) the wavelength selector 9143, i.e., the wavelength selector 9143 may be located between the second lens 91422 and the second reflector 9147. The second reflector 9147 may allow light to be partially reflected and partially transmitted.

[0184] In some embodiments, the second reflector 9147 can be directly fixed to the heat sink 9114.

[0185] In some embodiments, the second reflector 9147 can be fixed to the heat sink 9114 by piezoelectric ceramics.

[0186] like Fig.16 and Fig.17 As shown, in some embodiments, the optical component 914 may include a second wave plate 9144. The second wave plate 9144 may be fixed to the heat sink 9114 via a third support plate 9116. The second wave plate 9144 may be located behind (i.e., at the right end of) the second reflector 9147, i.e., the second reflector 9147 may be located between the wavelength selector 9143 and the second wave plate 9144. The second wave plate 9144 may allow light to be partially reflected and partially transmitted.

[0187] In some embodiments, the third support plate 9116 may include a third support portion. The third support portion may be located at one side of the second wave plate 9144.

[0188] In some embodiments, the third support plate 9116 may include a fourth support portion. The fourth support portion may be located at the other side of the second wave plate 9144.

[0189] The third support portion may be located on one side of the second wave plate 9144 , and the fourth support portion may be located on the other side of the second wave plate 9144 , so that the middle position of the second wave plate 9144 is suspended, thereby allowing light to be transmitted through the second wave plate 9144 .

[0190] like Fig.16 and Fig.17 As shown, in some embodiments, the optical component 914 may include a photodetector 9145. The photodetector 9145 may be located below the second wave plate 9144 so that the photodetector 9145 may receive light reflected by the second wave plate 9144. The photodetector 9145 may convert the received light into a feedback signal.

[0191] like Fig.16 and Fig.17As shown, in some embodiments, the optical component 914 may include a first reflector 9148. The first reflector 9148 may be located in front of the first lens 91421 (i.e., at the left end), so that the first reflector 9148 can receive the light collimated by the first lens 91421.

[0192] In some embodiments, the first reflector 9148 may be fixed to the heat sink 9114 via the fourth support plate 9118. That is, the bottom surface of the fourth support plate 9118 may be fixed to the heat sink 9114, and the first reflector 9148 may be disposed on the side surface of the fourth support plate 9118, so that the first reflector 9148 and the heat sink 9114 are vertically disposed, and the reflective surface of the first reflector 9148 may move left and right along the horizontal plane, thereby changing the distance between the reflective surface of the first reflector 9148 and the first lens 91421.

[0193] like Fig.17 As shown, the gain chip 9141 emits a wide spectrum light including multiple wavelengths, the wide spectrum light including multiple wavelengths is collimated by the first lens 91421 and the second lens 91422, the light collimated by the first lens 91421 is reflected by the first reflector 9148, the light collimated by the second lens 91422 is selected by the wavelength selector 9143, the light selected by the wavelength selector 9143 is partially reflected and partially transmitted by the second reflector 9147, the light transmitted by the second reflector 9147 is partially reflected and partially transmitted by the second wave plate 9144, the light reflected by the second wave plate 9144 is received by the photodetector 9145 to obtain a feedback signal, and the light transmitted by the second wave plate 9144 is emitted.

[0194] The first reflector 9148, the first lens 91421, the gain chip 9141, the second lens 91422, the wavelength selector 9143, and the second reflector 9147 can form a resonant cavity. One end of the resonant cavity is the reflecting surface of the first reflector 9148, and the other end of the resonant cavity is the second reflector 9147. Light of a specific wavelength oscillates back and forth in the resonant cavity, that is, light of a specific wavelength reflects and oscillates back and forth between the reflecting surface of the first reflector 9148 and the second reflector 9147.

[0195] Since the reflective surface of the first reflector 9148 can be moved left and right, the distance between the reflective surface of the first reflector 9148 and the first lens 91421 can be changed, and the cavity length of the resonant cavity can be changed, thereby changing the cavity mode of the resonant cavity. Therefore, the MCU can adjust the position of the reflective surface of the first reflector 9148 in real time according to the feedback signal to change the cavity length of the resonant cavity, and then select a suitable cavity mode of the resonant cavity for lasing. When the wavelength corresponding to the cavity membrane of the resonant cavity is aligned with the wavelength of the light selected by the wavelength selector 9143, the light selected by the wavelength selector 9143 oscillates back and forth in the resonant cavity, and finally outputs from the second reflector 9147 in the form of laser.

[0196] When the second reflector 9147 is directly fixed on the heat sink 9114 , the electric chip can provide the first reflector 9148 with a driving signal consisting of an AC driving signal and a DC driving signal.

[0197] When the second reflector 9147 is fixed to the heat sink 9114 through the piezoelectric ceramic, the electric chip can provide an AC driving signal to the piezoelectric ceramic, and the electric chip can provide a DC driving signal to the first reflector 9148.

[0198] Fig.18 FIG. 1 is a structural diagram of a third optical component provided according to some embodiments. Fig.18 As shown, in some embodiments, the optical component 914 may include a phase shifter 9146. The phase shifter 9146 may be located between the wavelength selector 9143 and the second reflector 9147.

[0199] When the phase shifter 9146 is located between the wavelength selector 9143 and the second reflector 9147, the second reflector 9147 is directly fixed on the heat sink 9114, and the electrical chip provides an AC drive signal to the first reflector 9148 and thermally adjusts the phase shifter according to the AC feedback signal to change the cavity length of the resonant cavity.

[0200] When the phase shifter 9146 is located between the wavelength selector 9143 and the second reflector 9147, the second reflector 9147 is fixed to the heat sink 9114 through piezoelectric ceramics. The electric chip provides an AC driving signal to the first reflector 9148 or the piezoelectric ceramics, and thermally adjusts the phase shifter according to the AC feedback signal to change the cavity length of the resonant cavity.

[0201] Fig.19 A structural diagram of a fourth optical component provided according to some embodiments. Fig. 20 FIG. 4 is a light path diagram of a fourth optical component provided according to some embodiments. Fig.19 and Fig. 20As shown, in some embodiments, the optical component 914 may include a gain chip 9141. The gain chip 9141 may be fixed to the heat sink 9114 via a first support plate 9115.

[0202] In some embodiments, the first cavity surface (i.e., the right cavity surface) of the gain chip 9141 can be coated with a partial reflective film to make the first cavity surface of the gain chip 9141 a reflective and transmissive surface, thereby allowing light to be reflected and transmitted at the first cavity surface of the gain chip 9141.

[0203] In some embodiments, the second cavity surface (ie, the left cavity surface) of the gain chip 9141 may be coated with an anti-reflection film to make the second cavity surface of the gain chip 9141 a transmission surface, thereby allowing light to be emitted through the second cavity surface of the gain chip 9141.

[0204] like Fig.19 and Fig. 20 As shown, in some embodiments, the optical component 914 may include a lens 9142. The lens 9142 may be fixed to the heat sink 9114 via the first support plate 9115. The lens 9142 is used to collimate / converge light. For example, the light emitted by the gain chip 9141 is collimated by the lens 9142, and the light is converged by the lens 9142 and incident on the gain chip 9141.

[0205] In some embodiments, the lens 9142 may include a first lens 91421. The first lens 91421 may be located at the front (ie, the left end) of the gain chip 9141.

[0206] In some embodiments, the lens 9142 may include a second lens 91422. The second lens 91422 may be located behind (ie, behind) the gain chip 9142.

[0207] like Fig.19 and Fig. 20 As shown, in some embodiments, the optical component 914 may include a wavelength selector 9143. The wavelength selector 9143 may be directly fixed to the heat sink 9114. The wavelength selector 9143 may be located in front of the first lens 91421 (i.e., the left end), that is, the first lens 91421 may be located between the gain chip 9141 and the wavelength selector 9143.

[0208] like Fig.19 and Fig. 20As shown, in some embodiments, the optical component 914 may include a second wave plate 9144. The second wave plate 9144 may be fixed to the heat sink 9114 through a third support plate 9116. The second wave plate 9144 may be located behind (i.e., at the right end) the second lens 91422, i.e., the second lens 91422 may be located between the gain chip 9141 and the second wave plate 9144. The second wave plate 9144 may allow light to be partially reflected and partially transmitted.

[0209] like Fig.19 and Fig. 20 As shown, in some embodiments, the optical component 914 may include a photodetector 9145. The photodetector 9145 may be located below the second wave plate 9144 so that the photodetector 9145 may receive light reflected by the second wave plate 9144. The photodetector 9145 may convert the received light into a feedback signal.

[0210] like Fig.19 and Fig. 20 As shown, in some embodiments, the optical component 914 may include a first reflector 9148. The first reflector 9148 may be located in front of the wavelength selector 9143 (ie, at the left end), so that the first reflector 9148 can receive the light selected by the wavelength selector 9143.

[0211] In some embodiments, the first reflector 9148 may be fixed to the heat sink 9114 via the fourth support plate 9118. That is, the bottom surface of the fourth support plate 9118 may be fixed to the heat sink 9114, and the first reflector 9148 may be disposed on the side surface of the fourth support plate 9118, so that the first reflector 9148 and the heat sink 9114 are vertically disposed, and the reflective surface of the first reflector 9148 may move left and right along the horizontal plane, thereby changing the distance between the reflective surface of the first reflector 9148 and the first lens 91421.

[0212] like Fig. 20 As shown, the gain chip 9141 emits a wide spectrum light including multiple wavelengths, the wide spectrum light including multiple wavelengths is collimated by the first lens 91421 and the second lens 91422, the light collimated by the first lens 91421 is selected by the wavelength selector 9143, the light selected by the wavelength selector 9143 is reflected by the first reflector 9148, the light collimated by the second lens 91422 is partially reflected and partially transmitted by the second wave plate 9144, the light reflected by the second wave plate 9144 is received by the photodetector 9145 to obtain a feedback signal, and the light transmitted by the second wave plate 9144 is emitted.

[0213] The first reflector 9148, the wavelength selector 9143, the first lens 91421, and the gain chip 9141 can form a resonant cavity, one end of the resonant cavity is the reflection surface of the first reflector 9148, and the other end of the resonant cavity is the first cavity surface of the gain chip 9141. Light of a specific wavelength oscillates back and forth in the resonant cavity, that is, light of a specific wavelength reflects and oscillates back and forth between the reflection surface of the first reflector 9148 and the second cavity surface of the gain chip 9141.

[0214] Since the reflective surface of the first reflector 9148 can be moved left and right, the distance between the reflective surface of the first reflector 9148 and the wavelength selector 9143 can be changed, and then the cavity length of the resonant cavity can be changed, so that the cavity mode of the resonant cavity can be changed. Therefore, the MCU can adjust the position of the reflective surface of the first reflector 9148 in real time according to the feedback signal to change the cavity length of the resonant cavity, and then select a suitable resonant cavity mode for lasing. When the wavelength corresponding to the cavity membrane of the resonant cavity is aligned with the wavelength of the light selected by the wavelength selector 9143, the light selected by the wavelength selector 9143 oscillates back and forth in the resonant cavity, and finally outputs from the first cavity surface of the gain chip 9141 in the form of laser.

[0215] Fig.21 FIG. 4 is a structural diagram of a fifth optical component provided according to some embodiments. Fig.21 As shown, in some embodiments, the optical component 914 may include a phase shifter 9146. The phase shifter 9146 may be located between the wavelength selector 9143 and the first lens 91421.

[0216] When the phase shifter 9146 is located between the wavelength selector 9143 and the first lens 91421, the electrical chip provides an AC driving signal to the first reflector 9148 and thermally adjusts the phase shifter according to the AC feedback signal to change the cavity length of the resonant cavity.

[0217] When the optical component 914 includes a phase shifter 9146 and a first reflector 9148, the electrical chip provides an AC driving signal to the first reflector 9148 and thermally adjusts the phase shifter according to the AC feedback signal to change the cavity length of the resonant cavity.

[0218] When the optical component 914 includes a phase shifter 9146, a first reflector 9148 and a second reflector 9147, the second reflector 9147 is directly fixed on the heat sink 9114, and the electrical chip provides an AC driving signal to the first reflector 9148, and thermally adjusts the phase shifter according to the AC feedback signal to change the cavity length of the resonant cavity.

[0219] When the optical component 914 includes a phase shifter 9146, a first reflector 9148 and a second reflector 9147, the second reflector 9147 is fixed to the heat sink 9114 through piezoelectric ceramics, the electrical chip provides an AC driving signal to the first reflector 9148 or the piezoelectric ceramics, and thermally adjusts the phase shifter according to the AC feedback signal to change the cavity length of the resonant cavity.

[0220] Any two of the cavity surface of the gain chip 9141 coated with a reflective film, the reflective surface of the first reflector 9148 and the second reflector 9147 can constitute the two cavity surfaces of the resonant cavity. Any two of them can be selected as the two cavity surfaces of the resonant cavity, and corresponding devices can be selected from the lens 9142, the wavelength selector 9143, the second wave plate 9144, the first wave plate 9149, the photodetector 9145 and the phase shifter 9146 according to the selected devices for combination, so that light is output from the resonant cavity in the form of laser.

[0221] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A tunable laser, characterized in that: include: A first housing, in which an optical component is disposed; Wherein, the optical component comprises: A gain chip, used to emit a wide spectrum light including multiple wavelengths; the gain chip comprises a first cavity surface and a second cavity surface, the first cavity surface is located behind the second cavity surface, the first cavity surface is a transmission surface, and the second cavity surface is a reflection surface; a wavelength selector, located behind the first cavity surface, for selecting light of a specific wavelength from the broad spectrum light; A first wave plate, located behind the wavelength selector, for reflection and transmission of light; A first reflector is arranged horizontally with the bottom surface of the first housing and is located below the first wave plate to receive light reflected by the first wave plate; the first reflector has a reflective surface, and the reflective surface moves up and down to adjust the distance between the reflective surface and the first wave plate; A second wave plate, located behind the first wave plate, for receiving the light transmitted by the first wave plate and for reflecting and transmitting light; The photodetector is located below the second wave plate to receive the light reflected by the second wave plate.

2. The tunable laser according to claim 1, characterized in that: The optical component also includes a lens, which is located between the gain chip and the wavelength selector. The lens and the gain chip are both fixed to the bottom surface of the first shell through a first support plate. The height of the lens in the area of ​​the first support plate is lower than the height of the gain chip in the area of ​​the first support plate, so that the central axes of the gain chip and the lens coincide with each other.

3. The tunable laser according to claim 1, characterized in that: The first wave plate comprises a light incident surface and a light exiting surface, light is reflected and transmitted through the light incident surface of the first wave plate, light reflected through the light incident surface of the first wave plate is incident on the first reflector, and light transmitted through the light incident surface of the first wave plate is transmitted through the light exiting surface of the first wave plate to the second wave plate; The second wave plate comprises a light incident surface and a light exiting surface, the light transmitted through the light exiting surface of the first wave plate is reflected and transmitted through the light incident surface of the second wave plate, the light reflected through the light incident surface of the second wave plate is incident on the photodetector, and the light transmitted through the light incident surface of the second wave plate is transmitted out through the light exiting surface of the second wave plate; The light emitting surface of the first wave plate is connected to the light incident surface of the second wave plate, so that the first wave plate is connected to the second wave plate; The light exiting surface of the first wave plate is arranged in parallel with the light incident surface of the second wave plate, the light incident surface of the first wave plate is arranged non-parallel with the light exiting surface of the first wave plate, and the light incident surface of the second wave plate is arranged non-parallel with the light exiting surface of the second wave plate, so that the light incident surface of the first wave plate is arranged non-parallel with the light exiting surface of the second wave plate.

4. A tunable laser, characterized in that: include: A first housing, in which an optical component is disposed; Wherein, the optical component comprises: A gain chip, used for emitting a wide spectrum light including multiple wavelengths; the gain chip comprises a first cavity surface and a second cavity surface, the first cavity surface is located behind the second cavity surface, the first cavity surface is a transmission surface, and the second cavity surface is a transmission surface; A first reflector is vertically arranged with the bottom surface of the first shell and is located in front of the second cavity surface; the first reflector has a reflective surface, and the reflective surface moves left and right to adjust the distance between the reflective surface and the second cavity surface; a wavelength selector, located behind the first cavity surface, for selecting light of a specific wavelength from the broad spectrum light; A second reflector, located behind the wavelength selector; a second wave plate, located behind the second reflector, for reflection and transmission of light; The photodetector is located below the second wave plate to receive the light reflected by the second wave plate.

5. The tunable laser according to claim 4, characterized in that: The optical assembly further comprises a lens, wherein the height of the lens in the region of the first support plate is lower than the height of the gain chip in the region of the first support plate, so that the central axes of the gain chip and the lens coincide with each other; The lens includes a first lens and a second lens, the gain chip is located between the first lens and the second lens, the first lens is located between the first reflector and the gain chip, and the second lens is located between the gain chip and the wavelength selector.

6. A tunable laser, characterized in that: include: A circuit board having an MCU; A first housing, in which an optical component is disposed; Wherein, the optical component comprises: A gain chip, used to emit a wide spectrum light including multiple wavelengths; the gain chip comprises a first cavity surface and a second cavity surface, the first cavity surface is located behind the second cavity surface, the first cavity surface is a reflection-transmission surface, and the second cavity surface is a transmission surface; a wavelength selector, located in front of the second cavity surface, for selecting light of a specific wavelength from the broad spectrum light; A first reflector is vertically arranged with the bottom surface of the first housing and is located in front of the wavelength selector; the first reflector has a reflective surface, and the reflective surface moves left and right to adjust the distance between the reflective surface and the wavelength selector; A second wave plate, located behind the first cavity surface, for light reflection and transmission; The photodetector is located below the second wave plate to receive the light reflected by the second wave plate.

7. The tunable laser according to claim 6, characterized in that: The optical assembly further comprises a lens, wherein the height of the lens in the region of the first support plate is lower than the height of the gain chip in the region of the first support plate, so that the central axes of the gain chip and the lens coincide with each other; The lens includes a first lens and a second lens, the gain chip is located between the first lens and the second lens, the first lens is located between the wavelength selector and the gain chip, and the second lens is located between the gain chip and the second wave plate.

8. An optical module, characterized in that: include: A circuit board having an MCU; A tunable laser comprises a first housing, wherein an optical component is arranged in the first housing, and the optical component comprises: A gain chip, used to emit a wide spectrum light including multiple wavelengths; the gain chip comprises a first cavity surface and a second cavity surface, the first cavity surface is located behind the second cavity surface, the first cavity surface is a transmission surface, and the second cavity surface is a reflection surface; a wavelength selector, located behind the first cavity surface, for selecting light of a specific wavelength from the broad spectrum light; A first wave plate, located behind the wavelength selector, for reflection and transmission of light; A first reflector is arranged horizontally with the bottom surface of the first housing and is located below the first wave plate to receive light reflected by the first wave plate; the first reflector has a reflective surface; A second wave plate, located behind the first wave plate, for receiving the light transmitted by the first wave plate and for reflecting and transmitting light; A photodetector, located below the second wave plate, to receive light reflected by the second wave plate to obtain a feedback signal; The MCU adjusts the driving signal provided to the first reflector according to the feedback signal, so that the reflecting surface moves left and right under the action of the driving signal; The coherent optical component is connected to the tunable laser to realize the conversion of the photoelectric signal.

9. An optical module, characterized in that: include: A circuit board having an MCU; A tunable laser comprises a first housing, wherein an optical component is arranged in the first housing, and the optical component comprises: A gain chip, used for emitting a wide spectrum light including multiple wavelengths; the gain chip comprises a first cavity surface and a second cavity surface, the first cavity surface is located behind the second cavity surface, the first cavity surface is a transmission surface, and the second cavity surface is a transmission surface; A first reflector is vertically arranged with the bottom surface of the first shell and is located in front of the second cavity surface; the first reflector has a reflective surface; a wavelength selector, located behind the first cavity surface, for selecting light of a specific wavelength from the broad spectrum light; A second reflector, located behind the wavelength selector; a second wave plate, located behind the second reflector, for reflection and transmission of light; A photodetector is located below the second wave plate to receive the light reflected by the second wave plate to obtain a feedback signal. The MCU adjusts the driving signal provided to the first reflector according to the feedback signal, so that the reflecting surface moves left and right under the action of the driving signal; The coherent optical component is connected to the tunable laser to realize the conversion of the photoelectric signal.

10. An optical module, characterized in that: include: A circuit board having an MCU; A tunable laser comprises a first housing, wherein an optical component is arranged in the first housing, and the optical component comprises: A gain chip, used to emit a wide spectrum light including multiple wavelengths; the gain chip comprises a first cavity surface and a second cavity surface, the first cavity surface is located behind the second cavity surface, the first cavity surface is a reflection-transmission surface, and the second cavity surface is a transmission surface; a wavelength selector, located in front of the second cavity surface, for selecting light of a specific wavelength from the broad spectrum light; A first reflector is vertically arranged with the bottom surface of the first housing and is located in front of the wavelength selector; the first reflector has a reflective surface, and the reflective surface moves left and right; A second wave plate, located behind the first cavity surface, for light reflection and transmission; a photodetector located below the second wave plate to receive light reflected by the second wave plate to obtain a feedback signal; the MCU adjusts the driving signal provided to the first reflector according to the feedback signal so that the reflecting surface moves left and right under the action of the driving signal; The coherent optical component is connected to the tunable laser to realize the conversion of the photoelectric signal.

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